CN105659945B - The large hear rate radiating device for electronic equipment of a kind of high heat flux - Google Patents
The large hear rate radiating device for electronic equipment of a kind of high heat fluxInfo
- Publication number
- CN105659945B CN105659945B CN201218001259.XA CN201218001259A CN105659945B CN 105659945 B CN105659945 B CN 105659945B CN 201218001259 A CN201218001259 A CN 201218001259A CN 105659945 B CN105659945 B CN 105659945B
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- CN
- China
- Prior art keywords
- hot plate
- heat pipe
- electronic equipment
- buried
- buried heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000004907 flux Effects 0.000 title claims abstract description 17
- 230000001413 cellular Effects 0.000 claims abstract description 20
- 210000003491 Skin Anatomy 0.000 claims abstract description 13
- 210000003660 Reticulum Anatomy 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 229910052788 barium Inorganic materials 0.000 description 4
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium(0) Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000001702 transmitter Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001603 reducing Effects 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000256844 Apis mellifera Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Abstract
The invention discloses the large hear rate radiating device for electronic equipment of a kind of high heat flux, belong to spacecraft thermal control technical field. Described device comprises expansion hot plate and pre-buried heat pipe, expand hot plate lower surface and have the indent groove of setting number as the installing space of pre-buried heat pipe, pre-buried heat pipe stage casing is embedded in the indent groove that expands hot plate, two ends are extended the part that expands hot plate and are imbedded in the honeycomb core of cellular board of spacecraft module plate, pre-buried heat pipe lower surface is concordant with the lower surface that expands hot plate, form a radiating surface, upper surface and the indent groove bottom surface of pre-buried heat pipe are connected, together with radiating surface fits to the exterior skin of cellular board; Expand the mounting platform that hot plate upper surface provides electronic equipment. Described device has good radiating effect and temperature homogeneity, has been used for the heat radiation of the high-power high heat flux electronic equipment of spacecraft.<pb pnum="1" />
Description
Technical field
The present invention relates to the large hear rate radiating device for electronic equipment of a kind of high heat flux, belong to spacecraft thermal control skillArt field.
Background technology
Along with space technology develops rapidly worldwide and apply, along with spacecraft electronic equipment integrated levelRaising and the progress of components and parts, the appearance of high heat flux device must be caused, as travelling-wave tubes, microwave meritRate amplifier, solid state transmitter etc., its power is increasing, and heat flow density is more and more higher.
Most of electronic devices and components require harsh to hot environment, do not allow environment temperature to exceed or approach its instituteThe tolerant limit. The device power capacity that uses along with electronic equipment and the increase of quantity, will cause establishingStandby device heating amount strengthens and temperature rise, if heat can not come out timely and effectively when equipment is worked,The thermograde inside and outside equipment can be caused excessive, thus form overheated zone or heat spot at device interior, thenCause devices function hydraulic performance decline, burning apparatus device power monolithic even when serious, causes whole synthetic systemSystem lost efficacy. Statistics shows, the heat flow density trend of components and parts and PCB level, from 1992 to 2002, increasesGrown 10 doubly, 5 also will be increased by 2010 doubly, the heat how electronic devices and components being produced is delivered toInstrument shell, and the problem that is finally delivered to that space outerpace will be needs solution. Therefore equipment thermal design andHeat dissipation technology research has great importance.
Microwave power amplifier has that integrated level is high, compact conformation, reliability is high, noise is low, good linearity etc.Advantage is widely used in mobile communication, radar system. In Connectors for Active Phased Array Radar, microwavePower amplifier plays important role. Microwave power transistor in microwave power amplifier intrinsic oneIndividual feature is the sensitiveness of temperature. When the environmental temperature is changed, many indexs of microwave power amplifier will haveChange. Microwave power amplifier is in high-power lower work, and in the electric energy that it consumes, major part is changed into heat energyDiffusion towards periphery, works under making device itself and around other components and parts being in the condition of high temperature. And high temperature can makeComponents and parts electrical property worsens, and causes component failure, causes equipment dependability to be deteriorated.
The thermal design target of microwave power amplifier is in ensureing radio-frequency performance, makes power crystal duct ligationTemperature is minimum, and the possible best cost performance of tool. Theory and experimental data show, for microwave power crystalline substanceBody pipe, 10 DEG C ~ 12 DEG C of the every reductions of junction temperature, device mean time to failure, MTTF will extend one doubly, 50 DEG C of every reductions,An order of magnitude then will be improved. Therefore the reasonability of thermal design just becomes the key of reliability of electronic equipment success or failure.
Thermal design is the same with structural design and electrical property design, is that electronic apparatus system designs indispensable portionPoint. Along with the densification of device, the power density of electronic equipment is increasing, to the demand of thermal design also dayBenefit is strong. In space flight circle, because the improper example of equipment failure or hydraulic performance decline that causes of thermal design is not rarely seen.The orbital test satellite 2 (OTS-2) of European Space Agency's transmitting on May 11st, 1978, to by the end of June, findsA travelling-wave tube amplifier lost efficacy, and the spurious signal that it is disconnected repeatedly appears in another one travelling-wave tubes. AnalyzeResult think, this causes by temperature is too high. The practical broadcasting satellite BS-2A of Japan is in January, 1984Transmitting on the 23rd. After two months, A system repeater occurs abnormal, because temperature after satellier injection increases to overAllow boundary, the travelling-wave tubes electron gun negative pole of making and be impregnated with barium by tungsten is under the effect of high temperature, and barium overflows to electricityOn utmost point support and electron gun insulator, cause electric leakage, cause travelling-wave tubes and transponder to quit work. Electron gunDuring negative pole work, temperature design is 1020 DEG C, and electronics wave beam is brought very 300 DEG C together, proves through space test,If temperature exceedes about 8 DEG C of design objectives, will there is abnormal evaporation in barium. A system repeater and R for subsequent useSystem repeater all quits work because barium infiltrates in travelling-wave tubes. Visible rational thermal design to electronic equipment isUnite significant.
Most of spacecrafts are non-airtight structure, when orbiting, there is no air in spacecraft module,Radiant heat transfer becomes the important way of electronic equipment dissipating heat. The various air naturals pair that often utilize on the groundFlow or force flowing cooling measure all inapplicable to spacecraft electronic equipment. Electronic equipment peace on spacecraft at presentBe contained on the installed surface of cabin plate inner surface pre-buried heat pipe in the cellular board in equipment bottom surface, heat pipe be positioned at starOuter radiating surface is connected, and the hear rate that equipment produces is arrived space by installed surface → heat pipe → radiating surface Scarfskin radiation.This mode is applicable for the equipment cooling that hear rate is little, heat flow density is not high. But, owing to being subject toThe restriction of the heat flow density that adopting heat pipes for heat transfer ability and heat pipe can bear, to hear rate is very large, heat flow density is very high,The exigent equipment of temperature homogeneity is also inapplicable.
Summary of the invention
The object of the present invention is to provide the large hear rate radiating device for electronic equipment of a kind of high heat flux, described dressPut and there is good radiating effect and temperature homogeneity, be used for the high-power high heat flux electronics of spacecraftThe heat radiation of equipment.
Object of the present invention is realized by following technical scheme:
The large hear rate radiating device for electronic equipment of a kind of high heat flux, described device comprises expansion hot plate and pre-buried heatPipe, ancillary equipment comprises spacecraft module plate, and wherein, described spacecraft module plate comprises cellular board and coating, honeybeeNest plate comprises inside panel, honeycomb core and exterior skin, honeycomb core in cellular board between inside panel and exterior skin,Exterior skin and coating form the heat loss through radiation face of spacecraft module plate; Expand hot plate lower surface to have in setting numberRecessed groove is as the installing space of pre-buried heat pipe, and the indent groove degree of depth equals the thickness of pre-buried heat pipe, pre-buried heatPipe stage casing is embedded into be expanded in the indent groove of hot plate, and the honeybee of cellular board is extended the part that expands hot plate and imbeds at two endsIn nest core, pre-buried heat pipe lower surface is concordant with the lower surface that expands hot plate, forms a radiating surface, pre-buried heat pipeUpper surface and indent groove bottom surface be connected, together with radiating surface fits to the exterior skin of cellular board; Expand hot plateUpper surface provides the mounting platform of electronic equipment.
Described expansion hot plate is rectangular configuration; Pre-buried heat pipe is single hole conduit or diplopore conduit tubular structure, its horizontal strokeCross section is rectangle or I-shaped; Wherein, the cross section pre-buried heat pipe side that is I shape and expand shape between hot plateThe space cellular material becoming is filled.
Being connected between the upper surface of described pre-buried heat pipe and indent groove bottom surface adopts gluing mode; Heat radiationIn face, the laminating in pre-buried tube surface and heat loss through radiation face adopts gluing mode.
In described expansion hot plate, the flatness of indent groove conduit is better than 0.2mm/200mm, and roughness is 3.2.
Operation principle
Expand the mounting platform that hot plate provides spacecraft electronic equipment, electronic equipment is arranged on and expands on hot plate upper surface,Expanding hot plate upper surface requires to contact good with electronic equipment, fills heat filling between the two. In heat flow densityPre-buried heat pipe is installed in larger and concentrated region, by heat conducting heat transfer type, by the heating of electronic equipmentAmount is passed to expansion hot plate, by expanding the heat conduction of hot plate, heat is finally transferred to pre-buried heat pipe, through pre-buried heatPipe is delivered on heat loss through radiation face, and to space, row is loose, reaches the whole Heat transmission process of the heat radiation of electronic equipment.
Beneficial effect
(1) expansion hot plate is arranged in cellular board by heat abstractor of the present invention, expands in hot plate pre-buried heat pipe is installed,Pre-buried heat pipe by structure glue with expand hot plate be connected with heat loss through radiation face, by heat radiation in space environment,There is good radiating effect and temperature homogeneity, and described apparatus structure is compact, to the peace of spacecraft equipmentDress and influence of arrangement are less.
(2) in heat abstractor of the present invention, expand hot plate very high heat flow density can be born, and heat transfer property is goodGood. For the electronic equipment of large caloric value high heat flux, electronic equipment temperature can be controlled effectively and exist especiallyIn the scope of requirement, and device temperature uniformity is better.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat abstractor of the present invention.
Fig. 2 is the profile of Fig. 1 along AA direction.
Fig. 3 is the partial enlarged drawing of the pre-buried heat pipe of rectangle diplopore conduit.
Fig. 4 is the partial enlarged drawing of the pre-buried heat pipe of I shape single hole conduit.
Fig. 5 is the cross sectional representation of the pre-buried heat pipe of rectangle diplopore conduit.
Wherein, 1-expands hot plate, the pre-buried heat pipe of 2-, 3-heat loss through radiation face, 4-cellular board, and 5-expands hot plateUpper surface.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments in detail the present invention is described in detail, but is not limited to this.
Embodiment 1
As illustrated in fig. 1 and 2, the large hear rate radiating device for electronic equipment of a kind of high heat flux, described device bagDraw together and expand hot plate 1 and pre-buried heat pipe 2, ancillary equipment comprises spacecraft module plate, wherein, and described spacecraft module plate bagDraw together cellular board 4 and coating, cellular board 4 comprises inside panel, honeycomb core and exterior skin, and honeycomb core is positioned at honeycombIn plate 4, between inside panel and exterior skin, exterior skin and coating form the heat loss through radiation face 3 of spacecraft module plate; ExpandHot plate 1 lower surface has the rectangle indent groove that 3 degree of depth are 15mm, as the installation of pre-buried heat pipe 2Space, is respectively the first indent groove, the second indent groove and the 3rd indent groove, and wherein the first indent is logicalThe width of groove and the second indent groove and two pre-buried heat pipes 2 is suitable, the 3rd indent groove and a pre-buried heatThe width of pipe 2 is suitable, and the stage casing of 5 pre-buried heat pipes 2 is embedded into respectively in 3 indent grooves that expand hot plate 1,Two ends are extended the part that expands hot plate 1 and are imbedded in the honeycomb core of cellular board 4, pre-buried heat pipe 2 lower surface and expansionThe lower surface of hot plate 1 is concordant, forms a radiating surface, upper surface and the indent groove bottom surface of pre-buried heat pipe 2Be connected, together with radiating surface fits to the exterior skin of cellular board 4; Expand hot plate upper surface 5 electronic equipment is providedMounting platform.
Described expansion hot plate 1 is rectangular configuration; Pre-buried heat pipe 2 is single hole conduit or diplopore conduit tubular structure,Its cross section is rectangle or I-shaped, as shown in Figures 3 and 4; Fig. 5 is the pre-buried heat pipe 2 of diplopore conduit; Wherein,Cross section is pre-buried heat pipe 2 side of I shape and expands the space cellular material forming between hot plate 1 and fill.
Glued together with J78B between the upper surface of described pre-buried heat pipe 2 and indent groove bottom surface; Radiating surfaceIn pre-buried heat pipe 2 surface also glued together by J78B with heat loss through radiation face 3.
In described expansion hot plate 1, the flatness of indent groove conduit is 0.15mm/200mm, and roughness is 3.2.
Described expansion hot plate 1 and pre-buried heat pipe 2 material are aluminium alloy.
Electronic equipment is arranged on and expands on hot plate upper surface 5, expands hot plate upper surface 5 and requires to contact with electronic equipmentWell, heat filling is filled between the two. The caloric value of electronic equipment is passed to pre-buried heat pipe 2 through expanding hot plate 1,Be transmitted on the heat loss through radiation face 3 of high emissivity, to space, row is loose again.
Environment C Satellite Payloads is solid state transmitter, overall heat consumption 820W, is made up of 8 modules, eachThe maximum heat current density of module is 3.2W/cm2, be the stand-alone device of the heat flow density maximum of encountering at present. WorkAs time require 8 temperature difference between module no more than 10 DEG C. Adopt above-mentioned heat abstractor, described honeycomb thickness of slabDegree is 25.6mm, and expand hot plate and be of a size of 510mm × 800mm × 25mm, solid state transmitter is arranged onExpand on hot plate upper surface 5 pre-buried 5 pre-buried heat pipes of rectangle diplopore conduit in expansion hot plate. Heat balance testData show, and the temperature of solid state transmitter is controlled in the scope of requirement effectively, and maximum temperature difference is less than 6 DEG C,Meet design requirement.
The present invention includes but be not limited to above embodiment, every under the principle of spirit of the present invention, carry out appointHow with replacement or local improvement, all will be considered as within protection scope of the present invention.
Claims (6)
1. the large hear rate radiating device for electronic equipment of high heat flux, is characterized in that: described device comprisesExpand hot plate (1) and pre-buried heat pipe (2), ancillary equipment comprises spacecraft module plate, wherein, and described spacecraft modulePlate comprises cellular board (4) and coating, and cellular board (4) comprises inside panel, honeycomb core and exterior skin, honeycombCore is arranged between cellular board (4) inside panel and exterior skin, and exterior skin and coating form the spoke of spacecraft module platePenetrate radiating surface (3); Expand hot plate (1) lower surface and have the indent groove of setting number as pre-buried heat pipe (2)Installing space, the indent groove degree of depth equals the thickness of pre-buried heat pipe (2), and pre-buried heat pipe (2) stage casing is embeddingEnter to expanding in the indent groove of hot plate (1), two ends are extended the part that expands hot plate (1) and are imbedded cellular board (4)Honeycomb core in, pre-buried heat pipe (2) lower surface with expand hot plate (1) lower surface concordant, forms one fall apartHot side, upper surface and the indent groove bottom surface of pre-buried heat pipe (2) are connected, radiating surface and cellular board (4)Exterior skin fits to together; Expand the mounting platform that hot plate upper surface (5) provides electronic equipment.
2. the large hear rate radiating device for electronic equipment of a kind of high heat flux according to claim 1, its spyLevy and be: described expansion hot plate (1) is rectangular configuration.
3. the large hear rate radiating device for electronic equipment of a kind of high heat flux according to claim 1, its spyLevy and be: described pre-buried heat pipe (2) is single hole conduit or diplopore conduit tubular structure, and its cross section is rectangleOr I-shaped; Wherein, cross section pre-buried heat pipe (2) side that is I shape and expand shape between hot plate (1)The space cellular material becoming is filled.
4. the large hear rate radiating device for electronic equipment of a kind of high heat flux according to claim 1, its spyLevy and be: being connected between the upper surface of described pre-buried heat pipe (2) and indent groove bottom surface adopts gluing sideFormula.
5. the large hear rate radiating device for electronic equipment of a kind of high heat flux according to claim 1, its spyLevy and be: in described radiating surface, pre-buried heat pipe (2) surface adopts gluing with the laminating in heat loss through radiation face (3)Mode.
6. the large hear rate radiating device for electronic equipment of a kind of high heat flux according to claim 1, its spyLevy and be: in described expansion hot plate (1), the flatness of indent groove conduit is better than 0.2mm/200mm, roughnessBe 3.2.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105659945B true CN105659945B (en) | 2014-06-04 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107985630A (en) * | 2017-11-02 | 2018-05-04 | 银河航天（北京）科技有限公司 | A kind of multifunction structure plate |
| CN111918526A (en) * | 2020-07-23 | 2020-11-10 | 上海卫星工程研究所 | Heat transfer device suitable for equipment group for space |
| CN112074150A (en) * | 2020-08-20 | 2020-12-11 | 航天科工空间工程发展有限公司 | Heat dissipation device and electronic equipment with same |
| CN112960144A (en) * | 2021-02-03 | 2021-06-15 | 北京无线电测量研究所 | Cabin plate based on 3D printing integrated into one piece |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107985630A (en) * | 2017-11-02 | 2018-05-04 | 银河航天（北京）科技有限公司 | A kind of multifunction structure plate |
| CN111918526A (en) * | 2020-07-23 | 2020-11-10 | 上海卫星工程研究所 | Heat transfer device suitable for equipment group for space |
| CN112074150A (en) * | 2020-08-20 | 2020-12-11 | 航天科工空间工程发展有限公司 | Heat dissipation device and electronic equipment with same |
| CN112960144A (en) * | 2021-02-03 | 2021-06-15 | 北京无线电测量研究所 | Cabin plate based on 3D printing integrated into one piece |
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Legal Events
| Date | Code | Title | Description |
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| GR03 | Grant of secret patent right | ||
| DC01 | Secret patent status has been lifted |