CN105698038A - Optical semiconductor lighting device - Google Patents
Optical semiconductor lighting device Download PDFInfo
- Publication number
- CN105698038A CN105698038A CN201410686200.7A CN201410686200A CN105698038A CN 105698038 A CN105698038 A CN 105698038A CN 201410686200 A CN201410686200 A CN 201410686200A CN 105698038 A CN105698038 A CN 105698038A
- Authority
- CN
- China
- Prior art keywords
- optical semiconductor
- fin
- sub
- luminaire according
- semiconductor luminaire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an optical semiconductor lighting device. The optical semiconductor lighting device comprises an upper body, a lower body, one or more cooling fins and a light emitting module. The lower side of the upper body is opened to define the inner space of the upper body, and the inner space is formed on the outer surface, with upper protruding portions, of the upper body. The upper side of the lower body is opened to define the inner space of the lower body, and the inner space is formed on the outer surface, with lower protruding portions, of the lower body. The lower protruding portions and the upper protruding portions are placed in a collinear mode. Each cooling fin comprises a fastening assembly, andthe upper protruding portions and the lower protruding portions are inserted into the fastening assemblies. The light emitting module comprises one or more optical semiconductor devices, wherein each optical semiconductor device is arranged on one side surface of the corresponding cooling fin. The cooling fins surround the outer surface of the upper body and the outer surface of the lower body. The optical semiconductor lighting device can achieve comfortable lighting, and the attractiveness is improved through the balance of the optical semiconductor lighting device and the surrounding landscape.
Description
Technical field
The present invention relates to a kind of optical semiconductor luminaire, particularly relate to and a kind of can realize comfortable illumination simultaneously by improving the optical semiconductor luminaire of aesthetic property with the balance of surrounding landscape。
Background technology
Due to the advantage compared with electric filament lamp or fluorescent lamp with such as low-power consumption, long-life, high-durability and premium brightness, therefore optical semiconductor device is (such as, light emitting diode (lightemittingdiode, LED) or laser diode (laserdiode, LD)) receive more and more attention。
Being different from the fluorescent lamp or mercury lamp that manufacture by argon and poisonous hydrargyrum being ejected in glass tubing, optical semiconductor device does not use environmentally harmful material, thus provides the product to eco-friendly。
Specifically, the luminaire that optical semiconductor device is used as light source is recently used for outdoor scene illumination or safety and it is thus desirable to the Simple assembled of described luminaire and installation。
In addition, it is necessary to by optical semiconductor device be used as light source this type of luminaire with allow break down and malfunctioning after displacement or maintenance。
Summary of the invention
[technical problem]
The present invention has conceived for solving problems of the prior art, and aims to provide a kind of optical semiconductor luminaire, and described optical semiconductor luminaire can realize comfortable illumination and improve aesthetic property by the balance with surrounding landscape simultaneously。
[technical solution]
According to an aspect of the present invention, optical semiconductor luminaire comprises: upper body, and described upper body place on the downside of it opens define inner space therein and be formed on its outer surface with upper ledge portion；Sub-body, described sub-body side place thereon opens define inner space therein and be formed on its outer surface with the lower protrusion portion placed with upper ledge portion conllinear；One or more fin, each self-contained fastening combined piece of described fin, described upper ledge portion and described lower protrusion portion are inserted in described fastening combined piece；And light emitting module, described light emitting module comprises the one or more optical semiconductor devices on a side surface of each being placed in described fin, and wherein said fin is around the outer surface of described upper body and described sub-body。
Optical semiconductor luminaire can comprise Edison base further, and described Edison base is formed on the lower end of sub-body；And base holder, described base holder provides the lower end of sub-body and is fastened on Edison base。
Optical semiconductor luminaire can comprise the fastening component that upper body is connected to sub-body further, and wherein the lower limb of upper body is corresponding to the top edge of sub-body。
The lower end of upper body is inserted in the upper end of sub-body。
The upper end of sub-body is inserted in the upper end of upper body。
Fin can around the outer surface of upper body and sub-body to form polygon pillar。
Polygon pillar can have a kind of shape between following item: triangle strut configurations, square strut configurations, pentagon strut configurations, hexagon strut configurations, heptagon strut configurations and octagon strut configurations。
Each in described fin can be formed at its side surface place with through hole, for supplying the interconnecting lead described through hole of traverse of electric power to light emitting module。
Optical semiconductor luminaire can have lead channels in a portion, and at described part place, the lower end of upper body engages with the upper end of sub-body。
The inner space of upper body or sub-body can equipped with power supply unit or drive circuit。
Optical semiconductor luminaire can comprise the multiple radiating fins prominent from the opposite side surface of fin further, and wherein fastening combined piece is formed at the central area of the plurality of radiating fin。
Optical semiconductor luminaire can comprise the multiple radiating fins prominent from the opposite side surface of fin further, and wherein fastening combined piece is formed at the central area on the opposite side surface of fin。
Fastening combined piece can comprise a pair prodger, described that prodger is prominent from the central area of the heat dissipation base on the surface constituting fin；And fixture, each fixture extends along the edge of prodger and is fixed on the outer surface of upper body and sub-body。
Optical semiconductor luminaire can comprise at least one binding groove further, at least one binding groove described be formed on the outer surface of upper body and sub-body with upper and lower jut conllinear, and receiving fastening combined piece, wherein upper ledge portion and lower protrusion portion are placed in binding groove。
Optical semiconductor luminaire can comprise multiple upper ledge portion further, and the plurality of upper ledge portion arranges along the outer surface of upper body with constant interval；And multiple lower protrusion portion, the plurality of lower protrusion portion arranges along the outer surface of sub-body with constant interval。
Multiple fin can form the air duct therebetween with constant width。
Described fin can be spaced constant distance。
[advantageous effects]
According to the embodiments of the invention with said structure, light emitting module is placed in each in multiple fin, the plurality of fin is radially placed in equipped with on the outer surface of the shell of Edison base, light can be irradiated on four direction simultaneously orthogonal with Edison base, be achieved in comfortable illumination and improve aesthetic property by the balance with surrounding landscape simultaneously。
Accompanying drawing explanation
Fig. 1 is the perspective view of the population structure of optical semiconductor luminaire according to an embodiment of the invention。
Fig. 2 is the decomposition diagram of the population structure of optical semiconductor luminaire according to an embodiment of the invention。
Fig. 3 is the fragmentary, perspective view of the shell of optical semiconductor luminaire according to an embodiment of the invention。
Fig. 4 is the perspective view of all the other structures of the shell of optical semiconductor luminaire according to an embodiment of the invention。
(a) and (b) of Fig. 5 is the perspective view of the fin of optical semiconductor luminaire according to an embodiment of the invention。
Fig. 6 is the side view of the shell of optical semiconductor luminaire according to an embodiment of the invention, and wherein fin is spaced apart with light emitting module。
Detailed description of the invention
[optimal mode]
Above-mentioned and other aspects, feature and the advantage of the present invention will become apparent from being described below of the following example provided in conjunction with accompanying drawing。
It should be understood, however, that the invention is not restricted to following example and can be implemented by different modes。
Herein, it is provided that embodiment is to provide for the entire disclosure of the present invention and makes those skilled in the art thoroughly understand the present invention。
The scope of the present invention should only be limited by appended claims and equivalent thereof。
Therefore, the unclear explanation to avoid the present invention of the detailed description to the apparent details of those skilled in the art of art will be omitted。
It addition, same reference numerals will refer to same components in the description, and accompanying drawing is merely provided for describing the purpose of specific embodiment and being not limiting as the present invention with the term that reference is made to (use)。
As used herein, singulative " ", " one " and " described " is set also comprises plural form, unless the context clearly dictates otherwise。Will be further understood that, term " includes (comprises) " and/or indicates " including (comprising) " existence of described feature, assembly and/or operation, but is not excluded for existence or the interpolation of other features one or more, assembly and/or operation。
Unless otherwise defined, otherwise all terms used herein (comprising technology and scientific terminology) have the same meaning that those skilled in the art in the invention are generally understood that。
Should be further understood that, term (those terms defined in such as common dictionary) should be interpreted as having the implication consistent with the implication in its context in this specification and correlation technique, and should not make an explanation in idealization or too formal meaning, unless so explicitly defined in this article。
The exemplary embodiment of the present invention is described in detail hereinafter with reference to accompanying drawing。
Fig. 1 is the perspective view of the population structure of optical semiconductor luminaire according to an embodiment of the invention, and Fig. 2 is the decomposition diagram of the population structure of optical semiconductor luminaire according to an embodiment of the invention。
With reference to Fig. 1 and Fig. 2, optical semiconductor luminaire according to an embodiment of the invention comprises shell 100, fin 200 and light emitting module 300。
Shell 100 is electrically connected on socket (not shown) and provides the space and region that are provided with fin 200 described below on it。Shell 100 can be generally divided into upper body 110d and sub-body 120d。
Upper body 110d place on the downside of it opens define inner space therein and be formed on its outer surface with upper ledge portion 161。
Sub-body 120d side place thereon opens define inner space therein and be formed on its outer surface with lower protrusion portion 162, and described lower protrusion portion 162 places with described upper ledge portion 161 conllinear。
The supporting member of two ends for supporting fastening combined piece 230 described below is served as in upper ledge portion 161 and lower protrusion portion 162。
Optical semiconductor luminaire comprises one or more fin 200。Herein, each in described fin 200 comprises fastening combined piece 230, upper ledge portion 161 and lower protrusion portion 162 and is inserted in described fastening combined piece 230, and in order to provide the high efficiency and heat radiation from light emitting module 300。
Light emitting module 300 comprises the one or more optical semiconductor devices 500 on the side surface being placed in fin 200 and serves as light source。
Fin 200 is around the outer surface of upper body 110d and sub-body 120d。
Should be understood that following various embodiment and above example can apply to the present invention。
In order to carry out reference, Fig. 3 is the fragmentary, perspective view of the shell of optical semiconductor luminaire according to an embodiment of the invention, and Fig. 4 is the perspective view of all the other structures of the shell of optical semiconductor luminaire according to an embodiment of the invention。
(a) and (b) of Fig. 5 is the perspective view of the fin of optical semiconductor luminaire according to an embodiment of the invention。
It addition, Fig. 6 is the side view of the shell of optical semiconductor luminaire according to an embodiment of the invention, wherein fin is spaced apart with light emitting module。
According to the present invention, sub-body 120d is formed at its lower end with Edison base 101, and described Edison base 101 will be coupled into socket (not shown)。
Specifically, Edison base 101 serves as electric contact, and described electric contact is swirled on socket and receives electric power from power supply。
For ease of fastening and assembling Edison base 101, optical semiconductor luminaire can comprise base holder 105 further, and described base holder 105 is supplied to the lower end of sub-body 120d and is fixed on Edison base 101。
As shown in Figures 3 and 4, in certain embodiments, the lower limb of upper body 110d can correspond to the top edge of sub-body 120d, and optical semiconductor luminaire can comprise fastening component 140 further, and upper body 110d is connected to sub-body 120d by described fastening component 140。
It is to say, upper body 110d and sub-body 120d is secured to one another by securing member 141, being consequently formed shell 100, described securing member 141 such as, is formed at the screw bolt and nut in each in upper body 110d and sub-body 120d by fastening component。
Although not specifically illustrated, however, it is understood that shell 100 can have other fastening structures except above fastening structure。Such as, the lower end of upper body 110d is inserted in the upper end of sub-body 120d, or the upper end of sub-body 120d is inserted in the upper end of upper body 110d。
On the other hand, according to the present invention, lead channels 170 can be formed at a portion, at described part place, the lower end of upper body 110d engages with the upper end of sub-body 120d so that the interconnecting lead for supplying electric power to light emitting module 300 extends in the inner space of upper body 110d and sub-body 120d。
The inner space of upper body 110d or sub-body 120d can be connected on light emitting module 300 by interconnecting lead equipped with power supply unit 400 or drive circuit (not shown), said supply unit 400 or described drive circuit。
With reference to Fig. 3, Fig. 4 and Fig. 6, lead channels 170 is segmented into the first lead channels half portion 171 and the second lead channels half portion 172。
First, before reference the first lead channels half portion 171 and the second lead channels half portion 172, shell 100 can be divided into upper body 110d and sub-body 120d according to its partition structure, or can according to being divided into the first cylinder 110c and the second cylinder 120c relative to the coupled structure of fin 200。
First cylinder 110c defines inner space, and the power supply unit 400 being electrically connected to light emitting module 300 is received in described inner space。
Second cylinder 120c has the inner perimeter of the periphery towards the first cylinder 110c and is placed in outside the first cylinder 110c。
Herein, fin 200 is coupling between the first cylinder 110c and the second cylinder 120c。
This type of the first cylinder 110c and the second cylinder 120c by via fastening component 140 by coupled to each other for upper body 110d and sub-body 120d and formed。
Herein, shell 100 comprises one or more binding groove 130 further, on the outer surface of each that described binding groove 130 is formed in upper body 110d and sub-body 120d and receive fastening combined piece 230 so that upper ledge portion 161 and lower protrusion portion 162 can be received in each in binding groove 130。
Preferably, luminaire is included along multiple upper ledge portions 161 and the multiple lower protrusion portion 162 that the periphery of upper body 110d and sub-body 120d is arranged with constant interval, to form polygon pillar as described below。
Therefore, (namely first lead channels half portion 171 by convexly cutting the lower limb of upper body 110d upward, it is divided into the lower limb of the upper part of the first cylinder 110c of upper part and low portion) be formed as arcuate shape (as shown in Figure 6), and place corresponding to each in binding groove 130。
(namely second lead channels half portion 172 by convexly cutting the top edge of sub-body 120d down, it is divided into the top edge of the low portion of the first cylinder 110c of upper part and low portion) be formed as arcuate shape (as shown in Figure 6), and place corresponding to each in binding groove 130。
Therefore, when upper body 110d integrally engages with sub-body 120d, the first lead channels half portion 171 and the second lead channels half portion 172 placed corresponding to each in binding groove 130 are engaged with each other, to form the lead channels 170 with circle or elliptical shape。
Herein, the optical semiconductor device 500 of light emitting module 300 can be electrically connected to power supply unit 400 via the interconnecting lead (not shown) through lead channels 170。
On the other hand, fin 200 around the outer surface of upper body 110d and sub-body 120d to form polygon pillar。Polygon pillar can have a kind of shape between following item: triangle strut configurations, square strut configurations, pentagon strut configurations, hexagon strut configurations, heptagon strut configurations and octagon strut configurations。
Therefore, the optical semiconductor device 500 of the light emitting module 300 being arranged in each in fin 200 sends the light orthogonal with Edison base 101。
Fin 200 can be formed at its side surface place with through hole 211, for supplying the interconnecting lead described through hole 211 of traverse of electric power to light emitting module 300。
Fin 200 is spaced constant distance, and forms the air duct 201 therebetween with constant width, improves cooling performance further from there through free convection。
It addition, the optical semiconductor luminaire according to the present invention can comprise the multiple radiating fins 220 prominent from the opposite side surface of fin 200 further。In this case, for fastening and displacement structure, fastening combined piece 230 is advantageously formed on the central area of multiple radiating fin 220, i.e. be formed at the central area on the opposite side surface of fin 200。
Therefore, fastening combined piece 230 comprises a pair prodger 231, described that prodger 231 is prominent from the central area of the heat dissipation base 210 on the surface constituting fin 200；And fixture 232, described fixture 232 extends along the edge of prodger 231 and is fixed on the outer surface of upper body 110d and sub-body 120d。
As it has been described above, the optical semiconductor luminaire according to the present invention can realize comfortable illumination, improve aesthetic property by the balance with surrounding landscape simultaneously。
Although more already described herein embodiments, but those skilled in the art will appreciate that, these embodiments only provide by way of illustration, and without departing from the spirit and scope of the present invention, it is possible to carry out various amendment, change and change。
Claims (17)
1. an optical semiconductor luminaire, it is characterised in that including:
Upper body, described upper body place on the downside of it opens define inner space therein and be formed on its outer surface with upper ledge portion；
Sub-body, described sub-body side place thereon opens define inner space therein and be formed on its outer surface with the lower protrusion portion placed with described upper ledge portion conllinear；
One or more fin, each self-contained fastening combined piece of described fin, described upper ledge portion and described lower protrusion portion are inserted in described fastening combined piece；And
Light emitting module, described light emitting module comprises the one or more optical semiconductor devices on a side surface of each being placed in described fin,
Wherein said fin is around the outer surface of described upper body and described sub-body。
2. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Edison base, described Edison base is formed on the lower end of described sub-body；And
Base holder, described base holder is supplied to the described lower end of described sub-body and is fastened on described Edison base。
3. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Fastening component, described upper body is connected to described sub-body by described fastening component,
The lower limb of wherein said upper body is corresponding to the top edge of described sub-body。
4. optical semiconductor luminaire according to claim 1, it is characterised in that the lower end of described upper body is inserted in the upper end of described sub-body。
5. optical semiconductor luminaire according to claim 1, it is characterised in that the upper end of described sub-body is inserted in the upper end of described upper body。
6. optical semiconductor luminaire according to claim 1, it is characterised in that described fin around the described outer surface of described upper body and described sub-body to form polygon pillar。
7. optical semiconductor luminaire according to claim 6, it is characterised in that described polygon pillar has a kind of shape between following item: triangle strut configurations, square strut configurations, pentagon strut configurations, hexagon strut configurations, heptagon strut configurations and octagon strut configurations。
8. optical semiconductor luminaire according to claim 1, it is characterised in that each in described fin is formed at its side surface place with through hole, for supplying the interconnecting lead described through hole of traverse of electric power to described light emitting module。
9. optical semiconductor luminaire according to claim 1, it is characterized in that described optical semiconductor luminaire has lead channels in a portion, at described part place, the described lower end of described upper body engages with the described upper end of described sub-body。
10. optical semiconductor luminaire according to claim 1, it is characterised in that the described inner space of described upper body or described sub-body is equipped with power supply unit or drive circuit。
11. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Multiple radiating fins, the plurality of radiating fin is prominent from the opposite side surface of described fin,
Wherein said fastening combined piece is formed at the central area of the plurality of radiating fin。
12. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Multiple radiating fins, the plurality of radiating fin is prominent from the opposite side surface of described fin,
Wherein said fastening combined piece is formed at the central area on the opposite side surface of described fin。
13. optical semiconductor luminaire according to claim 1, it is characterised in that described fastening combined piece includes a pair prodger, described that prodger is prominent from the central area of the heat dissipation base on the surface constituting described fin；And fixture, described fixture extends each along the edge of described prodger and is fixed on described upper body and described sub-body。
14. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
At least one binding groove, described binding groove be formed on the outer surface of described upper body and described sub-body with described upper ledge portion and described lower protrusion portion conllinear, and receive described fastening combined piece,
Wherein said upper ledge portion and described lower protrusion portion are placed in described binding groove。
15. optical semiconductor luminaire according to claim 14, it is characterised in that farther include:
Multiple upper ledge portions, the plurality of upper ledge portion arranges along the described outer surface of described upper body with constant interval；And multiple lower protrusion portion, the plurality of lower protrusion portion arranges along the described outer surface of described sub-body with constant interval。
16. optical semiconductor luminaire according to claim 1, it is characterised in that multiple fin form the air duct therebetween with constant width。
17. optical semiconductor luminaire according to claim 1, it is characterised in that described fin is spaced apart from each other with constant distance。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410686200.7A CN105698038A (en) | 2014-11-25 | 2014-11-25 | Optical semiconductor lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410686200.7A CN105698038A (en) | 2014-11-25 | 2014-11-25 | Optical semiconductor lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105698038A true CN105698038A (en) | 2016-06-22 |
Family
ID=56940800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410686200.7A Pending CN105698038A (en) | 2014-11-25 | 2014-11-25 | Optical semiconductor lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105698038A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101571239A (en) * | 2009-05-25 | 2009-11-04 | 广州南科集成电子有限公司 | Multi-light emitting surface LED bulb |
| CN102667333A (en) * | 2009-10-20 | 2012-09-12 | 科锐公司 | Heat sinks and lamp incorporating same |
| CN203286334U (en) * | 2013-05-27 | 2013-11-13 | 李铎方 | Plug-in type LED (Light-Emitting Diode) light source assembly of LED lamp bulb |
-
2014
- 2014-11-25 CN CN201410686200.7A patent/CN105698038A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101571239A (en) * | 2009-05-25 | 2009-11-04 | 广州南科集成电子有限公司 | Multi-light emitting surface LED bulb |
| CN102667333A (en) * | 2009-10-20 | 2012-09-12 | 科锐公司 | Heat sinks and lamp incorporating same |
| CN203286334U (en) * | 2013-05-27 | 2013-11-13 | 李铎方 | Plug-in type LED (Light-Emitting Diode) light source assembly of LED lamp bulb |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101413649B (en) | LED light fitting | |
| KR101135721B1 (en) | Socket-typed LED light apparatus | |
| EP2497999A2 (en) | Heat sink device for lamp and LED lamp comprising the same | |
| KR101349843B1 (en) | Lighting apparatus | |
| US8864348B2 (en) | Light emitting diode bulb with a cup-shaped heat dissipating structure | |
| US10197263B2 (en) | Omnidirectional light emission LED lamp | |
| JP2013527575A (en) | Heat dissipation device for LED bulb and LED bulb with high heat dissipation | |
| CN102128381B (en) | LED (Light-Emitting Diode) lamp bulb with high lighting effect | |
| JP3164034U (en) | LED lighting device | |
| US20130242566A1 (en) | Light emitting diode lamp | |
| KR20100100450A (en) | Led fluorescent lamp | |
| KR101933046B1 (en) | Boltless-type illuminating device | |
| KR101039556B1 (en) | Socket type LED lighting device having double cooling fin structure | |
| US9423099B2 (en) | LED lamp having reflector with high heat dissipation rate | |
| US9416953B2 (en) | LED lighting apparatus | |
| CN105698038A (en) | Optical semiconductor lighting device | |
| CN201992446U (en) | High-luminous efficiency LED (light-emitting diode) bulb | |
| KR101202406B1 (en) | Lighting device of LED | |
| WO2017080343A1 (en) | Led bulb | |
| JP6366017B2 (en) | lighting equipment | |
| KR101325793B1 (en) | A straight line pipe style light emitted diode lighting lamp | |
| EP2995848A1 (en) | Led lamp tightly supported on lamp unit by insertion of power socket | |
| US20160146405A1 (en) | Optical semiconductor lighting apparatus | |
| CN202349689U (en) | LED (light-emitting diode) bulb eliminating heat island effect | |
| CN202629661U (en) | Light emitting diode (LED) lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20190409 |
|
| AD01 | Patent right deemed abandoned |