CN105666794B - Carry disk injection mold and applied to the process on the mould - Google Patents
Carry disk injection mold and applied to the process on the mould Download PDFInfo
- Publication number
- CN105666794B CN105666794B CN201610003948.1A CN201610003948A CN105666794B CN 105666794 B CN105666794 B CN 105666794B CN 201610003948 A CN201610003948 A CN 201610003948A CN 105666794 B CN105666794 B CN 105666794B
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- Prior art keywords
- injection
- cast gate
- reel
- carrier band
- cover half
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- 238000002347 injection Methods 0.000 title claims abstract description 63
- 239000007924 injection Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 77
- 238000001746 injection moulding Methods 0.000 claims abstract description 31
- 230000004907 flux Effects 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000011799 hole material Substances 0.000 description 47
- 230000000694 effects Effects 0.000 description 9
- 230000003139 buffering effect Effects 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2737—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76494—Controlled parameter
- B29C2945/76531—Temperature
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses one kind to carry disk injection mold, including dynamic model and cover half, heat flux plates, upper cores are provided with the cover half, lower die is provided with the dynamic model, the mold insert for carrying reel injection molding on disk is provided with the upper cores, the note cast gate of injection material in oriented die cavity is set on the mold insert, the position of the note cast gate injection is between the axis hole of reel and the edge of reel, reduce unnecessary cost of labor input, the excision cast gate technological process need not be increased, improve the production efficiency of carrier band disk product.
Description
Technical field
The present invention relates to one kind to carry disk processing and forming technology, more specifically, it relates to a kind of carrier band disk injection mold
And applied to the process on the mould.
Background technology
In electronics field, the job streams such as storage, carrying, transport and the automation of electronic component are frequently referred to
Journey, transported in order to facilitate electronic component in these flows, be generally all by electronic component by carrier band wound on carrier band disk on,
Realize includes the reel of winding carrier band, is fixed on reel both ends to the packaging of electronic component, carrying and transport, in general carrier band disk
Limitation carries the position on reel width and is formed as discoid a pair of flanges, is in number of patent application
In one Chinese patent document of " 201220504503.9 ", a kind of carrier band reel is described, the reel passes through on flange
Multiple first opening portions and multiple second opening portions are set, realize the lightweight of reel, by making the second opening portion from spray
The outer circumferential side unshakable in one's determination to flange of loophole extends, and is detoured so as to which resin is less, in runny state is held, is not likely to produce into
Type density variation, warpage can be suppressed.
But this carrier band is with the weak point of reel, core unshakable in one's determination axis hole inner side formed with injection
The jet of shaping, jet can leave the cast gate of projection on axis hole madial wall after injection molding, can be just in order to facilitate axis hole
Conventional pattern is located in frame and used, after carrier band is with reel injection molding, it is necessary to worker by sharp instrument by the projection
Cast gate cut away, this undoubtedly again add one of technological process, so as to cause the production efficiency of the product to reduce, add worker
Work load, meanwhile, misoperation easily causes carrier band to be scratched with reel, produces scrap, reduces the non-defective unit of product
Rate.
The content of the invention
In view of the deficienciess of the prior art, reduce unnecessary cost of labor throwing it is an object of the invention to provide a kind of
Enter, it is not necessary to the technological process of increase excision cast gate, improve the carrier band disk injection mold of the production efficiency of carrier band disk product；
Preferable another object of the present invention is to provide a kind of injection effect, the carrier band disk quality of injection molding is preferable, and
The process being applied on above-mentioned carrier band disk injection mold of thinner thickness.
To achieve the above object, the invention provides following technical scheme：One kind carrier band disk injection mold, including dynamic model,
Cover half, heat flux plates, upper cores are provided with the cover half, lower die is provided with the dynamic model, is provided with the upper cores
For carrying the mold insert of reel injection molding on disk, the note cast gate of injection material in oriented die cavity is set on the mold insert, it is described
The position of cast gate injection is noted between the axis hole of reel and the edge of reel.
By using above-mentioned technical proposal, the injection-moulding position of injection hole is between axis hole and reel edge, after injection
Cast gate is in the range of the non-usable floor area of reel, i.e., cast gate is between axis hole and reel edge, and note cast gate is transferred into axle
On the non-usable floor area of disk, in the case where cast gate does not remove, the axis hole on the carrier band disk can also be normally carried out using, and reduce
Unnecessary cost of labor input, it is not necessary to the technological process of increase excision cast gate, improve the production efficiency of carrier band disk product.
Further, the note cast gate includes the dilatation chamber that material in heat supply runner enters note cast gate, the side of the mold insert
Wall, which is located at dilatation chamber, offers the notch part being bonded with heat flux plates.
By using above-mentioned technical proposal, gap slot is bonded with heat flux plates, and the heat of heat flux plates is passed by gap slot
Dilatation intracavitary is delivered to, the material of dilatation intracavitary is flowed out not by the influential effect being cooled after heat flux plates is departed from from injection hole
Material there is good flow velocity, preferable heat insulating ability and stability are played to the temperature of material.
Further, it is recessed that first formed that be recessed downwards is provided with the lower die in the position of corresponding note cast gate injection
Groove portion.
By using above-mentioned technical proposal, the material at injection hole first fills up the first concave part, is then spread to surrounding,
To be formed because the first concave part is recessed downwards, the flow velocity of the material flow down to injection hole has the effect of buffering.
Further, the first forming part for axis hole injection molding, first shaping are provided with the lower die
The edge in portion is provided with the first buffer part for buffering material flow velocity in die cavity.
By using above-mentioned technical proposal, the first buffer part is six circular troughs that depression is formed downwards, and flow velocity is faster
Material is needed to fill up six center of circle grooves when passing through circular trough in flowing, and the flow velocity of material is buffered by center of circle groove, makes material
Flow velocity tend to be steady state, improve the stability of injection molding process.
Further, several the second shapings for being used to carry slit injection molding on disk are provided with the lower die
Block, the both sides of each second forming blocks are symmetrically distributed with two the second dashpots.
By using above-mentioned technical proposal, the second dashpot plays a part of buffering to the flow velocity of material, and material needs elder generation
Continue outwards diffusion after second dashpot is filled up.
Further, it is provided with the upper cores and lower die for positioning determining for upper cores and lower die die-closed position
Position part.
By using above-mentioned technical proposal, positioning element includes the positioning hole being arranged in upper cores and is arranged on lower die
On locating piece, detect upper cores and lower die die-closed position it is whether accurate, avoid upper cores and lower die in installation process
There is deviation, cause the phenomenon that upper cores and lower die produce dislocation in matched moulds to occur, improve the accuracy of the mould.
Further, a kind of process applied on any of the above-described described carrier band disk injection mold, including it is following
Step：
A：Charging, material are ejected into cover half by the nozzle on injection machine from the charging aperture on cover half, the injection of nozzle
Time is the 0.2-0.8 seconds, and the speed that nozzle projects is per second for 450-500 millimeters, and the material initial temperature entered in cover half is
220-280℃；
B：Heating, is flowed in the hot flow path in heat flux plates after entering the material in cover half, and hot flow path heats to material, adds
Temperature of charge after heat is 250-330 DEG C；
C：Discharging, material by hot flow path enter note pour it is intraoral, note cast gate material is ejected into die cavity, note cast gate go out
The temperature of material is 260-300 degrees Celsius during material.
By using above-mentioned technical proposal, the temperature spurted into die cavity can not be less than 260 degrees Celsius, and temperature is too low to be made
The mobility of material is poor, the product that injection molding comes out it is in uneven thickness, it is thicker to flow slow local thickness ratio, and flowing is fast
Local thickness ratio it is relatively thin, when temperature is more than 300 degrees Celsius, temperature is too high to be made to produce flash after material forming, in high temperature
Plastic product caused by lower is easy to be excessively crisp, and product quality is poor.
Further, during mold work, the temperature of the heat flux plates is 220-280 degrees Celsius.
By using above-mentioned technical proposal, the hot flow path in heat flux plates heats to material, material is transferred heat to, to thing
Material plays a part of heating, enable material from injection hole discharge when temperature reach the requirement of injection molding.
Further, temperature of charge is 280 degrees Celsius when noting cast gate discharging.
By using above-mentioned technical proposal, the preferable temperature of material is 280 degrees Celsius during injection, the temperature of charge of the temperature
Compare high, the mobility reached is relatively good, coordinates the injection-moulding position by the material of high-temperature, high flow rate, by material it is very fast,
The flange on reel periphery is filled up in the case of preferable compared with stable, mobility, thinner, effect is produced and preferably carries disk.
Brief description of the drawings
Fig. 1 is the structural representation of carrier band disk injection mold；
Fig. 2 is the exploded perspective view of cover half and dynamic model；
Fig. 3 is the structural representation of lower die；
Fig. 4 is the structural representation of cover half；
Fig. 5 is the exploded perspective view of cover half.
In figure：1st, charging aperture；2nd, heat flux plates；3rd, cover half；301st, upper cores；302nd, positioning hole；4th, dynamic model；401st, lower mould
Benevolence；402nd, the first forming part；403rd, the second forming blocks；404th, the second dashpot；405th, the first buffer part；406th, locating piece；5、
Mold insert；6th, dilatation chamber；7th, notch part；8th, cast gate is noted；9th, the first concave part.
Embodiment
Referring to figs. 1 to embodiments of the Fig. 5 to present invention carrier band disk injection mold and applied to the process on the mould
It is described further.
As depicted in figs. 1 and 2, it is a kind of to carry disk injection mold, including dynamic model 4 and cover half 3, it is provided with hot-fluid on cover half 3
Plate 2, upper cores 301, upper cores 301 are used for the injection molding for carrying disk upper surface, and carrier band disk includes reel, is fixed on reel two
End limitation carries the position on reel width and is formed as discoid a pair of flanges, and lower die is provided with dynamic model 4
401, lower die 401 is used for the injection molding for carrying disk lower surface, and upper cores 301 during lower 401 matched moulds of die with forming injection molding
Chamber, carrier band disk complete injection molding process in die cavity, and the center of upper cores 301 is provided with the mold insert 5 of cylinder, mold insert
5 lower surface matches with reel upper surface bumps, for the injection molding of reel upper surface, is set on the upper surface of mold insert 5
There is the note cast gate 8 through the upper and lower end face of mold insert 5, note cast gate 8 includes dilatation chamber 6, and the bottom of dilatation chamber 6 is offered through mold insert 5
The injection hole of lower surface, material first pass through dilatation chamber 6, are then injected into from injection hole in die cavity, carry out injection molding work, note
The injection-moulding position of cast gate 8 between reel upper shaft hole and the edge of reel, i.e. the position of injection hole be arranged on corresponding axis hole and
Between the edge of reel, material enters in die cavity by injection hole, is spread in die cavity to the edge of die cavity, by the note of injection hole
Modeling position is arranged between axis hole and the edge of reel, and in die sinking, injection hole moves straight up, and cast gate takes off with injection hole
From because the injection-moulding position of injection hole is between axis hole and reel edge, the cast gate after injection is in the non-of reel and uses face
In product scope, i.e., cast gate is between axis hole and reel edge, and note cast gate 8 is transferred on the non-usable floor area of reel, poured
In the case that mouth does not remove, the axis hole on the carrier band disk can be normally carried out using, and reduce unnecessary cost of labor input, no
The technological process of increase excision cast gate is needed, improves the production efficiency of carrier band disk product.
As shown in Fig. 2 the side wall of mold insert 5 is located at the notch part 7 for offering at dilatation chamber 6 and being bonded with heat flux plates 2, notch part
7 be gap slot, and mold insert 5 is installed in upper cores 301, because gap slot is in the upper end of mold insert 5, gap slot and upper cores
The heat flux plates 2 of 301 tops are bonded, and the hot flow path in heat flux plates 2 connects with dilatation chamber 6, and the material in hot flow path flows to expansion
In cavity volume 6, then the injection hole from the bottom of dilatation chamber 6 is flowed into die cavity, and gap slot is bonded with heat flux plates 2, therefore, is lacked
Temperature at mouth groove is identical with the temperature of heat flux plates 2, and the heat of heat flux plates 2 is delivered in dilatation chamber 6 by gap slot, makes dilatation
Material in chamber 6 makes material be maintained at the temperature in hot flow path not by the influential effect being cooled after heat flux plates 2 is departed from
Become, there is good flow velocity from the material of injection hole outflow, preferable heat insulating ability and stability are played to the temperature of material.
As shown in figure 3, first for being recessed formed downwards is provided with lower die 401 in the position that corresponding note cast gate 8 is molded
Concave part 9, the first concave part 9 are shaped as circle, and the first concave part 9 is located at the underface of injection hole, and material is from injection hole stream
When in die cavity, the material at injection hole first fills up the first concave part 9, then to surrounding spread, due to the first concave part 9 to
Lower recess is formed, and the flow velocity of the material flow down to injection hole has the effect of buffering, reduces mould under the fast material impact of flow velocity
The surface of benevolence 401, the situation that causing reel surface flatness reduces occur, in addition, the reel after injection molding is recessed corresponding first
The position thickness ratio of groove portion 9 is thicker, and when injection hole departs from cast gate, the reel thickness of the position of the first concave part 9 is bigger, resistance to note
The intensity that modeling mouth is pullled is higher, reduces to occur departing from reel after cast gate is pullled producing the feelings deformed at damaged or cast gate
Condition occurs, and improves the production yield of carrier band disk.
As shown in figure 3, the first forming part 402 for axis hole injection molding, the first forming part are provided with lower die 401
402 edge is provided with the first buffer part 405 for buffering material flow velocity in die cavity, and the first forming part 402 is arranged on down
The center of die 401 and the first forming part 402 are mutually matched with the axis hole bumps on carrier band disk, the first buffer part 405
For six circular troughs that depression is formed downwards, six center of circle grooves are evenly distributed on the edge of the first forming part 402, and flow velocity is faster
Material is needed to fill up six center of circle grooves when passing through circular trough in flowing, and the flow velocity of material is buffered by center of circle groove, makes material
Flow velocity tend to be steady state, improve the stability of injection molding process.
As shown in Fig. 2 several the second forming blocks for being used to carry slit injection molding on disk are provided with lower die 401
403, the first forming blocks are engaged with the slit bumps on carrier band disk, and the both sides of each the second forming blocks 403 are symmetrically distributed with
Two the second dashpots 404, the second dashpot 404 are shaped as the circular trough that depression is formed downwards, and the second dashpot 404 is to thing
The flow velocity of material plays a part of buffering, and material needs to continue outwards diffusion after first the second dashpot 404 is filled up.
As shown in Figure 3 and Figure 4, it is provided with upper cores 301 and lower die 401 for positioning upper cores 301 and lower die
The positioning element of 401 die-closed positions, positioning element include the positioning hole 302 being arranged in upper cores 301 and are arranged on lower die
Whether the locating piece 406 on 401, locating piece 406 are engaged with positioning hole 302, during matched moulds, can be inserted into by locating piece 406
In positioning hole 302, detect upper cores 301 and whether the lower die-closed position of die 401 is accurate, avoid upper cores 301 and lower die 401
Occur deviation in installation process, cause the phenomenon that upper cores 301 and lower die 401 produce dislocation in matched moulds to occur, improve
The accuracy of the mould.
A kind of process applied on the carrier band disk injection mold, its step are as follows：a：Charging, material pass through injection
Nozzle on machine is ejected into cover half 3 from the charging aperture 1 on the upper surface of cover half 3, and the injection time of nozzle is the 0.2-0.8 seconds, is penetrated
The speed that mouth projects is per second for 450-500 millimeters, and the speed ratio that nozzle projects is higher, it is therefore desirable to is projected from high pressure, nozzle
The higher injection machine of speed ratio coordinates the mould to be used, and the speed ratio of the material entered by nozzle in cover half 3 is very fast,
When flowing in die cavity, the speed ratio of shaping is very fast, the rapid shaping of convenient-loading tep reel, avoids speed is too low from causing shaping uneven
The situation even, molding effect is poor occurs, and then material is entered in cover half 3 by charging aperture 1, is entered in cover half 3
Material initial temperature is 220-280 DEG C；B：Heat, flowed to after the material entered in cover half 3 in the hot flow path in heat flux plates 2,
The temperature of heat flux plates 2 is 220-280 degrees Celsius, after entering charging aperture 1 due to material, because the temperature of mould is not high, with material
During contact, temperature of charge can be caused to reduce, in order to keep material to have preferable mobility, the temperature that can reach injection molding will
Ask, the temperature setting of heat flux plates 2 has 220-280 degrees Celsius, and material is heated by the hot flow path in heat flux plates 2, heat is passed
Material is passed, the temperature of charge after heating is 250-330 DEG C, when the temperature of charge after heating is less than 250 DEG C, the mobility of material
It can reduce, reduce the normal work of hot flow path and relatively low from the temperature of charge gone out of hot flow path, subsequently enter in die cavity and note
Material diffusion is uneven when being moulded into type, and molding effect is poor, and when the temperature of charge after heating is more than 330 DEG C, material is in hot flow path
Content is also easy to produce melting phenomenon, easily causes the blocking of hot flow path；C：Discharging, material are entered in note cast gate 8 by hot flow path,
Material is ejected into die cavity by the injection hole on note cast gate 8, and the temperature of material is 260-300 degrees Celsius at injection hole, due to this
The injection-moulding position of mould is not on the inside of axis hole, easily occurs material in injection moulding process and first fills up close to the convex of injection hole side
Edge, then resin will be far from a side flange of injection hole and fill up, so easily there is waterside in the side flange away from injection hole
Phenomenon, causes the yield of product to reduce, and therefore, the preferable temperature of material is 280 degrees Celsius during injection, the temperature of charge of the temperature
Compare high, the mobility reached is relatively good, coordinates the injection-moulding position by the material of high-temperature, high flow rate, by material it is very fast,
The flange on reel periphery is filled up in the case of preferable compared with stable, mobility, thinner, effect is produced and preferably carries disk.
Described above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that for the art
Those of ordinary skill for, some improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (7)
1. one kind carrier band disk injection mold, including dynamic model and cover half, it is characterised in that：Be provided with the cover half heat flux plates, on
Die, lower die is provided with the dynamic model, the mold insert for carrying reel injection molding on disk is provided with the upper cores,
The note cast gate of injection material in oriented die cavity is set on the mold insert, the position of the note cast gate injection be located at reel axis hole and
Between the edge of reel, the note cast gate includes the dilatation chamber that material in heat supply runner enters note cast gate, the side wall of the mold insert
The notch part being bonded with heat flux plates is offered at dilatation chamber, is set on the lower die in the position of corresponding note cast gate injection
The first concave part that oriented lower recess is formed.
2. carrier band disk injection mold according to claim 1, it is characterised in that：It is provided with the lower die for axis hole
First forming part of injection molding, the edge of first forming part be provided with for buffer material in die cavity flow velocity first
Buffer part.
3. carrier band disk injection mold according to claim 2, it is characterised in that：Several use are provided with the lower die
In the second forming blocks of slit injection molding on carrier band disk, the both sides of each second forming blocks are symmetrically distributed with two second
Dashpot.
4. carrier band disk injection mold according to claim 3, it is characterised in that：It is provided with the upper cores and lower die
For positioning the positioning element of upper cores and lower die die-closed position.
5. a kind of process applied on any described carrier band disk injection mold of Claims 1-4, including following steps
Suddenly：
A：Charging, material are ejected into cover half by the nozzle on injection machine from the charging aperture on cover half, the injection time of nozzle
For the 0.2-0.8 seconds, the speed that nozzle projects is per second for 450-500 millimeters, and the material initial temperature entered in cover half is 220-
280℃；
B：Heating, is flowed in the hot flow path in heat flux plates after entering the material in cover half, and hot flow path heats to material, after heating
Temperature of charge be 250-330 DEG C；
C：Discharging, material by hot flow path enter note pour it is intraoral, note cast gate material is ejected into die cavity, note cast gate discharge when
The temperature of material is 260-300 degrees Celsius.
6. process according to claim 5, it is characterised in that：During mold work, the temperature of the heat flux plates is
220-280 degrees Celsius.
7. process according to claim 6, it is characterised in that：Temperature of charge is 280 degrees Celsius when noting cast gate discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610003948.1A CN105666794B (en) | 2016-01-05 | 2016-01-05 | Carry disk injection mold and applied to the process on the mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610003948.1A CN105666794B (en) | 2016-01-05 | 2016-01-05 | Carry disk injection mold and applied to the process on the mould |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105666794A CN105666794A (en) | 2016-06-15 |
| CN105666794B true CN105666794B (en) | 2017-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610003948.1A Active CN105666794B (en) | 2016-01-05 | 2016-01-05 | Carry disk injection mold and applied to the process on the mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105666794B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111716624A (en) * | 2020-05-28 | 2020-09-29 | 上海富驰高科技股份有限公司 | Injection mold for producing upper head ring cover of camera and production process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1149681A1 (en) * | 2000-04-26 | 2001-10-31 | Wea Manufacturing Inc. | Method and apparatus for vacuum assisted venting |
| CN103612361A (en) * | 2013-11-23 | 2014-03-05 | 诸暨市泰昂机械有限公司 | Injection molding process |
| CN204340088U (en) * | 2014-12-25 | 2015-05-20 | 长兴添辰模具有限公司 | A kind of feedboard |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60240424A (en) * | 1984-05-15 | 1985-11-29 | Polyplastics Co | Manufacture of tape reel |
| JP4367765B2 (en) * | 2004-03-17 | 2009-11-18 | 日立マクセル株式会社 | Tape reel for magnetic tape cartridge |
-
2016
- 2016-01-05 CN CN201610003948.1A patent/CN105666794B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1149681A1 (en) * | 2000-04-26 | 2001-10-31 | Wea Manufacturing Inc. | Method and apparatus for vacuum assisted venting |
| CN103612361A (en) * | 2013-11-23 | 2014-03-05 | 诸暨市泰昂机械有限公司 | Injection molding process |
| CN204340088U (en) * | 2014-12-25 | 2015-05-20 | 长兴添辰模具有限公司 | A kind of feedboard |
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