CN108447631B - GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution - Google Patents
GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution Download PDFInfo
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- CN108447631B CN108447631B CN201810217653.3A CN201810217653A CN108447631B CN 108447631 B CN108447631 B CN 108447631B CN 201810217653 A CN201810217653 A CN 201810217653A CN 108447631 B CN108447631 B CN 108447631B
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
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Abstract
The invention discloses a GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution, which mainly comprises the following steps: firstly, preparing an epoxy resin material; then, processing by adopting a step curing method; and finally, performing gradient design on the epoxy resin basin-type insulator: dividing the surface of the epoxy resin basin-type insulator into five closely connected rings from inside to outside, and enabling the relative dielectric constant of the rings to be reduced and then increased; and placing the epoxy resin basin-type insulator in magnetron sputtering equipment, and sputtering for different time at different positions according to the U-shaped distribution gradient within the time range of 0min-60min to obtain the basin-type insulator with two-dimensional gradient distribution. The invention aims at relieving the overhigh local electric field under the alternating voltage and improving the electric resistance of an insulation system; the method has important theoretical value and engineering significance for improving the running stability of the GIS and the safety of a power system.
Description
Technical Field
The invention belongs to the field of modified polymer materials in high-voltage equipment manufacturing and preparation thereof, relates to a GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution, and particularly relates to a GIS epoxy resin insulator design method with two-dimensional dielectric constant U-shaped gradient distribution.
Background
In recent years, with the development demand of high-voltage and high-capacity power transmission of a power system, gas insulated metal enclosed switchgear (GIS) and gas insulated metal enclosed power transmission lines (GIL) have attracted attention and are widely used due to the advantages of large transmission capacity, small floor area, high reliability and the like. The basin-type insulator plays a role in mechanical support and also plays a decisive key role in the safe and stable operation of the whole GIS and GIL as an electrical insulator. However, even in 1000kV alternating current extra-high voltage engineering with severe quality, the epoxy casting insulator still frequently fails.
It is considered that the high non-uniformity of the electric field distribution is the root cause of the insulation breakdown and the poor withstand performance. At interfaces of different media, e.g. metallic conductors, insulators, SF6At the gas triple junction, the electric field distribution is not uniform due to the rapid change of the dielectric parameters, and the local electric field distortion is serious, so that the local discharge occurs. On the one hand, the insulation aging is accelerated, and on the other hand, flashover is caused, and the electrical resistance of the insulation is reduced. At present, to mentionTo improve the dielectric strength, methods of optimizing the shape of the electrode or the insulating structure are often used, such as adding grading rings, shielding cages and improving the shape of the insulator. Although the electric field distribution is improved, the insulation structure is more complicated and the effect is limited.
The method is characterized in that a Functional Gradient Material (FGM) concept in the field of materials science is applied to the field of electrical insulation, and the electric field distribution under alternating current is regulated and controlled by constructing an insulation structure with non-uniformly distributed relative dielectric constants, so that the electric field distribution is promoted to be uniform, and the aim of relieving overhigh local electric field is fulfilled. By means of an inorganic filler centrifugal manufacturing technology, a professor Okubo of Japan famous ancient house university constructs a composite material FGM insulator with a circular truncated cone and a disc shape, and researches show that the maximum electric field intensity at a triple junction point is effectively reduced, and the flashover voltage is obviously improved. However, this technique has poor controllability and complicated influence factors, and it is difficult to manufacture the epoxy insulator in large quantities. The magnetron sputtering method is applied to the epoxy resin base surface, and the two-dimensional FGM insulator is constructed by controlling the target material type, sputtering time, sputtering power and the like, so that the method has the advantages of simple and convenient operation, easy control and the like, and provides a brand new method for manufacturing the FGM insulator.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution.
The technical scheme provided by the invention for solving the technical problem is as follows: the GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution comprises the following steps:
1) preparing an epoxy resin material:
(1) adding the epoxy resin base, the curing agent and the alumina into a mixing tank according to the proportion of 100:38:330 to obtain an epoxy resin mixed material, and keeping the temperature at 130 ℃;
(2) stirring for 0.5 hour by a motor, and vacuum degassing for one hour under the vacuum degree of-0.1 MPa;
(3) pouring the epoxy resin mixed material in the step (2) into a preheated mold, wherein the preheating temperature is 130 ℃, and is not lower than 1 hour;
2) adopts a step curing method for treatment, and the curing process comprises two steps:
(1) firstly, putting the mould into an oven to perform primary curing for 8 hours at 130 ℃, and then demoulding;
(2) putting the demoulded product into an oven for secondary curing at 130 ℃ for 8 hours, and cooling to obtain the epoxy resin basin-type insulator;
3) carrying out gradient design on the epoxy resin basin-type insulator:
(1) dividing the surface of the epoxy resin basin-type insulator into five closely connected rings from inside to outside, and enabling the relative dielectric constant of the rings to be reduced and then increased;
(2) and placing the epoxy resin basin-type insulator in magnetron sputtering equipment, and sputtering for different time at different positions according to the U-shaped distribution gradient within the time range of 0min-60min to obtain the basin-type insulator with two-dimensional gradient distribution.
And in the step 3), sputtering is carried out at different positions for different time according to the U-shaped distribution gradient in the step (2), wherein the sputtering time is respectively 60min, 30min, 0min, 30min and 60min from inside to outside.
And in the step 3), sputtering is carried out at different positions for different time according to the U-shaped distribution gradient in the step (2), wherein the sputtering time is respectively 40min, 20min, 0min, 20min and 40min from inside to outside.
And in the step 3), sputtering is carried out at different positions for different time according to the U-shaped distribution gradient in the step (2), wherein the sputtering time is respectively 20min, 10min, 0min, 10min and 20min from inside to outside.
The radio frequency voltage in the sputtering process in the step (2) in the step 3) is 650V, and the current is 120 mA.
And in the step 3), the sputtering in the step (2) is carried out in an argon atmosphere, and the flow rate of argon is 50-60 SCCM.
The epoxy resin base in the step 1) is preferably American import Henschel brand CT 5531.
The curing agent in the step 1) is preferably HY 5533.
TiO is preferably selected as the target material used in the magnetron sputtering in the step (2) in the step 3)2
Advantageous effects
The invention uses the concept of absorbing Functional Gradient Materials (FGM) for reference, and innovatively applies a magnetron sputtering method to prepare high dielectric constant inorganic TiO2、BaTiO3And sputtering to the epoxy resin base surface, forming two-dimensional gradient distribution of the surface dielectric constant of the epoxy resin by controlling the sputtering time length, and constructing a surface dielectric function gradient material, thereby achieving the purposes of relieving overhigh local electric field under the alternating voltage and improving the electric resistance of an insulation system.
The method has important theoretical value and engineering significance for improving the running stability of the GIS and the safety of the power system.
Drawings
Fig. 1 is a simulation designed epoxy basin insulator with a U-shaped gradient distribution of dielectric constant in two dimensions.
Detailed Description
The invention is further illustrated by the following specific examples and the accompanying drawings. The examples are intended to better enable those skilled in the art to better understand the present invention and are not intended to limit the present invention in any way.
The casting material of the basin-type insulator used in the invention is American imported Hensman CT5531 epoxy resin and HY5533 curing agent; the two-dimensional linear gradient distribution of the epoxy resin base is realized by a magnetron sputtering method, and the target material used by magnetron sputtering includes but is not limited to TiO2And BaTiO3Provided by Zhongnuo new materials (Beijing) science and technology, Inc.
Stirring for 0.5 hour by a motor, and vacuum degassing for one hour under the vacuum degree of-0.1 MPa; the preheating temperature is 130 ℃, and is not lower than 1 hour; primary curing is carried out for 8 hours at 130 ℃; the secondary curing was carried out at 130 ℃ for 8 hours.
The magnetron sputtering preparation device is a DK-92L type electric control cabinet and a BILON-T-5001 type low-temperature cooling circulating device; the type of the two-dimensional gradient distribution is a linear U-shaped distribution.
Example 1
1) Adding the epoxy resin base, the curing agent and the alumina into a mixing tank according to the proportion of 100:38:330, and keeping the temperature at 130 ℃; starting a motor for stirring and vacuum degassing; pushing the preheated mould into a casting tank for evacuation treatment; and pouring the mixed epoxy resin mixed material into a mould through pouring equipment.
2) The epoxy resin is treated by a step curing method, and the curing process comprises two steps: firstly, putting the mould subjected to vacuum treatment into an oven for primary curing, and then demoulding; and putting the insulator into an oven again for secondary curing, and cooling to obtain the epoxy resin basin-type insulator.
3) The design of gradient is carried out to epoxy basin formula insulator, is to divide into five rings that closely link to each other from inside to outside its surface, makes the relative dielectric constant of annular reduce earlier then increase:
the epoxy resin basin-type insulator is placed in magnetron sputtering equipment, sputtering is carried out for different time at different positions according to U-shaped distribution gradient, and the sputtering time is respectively 60min, 30min, 0min, 30min and 60min from inside to outside, so that the basin-type insulator with two-dimensional gradient distribution can be obtained.
The radio frequency voltage in the sputtering process is 650V, and the current is 120 mA; sputtering was carried out under an argon atmosphere with an argon flow rate of 50 SCCM.
Example 2
1) Adding the epoxy resin base, the curing agent and the alumina into a mixing tank according to the proportion of 100:38:330, and keeping the temperature at 130 ℃; starting a motor for stirring and vacuum degassing; pushing the preheated mould into a casting tank for evacuation treatment; and pouring the mixed epoxy resin mixed material into a mould through pouring equipment.
2) The epoxy resin is treated by a step curing method, the curing process is divided into two steps, firstly, the mould after vacuum treatment is put into an oven for primary curing, and then demoulding is carried out; and putting the insulator into an oven again for secondary curing, and cooling to obtain the epoxy resin basin-type insulator.
3) The design of gradient is carried out to epoxy basin formula insulator, is to divide into five rings that closely link to each other from inside to outside its surface, makes the relative dielectric constant of annular reduce earlier then increase:
the epoxy resin basin-type insulator is placed in magnetron sputtering equipment, sputtering is carried out on different positions for different time according to U-shaped distribution gradient, and the sputtering time is respectively 40min, 20min, 0min, 20min and 40min from inside to outside, so that the basin-type insulator with two-dimensional gradient distribution can be obtained.
The radio frequency voltage in the sputtering process is 650V, and the current is 120 mA; sputtering was performed under an argon atmosphere with an argon flow rate of 55 SCCM.
Example 3
1) Adding the epoxy resin base, the curing agent and the alumina into a mixing tank according to the ratio of 100:38:330, heating to 130 ℃, starting a motor, stirring, and carrying out vacuum degassing; pushing the preheated mould into a casting tank for evacuation treatment; and pouring the mixed epoxy resin mixed material into a mould through pouring equipment.
2) The epoxy resin is treated by a step curing method, and the curing process comprises two steps: and firstly, placing the mold after vacuum treatment into an oven for primary curing, then demolding, placing into the oven again for secondary curing, and cooling to obtain the epoxy resin basin-type insulator.
3) The design of gradient is carried out to epoxy basin formula insulator, is to divide into five rings that closely link to each other from inside to outside its surface, makes the relative dielectric constant of annular reduce earlier then increase:
the epoxy resin basin-type insulator is placed in magnetron sputtering equipment, sputtering is carried out for different time at different positions according to U-shaped distribution gradient, and the sputtering time is respectively 20min, 10min, 0min, 10min and 20min from inside to outside, so that the basin-type insulator with two-dimensional gradient distribution can be obtained.
The radio frequency voltage in the sputtering process is 650V, and the current is 120 mA; sputtering was performed under an argon atmosphere with an argon flow rate of 60 SCCM.
Fig. 1 is a simulation-designed epoxy resin basin-type insulator with two-dimensional dielectric constant U-shaped gradient distribution, the insulator with two-dimensional dielectric constant gradient distribution is constructed by controlling sputtering time, and further, electric field distribution on the surface of the insulator under alternating voltage is flexibly regulated and controlled, and the electricity resistance of the insulator for the GIS is improved.
Fig. 1 is a simulation-designed epoxy resin basin-type insulator with U-shaped gradient distribution of dielectric constant, and it can be seen from the figure that the relative dielectric constant along the surface from the ground end to the high-voltage end is first decreased and then increased to form U-shaped distribution. Compared with the basin-type insulator made of pure epoxy resin, the design of the U-shaped gradient reduces the field intensity of the three junction points of the high-voltage end and the field intensity of the grounding end, so that the surface electric field of the basin-type insulator is distributed more uniformly, and the electric resistance of the insulation system is improved.
Claims (9)
1. The GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution is characterized by comprising the following steps of:
1) preparing an epoxy resin material:
(1) adding the epoxy resin base, the curing agent and the alumina into a mixing tank according to the proportion of 100:38:330 to obtain an epoxy resin mixed material, and keeping the temperature at 130 ℃;
(2) stirring for 0.5 hour by a motor, and vacuum degassing for one hour under the vacuum degree of-0.1 MPa;
(3) pouring the epoxy resin mixed material in the step (2) into a preheated mould: the preheating temperature is 130 ℃, and is not lower than 1 hour;
2) adopts a step curing method for treatment, and the curing process comprises two steps:
(1) firstly, putting the mould into an oven to perform primary curing for 8 hours at 130 ℃, and then demoulding;
(2) putting the demoulded product into an oven for secondary curing at 130 ℃ for 8 hours, and cooling to obtain the epoxy resin basin-type insulator;
3) carrying out gradient design on the epoxy resin basin-type insulator:
(1) dividing the surface of the epoxy resin basin-type insulator into five closely connected rings from inside to outside, and enabling the relative dielectric constant of the rings to be reduced and then increased;
(2) and placing the epoxy resin basin-type insulator in magnetron sputtering equipment, and sputtering for different time at different positions according to the U-shaped distribution gradient within the time range of 0min-60min to obtain the basin-type insulator with two-dimensional gradient distribution.
2. The method for designing the GIS insulator with the two-dimensional dielectric constant U-shaped gradient distribution according to claim 1, wherein in the step 3), sputtering is performed at different positions for different times according to the U-shaped gradient distribution in the step (2), and the sputtering time is 60min, 30min, 0min, 30min and 60min from inside to outside respectively.
3. The method for designing the GIS insulator with the two-dimensional dielectric constant U-shaped gradient distribution according to claim 1, wherein in the step 3), sputtering is performed at different positions for different times according to the U-shaped gradient distribution in the step (2), and the sputtering time is respectively 40min, 20min, 0min, 20min and 40min from inside to outside.
4. The method for designing the GIS insulator with the two-dimensional dielectric constant U-shaped gradient distribution according to claim 1, wherein in the step 3), sputtering is performed at different positions for different times according to the U-shaped gradient distribution in the step (2), and the sputtering time is respectively 20min, 10min, 0min, 10min and 20min from inside to outside.
5. The method for designing the GIS insulator with the two-dimensional U-shaped gradient distribution of dielectric constant according to claim 1, wherein the radio frequency voltage in the sputtering process in the step (2) in the step 3) is 650V, and the current is 120 mA.
6. The GIS insulator design method with two-dimensional dielectric constant U-shaped gradient distribution according to claim 1, wherein the sputtering in the substep (2) in the step 3) is performed under argon atmosphere, and the flow rate of argon gas is 50-60 SCCM.
7. The method for designing the GIS insulator with the two-dimensional U-shaped gradient distribution of dielectric constant according to claim 1, wherein the epoxy resin in step 1) is American imported Henschel brand CT 5531.
8. The method for designing the GIS insulator with the two-dimensional U-shaped gradient distribution of dielectric constant according to claim 1, wherein the curing agent in the step 1) is HY 5533.
9. The method for designing the GIS insulator with the two-dimensional dielectric constant U-shaped gradient distribution according to claim 1, wherein the target material used in the magnetron sputtering in the step (2) in the step 3) is TiO2。
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| CN109992851A (en) * | 2019-03-15 | 2019-07-09 | 天津大学 | A kind of dielectric constant distribution optimization method of GIS functionally gradient insulator |
| CN111599548B (en) * | 2020-05-28 | 2021-10-22 | 天津大学 | Manufacturing method of flexible interface functional gradient basin-type insulator for extra-high voltage alternating current GIL |
| CN111599554A (en) * | 2020-05-28 | 2020-08-28 | 天津大学 | Electric field optimization method for post insulator for extra-high voltage alternating current GIL |
| CN113470907B (en) * | 2021-06-23 | 2022-07-12 | 西安交通大学 | Method for inhibiting partial discharge at flange of GIS/GIL supporting insulator |
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| CN101840757A (en) * | 2010-05-21 | 2010-09-22 | 扬州东宇电气有限公司 | Manufacturing method for environment-friendly type insulator shell |
| CN105542399A (en) * | 2016-01-18 | 2016-05-04 | 西安交通大学 | Centrifugal manufacturing method for dielectric functional gradient insulator |
| CN105679473A (en) * | 2016-01-18 | 2016-06-15 | 西安交通大学 | Lamination fabrication method of dielectric functionally graded insulator |
| CN107578861A (en) * | 2017-09-01 | 2018-01-12 | 云南电网有限责任公司电力科学研究院 | Charge injection and device under a kind of transient suppression electric field |
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