CN105694109B - It is a kind of that there is toughening and the nucleocapsid structure conduction powder of chain extension and preparation method thereof - Google Patents
It is a kind of that there is toughening and the nucleocapsid structure conduction powder of chain extension and preparation method thereof Download PDFInfo
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- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
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- C08K3/28—Nitrogen-containing compounds
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
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Abstract
The present invention provides a kind of nucleocapsid conduction powder with toughening and chain extension and preparation method thereof, one layer of organic matter for containing epoxy group with toughening and end of conduction powder surface package, inorganic conduction powder is not only realized in end with the fine dispersion in the engineering plastics of carboxyl or amino, greatly increase the dosage of heat conduction engineering plastics, and should have the function of that the epoxy group of toughening and the nucleocapsid conduction powder end of chain extension can be as the chain extender of engineering plastics of the end with carboxyl or amino in process, while considerably increasing the heat conductivility of engineering plastics of the end with carboxyl or amino, mechanical property can also meet actual demand, the compatibility for overcoming the inorganic conduction powder of tradition and engineering plastics is poor, the shortcomings of leading to mechanical properties decrease.
Description
Technical field
The present invention relates to engineering plastics heat conduction technical fields, and in particular to a kind of core-shell structure copolymer with toughening and chain extension
Structure conduction powder and preparation method thereof.
Background technology
Status of the Heat Conduction Material in social development, scientific and technological progress is more and more important, and almost industry-by-industry all be unable to do without and leads
Hot material.The development of society promotes the development of Heat Conduction Material, and modern society is the society of a advanced IT application, electronics, automobile
Industry occupies position critically important in people's life, and Heat Conduction Material plays very important effect at it, with science and technology
Progress, people also propose Heat Conduction Material update, higher requirement.In addition to thermal conductivity, it is also desirable to which material has excellent
Comprehensive performance is for example light, easy technology, excellent in mechanical performance etc..Metal thermal conductive material far can not meet more integrated
Electronic industry, heat conduction engineering plastics are since with the molding of light, resistant to chemical etching, easy processing, electrical insulation capability is excellent, mechanics
And anti-fatigue performance it is excellent etc. excellent the characteristics of, important role is played in terms of Heat Conduction Material.
Heat conduction engineering plastics are a kind of widely used civilian and industrial materials, have good heat resistance, weatherability,
Resistance to chemical reagents, electrical insulating property, water imbibition is small, and gloss is good.With the global tide of IT application, high information industry and Electric Industrial
It flourishes, function is stronger and stronger possessed by electric appliance, and with the development of China's economic society, heat conduction engineering plastics are in electronics
The key player played the part of in information-based road, the purposes of heat conduction engineering plastics are also more and more.
The preparation of heat conduction engineering plastics is mainly blended by adding between heat filling and matrix, then is gathered by traditional height
It is prepared by object processing method.Comparatively, technics comparing is simple, and cost is not also high, and practical value and researching value are all very high,
But since the compatibility of heat filling and engineering plastics is poor, the heat filling of general filled-type can make the power of engineering plastics
Learning performance can be declined, and be a problem existing for present production heat conduction engineering plastics.In general, heat filling surface has
Great amount of hydroxy group exists, and before preparation heat conduction engineering plastics are blended with engineering plastics, can be all surface-treated.It is even to add silane
Connection agent is the common method of surface treatment, and the powder activation grade that coupling agent treatment is crossed can increase, some coupling agents even can be with
Play the role of chain extension.But the toughness of heat conduction engineering plastics prepared after being blended generally will not increase or even can reduce.Cause
This, the conduction powder both with toughening and chain extension is significant to the production of heat conduction engineering plastics.
Number of patent application is that the patent of invention of CN201110059931.5 discloses a kind of carbon coating with nucleocapsid
The preparation method of nanometer silicon carbide powder using graphite arc discharge method, is wrapped up one layer of carbon-coating in silicon carbide, is prepared for
It is a kind of last for the core-shell structure nanopowder of shell by core, carbon of silicon carbide；By wrapping up carbon-coating in silicon carbide, it is not being destroyed
On the basis of original stable chemical performance itself, thermal conductivity factor are high, coefficient of thermal expansion is small, wear-resisting property is good, silicon carbide is improved
Surface-active, but still without solve compatibility it is poor the problems such as.
Invention content
The present invention provides a kind of nucleocapsid structure conduction powder with toughening and chain extension and preparation method thereof, with nothing
Machine conduction powder is core, using the organic matter with toughening and with epoxy group as shell, utilizes its excellent heat conduction and toughening
Performance and unique chain extension performance, engineering plastics of the filling end with carboxyl or amino, heat conduction engineering plastics heat conduction obtained
Performance is good, good mechanical performance.
In order to solve the above technical problems, the present invention provides a kind of nucleocapsid structure conductive powder with toughening and chain extension
Preparation includes the following steps：
Step（1）, will inorganic conduction powder drying after be added in high-speed mixer, heat up, by amino silicane coupling agent
Hydrolyzate is sprayed onto in inorganic conduction powder and mixes, and after mixing, puts it into oven drying, obtains surface and carries amino
Inorganic conduction powder；
Step（2）, inorganic conduction powder of the surface with amino is added in high-speed mixer, heating sprays into both ends band epoxy
The diglycidyl ether of group, mixing, obtains the conduction powder with the nucleocapsid structure of toughening and chain extension.
Preferably, the step（1）In inorganic conduction powder for 100-150 parts by weight, amino silicane coupling agent water
Solution liquid be 6-20 parts by weight, step（2）In diglycidyl ether of the both ends with epoxy group be 4-13 parts by weight.
Any of the above-described scheme is preferably, the amino silicane coupling agent hydrolyzate be amino silicane coupling agent, ethyl alcohol,
Deionized water presses 3-5:6：It stirs evenly after 1 mass ratio mixing, is made after hydrolyzing 20-30min at room temperature.
Any of the above-described scheme is preferably, and the amino silicane coupling agent is 3- aminopropyl triethoxysilanes, 3- ammonia third
Base trimethoxy silane, phenylaminomethyl triethoxysilane, phenylamino propyl-triethoxysilicane, phenylamino propyl trimethoxy silicane
One or more of mixture.
Any of the above-described scheme is preferably, and the inorganic conduction powder is aluminium oxide, aluminium nitride, magnesia, zinc oxide, nitrogen
Change the mixture of one or more of boron, silicon carbide.
Any of the above-described scheme is preferably, the step（2）Diglycidyl ether of the middle both ends with epoxy group is 1,
6- hexanediol diglycidyl ethers, 1,4- butanediol diglycidyl ethers, ethylene glycol diglycidylether, diglycol two
The mixture of one or more of glycidol ether.
Any of the above-described scheme is preferably, the step（1）In inorganic conduction powder drying temperature be 100-120 DEG C, do
The dry time is 1-3h.
Any of the above-described scheme is preferably, the step（1）In when being warming up to 120 DEG C, amino silicane coupling agent is hydrolyzed
Liquid is sprayed onto in inorganic conduction powder, incorporation time 20-30min, after mixing, puts it into the baking that temperature is 100 DEG C
Dry 3-4h in case, obtains the inorganic conduction powder that surface carries amino.
Any of the above-described scheme is preferably, the step（2）In when being warming up to 100 DEG C, spray into both ends with epoxy group
Diglycidyl ether, mixed at high speed 0.5-1h obtain the conduction powder with the nucleocapsid structure of toughening and chain extension.
It is led the present invention also provides a kind of according to the nucleocapsid structure with toughening and chain extension that any of the above-described method is prepared
Hot powder.
The above-mentioned technical proposal of the present invention has the beneficial effect that：Present invention offer is a kind of to have the function of toughening and chain extension
Nucleocapsid structure conduction powder and preparation method thereof, conduction powder surface wrap up one layer and contain epoxy group with toughening and end
Organic matter, not only realize fine dispersion of the inorganic conduction powder in engineering plastics of the end with carboxyl or amino, greatly
The big dosage for increasing heat conduction engineering plastics, and should have the function of toughening and the nucleocapsid structure heat conduction of chain extension in process
The epoxy group of powder end can considerably increase end as the chain extender of engineering plastics of the end with carboxyl or amino
While the heat conductivility of engineering plastics with carboxyl or amino, mechanical property can also meet actual demand, overcome tradition
Inorganic conduction powder and the compatibility of engineering plastics are poor, the shortcomings of leading to mechanical properties decrease.
Specific embodiment
To make the technical problem to be solved in the present invention, technical solution and advantage clearer, below by specific embodiment into
Row detailed description.
Embodiment 1
Vacuum drying will be put into after 25 parts of silicon carbide, 25 parts of aluminium oxide, 25 parts of aluminium nitride, 25 parts of magnesia uniformly mixing
It is 3 hours dry at 120 DEG C in case.
Weigh 4 parts of amino silicane coupling agent 3- aminopropyl triethoxysilanes coupling agent, 8 parts of absolute ethyl alcohol, deionization
1 part of water is uniformly mixed, and is hydrolyzed 30min after mixing at room temperature and is prepared amino silicane coupling agent hydrolyzate.By inorganic conductive powder
Body is placed on the stirring of high-speed mixer high speed, when material temperature is raised to 120 DEG C, starts to spray into three second of 3- aminopropyls of above-mentioned preparation
Oxysilane coupling agent hydrolyzate, mixed at high speed 30min obtain the inorganic conduction powder that surface carries amino, put it into
Dry 4h in 100 DEG C of air dry ovens.
The powder after dried 3- aminopropyl triethoxysilane coupling agent treatments is placed in high-speed mixer again high
Speed stirring when material temperature is raised to 100 DEG C, starts to spray into 9 parts of 1,6- hexanediol diglycidyl ether mixed at high speed 0.5h.To obtain the final product
There is toughening and the conduction powder of the nucleocapsid structure of chain extension to dry.Its epoxide number：0.033-0.067mol/100g.
Embodiment 2
10 parts of silicon carbide, 70 parts of aluminium oxide, 10 parts of aluminium nitride, 10 parts of magnesia, 40 parts of boron nitride are uniformly mixed it
After be put into vacuum drying chamber at 120 DEG C it is 4 hours dry.
Weigh 5 parts of amino silicane coupling agent 3- aminopropyl triethoxysilanes coupling agent, 10 parts of absolute ethyl alcohol, deionization
1.25 parts of water is uniformly mixed, and is hydrolyzed 30min after mixing at room temperature and is prepared amino silicane coupling agent hydrolyzate.It is led inorganic
Hot powder is placed on the stirring of high-speed mixer high speed, when material temperature is raised to 120 DEG C, starts to spray into 3- aminopropyl-triethoxy silicon
Alkane coupling agent hydrolyzate, mixed at high speed 30min obtain conduction powder of the surface with amino, put it into 100 DEG C of forced air dryings
Case 3h.
Conduction powder of the surface with amino is added in into high-speed mixer stirring again, when material temperature is raised to 100 DEG C, starts to spray into
10 parts of ethylene glycol diglycidylether mixed at high speed 1h.Obtain the dry nucleocapsid structure with toughening and chain extension
Conduction powder.Shell epoxide number：0.031-0.059mol/100g.
Embodiment 3
It is done vacuum is put into after 20 parts of silicon carbide, 25 parts of aluminium oxide, 60 parts of aluminium nitride, 15 parts of magnesia uniformly mixing
It is 4 hours dry at 120 DEG C in dry case.
6 parts of 3- aminopropyl trimethoxysilanes coupling agent, 12 parts of absolute ethyl alcohol are weighed, 2 parts of stirrings of deionized water mix
It closes uniformly, hydrolyzes 30min after mixing at room temperature and prepare amino silicane coupling agent hydrolyzate, inorganic conduction powder is added to height
Fast mixing machine high speed stirring when material temperature is raised to 120 DEG C, starts to spray into the hydrolysis of 3- aminopropyl trimethoxysilanes coupling agent
Liquid, mixed at high speed 30min obtain conduction powder of the surface with amino, put it into 100 DEG C of air dry oven 4h.
Conduction powder of the surface with amino is placed on the stirring of high-speed mixer high speed again, when material temperature is raised to 100 DEG C, is opened
Begin 14 parts of penetrating 1,4- butanediol diglycidyl ethers mixed at high speed 4 hours.After stopping stirring, it is put into 100 DEG C of air dry ovens
3h has the function of toughening and the conduction powder of the nucleocapsid structure of chain extension to get to dry.Shell epoxide number：0.065-
0.087mol/100g。
Embodiment 4
After 30 parts of silicon carbide, 50 parts of aluminium oxide, 20 parts of 10 parts of aluminium nitride, 40 parts of magnesia boron nitride uniformly mixing
It is put into vacuum drying chamber at 120 DEG C 4 hours dry.
Weigh 4 parts of silane coupling agent 3- aminopropyl triethoxysilanes coupling agent, 14 parts of absolute ethyl alcohol, deionized water
1.5 parts are uniformly mixed, and hydrolyze 30min after mixing at room temperature and prepare amino silicane coupling agent hydrolyzate.By inorganic conductive powder
Body adds in the stirring of high-speed mixer high speed, when material temperature is raised to 120 DEG C, starts to spray into 3- aminopropyl triethoxysilanes idol
Join agent hydrolyzate, mixed at high speed 30min obtains conduction powder of the surface with amino.Put it into 100 DEG C of air dry ovens
3h。
Conduction powder of the surface with amino is placed on the stirring of high-speed mixer high speed again, when material temperature is raised to 100 DEG C, is opened
Begin 10 parts of penetrating ethylene glycol diglycidylether mixed at high speed 4 hours.Obtain the nucleocapsid structure with toughening and chain extension
Conduction powder.Shell epoxide number：0.023-0.056mol/100g.
The preferred embodiment of the present invention described in detail above.It should be appreciated that those of ordinary skill in the art without
Creative work is needed according to the present invention can to conceive and makes many modifications and variations.Therefore, all technologies in the art
Personnel are available by logical analysis, reasoning, or a limited experiment on the basis of existing technology under this invention's idea
Technical solution, all should be in the protection domain being defined in the patent claims.
Claims (8)
1. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension, includes the following steps：
Step（1）, will inorganic conduction powder drying after be added in high-speed mixer, heat up, amino silicane coupling agent is hydrolyzed
Liquid is sprayed onto in inorganic conduction powder and mixes, and after mixing, puts it into oven drying, and it is inorganic with amino to obtain surface
Conduction powder；
Step（2）, inorganic conduction powder of the surface with amino is added in high-speed mixer, heating sprays into both ends band epoxy group
Diglycidyl ether, mixing, obtain the conduction powder with the nucleocapsid structure of toughening and chain extension；
Step（1）In when being warming up to 120 DEG C, amino silicane coupling agent hydrolyzate is sprayed onto in inorganic conduction powder, during mixing
Between for 20-30min, after mixing, put it into dry 3-4h in the baking oven that temperature is 100 DEG C, obtain surface with amino
Inorganic conduction powder；Step（2）In when being warming up to 100 DEG C, spray into diglycidyl ether of the both ends with epoxy group, at a high speed
0.5-1h is mixed, obtains the conduction powder with the nucleocapsid structure of toughening and chain extension.
2. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension as described in claim 1, special
Sign is, the step（1）In inorganic conduction powder for 100-150 parts by weight, amino silicane coupling agent hydrolyzate is 6-20
Parts by weight, step（2）In diglycidyl ether of the both ends with epoxy group be 4-13 parts by weight.
3. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension as claimed in claim 2, special
Sign is that the amino silicane coupling agent hydrolyzate is amino silicane coupling agent, ethyl alcohol, deionized water by 3-5:6：1 quality
Than being stirred evenly after mixing, it is made after hydrolyzing 20-30min at room temperature.
4. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension as claimed in claim 3, special
Sign is that the amino silicane coupling agent is 3- aminopropyl triethoxysilanes, 3- aminopropyl trimethoxysilanes, anilinomethyl
The mixture of one or more of triethoxysilane, aniline propyl-triethoxysilicane, aniline propyl trimethoxy silicane.
5. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension as described in claim 1, special
Sign is, the inorganic conduction powder is aluminium oxide, aluminium nitride, magnesia, zinc oxide, boron nitride, one kind in silicon carbide or
Several mixtures.
6. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension as described in claim 1, special
Sign is, the step（2）Middle both ends with epoxy group diglycidyl ether for 1,6 hexanediol diglycidylether, 1,
One kind or several in 4- butanediol diglycidyl ethers, ethylene glycol diglycidylether, diethylene glycol diglycidyl ether
The mixture of kind.
7. a kind of nucleocapsid structure conduction powder preparation method with toughening and chain extension as described in claim 1, special
Sign is, the step（1）In inorganic conduction powder drying temperature be 100-120 DEG C, drying time 1-3h.
8. the nucleocapsid structure conductive powder with toughening and chain extension being prepared according to any one of claim 1-7
Body.
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| CN108822553A (en) * | 2018-07-10 | 2018-11-16 | 合肥工业大学 | A kind of the self-reinforcing heat-conducting insulating silicon rubber material and preparation method of filling crosslinking function conduction powder |
| CN109161276A (en) * | 2018-09-18 | 2019-01-08 | 浙江洋铭工贸有限公司 | Paint film and preparation method thereof in radiator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337097A (en) * | 2011-07-01 | 2012-02-01 | 哈尔滨理工大学 | Preparation method of adhesive for powder-filled high-thermal-conductivity mica tape |
| CN103087665A (en) * | 2013-01-31 | 2013-05-08 | 合肥工业大学 | High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof |
| CN103131364A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Preparation method of single component room temperature curing epoxy construction glue |
| CN104371274A (en) * | 2014-11-18 | 2015-02-25 | 中国科学院深圳先进技术研究院 | Modified alumina composite material, copper-coated substrate and preparation method of copper-coated substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008030910A1 (en) * | 2006-09-08 | 2008-03-13 | Lord Corporation | Flexible microelectronics adhesive |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337097A (en) * | 2011-07-01 | 2012-02-01 | 哈尔滨理工大学 | Preparation method of adhesive for powder-filled high-thermal-conductivity mica tape |
| CN103131364A (en) * | 2011-11-30 | 2013-06-05 | 常熟市辛庄镇前进五金厂 | Preparation method of single component room temperature curing epoxy construction glue |
| CN103087665A (en) * | 2013-01-31 | 2013-05-08 | 合肥工业大学 | High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof |
| CN104371274A (en) * | 2014-11-18 | 2015-02-25 | 中国科学院深圳先进技术研究院 | Modified alumina composite material, copper-coated substrate and preparation method of copper-coated substrate |
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