CN105645785B - A kind of intensifying method of high-intensitive protection glass - Google Patents
A kind of intensifying method of high-intensitive protection glass Download PDFInfo
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- CN105645785B CN105645785B CN201610123670.1A CN201610123670A CN105645785B CN 105645785 B CN105645785 B CN 105645785B CN 201610123670 A CN201610123670 A CN 201610123670A CN 105645785 B CN105645785 B CN 105645785B
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- 239000011521 glass Substances 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000003426 chemical strengthening reaction Methods 0.000 claims abstract description 55
- 239000000126 substance Substances 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 25
- 238000007688 edging Methods 0.000 claims abstract description 18
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 16
- 238000004080 punching Methods 0.000 claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 28
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 24
- 230000002000 scavenging effect Effects 0.000 claims description 21
- 238000004140 cleaning Methods 0.000 claims description 15
- 239000006058 strengthened glass Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 235000010333 potassium nitrate Nutrition 0.000 claims description 12
- 239000004323 potassium nitrate Substances 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 11
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 9
- 229910017604 nitric acid Inorganic materials 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 8
- 238000005496 tempering Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 6
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 9
- 230000008595 infiltration Effects 0.000 abstract description 5
- 238000001764 infiltration Methods 0.000 abstract description 5
- 239000002344 surface layer Substances 0.000 abstract description 3
- 238000002203 pretreatment Methods 0.000 abstract description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 31
- 238000012360 testing method Methods 0.000 description 7
- 238000007654 immersion Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000000306 component Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012533 medium component Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
- Glass Compositions (AREA)
Abstract
The invention discloses a kind of intensifying methods of high-intensitive protection glass; by glass after carving machine carries out edging, chamfering, punching processing; ultrasonic cleaning, microetch processing, chemical intensification treatment are carried out again; it further include chemical strengthening pre-treatment step, chemical strengthening pretreatment can be handled between chemical intensification treatment after punching processing, before ultrasonic cleaning or in microetch.The present invention can remove the infiltration tin layers and micro-crack of surface layer of glass, and be combined by the technique of 2 chemical strengthenings and microetch, so that glass is greatly improved.
Description
Technical field
The present invention relates to glass reinforced field, more particularly to a kind of intensifying method of high-intensitive protection glass.
Background technique
With the high speed development of intelligent touch industry, towards display device protection, with glass substrate, there are two big technologies at present
Project.One is the thickness of glass to thinning transition, and existing 0.70~0.40mm glass is the main product that cover board protects glass,
In again using the ultra-thin glass of 0.40mm as leading technology.Another is then the surface strength performance of glass, usually gets over the glass of thinning
Its intensity of glass intensity after chemical strengthening can be reduced than heavy sheet glass, also meaned that the mobile phone assembled with it is easier and broken into pieces.
Edging, the chamfering, punching processing of carving machine are had to pass through with glass currently as display device protection.Due to finishing impression
Machine processes glass using high-speed rotating main shaft, needs that glass is fixed, fixed method using
Vacuum suction, while scratching in order to prevent, coating processing is carried out to adsorption plane, this has resulted in glass surface and has easily left sucker print
Mark and film trace.Naked eyes are almost invisible in normal circumstances for these traces, but visible under the strong light in darkroom.
Influence strength of glass factor be mainly：Glass surface micro-crack and glass surface seep tin.Using the method for etching
Influence of both factors to strength of glass can be removed.The general single side etched thickness of traditional method is 80~150 μm, and removal is seeped
While tin layers and crizzle, the thickness of glass is also reduced.With the increase of etched thickness, the uniformity of glass surface
It cannot be guaranteed that be also processed by shot blasting after leading to etching, cost is greatly increased.Glass after the completion of etching simultaneously will also pass through
The processes such as cutting machine cutting, carving machine grinding, lead to the appearance again of glass surface micro-crack, after eventually leading to chemical strengthening
Strength of glass reduces.
Based on above-mentioned background, it is desirable to while removing glass surface trace, reduce the etched thickness of glass, significantly mention
The surface strength of glass after high chemical strengthening.
Summary of the invention
The present invention provides one kind while removing glass surface trace, reduces the etched thickness of glass, significantly mentions
The intensifying method of the surface strength of glass after high chemical strengthening.
In order to solve the above technical problems, the present invention uses following technical scheme：
Glass is carried out edging, chamfering, punching processing by carving machine by a kind of intensifying method of high-intensitive protection glass
Afterwards, then ultrasonic cleaning, microetch processing, chemical intensification treatment are carried out, further includes chemical strengthening pre-treatment step, chemical strengthening
Pretreatment can handle and change after carving machine carries out edging, chamfering, punching processing, before ultrasonic cleaning or in microetch
It learns between intensive treatment.
The above method, the performance of the strengthened glass obtained using the process of the prior art just have a degree of mention
It rises.This is a positive factor to glass reinforced field.
The prior art be all it is step-by-step glass is subjected to edging, after chamfer machining, then carry out chemical intensification treatment, this
Kind of method can also obtain strengthened glass, but the depth that the obtained strengthened glass of this method is etched is larger（General single side energy
Reach 80~150 μm）, the intensity that can be born is not high, and the uniformity of glass surface is bad, also to be polished after leading to etching
Processing, also increases cost.In glass reinforced field, since glass reinforced method is two class of physics and chemical method, physics
Method mainly uses mechanical means, and chemical method then uses the methods of ion exchange or acidification, glass reinforced according to general thinking
Influence factor it is main related with chemical strengthening technique, other generally added using reinforcement process such as clean additional step and be
It can.Therefore, the technique of other additional steps such as reinforcement process and cleaning is substantially set.With the area prior art You Hen great
Not, the present invention is combined using chemical strengthening pretreatment, microetch processing, chemical intensification treatment and other supplementary means, can be obtained
To the higher glass of intensity；And inventor chances on during the experiment, and the pretreated process station of chemical strengthening is different
I.e. entire process sequence is different, and the glass properties obtained after glass reinforced also can be different, and chemical strengthening pretreatment is placed on
Carving machine carry out edging, chamfering, punching processing after, before ultrasonic cleaning or microetch processing and chemical intensification treatment it
Between effect it is consistent, the characteristic of obtained strengthened glass is all greatly improved, that is, the strengthened glass surface strengthened pressure
Stress be 820~880Mpa, compressive stress layer depth be 30~50 μm, compared with the existing technology for, technique of the invention with
The strengthened glass arrived has substantive distinguishing features outstanding and significant progress.
The microetch medium that microetch processing uses includes following components, is indicated with mass percent, HF：1%~5%,
H2SO4 ：1%~8%, HNO3 ：0%~5%, while HF+ H2SO4+ HNO3+ HCL total amount 7%~12%, remaining is pure water.
HF is during microetch in the present invention, mainly with the SiO in glass2 、MgO、Na2The reaction such as O, plays removing glass
The effect of glass infiltration tin layers and crizzle；H2SO4 During the polishing process, main function is shape when dissolution HF degrades glass surface
At insoluble fluosilicate, avoid its residue from being adhered to glass surface, making that treated, glass surface is smooth, therefore HF+
H2SO4+ HNO3+ HCL total amount indicates to control 7%~12% with mass percent.
Microetch is handled：Glass immersion is sprayed in microetch medium or by microetch homogeneous media
Glass surface.
Microetch handles the time as 2~15min.Microetch carving technology can control the etch depth of glass, to the strong of glass
Change performance it is influential, it is desirable to control the etch depth of different glass, need to adjust microetch medium component and rationally
Microetch is arranged to handle the time.
Ultrasonic cleaning is specially to use the lye previous cleaning of 8-10wt%, and scavenging period is 5 minutes；Again with 4-6wt% lye essence
It washes, scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period is 20~25 minutes, and pure water is 12~18,000,000；Pure water cleaning
Wide slow moving water-removal air-dries again afterwards.Lye can be the common lye such as sodium hydroxide, sodium carbonate.
Since glass is in finishing impression machining process, the dual reason of vacuum suction and overlay film causes glass surface to occur
The visually visible trace of the strong light in invisible darkroom.
The present invention can remove trace described above using the method for chemical pretreatment, and glass is placed in potassium nitrate fused salt
Middle progress high temperature pretreatment, pretreatment temperature are 380 DEG C~400 DEG C, and the chemical strengthening time is 2~30min.Wherein, it pre-processes
Temperature is preferably 390 DEG C~400 DEG C, and the chemical strengthening time is preferably 2~10min.
Chemical intensification treatment is specially that glass is put into tempering liquid to carry out chemical strengthening, and chemical strengthening temperature is 380 DEG C
~430 DEG C, the chemical strengthening time is 4~8 hours.The alkali metal ion in alkali metal ion and fused salt in glass is due to diffusion
It is exchanged with each other, generates " jammed " phenomenon, so that glass surface is generated compression stress, to improve the intensity of glass.
Strengthened glass made from foregoing intensifying method, for double-sided glass microetch with a thickness of 18~25 μm, chemistry is strong
Change glass surface compression is 820~880Mpa, and compressive stress layer depth is 35~50 μm.
Research is found：When the infiltration tin amount of glass surface reaches a certain level, the tin for penetrating into glass surface can change glass table
The chemical composition of layer can also be used as network modification ion, change the network structure of glass surface, that is, change glass surface
Physical and chemical performance, to cause influence to performances such as the mechanics of glass, optics.Therefore, it seeps tin layers and glass surface is micro-
The presence of crackle, the actual glass intensity after leading to chemical strengthening are greatly reduced.
Intensifying method set forth in the present invention is that the thickness for etching glass is made to be maintained at two-sided 18~25 μm, eliminates glass
The infiltration tin layers and micro-crack on surface layer, while compressive stress layer depth can be removed to using the pretreated glass of chemical strengthening（5~10
μm）With glass surface compression.It is handled by chemical strengthening pretreatment, microetch, the glass of chemical intensification treatment, chemical strong
After change, intensity is greatly improved.
It is indicated with mass percent, strengthened glass includes following components：SiO2 ：60~65%, Al2O3：11~17%, K2O：
0.2%~6.8%, ZrO2：0%~1.8%, while SiO2 + Al2O3+Na2O+K2O+MgO+ ZrO2The total amount of+CaO is with quality hundred
Dividing should be 89%~100% than expression.The screen of electronic device with display equipment as made from aforementioned obtained strengthened glass
The glass cover of curtain protection panels or electronic equipment outer cover.With display equipment electronic device can for mobile phone, computer, PAD,
TV, radio or stereo set with display screen, or the robot etc. with display equipment, electronic equipment outer cover can be with
For the shield etc. of use for laboratory.
Compared with prior art, the beneficial effects of the invention are as follows：
1, the present invention can remove the infiltration tin layers and micro-crack of surface layer of glass, and pass through 2 chemical strengthenings and microetch
Technique combine so that glass is greatly improved.
2, the pretreated process station difference of chemical strengthening of the invention, that is, entire process sequence is different, obtains after glass reinforced
The glass properties arrived also can be different, and the characteristic of obtained strengthened glass is all greatly improved.
Specific embodiment
The present invention is further illustrated below.Embodiments of the present invention include but is not limited to the following example.
Embodiment 1
1, glass carries out edging, chamfering, punching processing by carving machine；
2, chemical pretreatment：Glass is placed in progress high temperature pretreatment, pretreatment temperature 380 in potassium nitrate fused salt
DEG C, the chemical strengthening time is 30min；
3, ultrasonic cleaning：For with the lye previous cleaning of 8-10wt%, scavenging period is 5 minutes；Again with 4-6wt% lye essence
It washes, scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period is 20~25 minutes, and pure water is 12~18,000,000；Pure water cleaning
Wide slow moving water-removal air-dries again afterwards；
4, microetch is handled：Glass immersion is sprayed in microetch medium or by microetch homogeneous media in glass
Surface, microetch handle the time as 2~15min, and microetch medium packet is to be indicated with mass percent, HF：1%, H2SO4 ：3%,
HNO3 ：4%, remaining is pure water.
5, chemical intensification treatment：Glass is put into potassium nitrate tempering liquid and carries out chemical strengthening, chemical strengthening temperature is 380
DEG C, the chemical strengthening time is 4 hours.
Embodiment 2
1, glass carries out edging, chamfering, punching processing by carving machine；
2, chemical pretreatment：Glass is placed in progress high temperature pretreatment, pretreatment temperature 400 in potassium nitrate fused salt
DEG C, the chemical strengthening time is 2min；
3, ultrasonic cleaning：For with the lye previous cleaning of 8-10wt%, scavenging period is 5 minutes；Again with 4-6wt% lye essence
It washes, scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period is 20~25 minutes, and pure water is 12~18,000,000；Pure water cleaning
Wide slow moving water-removal air-dries again afterwards；
4, microetch is handled：Glass immersion is sprayed in microetch medium or by microetch homogeneous media in glass
Surface, microetch handle the time as 2~15min, and microetch medium packet is to be indicated with mass percent, HF：5%, H2SO4 ：
4%, remaining is pure water.
5, chemical intensification treatment：Glass is put into potassium nitrate tempering liquid and carries out chemical strengthening, chemical strengthening temperature is 430
DEG C, the chemical strengthening time is 6 hours.
Embodiment 3
1, glass carries out edging, chamfering, punching processing by carving machine；
2, chemical pretreatment：Glass is placed in progress high temperature pretreatment, pretreatment temperature 390 in potassium nitrate fused salt
DEG C, the chemical strengthening time is 10min；
3, ultrasonic cleaning：For with the lye previous cleaning of 8-10wt%, scavenging period is 5 minutes；Again with 4-6wt% lye essence
It washes, scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period is 20~25 minutes, and pure water is 12~18,000,000；Pure water cleaning
Wide slow moving water-removal air-dries again afterwards；
4, microetch is handled：Glass immersion is sprayed in microetch medium or by microetch homogeneous media in glass
Surface, microetch handle the time as 2~15min, and microetch medium packet is to be indicated with mass percent, HF：3%, H2SO4 ：1%,
HNO3 ：2%, remaining is pure water.
5, chemical intensification treatment：Glass is put into potassium nitrate tempering liquid and carries out chemical strengthening, chemical strengthening temperature is 420
DEG C, the chemical strengthening time is 4 hours.
Embodiment 4
1, glass carries out edging, chamfering, punching processing by carving machine；
2, ultrasonic cleaning：For with the lye previous cleaning of 8-10wt%, scavenging period is 5 minutes；Again with 4-6wt% lye essence
It washes, scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period is 20~25 minutes, and pure water is 12~18,000,000；Pure water cleaning
Wide slow moving water-removal air-dries again afterwards；
3, microetch is handled：Glass immersion is sprayed in microetch medium or by microetch homogeneous media in glass
Surface, microetch handle the time as 2~15min, and microetch medium packet is to be indicated with mass percent, HF：5%, H2SO4 ：
4%, HNO3 ：3%, remaining is pure water.
4, chemical pretreatment：Glass is placed in progress high temperature pretreatment, pretreatment temperature 390 in potassium nitrate fused salt
DEG C, the chemical strengthening time is 15min；
5, chemical intensification treatment：Glass is put into potassium nitrate tempering liquid and carries out chemical strengthening, chemical strengthening temperature is 400
DEG C, the chemical strengthening time is 8 hours.
Embodiment 5
1, glass carries out edging, chamfering, punching processing by carving machine；
2, ultrasonic cleaning：For with the lye previous cleaning of 8-10wt%, scavenging period is 5 minutes；Again with 4-6wt% lye essence
It washes, scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period is 20~25 minutes, and pure water is 12~18,000,000；Pure water cleaning
Wide slow moving water-removal air-dries again afterwards；
3, microetch is handled：Glass immersion is sprayed in microetch medium or by microetch homogeneous media in glass
Surface, microetch handle the time as 2~15min, and microetch medium packet is to be indicated with mass percent, HF：2%, H2SO4 ：3%,
HNO3 ：2%, remaining is pure water.
4, chemical pretreatment：Glass is placed in progress high temperature pretreatment, pretreatment temperature 380 in potassium nitrate fused salt
DEG C, the chemical strengthening time is 8min；
5, chemical intensification treatment：Glass is put into potassium nitrate tempering liquid and carries out chemical strengthening, chemical strengthening temperature is 430
DEG C, the chemical strengthening time is 6 hours.
Embodiment 7
It is indicated with mass percent, strengthened glass made from above-described embodiment includes following components：SiO2 ：60~65%,
Al2O3：11~17%, K2O：0.2%~6.8%, ZrO2：0%~1.8%, while SiO2 + Al2O3+Na2O+K2O+MgO+ ZrO2+
The total amount of CaO is indicated with mass percent should be 89%~100%.It is had made from as made from aforementioned obtained strengthened glass
Show the screen protection panel of the electronic device of equipment or the glass cover of electronic equipment outer cover.
The lateral comparison of process flow：
Technological parameter with embodiment 1 be it is quantitative, processing flow sequence is converted, and 1# is obtained（Embodiment 1）,2#（Technique
Process：Carving machine carry out edging, chamfering, punching processing after, then carry out ultrasonic cleaning, microetch processing, chemical strengthening pretreatment,
Chemical intensification treatment）,3#（Process flow：Carving machine edging, chamfering, punching-ultrasonic cleaning）,4#（Process flow：Finishing impression
Machine edging, chamfering, punching-ultrasonic cleaning-chemical strengthening）,5#（Process flow：Ultrasonic cleaning-micro etch-finishing impression
Machine edging, chamfering, punching-chemical strengthening）,6#（Process flow：Carving machine edging, chamfering, punching-ultrasonic cleaning-are micro-
Etching-chemical strengthening）, after carrying out intensive treatment according to the process flow of 1#-6# with the glass of identical quantity, carry out surface pressure
The test that stress, compressive stress layer thickness and falling sphere, face angle fall, test result such as table 1：
Table 1
As can be seen from the above table, by present invention process method and step treated 1# and 2# glass sample, surface is strong
Degree is greatly improved, and the performance after tempering is in higher level, the test of 3 Secondary Shocks of positioning height 85CM falling sphere
Glass slip gradient is 5% or less, the face positioning height 160CM falls 3 test glass slip gradients and has been even up to 1.5%, determined
Fall 2 test glass slip gradients equally also below 15% or less in the position angle height 50CM.
From the point of view of longitudinal comparison, embodiment 1- embodiment 5 is carried out to the test of bearing stress and compressive stress layer thickness, is surveyed
Test result such as table 2：
As can be seen from the above table, the two-sided compressive stress layer thickness value of embodiment 1-5 is in 30-50 μ m,
Bearing stress value mean value is between 820-880MPa.
It is as described above the embodiment of the present invention.The present invention is not limited to the above-described embodiments, anyone answers
This learns the structure change made under the inspiration of the present invention, all to have same or similar technology with of the invention
Scheme is fallen within the scope of protection of the present invention.
Claims (9)
1. a kind of intensifying method of high-intensitive protection glass, it is characterised in that：By glass by carving machine carry out edging, chamfering,
After punching processing, then ultrasonic cleaning, microetch processing, chemical intensification treatment are carried out, further includes chemical strengthening pretreatment, it is described
Chemical strengthening pretreatment can be handled after carving machine edging, chamfering, punching processing, before ultrasonic cleaning or in microetch
It is visible using the invisible strong light in darkroom of the pretreated method removal glass surface naked eyes of chemical strengthening between chemical intensification treatment
Trace, the pretreated method of the chemical strengthening is that glass is placed in potassium nitrate fused salt to progress high temperature pretreatment, and temperature is
380 DEG C~400 DEG C, the time is 2~30min.
2. intensifying method according to claim 1, it is characterised in that：The microetch medium that uses of microetch processing include with
Lower component, is indicated, HF with mass percent：1%~5%, H2SO4 ：1%~8%, HNO3 ：0%~5%, while HF+ H2SO4+ HNO3
+ HCL total amount 7%~12%, remaining is pure water.
3. intensifying method according to claim 1, it is characterised in that：Microetch handles the time as 2~15min.
4. intensifying method according to claim 1, it is characterised in that：Ultrasonic cleaning is specially to use the lye of 8-10wt%
Previous cleaning, scavenging period are 5 minutes；4-6wt% lye fine purifiation is used again, and scavenging period is 5 minutes；It is rinsed again with pure water, scavenging period
It is 20~25 minutes, pure water is 12~18,000,000；Wide slow moving water-removal air-dries again after pure water cleaning.
5. intensifying method according to claim 1, it is characterised in that：The pretreated temperature of chemical strengthening is 390 DEG C~400
DEG C, the time is 2~10min.
6. intensifying method according to claim 1, it is characterised in that：Chemical intensification treatment is specially that glass is put into tempering
Chemical strengthening is carried out in liquid, chemical strengthening temperature is 380 DEG C~430 DEG C, and the chemical strengthening time is 4~8 hours.
7. strengthened glass made from intensifying method as claimed in any one of claims 1 to 6, it is characterised in that：Double-sided glass microetch
It carves with a thickness of 18~25 μm, chemically reinforced glass bearing stress is 820~880Mpa, and compressive stress layer depth is 30~50 μm.
8. strengthened glass according to claim 7, it is characterised in that：It is indicated with mass percent, including following components：
SiO2 ：60~65%, Al2O3：11~17%, K2O：0.2%~6.8%, ZrO2：0%~1.8%, while SiO2 + Al2O3+Na2O+
K2O+MgO+ ZrO2The total amount of+CaO is indicated with mass percent should be 89%~100%.
9. the screen protection panel or electronics of the electronic device with display equipment as made from the strengthened glass of claim 8
The glass cover of equipment housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610123670.1A CN105645785B (en) | 2016-03-04 | 2016-03-04 | A kind of intensifying method of high-intensitive protection glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610123670.1A CN105645785B (en) | 2016-03-04 | 2016-03-04 | A kind of intensifying method of high-intensitive protection glass |
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| KR20190086019A (en) * | 2016-11-29 | 2019-07-19 | 코닝 인코포레이티드 | Methods for reducing warpage in tempered glass-based products and tempered glass-based products |
| CN108033685A (en) * | 2017-12-13 | 2018-05-15 | 江西沃格光电股份有限公司 | The thining method of glass panel, be thinned glass panel and display device |
| CN108298827A (en) * | 2018-01-24 | 2018-07-20 | 苏州新吴光电科技有限公司 | Improve the method for warpage after chemically enhancing glass |
| CN109849204B (en) * | 2019-01-25 | 2021-05-18 | 云南蓝晶科技有限公司 | Chamfering processing method of sapphire wafer |
| CN110282878A (en) * | 2019-05-31 | 2019-09-27 | 东莞市银泰玻璃有限公司 | A kind of processing method of eye-protecting type peep-proof glass |
| CN112047643A (en) * | 2019-06-06 | 2020-12-08 | 华为技术有限公司 | Method for strengthening glass |
| CN110723908B (en) * | 2019-10-29 | 2022-04-19 | 维达力实业(深圳)有限公司 | Glass reinforcing liquid, cover plate glass, preparation method of cover plate glass and display device |
| CN112745034A (en) * | 2019-10-30 | 2021-05-04 | 惠州市清洋实业有限公司 | Etching solution for DT-STAR material laser cutting lens and use method thereof |
| CN114292034B (en) * | 2021-12-23 | 2023-12-12 | 四川虹科创新科技有限公司 | Chemical strengthening method for anti-falling lithium aluminum silicon glass |
| CN114772914B (en) * | 2022-05-26 | 2023-10-27 | 江西沃格光电股份有限公司 | Toughening method for large-size ultrathin glass |
| CN115057624A (en) * | 2022-07-11 | 2022-09-16 | 东莞华清光学科技有限公司 | Process for increasing single-point static pressure strength of 2.5D watch glass cover plate |
| CN115925272A (en) * | 2022-12-07 | 2023-04-07 | 蚌埠中光电科技有限公司 | Chemical treatment process used before grinding of TFT-LCD glass substrate |
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| CN105236767A (en) * | 2015-10-30 | 2016-01-13 | 秦皇岛玻璃工业研究设计院 | Tempering equipment and tempering method for cover plate glass of display screen |
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| JP2002237030A (en) * | 2001-02-13 | 2002-08-23 | Nippon Sheet Glass Co Ltd | Substrate for information recording medium and manufacturing method therefor |
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| CN104829139A (en) * | 2015-04-22 | 2015-08-12 | 四川旭虹光电科技有限公司 | Polishing solution for improving glass surface strength and polishing method using the same |
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