CN105690967B - A kind of boring discarded backing plate renovation process - Google Patents
A kind of boring discarded backing plate renovation process Download PDFInfo
- Publication number
- CN105690967B CN105690967B CN201610039631.3A CN201610039631A CN105690967B CN 105690967 B CN105690967 B CN 105690967B CN 201610039631 A CN201610039631 A CN 201610039631A CN 105690967 B CN105690967 B CN 105690967B
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- CN
- China
- Prior art keywords
- backing plate
- discarded
- boring
- thermosetting resin
- renovation process
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
Abstract
The present invention discloses a kind of boring discarded backing plate renovation process, and it includes step：After being drilled the backing plate recovery in hole, one layer of thermosetting resin of coating to pad surfaces, in the cavity that backing plate leaves when filling and leading up drilling, then 100 ~ 120 DEG C are heated up to, then toasted 1 ~ 1.5 hour；Plant fiber paper is used after baking again, backing plate two sides is fitted to and carries out hot pressing, generate new backing plate.The present invention does raw material with discarded backing plate, produces new backing plate, so as to reduce material cost, reduces solid waste and produces.
Description
Technical field
The present invention relates to boring backing plate field, more particularly to a kind of boring discarded backing plate renovation process.
Background technology
Printed circuit board drill hole is typically by 1 to several dual platens or multi-layer sheet, is piled up and is drilled out respectively with Digit Control Machine Tool
The through hole of kind diameter, to connect to form loop each sandwich circuit of printed wiring board.In Digit Control Machine Tool boring procedure, each double exposure
Wiring board bottom processed needs with a backing plate, for ensuring that wiring board is drilled out, and not injuring Digit Control Machine Tool table top.This pad
Plate is exactly printed circuit board drill hole backing plate.Printed circuit board drill hole mainly mixes various wood with backing plate with thermosetting resin at present
Fiber compacting forms.Current all printed circuit board drill hole backing plates are all disposable products, can not recycle, cause after use
The huge waste of resource, and due to current backing plate substantially all can not natural degradation, it is necessary to handle a large amount of solid waste, cause ring
Pollute in border.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of boring discarded backing plate regeneration side
Method, it is intended to it is all disposable products to solve existing backing plate, can not be recycled after use, causes the huge waste of resource, and due to
Can not natural degradation, it is necessary to handle a large amount of solid waste, the problem of causing environmental pollution.
Technical scheme is as follows：
A kind of boring discarded backing plate renovation process, wherein, including step：
A, after being drilled the backing plate recovery in hole, one layer of thermosetting resin of coating stays to pad surfaces when filling and leading up drilling in backing plate
Under cavity, then be heated up to 100 ~ 120 DEG C, then toast 1 ~ 1.5 hour；
B, plant fiber paper is used again after toasting, and is fitted to backing plate two sides and is carried out hot pressing, generates new backing plate.
Described boring discarded backing plate renovation process, wherein, coat one layer of thermosetting tree in the method for printing or roller coating
Fat is to pad surfaces.
Described boring discarded backing plate renovation process, wherein, the thermosetting resin be phenolic resin, Lauxite,
One kind in melmac.
Described boring discarded backing plate renovation process, wherein, addition volume ratio is filled out for 5 ~ 30% in the thermosetting resin
Material.
Described boring discarded backing plate renovation process, wherein, the filler is in talcum powder, calcium carbonate, aluminum oxide
It is a kind of.
Described boring discarded backing plate renovation process, wherein, the particle diameter of the filler is≤30 μm.
Described boring discarded backing plate renovation process, wherein, the condition of the hot pressing is：Pressure is 40 ~ 80KG/CM2,
Temperature is 120 ~ 170 DEG C.
Beneficial effect：The present invention does raw material with discarded backing plate, produces new backing plate, so as to reduce material cost, reduces solid
Body discarded object produces.
Brief description of the drawings
Fig. 1 is the structural representation for the backing plate for being drilled hole.
The structural representation for the backing plate that Fig. 2 obtains for the coated thermosetting resin of Fig. 1 backing plates and after toasting.
Fig. 3 is the structural representation that Fig. 2 pad surfaces are bonded the backing plate obtained after plant fiber paper.
Fig. 4 is the structural representation for the new backing plate that Fig. 3 backing plates generate after hot-forming.
Embodiment
The present invention provides a kind of boring discarded backing plate renovation process, to make the purpose of the present invention, technical scheme and effect
Clearer, clear and definite, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
The present invention provides a kind of boring discarded backing plate renovation process preferred embodiment, and it includes step：
A, after being drilled the backing plate recovery in hole, one layer of thermosetting resin of coating stays to pad surfaces when filling and leading up drilling in backing plate
Under cavity, then be heated up to 100 ~ 120 DEG C, then toast 1 ~ 1.5 hour；
Preferably, the present invention is to print or the method for roller coating coats one layer of thermosetting resin to pad surfaces.Wherein, institute
State one kind that thermosetting resin can be but be not limited in phenolic resin, Lauxite, melmac.The present invention is also in heat
Addition volume ratio is 5 ~ 30% fillers in thermosetting resin, with control cost and improves thermosetting resin dimensional stability.The filler
For one kind in talcum powder, calcium carbonate, aluminum oxide etc..The particle diameter of the filler is≤30 μm, in order to avoid influence borehole accuracy.
In the step A, printed circuit board drill hole be drilling with backing plate after discarded backing plate, positive and negative respectively with printing or
The methods of roller coating, one layer of thermosetting resin is coated, in the cavity that backing plate leaves when filling and leading up drilling, then is heated up to 100 ~ 120 DEG C（Such as
120℃）, then toast 1 ~ 1.5 hour（Such as 1 hour）, by thermosetting resin semi-solid preparation.
B, plant fiber paper is used again after toasting, and is fitted to backing plate two sides and is carried out hot pressing, generates new backing plate.
Preferably, the condition of the hot pressing is：Pressure is 40 ~ 80KG/CM2, temperature is 120 ~ 170 DEG C.It is it is highly preferred that hot
When thermosetting resin is phenolic resin, temperature is 150 ~ 170 DEG C；When thermosetting resin is melamine resin, temperature is 140 ~ 150 DEG C；
When thermosetting resin is Lauxite, temperature is 120 ~ 140 DEG C.
In the step B, plant fiber paper is used after baking again, backing plate two sides is fitted to and carries out hot pressing, can after hot pressing is complete
New backing plate is generated, to provide printed circuit board drill hole use.The present invention can also use the plant fiber paper of dipping thermosetting resin,
Fit to backing plate two sides and carry out hot pressing, to improve the adhesive property of backing plate and plant fiber paper.The present invention does original with discarded backing plate
Material, new backing plate is generated, so as to reduce cost, reduce solid waste generation.
Incorporated by reference to Fig. 1 ~ 4, Fig. 1 is the structural representation for the backing plate for being drilled hole, and Fig. 2 is the coated thermosetting tree of Fig. 1 backing plates
The structural representation of the backing plate obtained after fat and baking, Fig. 3 are that Fig. 2 pad surfaces are bonded the backing plate obtained after plant fiber paper
Structural representation, Fig. 4 are the structural representation for the new backing plate that Fig. 3 backing plates generate after hot-forming.Specifically, backing plate is discarded again
The step of generation method is：After being drilled Fig. 1 backing plates recovery in hole, one layer of thermosetting resin of coating fills and leads up drilling to Fig. 1 pad surfaces
When in the cavity that backing plate leaves, then be heated up to 100 ~ 120 DEG C, then toast 1 ~ 1.5 hour, obtain Fig. 2 backing plates；It is fine with plant again
Paper is tieed up, fits to Fig. 2 backing plates two sides, obtains Fig. 3 backing plates, Fig. 3 backing plates two sides carries out hot pressing, generates the new backing plates of Fig. 4.The present invention uses
Discarded backing plate does raw material, produces new backing plate, so as to reduce material cost, reduces solid waste and produces.
In summary, the boring discarded backing plate renovation process of one kind provided by the invention, the present invention do original with discarded backing plate
Material, new backing plate is produced, so as to reduce material cost, reduce solid waste and produce.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (4)
1. a kind of boring discarded backing plate renovation process, it is characterised in that including step：
A, after being drilled the backing plate recovery in hole, one layer of thermosetting resin of coating fills and leads up what is left during drilling in backing plate to pad surfaces
Cavity, then 100 ~ 120 DEG C are heated up to, then toast 1 ~ 1.5 hour；
B, plant fiber paper is used again after toasting, and is fitted to backing plate two sides and is carried out hot pressing, generates new backing plate；
Addition volume ratio is 5 ~ 30% fillers in the thermosetting resin；
The filler is one kind in talcum powder, calcium carbonate, aluminum oxide；
The particle diameter of the filler is≤30 μm；
The fibrous paper is the plant fiber paper of dipping thermosetting resin.
2. boring discarded backing plate renovation process according to claim 1, it is characterised in that in the method for printing or roller coating
One layer of thermosetting resin is coated to pad surfaces.
3. boring discarded backing plate renovation process according to claim 1, it is characterised in that the thermosetting resin is phenol
One kind in urea formaldehyde, Lauxite, melmac.
4. boring discarded backing plate renovation process according to claim 1, it is characterised in that the condition of the hot pressing is：
Pressure is 40 ~ 80KG/CM2, temperature is 120 ~ 170 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610039631.3A CN105690967B (en) | 2016-01-21 | 2016-01-21 | A kind of boring discarded backing plate renovation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610039631.3A CN105690967B (en) | 2016-01-21 | 2016-01-21 | A kind of boring discarded backing plate renovation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105690967A CN105690967A (en) | 2016-06-22 |
| CN105690967B true CN105690967B (en) | 2017-11-17 |
Family
ID=56226656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610039631.3A Active CN105690967B (en) | 2016-01-21 | 2016-01-21 | A kind of boring discarded backing plate renovation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105690967B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655480B2 (en) * | 1989-08-11 | 1994-07-27 | 日本製紙株式会社 | Laminated board manufacturing method |
| CN1492728A (en) * | 2002-10-21 | 2004-04-28 | 宇瑞电子股份有限公司 | Drill hole press board substitution method of printed circuit board |
| CN102490438B (en) * | 2011-11-30 | 2014-04-09 | 深圳市德信义贸易行 | Regeneration method for phenolic aldehyde Bakelite plates |
| CN103642149B (en) * | 2013-11-07 | 2016-02-03 | 陈元文 | A kind of making of recyclable drilling liner plate of circuit board and recovery process |
-
2016
- 2016-01-21 CN CN201610039631.3A patent/CN105690967B/en active Active
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| Publication number | Publication date |
|---|---|
| CN105690967A (en) | 2016-06-22 |
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