CN105679473B - The layered manufacturing method of dielectric function gradient insulator - Google Patents

The layered manufacturing method of dielectric function gradient insulator Download PDF

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Publication number
CN105679473B
CN105679473B CN201610031582.9A CN201610031582A CN105679473B CN 105679473 B CN105679473 B CN 105679473B CN 201610031582 A CN201610031582 A CN 201610031582A CN 105679473 B CN105679473 B CN 105679473B
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insulator
layer
resin
dielectric
resin mixture
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CN105679473A (en
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张冠军
李文栋
刘哲
张丽元
穆海宝
邓军波
徐曼
徐阳
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Xian Jiaotong University
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/04—Insulators

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Insulating Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention discloses the layered manufacturing method of dielectric function gradient insulator, and the manufacture by being layered superposition on the basis of conventional insulators obtains the insulator of dielectric parameter graded.Preparation method is comprised the following steps：(1) solve packing volume mark；(2) calculate the mass ratio of each raw material in each layer resin mixture；(3) prepare the resin mixture of different filler filling proportions；(4) vacuum stirring degassing；(5) above-mentioned compound is successively superimposed in a mold by desired sequence；(6) secondary solidification the demoulding are carried out in high temperature environments to insulator.This insulator in the present invention can realize graded of the dielectric parameter in interior insulator, so as to improve the electric durability energy of insulator.

Description

The layered manufacturing method of dielectric function gradient insulator
【Technical field】
The invention belongs to high voltage installation manufacture field, and in particular to the manufacture method of dielectric function gradient insulator.
【Background technology】
In ultra-high/extra-high voltage power equipment and pulse-power apparatus, the electric discharge destruction of solid insulation system happens occasionally, this Class malicious event is often caused by the uneven insulation electric durability energy weakness brought of electric field, brings very high skill to design, manufacture Art difficulty and cost, seriously jeopardize the safe and reliable operation of system, and limit equipment to enter to " miniaturization ", " integrated " direction One step develops.
It is generally believed that non-uniform electric is to cause insulation breakdown destruction, the major reason of resistance to electrical characteristics difference.For exhausted Most ultra-high/extra-high voltage power equipment and pulse-power apparatus, the born Electric Field Distribution of its insulation are often extremely uneven, special It is not that (such as the composition such as metallic conductor, solid insulation and air-liquid, vacuum is compound for junction between insulation system different materials The interface and surface of insulation system), due to the drastically change of dielectric material parameter, often bear the electric field for being several times as much as average field-strength Intensity.The electric field intensity excessively concentrated can not only reduce the edge flashing voltage of insulator, weaken its electric durability energy, and can band Carry out the shelf depreciation of insulator, aggravate the aging of insulant.
The problem concentrated for interior insulator and its along face internal field, traditional solution is mainly by increase Insulation size, change electrode-dielectric structure improving Electric Field Distribution, traditional method has effect often limited and excessively multiple Miscellaneous insulation system not only brings very big difficulty to manufacturing, while also bringing along the problem that much grow nonparasitically upon another plant." functionally gradient material Material " (Functionally Graded Material, FGM) appear as solve this problem provide a kind of brand-new think of Road.Such material in preparation process, by using advanced technique, the material of different performance is combined, and is made material Characteristic is presented continuous gradient change in material internal different spatial, and stress raisers problem is overcome with " active ".
The concept of FGM can also introduce high voltage installation manufacture field, because according to Theory of Electromagnetic Field, if suitably can increase Dielectric constant/the electrical conductivity in electric field concentration of local region, it is possible to reduce the electric field intensity in the region, reaches homogenizing Electric Field Distribution Purpose.At present, the preparation method of FGM materials mainly includes vapour deposition process, plasma spraying method, SHS process Method, powder metallurgic method etc., these methods are applied to metal, the preparation of ceramic-like FGM material, are not suitable for mainly with epoxy resin For the high voltage installation insulator that the polymer composites for representing are constituted.Accordingly, it would be desirable to research and develop for polymer composites The preparation technology of FGM insulators, to meet the needs that the present age and following high voltage installation further develop.
【The content of the invention】
It is an object of the invention to provide the layered manufacturing method of dielectric function gradient insulator, by the side for being layered superposition Formula causes the stepped spatial distribution of the packing density of interior insulator so that insulator dielectric parameter value (dielectric constant or Electrical conductivity) graded is spatially produced, finally realize the preparation of dielectric function gradient insulator.
To achieve these goals, the present invention is adopted the following technical scheme that：
The layered manufacturing method of dielectric function gradient insulator, comprises the following steps：
If step 1, insulator to be divided into dried layer, per layer of resin mixture structure mixed by resin matrix and filler Into；If the dielectric parameter value distribution gradient of dried layer, filler in each layer resin mixture is calculated according to per layer of dielectric parameter value Volume fraction；
Step 2, resin matrix include epoxy resin and firming agent, and both mass ratioes are 100:30～100；According to each layer Packing volume mark in resin mixture, the density value of all kinds of raw materials in binding resin compound calculate each layer resin mixture Raw material mass mixture ratio；
The raw material mass mixture ratio of step 3, each layer resin mixture calculated according to step 2, prepares the tree required for each layer Fat compound；In resin mixture required for each layer, the mass ratio of filler is determined by step 1；
Step 4, the resin mixture required for each layer is placed in into vacuum intracavity, is heated to 80 DEG C, and stirs in vacuum intracavity Resin mixture is mixed, disperses uniform filling, and fully remove bubble therein；
Step 5, instill curing accelerator in the resin mixture required for each layer；By the mixed with resin required for each layer Material is successively poured in insulator mold successively, carries out the preparation of successively gradient insulator；Pour one layer every time into and be warming up to 120 afterwards DEG C and stand 5～30min, after treating this layer of resin raw material gelation, then pour next layer into, and the above-mentioned intensification of repetition and stood Journey；Insulator is obtained after all layers of gelation；
Step 6, the insulator for preparing is heated to 120 DEG C carries out secondary solidification, more than hardening time 5h, after solidification The demoulding is obtained dielectric function gradient insulator.
Further, in step 1, the computational methods of packing volume mark are as follows：
First, the dielectric constant or conductivity value of per layer of interior insulator are given；Secondly, according to the asymmetric of formula (1) Bruggeman Effective medium equations, solve accordingly per layer of packing volume mark：
In formula (1), φtFor required packing volume mark, value is between 0～1；K joins for the dielectric given in step 1 Numerical value；The dielectric parameter value is dielectric constant or electrical conductivity；kjFor the dielectric parameter value of resin matrix；ktFor the dielectric of filler Parameter value；α is the coefficient relevant with filler shape, and span is 0～1.
Further, in step 2, the computational methods of raw material mass mixture ratio are as follows：
First, according to packing volume mark φ obtained in step 1t, solve packing quality fraction, computing formula such as formula (2) shown in：
In formula (2), θtFor packing quality fraction, value is between 0～1；msFor the mass fraction of epoxy resin, unit is g；mgFor the mass fraction of firming agent, unit is g；ρt、ρs、ρgIt is followed successively by the density of filler, epoxy resin and firming agent, unit For g/cm3；
Secondly, according to packing quality fraction θt, the mass ratio of resin mixture is tried to achieve, specifically as shown in formula (3)：
In formula (3), Ps、Pg、PtThe respectively mass ratio of epoxy resin, firming agent and filler.
Further, resin mixture is processed using mechanical agitation mode in vacuum intracavity in step 4, process time is 0.5～1h, in vacuum chamber, air pressure is less than 0.02MPa.
Further, in resin matrix, epoxy resin is E-44 or E-51 resins, and firming agent is acid anhydride type curing agent, Gu Change accelerator is 2,4,6- tri- (dimethylamino methyl) phenol, and curing accelerator quality is the 0.15% of resin mixture quality.
Further, firming agent is methyl tetrahydro phthalic anhydride or methylhexahydrophthalic anhydride.
Further, described filler is Zinc Oxide, silicon dioxide, aluminium oxide, titanium dioxide, Barium metatitanate., barium dioxide, zirconium Lead titanates, tin ash, antimony-doped stannic oxide, tin-doped indium oxide, carborundum, GaAs, CuBr, white carbon black, graphite, carbon fiber, carbon One or more compound in nanotube, Graphene, filler form is spherical shape, lamellar or threadiness, and packing material size scope is 0.1～100 μm.
Further, the material of the insulator mold is rustless steel, with round table-like or cylindrical cavity.
Compared with prior art, the present invention has following beneficial technique effect：It is exhausted that the present invention provides dielectric function gradient The layered manufacturing method of edge, the space for by way of being layered superposition causing the packing density of interior insulator stepped point Cloth, makes insulator dielectric parameter (dielectric constant or electrical conductivity) spatially produce graded, finally realizes dielectric function ladder The preparation of degree insulator.Using the inventive method can make in insulator produce Gradient distribution dielectric parameter (dielectric constant or Electrical conductivity) distribution, so as to optimize interior insulator and the Electric Field Distribution along face, improves the electric durability energy of insulator.
【Description of the drawings】
Fig. 1 is method of the present invention flow chart；
Structural representations of the Fig. 2 for specific embodiment dielectric functionally gradient insulator；
Fig. 3 be in specific embodiment insulator and dielectric constant be uniformly 4 the homogeneous insulator of epoxy resin identical Contrast schematic diagram of the AC high voltage interpolar along face electric field intensity.
【Specific embodiment】
Refer to shown in Fig. 1, the layered manufacturing method of dielectric function gradient insulator of the present invention is comprised the following steps：
If step 1, insulator to be divided into dried layer, per layer of resin mixture structure mixed by resin matrix and filler Into；If the dielectric parameter value distribution gradient of dried layer, filler in each layer resin mixture is calculated according to per layer of dielectric parameter value Volume fraction；
Step 2, resin matrix include epoxy resin and firming agent, and both mass ratioes are 100:30～100；According to each layer Packing volume mark in resin mixture, the density value of all kinds of raw materials in binding resin compound calculate each layer resin mixture Raw material mass mixture ratio；
The raw material mass mixture ratio of step 3, each layer resin mixture calculated according to step 2, prepares the tree required for each layer Fat compound；In resin mixture required for each layer, the mass ratio of filler is determined by step 1；
Step 4, the resin mixture required for each layer is placed in into vacuum intracavity, is heated to 80 DEG C, and stirs in vacuum intracavity Resin mixture is mixed, disperses uniform filling, and fully remove bubble therein；
Step 5, instill curing accelerator in the resin mixture required for each layer；By the mixed with resin required for each layer Material is successively poured in insulator mold successively, carries out the preparation of successively gradient insulator；Pour one layer every time into and be warming up to 120 afterwards DEG C and stand 5～30min, after treating this layer of resin raw material gelation, then pour next layer into, and the above-mentioned intensification of repetition and stood Journey；Insulator is obtained after all layers of gelation；
Step 6, the insulator for preparing is heated to 120 DEG C carries out secondary solidification, more than hardening time 5h, after solidification The demoulding is obtained dielectric function gradient insulator.
In step 1, the computational methods of packing volume mark are as follows：
First, the dielectric constant or conductivity value of per layer of interior insulator are given；Secondly, according to the asymmetric of formula (1) Bruggeman Effective medium equations, solve accordingly per layer of packing volume mark：
In formula (1), φtFor required packing volume mark, value is between 0～1；K joins for the dielectric given in step 1 Numerical value；The dielectric parameter value is dielectric constant or electrical conductivity；kjFor the dielectric parameter value of resin matrix；ktFor the dielectric of filler Parameter value；α is the coefficient relevant with filler shape, and span is 0～1.
In step 2, the computational methods of raw material mass mixture ratio are as follows：
First, according to packing volume mark φ obtained in step 1t, solve packing quality fraction, computing formula such as formula (2) shown in：
In formula (2), θtFor packing quality fraction, value is between 0～1；msFor the mass fraction of epoxy resin, unit is g；mgFor the mass fraction of firming agent, unit is g；ρt、ρs、ρgIt is followed successively by the density of filler, epoxy resin and firming agent, unit For g/cm3；
Secondly, according to packing quality fraction θt, the mass ratio of resin mixture is tried to achieve, specifically as shown in formula (3)：
In formula (3), Ps、Pg、PtThe respectively mass ratio of epoxy resin, firming agent and filler.
In resin matrix of the present invention, epoxy resin is E-44 or E-51 resins, and firming agent is acid anhydride type curing agent, and solidification promotees Enter agent for 2,4,6- tri- (dimethylamino methyl) phenol, curing accelerator quality for resin mixture quality 0.15%.
Currently preferred firming agent is methyl tetrahydro phthalic anhydride or methylhexahydrophthalic anhydride.
Currently preferred filler is Zinc Oxide, silicon dioxide, aluminium oxide, titanium dioxide, Barium metatitanate., barium dioxide, zirconium Lead titanates, tin ash, antimony-doped stannic oxide, tin-doped indium oxide, carborundum, GaAs, CuBr, white carbon black, graphite, carbon fiber, carbon One or more compound in nanotube, Graphene, filler form is spherical shape, lamellar or threadiness, and packing material size scope is 0.1～100 μm.
Present disclosure is described in further detail below in conjunction with specific embodiment and accompanying drawing.
It is illustrated in figure 2 dielectric function gradient insulator.The insulator is round table-like, and concrete size is as shown in Fig. 2 be divided into Ten layers, the relative dielectric constant of insulator presses layer distribution gradient, to meet the requirement of the average field-strength between high-field electrode.Insulation Sub- layers of material is mixed by E-51 epoxy resin, methyl tetrahydro phthalic anhydride and barium titanate crystal (spherical shape microgranule, mean diameter are 1 μm) Conjunction is prepared from, and its preparation method is comprised the following steps：
Step 1,2, given resin and firming agent mass ratio are 100:90, according to every layer of dielectric constant values meter that table 1 is given The mass ratio of resin, firming agent and filler is calculated, as shown in table 2, the value of parameters is as follows during calculating：Resin matrix (E-51 Epoxy resin and methyl tetrahydro phthalic anhydride firming agent) dielectric constant values be 3；The dielectric constant values of Barium metatitanate. filler are 2000；α takes For 1 (correspondence spherical particle)；The density of resin and firming agent is 1.20g/cm3；The density of Barium metatitanate. filler is 6.08g/ cm3。
1 layers of material dielectric constant values of table
Level number 1 2 3 4 5 6 7 8 9 10
Dielectric constant 65.7 19.8 13.5 9.9 7.5 5.9 4.6 4.0 4.0 4.0
2 each component mass ratio of table
Level number 1 2 3 4 5 6 7 8 9 10
E-51 epoxy resin 100 100 100 100 100 100 100 100 100 100
Methyl tetrahydro phthalic anhydride 90 90 90 90 90 90 90 90 90 90
Barium titanate crystal 1800 860 640 470 350 240 150 100 100 100
Step 3, at normal temperatures and pressures by E-51 epoxy resin, the matter of methyl tetrahydro phthalic anhydride and barium titanate crystal according to table 2 Amount ratio is mixed, and obtains the resin mixture of 10 parts of different Filled with Barium Titanate ratios；
Step 4, each part resin mixture is placed in vacuum intracavity (air pressure is 0.01MPa), is heated to 80 DEG C and carries out machine Tool is stirred, and mixing time is 0.5h, makes filler dispersed in compound, and fully removes the bubble in compound.
Step 5, each part resin mixture is down to into room temperature, instills 2,4,6- tri- (dimethylamino methyl) phenol thereto solid Change accelerator (addition quality is the 0.15% of above-mentioned resin mixture gross mass)；By the tree of above-mentioned several pieces difference filling proportion Fat compound is successively poured in insulator mold successively by proportion of filler, carries out the preparation of successively gradient insulator；Mould is not by Rust steel makes, and inner chamber is truncated cone-shaped, inner chamber basal diameter 120mm, top surface diameter 20mm, high 50mm.Mixed with resin is poured into successively During material, the 10th layer of resin mixture is poured first into, the thickness for controlling this layer is 5mm, pours one layer every time into and is warming up to 120 DEG C afterwards And 10min is stood, after treating this layer of resin raw material gelation, pour the 9th layer of resin mixture, and the above-mentioned intensification of repetition and standing into Process；Insulator is obtained after all layers of gelation.
Step 6, the insulator for preparing is heated to 120 DEG C carries out secondary solidification, hardening time is 10h, after solidification The demoulding is obtained dielectric function gradient insulator.
By adding 10kV power frequency ac voltages between electrode, can obtain the epoxy of insulator and average dielectric constant is obtained Comparison diagram of the resin insulator along face electric field magnitude, as shown in Figure 3；And per layer of maximum field intensity, as shown in table 3.Can be with Will become apparent from：Be compared to homogeneous insulator, FGM insulators it is more uniform along face electric-field intensity distribution, which insulate in homogenizing Son has obvious advantage in terms of the field intensity of face.
3 insulator of table is along face maximum field strength

Claims (8)

1. the layered manufacturing method of dielectric function gradient insulator, it is characterised in that comprise the following steps：
If step 1, insulator to be divided into dried layer, per layer is constituted by the resin mixture that resin matrix and filler are mixed； If the dielectric parameter value distribution gradient of dried layer, packing volume in each layer resin mixture is calculated according to per layer of dielectric parameter value Fraction；
Step 2, resin matrix include epoxy resin and firming agent, and both mass ratioes are 100:(30～100)；According to each layer tree Packing volume mark in fat compound, the density value of all kinds of raw materials in binding resin compound calculate each layer resin mixture Raw material mass mixture ratio；
The raw material mass mixture ratio of step 3, each layer resin mixture calculated according to step 2, prepares the resin required for each layer and mixes Close material；In resin mixture required for each layer, the mass ratio of filler is determined by step 1；
Step 4, the resin mixture required for each layer is placed in into vacuum intracavity, is heated to 80 DEG C, and set in the stirring of vacuum intracavity Fat compound, disperses uniform filling, and fully removes bubble therein；
Step 5, instill curing accelerator in the resin mixture required for each layer；By the resin mixture required for each layer according to It is secondary successively to pour in insulator mold, carry out the preparation of successively gradient insulator；Pour one layer every time into and be warming up to 120 DEG C afterwards simultaneously 5～30min is stood, after treating this layer of resin raw material gelation, then next layer is poured into, and the above-mentioned intensification of repetition and standing process； Insulator is obtained after all layers of gelation；
Step 6, the insulator for preparing is heated to 120 DEG C carries out secondary solidification, more than hardening time 5h, curing and demolding Prepared dielectric function gradient insulator.
2. the layered manufacturing method of dielectric function gradient insulator according to claim 1, it is characterised in that in step 1 The computational methods of packing volume mark are as follows：
First, the dielectric constant or conductivity value of per layer of interior insulator are given；Secondly, according to the asymmetric of formula (1) Bruggeman Effective medium equations, solve accordingly per layer of packing volume mark：
k t - k k 3 = ( 1 - φ t / α ) k t - k j k j 3 - - - ( 1 )
In formula (1), φtFor required packing volume mark, value is between 0～1；K is dielectric parameter value given in step 1； The dielectric parameter value is dielectric constant or electrical conductivity；kjFor the dielectric parameter value of resin matrix；ktFor the dielectric parameter of filler Value；α is the coefficient relevant with filler shape, and span is 0～1.
3. the layered manufacturing method of dielectric function gradient insulator according to claim 2, it is characterised in that in step 2 The computational methods of raw material mass mixture ratio are as follows：
First, according to packing volume mark φ obtained in step 1t, solve packing quality fraction, computing formula such as formula (2) institute Show：
θ t = φ t ρ t φ t ρ t + ( m g + m s ) ρ t ρ g m s ρ g + m g ρ s ( 1 - φ t ) - - - ( 2 )
In formula (2), θtFor packing quality fraction, value is between 0～1；msFor the mass fraction of epoxy resin, unit is g；mg For the mass fraction of firming agent, unit is g；ρt、ρs、ρgThe density of filler, epoxy resin and firming agent is followed successively by, unit is g/ cm3；
Secondly, according to packing quality fraction θt, the mass ratio of resin mixture is tried to achieve, specifically as shown in formula (3)：
P s : P g : P t = 100 : m g m s × 100 : ( m g + m s ) θ t m s ( 1 - θ t ) × 100 - - - ( 3 )
In formula (3), Ps、Pg、PtThe respectively mass ratio of epoxy resin, firming agent and filler.
4. the layered manufacturing method of dielectric function gradient insulator according to claim 1, it is characterised in that in step 4 Resin mixture is processed using mechanical agitation mode in vacuum intracavity, process time is 0.5～1h, and air pressure is less than in vacuum chamber 0.02MPa。
5. the layered manufacturing method of dielectric function gradient insulator according to claim 1, it is characterised in that resin matrix In, epoxy resin is E-44 or E-51 resins, and firming agent is acid anhydride type curing agent, and curing accelerator is 2,4,6- tri- (dimethylamine Ylmethyl) phenol, curing accelerator quality for resin mixture quality 0.15%.
6. the layered manufacturing method of dielectric function gradient insulator according to claim 1, it is characterised in that firming agent is Methyl tetrahydro phthalic anhydride or methylhexahydrophthalic anhydride.
7. the layered manufacturing method of dielectric function gradient insulator according to claim 1, it is characterised in that described filler For Zinc Oxide, silicon dioxide, aluminium oxide, titanium dioxide, Barium metatitanate., barium dioxide, lead zirconate titanate, tin ash, mix antimony dioxy Change one or more in stannum, tin-doped indium oxide, carborundum, GaAs, CuBr, white carbon black, graphite, carbon fiber, CNT, Graphene It is compound, filler form is spherical shape, lamellar or threadiness, and packing material size scope is 0.1～100 μm.
8. the layered manufacturing method of dielectric function gradient insulator according to claim 1, it is characterised in that the insulation The material of submodule tool is rustless steel, with round table-like or cylindrical cavity.
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