CN105699711A

CN105699711A - Automatic device fixing device for thermal resistance measurement of semiconductor device

Info

Publication number: CN105699711A
Application number: CN201610166698.3A
Authority: CN
Inventors: 冯士维; 王超; 史冬; 陈宇峥
Original assignee: Beijing University of Technology
Current assignee: Beijing University of Technology
Priority date: 2016-03-20
Filing date: 2016-03-20
Publication date: 2016-06-22
Anticipated expiration: 2036-03-20
Also published as: CN105699711B

Abstract

The invention discloses an automatic device fixing device for thermal resistance measurement of a semiconductor device. The automatic device fixing device comprises an upper computer, an FPGA, a drive circuit, a stepping motor, a pressure sensor, an AD conversion chip, and a clamp. The upper computer is connected with the FPGA by a USB-to-TTL conversion module; the FPGA is connected with the stepping motor by the drive circuit; the stepping motor is connected with the clamp; the pressure sensor is fixed on the clamp; and the pressure sensor is connected with the FGPA by the AD conversion chip. The upper computer is used for setting a pressure value; and the stepping motor drives a lead screw to make rotation to apply the pressure on a device. During the forcing process, the pressure on the device can be fed back to the upper computer in real time to form a closed-loop control system; and the upper computer compares the pressure value that is fed back and the set value to control rotation of the stepping motor, so that the pressure applied to the device is accurate. According to the invention, the automation degree is high and the operation becomes simple. The applied pressure value is guaranteed to be accurate, so that accuracy of thermal resistance measurement of a semiconductor device is improved.

Description

A kind of device automatic fixer being applied to semiconductor device thermal resistance measurement

Technical field

The present invention relates to and belongs to semiconductor device thermal resistance measurement field, be specifically related to a kind of can any setup pressure value and can the device of stationary semiconductor devices automatically。

Background technology

At present, semiconductor device thermo-resistance measurement many employings electric method, device need to be pressed on temperature platform with fixing device during measurement, this pressure size is very big for measurement result impact。Device complicated operation fixed by existing simple and easy device, and is difficult to ensure that and executes stressed repeatability, and size also cannot be learnt, causes that measurement result is inaccurate even damages device。The semiconductor device automatic fixer of step motor control, make use of powerful for FPGA operational capability, logical judgment ability, plus pressure transducer, the automatic control system that circuit etc. are constituted, automaticity is high, operate simple and easy, it is possible to ensure that the force value applied is accurate, improve semiconductor device thermal resistance measurement accuracy。

Summary of the invention

For the deficiency of existing fixing device, it is an object of the invention to, it is provided that a kind of stable performance, force value is accurate, and automaticity is high, semiconductor device automatic fixer easy and simple to handle。

In order to realize above-mentioned task, the present invention adopts the following technical scheme that and is achieved:

A kind of device automatic fixer being applied to semiconductor device thermal resistance measurement, it is characterised in that: include host computer, FPGA module, USB turn TTL module, drive circuit, motor, AD conversion chip, fixture；Host computer turns TTL module with FPGA by USB and is connected, and FPGA is connected with motor by drive circuit, and motor is connected with fixture, and pressure transducer is fixed on fixture to be a part for fixture, and pressure transducer passes through AD conversion chip and is connected with FPGA；

The structure of described fixture is: motor is connected with ball screw by shaft coupling, guide rail is installed one piece of slide block through ball screw, slide block is fixed a upperpush rod, outer sleeve is fixed in vertical pillars by horizontal gird, and inner sleeve is enclosed within outer sleeve, and inner sleeve can in outer sleeve slidably, spring is contained in inner sleeve, vertical pillars, through inner sleeve and spring contact, equipped with pressure transducer between lower spring end and down-pressed pole, is fixed on base by upperpush rod。

The present invention also has following technical characterstic:

Described FPGA module adopts EP2C8Q208C8N chip

Described USB turns TTL module and adopts PL2303 module

Described AD conversion chip adopts MAX197

Described pressure transducer adopts resistive pressure sensor FSR402

Automaticity of the present invention is high, and force value is accurate, and Stability Analysis of Structures is reliable, and flexibility ratio height can freely be put, and easy and simple to handle can improve efficiency, and simple in construction is readily produced。

Accompanying drawing explanation

Fig. 1 be the present invention catenation principle figure。

Fig. 2 is the clamp structure schematic diagram of the present invention。

In figure: 1. motor, 2. ball screw, 3. guide rail, 4. vertical pillars, 5. horizontal gird, 6. base, 7. shaft coupling, 8. slide block, 9. upperpush rod, 10. outer sleeve, 11. springs, 12. inner sleeves, 13. pressure transducers, 14. down-pressed poles。

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail。

Deferring to technique scheme, as depicted in figs. 1 and 2, the present invention includes host computer, FPGA module, drive circuit, motor, pressure transducer, AD conversion chip, fixture。Host computer turns TTL module with FPGA by USB and is connected, and FPGA is connected with motor by drive circuit, and motor is connected with fixture, and pressure transducer is fixed on fixture, and pressure transducer is connected with FPGA by AD conversion chip。

Motor 1 is connected with ball screw 2 by shaft coupling 7, one piece of slide block 8 through ball screw 2 is installed on guides 3, slide block is fixed a upperpush rod 9, outer sleeve 10 is fixed in vertical pillars 4 by horizontal gird 5, and inner sleeve 12 is enclosed within outer sleeve 10, and inner sleeve can in outer sleeve slidably, spring is contained in inner sleeve, upperpush rod 9 contacts through inner sleeve with spring 11, equipped with pressure transducer between lower spring end and down-pressed pole 14, vertical pillars 4 is fixed on base 6。

Described USB turns TTL module and adopts PL2303 module, this device internal USB function control device, USB transceiver, agitator and the UART with whole modem control signals, external several electric capacity are only needed to achieve that the conversion of usb signal and RS232 signal, it is possible to be conveniently embedded into various equipment。

Described FPGA module adopts EP2C8Q208C8N chip。

Described AD conversion chip adopts MAX197, MAX197 to be the high-speed a/d conversion chips with 12 certainties of measurement, only needs single power supply to power, and the conversion time very short (6us), has 8 tunnel input channels, it is also possible to and major partFPGADirect interface, uses very convenient。

Described pressure transducer adopts resistive pressure sensor FSR402。

By upper computer software, a certain force value is set, host computer sends an instruction to FPGA by serial ports, FPGA sends instruction to drive circuit and controls motor rotation, motor drives ball screw to rotate, down-pressed pole motion is driven by the turning block of screw mandrel rectilinear motion on screw mandrel, upper down-pressed pole can drive inner sleeve to slide up and down by extrusion spring, when down-pressed pole touches device, motor is rotated further generation certain pressure value, now pressure transducer detects that analogue signal is sent to AD conversion chip and converts analog signals into digital signal and be sent to FPGA by force value, force value is sent to host computer by serial ports by FPGA, actual force value and setting value are compared and again send instruction control motor rotation to FPGA by host computer, form closed-loop control system until the force value of reality reaches setting value。

Claims

1. the device automatic fixer being applied to semiconductor device thermal resistance measurement, it is characterised in that: include host computer, FPGA module, USB turn TTL module, drive circuit, motor, AD conversion chip, fixture；Host computer turns TTL module with FPGA by USB and is connected, and FPGA is connected with motor by drive circuit, and motor is connected with fixture, and pressure transducer is fixed on fixture to be a part for fixture, and pressure transducer passes through AD conversion chip and is connected with FPGA；

2. the device automatic fixer in semiconductor device thermal resistance measurement according to claim 1, it is characterised in that: described FPGA module adopts EP2C8Q208C8N chip。

3. the device automatic fixer in semiconductor device thermal resistance measurement according to claim 1, it is characterised in that: described USB turns TTL module and adopts PL2303 module。

4. the device automatic fixer in semiconductor device thermal resistance measurement according to claim 1, it is characterised in that: described AD conversion chip adopts MAX197。

5. the device automatic fixer in semiconductor device thermal resistance measurement according to claim 1, it is characterised in that: described pressure transducer adopts resistive pressure sensor FSR402。