CN105651425A - Three-dimensional pressure sensor detecting granary reserves - Google Patents

Three-dimensional pressure sensor detecting granary reserves Download PDF

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Publication number
CN105651425A
CN105651425A CN201410743730.0A CN201410743730A CN105651425A CN 105651425 A CN105651425 A CN 105651425A CN 201410743730 A CN201410743730 A CN 201410743730A CN 105651425 A CN105651425 A CN 105651425A
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CN
China
Prior art keywords
pressure sensor
sensor unit
substrate
flexible sheet
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410743730.0A
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Chinese (zh)
Inventor
吴芳
张洪亮
赵巧转
陈实
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BEIJING AEROSPACE JINTAI XINGCE TECHNOLOGY CO LTD
Aerospace Long March Launch Vehicle Technology Co Ltd
Original Assignee
BEIJING AEROSPACE JINTAI XINGCE TECHNOLOGY CO LTD
Aerospace Long March Launch Vehicle Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING AEROSPACE JINTAI XINGCE TECHNOLOGY CO LTD, Aerospace Long March Launch Vehicle Technology Co Ltd filed Critical BEIJING AEROSPACE JINTAI XINGCE TECHNOLOGY CO LTD
Priority to CN201410743730.0A priority Critical patent/CN105651425A/en
Publication of CN105651425A publication Critical patent/CN105651425A/en
Pending legal-status Critical Current

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Abstract

A three-dimensional pressure sensor detecting granary reserves comprises a shell, at least three pressure sensor units and a circuit board. The shell possesses an X direction, a Y direction and a Z direction. At least one of the at least three pressure sensor units is arranged along the X direction, at least one unit is arranged along the Y direction and at least one unit is arranged along the Z direction. The circuit board is arranged in the shell. Each pressure sensor unit comprises an elastic membrane sheet and a substrate. The substrate and the elastic membrane sheet are fixed to the elastic membrane sheet with an interval. The substrate is provided with a thick membrane electrode. The thick membrane electrode is two annular conduction bands which are printed on the substrate. The two annular conduction bands are used as an inner electrode and an outer electrode. The elastic membrane sheet and the inner electrode form a reference capacitor and the elastic membrane sheet and the outer electrode form a work capacitor. The circuit board comprises a demodulator module, an adjusting amplification circuit, a single chip microcomputer and a 485 output module. The sensor of the invention can simultaneously detect three stress information of a three-dimensional space.

Description

The three-dimensional pressure sensor of detection granary storage capacity
Technical field
The present invention relates to the automatic detection field of granary storage capacity, specifically, relate to a kind of three-dimensional pressure sensor for on-line checking granary storage capacity.
Background technology
China is a grain big country and populous nation, and grain occupies space of prominence in national economy, be involve the interests of the state and the people, the specialities of national security and social stability. And foodstuff preservation is safely a pith of grain security, for a long time, the monitoring of national food storage quantity is always up the major issue that national food authorities are urgently to be resolved hurrily.
The mode being presently used for grain measurement mainly has three kinds: a kind of method is to utilize weighbridge to weigh weight when grain inbound/outbound process, and shortcoming is to detect the weight change that natural wastage causes in the storage and management process of grain; A kind of method is that interior manual sampling of putting in storage measures grain density and grain face height carrys out estimated weight, owing to Density Distribution is uneven irregular, it is difficult to realize the measurement of degree of precision; Another kind is to be exclusively used in the pressure transducer that grain quality is measured, but can only measure the STRESS VARIATION in a direction. Grain is granule, the regularity of distribution of granule internal stress possesses isotropism unlike liquids and gases, and Density Distribution is also uneven, for improving accuracy, according to the stress of three sensor measurement different directions, then volume is big, cost is high, wiring is complicated and affects grain heap stress.
Therefore, it is necessary in fact to develop to be exclusively used in the three-dimensional pressure sensor that grain internal pressure is measured.
Summary of the invention
The technical problem to be solved is in that, it is provided that a kind of three-dimensional pressure sensor detecting granary storage capacity, can detect three-dimensional three stress informations simultaneously such that it is able to accurately measure the grain class granule internal stress in silo.
In order to solve above-mentioned technical problem, a kind of three-dimensional pressure sensor detecting granary storage capacity provided by the invention, including a housing, it is arranged at least three pressure sensor unit on housing and a circuit board. This housing has the X-direction in three dimensions, a Y-direction and a Z-direction.At least one of which pressure sensor unit of this at least three pressure sensor unit is arranged in X direction, the at least one of which pressure sensor unit of this at least three pressure sensor unit is arranged along Y-direction, and at least one of which pressure sensor unit of this at least three pressure sensor unit is arranged along Z-direction. This circuit board is arranged in this housing. Wherein, this pressure sensor unit each includes a flexible sheet and a substrate, this substrate is fixed on this flexible sheet with this flexible sheet maintenance gap, this substrate has thick membrane electrode, this thick membrane electrode is printing two ring-type conduction band on the substrate, these two ring-type conduction band are respectively as inner and outer electrodes, and this flexible sheet constitutes reference capacitance and mutual capacitance respectively with this inner and outer electrodes. This circuit board includes demodulator module, adjusts amplifying circuit, single-chip microcomputer and 485 output modules, this demodulator module is electrically connected the inner and outer electrodes of each pressure sensor unit, this adjustment amplifying circuit is electrically connected with this demodulator module, and this single-chip microcomputer is electrically connected with this adjustment amplifying circuit and this 485 output module respectively.
Above-mentioned three-dimensional pressure sensor, wherein, each pressure sensor unit also includes an electrode guard, surrounds this substrate and is fixed on this flexible sheet so that each pressure sensor unit is flattened round box like structure.
Above-mentioned three-dimensional pressure sensor, wherein, adopts sealing ring seal and fixed by screw so that this three-dimensional pressure sensor entirety is cube opposing seal structure between this housing and this flexible sheet each.
Above-mentioned three-dimensional pressure sensor, wherein, this circuit board is arranged on outside the electrode guard of each pressure sensor unit, and the fixed installation of the remaining electrically isolated from property of electrode guard with each pressure sensor unit.
Above-mentioned three-dimensional pressure sensor, wherein, this flexible sheet arranged outside has the groove producing Stress Transfer when preventing from assembling this electrode guard.
Above-mentioned three-dimensional pressure sensor, wherein, this 485 output module connects a communication cable, this communication cable through after this housing with silo outside a host computer be connected.
Above-mentioned three-dimensional pressure sensor, wherein, the back up of this substrate has pad, this interior electrode is conducted with this pad respectively through a metallization via with this external electrode, one end of one copper wire is welded on this pad, and the other end is welded on a test point of this circuit board to be electrically connected with this circuit board by this thick membrane electrode.
Above-mentioned three-dimensional pressure sensor, wherein, the gap between this flexible sheet and this substrate is kept by an interpolar pad.
Above-mentioned three-dimensional pressure sensor, wherein, this flexible sheet is the periphery fixed E shape circular iris with hard center, this substrate be fixed on this flexible sheet hard in the heart.
Above-mentioned three-dimensional pressure sensor, wherein, this substrate adopts ceramic substrate.
The beneficial functional of the present invention is in that: at least three pressure sensor unit is arranged on same housing, three-dimensional three stress informations can not only be detected simultaneously, realize the measurement of three direction stress, be conducive to obtaining grain heap internal stress distribution, accurately set up quantitative model, accurately obtain grain quality; And instead of three pressure transducers of use with a pressure transducer, sensor bulk is little, structure is relatively easy, cost is low. More, needing only to a communication cable when silo is implemented and installed, wiring is simple. ?he setting of tranquil male �� ? ? ? 85 output module of gown school ? Fructus Citri grandis ? plaited straw vanadium, sensor is output as the output of standard 485 bus type numeral, facilitates host computer to pass through data and processes and model calculating, obtains grain gross mass.
It addition, the three-dimensional pressure sensor entirety of the present invention is cube opposing seal structure, has and resist advantage stifling, water vapor.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the three-dimensional pressure sensor of the present invention;
Fig. 2 is the sectional view of the three-dimensional pressure sensor of the present invention;
Fig. 3 is the top view of the three-dimensional pressure sensor of the present invention;
Fig. 4 is the structure chart (from front) of the substrate of the three-dimensional pressure sensor of the present invention;
Fig. 5 is the structure chart (from the back side) of the substrate of the three-dimensional pressure sensor of the present invention;
Fig. 6 is the structured flowchart of the circuit board of the three-dimensional pressure sensor of the present invention.
Wherein, accompanying drawing labelling
10 housings
20 pressure sensitive units
30 circuit boards
1 flexible sheet
2 holding screws
3 interpolar pads
4 thick membrane electrodes
5 substrates
6 grooves
7 bottoms
8 spacers
9 electrode guards
11 screws
12 copper wires
13 O RunddichtringOs
14 screws
15 union joints
16 communication cables
17 screws
18 grooves
19 boss
21 screwed holes
23 metallization vias
24 external electrodes
Electrode in 25
26 pads
27 holes
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, technical solution of the present invention is described in detail, to be further understood that the purpose of the present invention, scheme and effect, but is not intended as the restriction of claims protection domain of the present invention.
Consult Fig. 1 to Fig. 3, as it can be seen, the three-dimensional pressure sensor of the present invention, including a housing 10, three pressure sensor unit 20, and a circuit board 30. This housing 10 is hexahedron, has the X-direction in three dimensions, a Y-direction and a Z-direction. Three pressure sensor unit 20 are respectively arranged on housing 10, and three pressure sensor unit 20 are arranged respectively in X direction, arrange along Y-direction and arrange along Z-direction. Circuit board 30 is fixedly installed in housing 10 by screw 14.
Consulting Fig. 2 again, three pressure sensor unit 20 have identical structure, its structure are discussed in detail for one of them pressure sensor unit below.
Pressure sensor unit 20 includes flexible sheet 1 and substrate 5, and wherein, flexible sheet 1 is the sensing element of pressure sensor unit 20, for the periphery fixed circular-flat diaphragm with hard center, i.e. E shape circular iris. Between substrate 5 and flexible sheet 1 keep gap be fixed on this flexible sheet 1 hard in the heart, in conjunction with consulting Fig. 4, this thick membrane electrode 4 is two the ring-type conduction band utilizing thick film technology to be printed on substrate 5 upper surface, these two ring-type conduction band are respectively as interior electrode 25 and external electrode 24, and this flexible sheet 1 constitutes reference capacitance Cr and mutual capacitance Cm with this interior electrode 25 and external electrode 24 respectively. Capacitance gap is ensured by interpolar pad 3. Interior electrode 25 and external electrode 24 are electrically connected circuit board 30.
Pressure sensor unit 20 still further comprises an electrode guard 9, and this electrode guard 9 is surrounded substrate 5 and is fixed on flexible sheet 1 by screw 11, thus pressure sensor unit 20 is in flattened round box like structure. Circuit board 30 is arranged on outside electrode guard 9, for ensureing the electrical insulating property between circuit board 30 and electrode guard 9, has additional spacer 8 between screw 11 and electrode guard 9.Protective substrate 5 is not easily damaged on the one hand in the effect of this protective cover 9, makes thick membrane electrode 4 surface remain clean on the other hand, it is to avoid to cause capacitance error.
Further, this three-dimensional pressure sensor also includes a bottom 7, the side of housing 20 is fixed by screw 17 and flexible sheet 1, and the contact surface of housing 20 and flexible sheet 1 adopts fluororubber O-type sealing ring 13 to seal, and O RunddichtringO is embedded on the outside groove 6 of flexible sheet 1. Bottom 7 and housing 20 adopt welded seal, pressurized leak detection sealing property. Housing 20 bottom inside is provided with boss 19 and conveniently welds location. Housing and bottom separate design but not one-body molded, be because when not mold, adopt tubing and bar to process respectively and can save raw material and reduce cost.
In conjunction with consulting Fig. 3, the material of flexible sheet 1 is 17-4PH constant elastic alloy, respectively through solid solution and Ageing Treatment before and after processing, has high hardness, elasticity and durability. Flexible sheet 1 upper surface is symmetrically arranged with screwed hole 21, and its effect is easy for sensor assembling. Outside flexible sheet 1 except the groove 6 of mounting O-shaped sealing ring 13, also having groove 18, the effect of groove 18 is to prevent from producing Stress Transfer during assembling electrode guard 9, causes that diaphragm produces unnecessary deformation, affects certainty of measurement. The error that volume for reducing grain class granule itself causes for sensing element, the external diameter of flexible sheet 1 is the bigger the better, it is preferable that take about 100mm in embodiment.
In conjunction with consulting Fig. 5, substrate 5 center porose 27, holding screw 2 through hole 27 substrate 5 is fixed on flexible sheet 1 hard in the heart. Substrate 5 adopts ceramic material. In conjunction with consulting Fig. 4, thick membrane electrode 4 is two the ring-type conduction band adopting thick-film technique to print in substrate 5 front, electrode 25 and external electrode 24 in respectively. Thick membrane electrode thickness is only small, about 10��25 ��m so that boundary effect is only small on the impact of electric capacity stability on the impact of capacitance and the linear expansion coefficient of film. Ceramic substrate 5 back up has pad 26, interior electrode 25 and external electrode 24 to be conducted with pad 26 respectively through a metallization via 23. Copper wire 12 one end is welded on pad 26, and the other end is welded on the test point of circuit board 30, it is achieved the electric connection of electrode and circuit board.
The material of electrode guard 9 is PVC, and its effect is protection ceramic condenser so that it is keeping clean duty, capacitance is stable, is susceptible to interference.
Referring to Fig. 2 again, also set up union joint 15 on the housing 20, union joint 15 and housing 6 are for being welded to connect. 485 output modules 34 (hereinafter having introduction) connect a communication cable 16, this communication cable 16 through after housing 6 with silo outside a host computer be connected, communication cable 16 transmits a signal to the host computer outside storehouse, make sensor internal and atmosphere outside storehouse simultaneously, ensure that air pressure inside is equal with atmospheric pressure all the time, it is to avoid internal gas expands with heat and contract with cold the error brought to measurement.
In the present invention, flexible sheet 1, housing 20, bottom 7, union joint 15 are stainless steel material, and adopt O RunddichtringO 13 to seal between housing 20 and each flexible sheet 1 and pass through screw 17 fixing, O RunddichtringO 13 is antiseptic rubber material, thus three-dimensional pressure sensor entirety is cube opposing seal structure, such structure is arranged has good Corrosion Protection, so that sensor can stand the long-term erosion of the fumigating gas such as hydrogen phosphide in silo and steam.
In conjunction with consulting Fig. 6, circuit board 30 includes demodulator module 31, adjusts amplifying circuit 32, single-chip microcomputer 33 and 485 output module 34, demodulator module 31 is electrically connected the inner and outer electrodes of each pressure sensor unit, adjusting amplifying circuit 32 to be electrically connected with demodulator module 31, single-chip microcomputer 33 is electrically connected with adjustment amplifying circuit 32 and 485 output module 34 respectively. The function of circuit board 30 is that the change that sensing element is measured the obtained capacity ratio of part is picked up, processes, calculates, and is ultimately converted to standard 485 signal. Demodulator module 31 and the sensing element (that is, flexible sheet 1) of circuit board 30 are mechanically connected by copper wire 12, and its function is that the difference of reference capacitance Cr and mutual capacitance Cm is converted to the corresponding signal of telecommunication; The adjustment amplifying circuit 32 of circuit board 30 and demodulator module 31 are electrically connected, be amplified with the signal of telecommunication that demodulator is exported, signal smoothing, adjustment, obtain difference mode signal and two signals of reference signal; The single-chip microcomputer 33 of circuit board 30 is electrically connected with adjustment amplifying circuit 32 and 485 output module 34 respectively, to be calculated processing to the signal after adjusting amplifying circuit 32, adjust the zero point of sensor, full scale, temperature-compensating is carried out according to reference signal, and control 485 output module outputting standard 485 signals, in the present invention, single-chip microcomputer 33 can adopt ARM-M0516-LBN single-chip microcomputer; 485 output modules 34 of circuit board 30 are electrically connected with single-chip microcomputer 33, process for host computer with outputting standard 485 signal.
The three-dimensional pressure sensor operating principles of the present invention is: flexible sheet 1 and thick membrane electrode 4 constitute variable condenser, respectively mutual capacitance Cm and reference capacitance Cr. Flexible sheet 1 upper surface is subject to well-distributed pressure effect and is deformed, and mutual capacitance Cm pole clearance increases, and capacitance reduces therewith. Reference capacitance Cr is distributed in the hard center range of diaphragm, and its pole clearance is constant, and capacitance does not change with by measuring pressure, and the effect of reference capacitance is used to carry out temperature-compensating. The sensitive end of circuit board is connected with mechanical capacitance by copper wire, detects change and the reference capacitance Cr of capacitance Cm in real time, and is converted into the differential mode signal of telecommunication, and finally exports 485 standardized digital signals.
It is measured as example with a three-dimensional pressure sensor wherein direction X-direction, specific implementation process is: be placed in silo corresponding test point by three-dimensional pressure sensor by placement model, after entering grain, flexible sheet 1 surface is subject to well-distributed pressure effect and is deformed, thus produce mutual capacitance Cm respectively, and reference capacitance Cr. Circuit board 30 picks up change and the reference capacitance Cr of reference capacitance Cm, and it is translated into two path signal, after the amplified process of signal, single-chip microcomputer 33 is transferred to process, adjust the zero point of sensor, full scale the coherent signal according to reference capacitance Cr, carry out temperature-compensating to measuring signal, obtaining final measurement result, Single-chip Controlling 485 output module exports corresponding 485 signals. Same process, obtains the pressure information of Y, Z-direction, and after communication cable 16 transmits, the host computer outside silo obtains the pressure value signal of three different directions of a test point, carries out Data Comparison comprehensively, completes the modeling of measurement data.
The present invention proposes a kind of three-dimensional pressure sensor, in silo, press model multiple spot arrange pressure transducer, more accurately by pressure information in sensor senses grain heap and transfer the signal of telecommunication to and be delivered to host computer, processed by data and model calculates, obtain grain gross mass.Compared with prior art, the invention have the advantages that
(1) instead of three pressure transducers of use with a pressure transducer, sensor bulk is little, cost is low.
(2) instead of three pressure transducers of use with a pressure transducer, only need to arrange a communication cable when silo is implemented and installed, wiring is simple.
(3) realize the measurement of three direction stress simultaneously, be more beneficial for obtaining grain heap internal stress distribution, accurately set up quantitative model, accurately obtain grain quality.
(4) sensor is the output of standard 485 bus type numeral.
(5) HIGH SENSITIVITY AND HIGH PRECISION, structure is relatively easy, and reliability is high, is suitable for batch production;
(6) integral seal structure of anticorrosive, anti-stifling, water vapor are all adopted.
More than simply show the embodiment with three pressure sensor unit, but in actual use, being not limited thereto, such as multidimensional pressure sensor, on five faces of housing, (face except bottom 7 place) can independent assortment realize pressure measxurement respectively.
Certainly; the present invention also can have other various embodiments; when without departing substantially from present invention spirit and essence thereof; those of ordinary skill in the art are when can make various corresponding change and deformation according to the present invention, but these change accordingly and deformation all should belong to the scope of the claims appended by the present invention.

Claims (10)

1. the three-dimensional pressure sensor detecting granary storage capacity, it is characterised in that including:
One housing, has the X-direction in three dimensions, a Y-direction and a Z-direction;
It is arranged at least three pressure sensor unit on this housing, and, the at least one of which pressure sensor unit of this at least three pressure sensor unit is arranged in X direction, the at least one of which pressure sensor unit of this at least three pressure sensor unit is arranged along Y-direction, and at least one of which pressure sensor unit of this at least three pressure sensor unit is arranged along Z-direction; And
One circuit board, is arranged in this housing;
Wherein, this pressure sensor unit each includes:
One flexible sheet; And
One substrate, with this flexible sheet keep gap be fixed on this flexible sheet, this substrate has thick membrane electrode, this thick membrane electrode is printing two ring-type conduction band on the substrate, these two ring-type conduction band are respectively as inner and outer electrodes, and this flexible sheet constitutes reference capacitance and mutual capacitance respectively with this inner and outer electrodes;
This circuit board includes demodulator module, adjusts amplifying circuit, single-chip microcomputer and 485 output modules, this demodulator module is electrically connected the inner and outer electrodes of each pressure sensor unit, this adjustment amplifying circuit is electrically connected with this demodulator module, and this single-chip microcomputer is electrically connected with this adjustment amplifying circuit and this 485 output module respectively.
2. three-dimensional pressure sensor according to claim 1, it is characterised in that each pressure sensor unit also includes an electrode guard, surrounds this substrate and is fixed on this flexible sheet so that each pressure sensor unit is flattened round box like structure.
3. three-dimensional pressure sensor according to claim 2, it is characterised in that adopt sealing ring seal and fixed by screw so that this three-dimensional pressure sensor entirety is cube opposing seal structure between this housing and this flexible sheet each.
4. three-dimensional pressure sensor according to claim 2, it is characterised in that this circuit board is arranged on outside the electrode guard of each pressure sensor unit, and the fixed installation of the remaining electrically isolated from property of electrode guard with each pressure sensor unit.
5. three-dimensional pressure sensor according to claim 2, it is characterised in that this flexible sheet arranged outside has the groove producing Stress Transfer when preventing from assembling this electrode guard.
6. three-dimensional pressure sensor according to claim 1, it is characterised in that this 485 output module connects a communication cable, this communication cable through after this housing with silo outside a host computer be connected.
7. the three-dimensional pressure sensor according to any one in claim 1-6, it is characterized in that, the back up of this substrate has pad, this interior electrode is conducted with this pad respectively through a metallization via with this external electrode, one end of one copper wire is welded on this pad, and the other end is welded on a test point of this circuit board to be electrically connected with this circuit board by this thick membrane electrode.
8. the three-dimensional pressure sensor according to any one in claim 1-6, it is characterised in that the gap between this flexible sheet and this substrate is kept by an interpolar pad.
9. the three-dimensional pressure sensor according to any one in claim 1-6, it is characterised in that this flexible sheet is the periphery fixed E shape circular iris with hard center, this substrate be fixed on this flexible sheet hard in the heart.
10. the three-dimensional pressure sensor according to any one in claim 1-6, it is characterised in that this substrate adopts ceramic substrate.
CN201410743730.0A 2014-12-08 2014-12-08 Three-dimensional pressure sensor detecting granary reserves Pending CN105651425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410743730.0A CN105651425A (en) 2014-12-08 2014-12-08 Three-dimensional pressure sensor detecting granary reserves

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Application Number Priority Date Filing Date Title
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110672244A (en) * 2019-01-21 2020-01-10 深圳市大可奇科技有限公司 3D sensing module and using method
CN111070950A (en) * 2019-12-31 2020-04-28 北京万象博众系统集成有限公司 Flexible engraver of force feedback self-adaptation cutting speed governing
CN112190245A (en) * 2020-11-06 2021-01-08 深圳市汇顶科技股份有限公司 Blood pressure measuring device and blood pressure measuring method
CN112484895A (en) * 2020-12-21 2021-03-12 天津城建大学 Three-dimensional stress testing device and method with hexahedral base as outline
CN114659697A (en) * 2022-03-28 2022-06-24 浙江机电职业技术学院 Flexible six-dimensional force sensor based on capacitive sensor

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US20140216175A1 (en) * 2011-06-03 2014-08-07 Piezocryst Advanced Sensorics Gmbh Sensor for measuring pressure and/or force
CN204359471U (en) * 2014-12-08 2015-05-27 北京航天金泰星测技术有限公司 Detect the three-dimensional pressure sensor of granary storage capacity

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CN201368786Y (en) * 2009-03-17 2009-12-23 北京科技大学 Three-dimensional vibrating wire pressure sensor
CN201532269U (en) * 2009-11-23 2010-07-21 北京科技大学 Fiber Bragg grating sensor used for measuring tri-axial pressures
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Publication number Priority date Publication date Assignee Title
CN110672244A (en) * 2019-01-21 2020-01-10 深圳市大可奇科技有限公司 3D sensing module and using method
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CN114659697B (en) * 2022-03-28 2023-06-23 浙江机电职业技术学院 Flexible six-dimensional force sensor based on capacitive sensor

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