CN105636410B - Heat pipe and electronic equipment - Google Patents
Heat pipe and electronic equipment Download PDFInfo
- Publication number
- CN105636410B CN105636410B CN201511001274.3A CN201511001274A CN105636410B CN 105636410 B CN105636410 B CN 105636410B CN 201511001274 A CN201511001274 A CN 201511001274A CN 105636410 B CN105636410 B CN 105636410B
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- Prior art keywords
- heat
- shell
- heat pipe
- electronic equipment
- eliminating medium
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of heat pipe, is used for electronic equipment, including shell and heat eliminating medium；Shell is surrounded by two groups of opposite side walls, wherein being not more than 2mm along the distance between opposite internal face of one group of side wall of the thickness direction of electronic equipment；Heat eliminating medium can be constantly fluidly arranged in shell, and heat eliminating medium is used in flow process, absorb the heat of heat source electronic component in electronic equipment and make the heat loss.It is not more than 2mm along the distance between opposite internal face of side wall of the thickness direction of electronic equipment in shell in the heat pipe, shell is set to be set as smaller along the size of the thickness direction of electronic equipment, to reduce heat pipe occupied thickness space in electronic equipment, conducive to the thickness of electronic equipment is reduced, it is allowed to realize lightening.The present invention also provides a kind of electronic equipment, the heat pipe that electronic apparatus application above-described embodiment provides, thickness can be set as smaller, be conducive to meet the requirement lightening for consumer electronic devices.
Description
Technical field
The present invention relates to Mechanical Industry Technology fields, and it is above-mentioned to further relate to a kind of application more specifically to a kind of heat pipe
The electronic equipment of heat pipe.
Background technology
With the development of society, electronic equipment is increasingly being applied to the production and living of people.
Kinds of electronic components is various in electronic equipment, wherein such as CPU electronic components can distribute largely in use
Heat need to radiate to it using radiator.
Currently, the radiator of electronic equipment includes heat pipe and fan；Heat pipe includes shell, heat transferring medium and capillary knot
Structure, capillary structure are arranged in shell, and heat transferring medium is sealed in the above-mentioned shell vacuumized.In application, the first end of heat pipe
It is overlapped with heat sources electronic components such as the above-mentioned CPU of electronic equipment, heat transferring medium absorbs the heat of heat source at the first end
Mutually become gas afterwards, gaseous heat transferring medium flow to the second end of heat pipe, later work of the gaseous heat transferring medium in said fans
It radiates at the second end under and mutually becomes liquid, then the heat transferring medium of liquid flows back under the action of above-mentioned capillary structure
Above-mentioned first end, so moves in circles, and realizes to heat source electronic element radiating.
But the thickness of shell (overlaps the ruler in direction along heat pipe and heat source electronic component in above-mentioned heat pipe
It is very little) it need to be set as larger, it causes heat pipe to occupy more thickness space, causes electronic equipment thicker, it is difficult to meet user to electricity
The lightening requirement of sub- equipment.
In conclusion how to reduce the thickness of heat pipe, facilitates electronic equipment to realize lightening, be people in the art
Member's technical problem urgently to be resolved hurrily.
Invention content
In view of this, the present invention provides a kind of heat pipe, in shell along the thickness direction of the electronic equipment it is opposite one
The distance between the internal face of group side wall is not more than 2mm, so that the thickness of heat pipe is set as smaller, heat pipe is avoided to occupy
Excessive thickness space in electronic equipment, it is lightening conducive to making the thickness of electronic equipment be set as smaller, realizing.The present invention also carries
For a kind of electronic equipment, the heat pipe that electronic apparatus application above-described embodiment provides, thickness can be set as smaller, profit
In meeting the needs of user is lightening to electronic equipment.
To achieve the above object, the present invention provides the following technical solutions：
A kind of heat pipe is used for electronic equipment, including：
Shell, the shell are surrounded by two groups of opposite side walls, wherein the thickness direction along the electronic equipment is opposite
The distance between internal face of one group of side wall is not more than 2mm；
Heat eliminating medium, the heat eliminating medium constantly can be fluidly arranged in the shell, and the heat eliminating medium
The heat of heat source electronic component in flow process, absorbing the electronic equipment simultaneously makes the heat loss.
Preferably, in above-mentioned heat pipe, the heat eliminating medium is liquid heat eliminating medium.
Preferably, in above-mentioned heat pipe, the heat eliminating medium is can to keep liquid in the first preset temperature range without phase-change
The heat eliminating medium of state.
Preferably, in above-mentioned heat pipe, first preset temperature range is -20 ° -100 °.
Preferably, in above-mentioned heat pipe, the shell is the shell of inner wall and liquid heat eliminating medium infiltration.
Preferably, in above-mentioned heat pipe, the inner wall of the shell is equipped with soakage layer.
Preferably, in above-mentioned heat pipe, the soakage layer is plastic coating or nickel coating.
Preferably, in above-mentioned heat pipe, the shell is that inner wall is equipped with the copper pipe of nickel coating or inner wall is equipped with nickel coating
Aluminum pipe.
Preferably, in above-mentioned heat pipe, the heat eliminating medium is liquid metal heat radiation medium.
Preferably, in above-mentioned heat pipe, the liquid metal heat radiation medium is gallium-indium alloy heat eliminating medium or sodium-potassium eutectic
Heat eliminating medium.
Preferably, in above-mentioned heat pipe, another group of opposite the distance between the internal face of side wall is not more than in the shell
25mm。
A kind of electronic equipment, including heat source electronic component and for the heat pipe to the heat source electronic element radiating, it is described
Heat pipe is the heat pipe described in any one of above-mentioned technical proposal.
The present invention provides a kind of heat pipe, is used for electronic equipment, including shell and heat eliminating medium, and shell is opposite by two groups
Side wall surrounds, wherein the distance between internal face of one group of side wall opposite along the thickness direction of electronic equipment is not more than 2mm；
Heat eliminating medium can be constantly fluidly arranged in shell, and heat eliminating medium is used in flow process, absorb electronic equipment
The heat of middle heat source electronic component simultaneously makes the heat loss.
In heat pipe provided by the invention, between the internal face of the opposite side wall of thickness direction of shell upper edge electronic equipment
Distance is not more than 2mm so that shell can be set as smaller along the size of the thickness direction of electronic equipment, exist to reduce heat pipe
Occupied thickness space in electronic equipment is conducive to reduce the thickness of electronic equipment, is allowed to realize lightening.
The present invention also provides a kind of electronic equipment, the heat pipe that electronic apparatus application above-described embodiment provides, thickness gauge
It is very little to be set as smaller, it is conducive to meet the requirement lightening for consumer electronic devices.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the assembling schematic diagram of heat pipe provided in an embodiment of the present invention and electronic equipment；
Fig. 2 is the schematic cross-section of the first shell provided in an embodiment of the present invention；
Fig. 3 is the schematic cross-section of second of shell provided in an embodiment of the present invention；
Fig. 4 is the schematic cross-section of the third shell provided in an embodiment of the present invention；
Fig. 5 is the schematic cross-section of the 4th kind of shell provided in an embodiment of the present invention
Wherein, in Fig. 1-Fig. 5：
Shell 101；Actuator 102；Heat source electronic component 201；Fan 202.
Specific implementation mode
The embodiment of the invention discloses a kind of heat pipe, along opposite one group of the thickness direction of the electronic equipment in shell
The distance between internal face of side wall is not more than 2mm, and the thickness of heat pipe is enable to be set as smaller, and heat pipe is avoided to occupy electricity
Excessive thickness space in sub- equipment, it is lightening conducive to making the thickness of electronic equipment be set as smaller, realizing.The embodiment of the present invention
A kind of electronic equipment is also provided, the heat pipe that electronic apparatus application above-described embodiment provides, thickness can be set as compared with
It is small, conducive to meeting the needs of user is lightening to electronic equipment.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig.1-Fig. 5, the embodiment of the present invention provides a kind of heat pipe, is used for electronic equipment, including shell 101 and dissipates
Thermal medium, shell 101 are surrounded by two groups of opposite side walls, wherein the one group side wall opposite along the thickness direction of electronic equipment
The distance between internal face is no more than 2mm (i.e. L1 is set as being not more than 2mm in Fig. 2-5)；Above-mentioned heat eliminating medium can not stop
It is arranged dynamicly in shell 101, and heat eliminating medium is used in flow process, absorbs the heat source electronic component of electronic equipment
201 heat simultaneously makes the heat loss.Specifically, heat eliminating medium is inhaled at bulb portion corresponding with heat source electronic component 201
Heat is received, in the bulb portion dissipated heat far from above-mentioned heat source electronic component 201, and this is used for the shell of heat eliminating medium heat dissipation
Part is corresponding with the fan 202 of electronic equipment.
In heat pipe provided by the invention, the inner wall of one group of opposite side wall of thickness direction of 101 upper edge electronic equipment of shell
The distance between face is not more than 2mm so that heat pipe can be set as smaller along the size of the thickness direction of electronic equipment, to subtract
Small heat pipe occupied thickness space in electronic equipment is conducive to reduce the thickness of electronic equipment, is allowed to realize lightening.
Further, in above-mentioned heat pipe, heat eliminating medium is set as liquid heat eliminating medium.In application, liquid heat eliminating medium exists
It constantly during flowing, absorbs the heat of heat source electronic component 201 and makes the heat loss, in entire heat absorption and radiation processes
Liquid is remained, the middle heat pipe that heat absorption and heat dissipation are realized using heat eliminating medium phase transformation, is not present compared with the prior art
The problem of caloric receptivity reaches the upper limit in endothermic process it can quickly and efficiently absorb the heat of the heat dissipation of heat source electronic component 201 simultaneously
It is allowed to lost, radiating efficiency higher, effect is more preferable.
Further, in above-mentioned heat pipe, heat eliminating medium is configured to that phase does not occur in the first preset temperature range
Become, remains liquid.It is well known that the thermal Finite that the heat source electronic component 201 of electronic equipment generates, and in the present embodiment
Heat eliminating medium is configured to keep liquid in the first preset temperature range, can always be protected during electronic apparatus application
Hold liquid with to heat source electronic component 201 effectively radiate, be also convenient for expand heat eliminating medium selection range, facilitate user according at
Sheet, manufacture craft etc. choose suitable material and do heat eliminating medium.Specifically, above-mentioned first preset temperature range be set as -20 ° -
100°。
In addition, in above-mentioned heat pipe, 101 internal fluid passageways of shell may be configured as being full of by heat eliminating medium, but shell 101 needs
It encapsulates, in order to reduce manufacture difficulty, the heat eliminating medium that the internal fluid passageways of shell 101 are set as existing liquid has gas again
Body.Since the thickness of above-mentioned shell 101 is smaller, in order to avoid liquid heat eliminating medium is made in 101 internal cause surface tension of shell
With and generate bubble or even form discontinuous heat eliminating medium liquid bead, above-mentioned shell 101 is set as inner wall and is soaked with heat eliminating medium
The shell 101 of profit, to ensure that heat eliminating medium can form stable and liaison liquid heat eliminating medium stream in shell 101, it is ensured that
The heat pipe always can effectively radiate to heat source electronic component 201.
Correspondingly, the material preparation infiltrated with the heat eliminating medium of liquid can be used in above-mentioned shell 101, it can also be in shell 101
Inner wall be arranged soakage layer.Specifically, according to the type of heat eliminating medium, above-mentioned soakage layer may be configured as plastic coating, nickel coating
Or the electroplated layer etc. that other metals are formed.
For the ease of manufacture and it is cost-effective, above-mentioned shell 101 may be configured as inner wall equipped with nickel coating copper pipe or
Person's inner wall is equipped with the aluminum pipe of nickel coating, and certainly according to the infiltration needs of heat eliminating medium, shell 101 may also be configured to by other materials
The shell 101 of preparation, or the shell 101 with other soakage layers, the present embodiment is not specifically limited.
In above-mentioned heat pipe, heat eliminating medium is set as liquid metal heat radiation medium, which can specifically set
It is set to gallium-indium alloy heat eliminating medium or sodium-potassium eutectic heat eliminating medium.
Specifically, in above-mentioned heat pipe, another group of opposite the distance between the internal face of side wall is not more than in shell 101
L2 need to be set as being not more than 25mm in 25mm, i.e., such as Fig. 2-5.Above-mentioned shell 101 may be configured as the rectangle shell of rule, such as Fig. 3
It is shown, rectangle shell of the edge with chamfering is may also be configured to, as shown in Fig. 2, it is other types four to be set as cross section
Side shape, other shells close to quadrangle, as illustrated in figures 4-5.
The shell 101 of above-mentioned heat pipe is set as annular enclosed shell, and shell 101 is equipped with actuator 102, scattered for driving
Thermal medium constantly does annularly flow along shell 101.In order to coordinate liquid metal heat radiation medium, above-mentioned actuator 102 that can specifically set
It is set to electromagnetic pump.
In the heat pipe, heat eliminating medium is driven by actuator 102, middle compared to the prior art to utilize phase-change heat medium and hair
Fine texture is not influenced the heat pipe of heat source electronic element radiating by heat eliminating medium gravity, can make heat eliminating medium quickly by
Bulb portion on shell 101 for heat dissipation flows back to bulb portion corresponding with heat source electronic component 201, makes heat source electronic component
201 heat can quickly scatter and disappear, radiating efficiency higher.
The present invention also provides a kind of electronic equipment comprising heat source electronic component 201 and for heat source electronic component 201
The heat pipe of heat dissipation, wherein heat pipe is the heat pipe that above-described embodiment provides.
Above-mentioned heat pipe cooperation radiator fan 202 is used to radiate to heat source electronic component 201.Last point of heat pipe with
Heat source electronic component 201 overlaps, and another part is close to radiator fan 202, in application, heat eliminating medium is first with heat source electronics
Heat is absorbed at 201 corresponding position of part, is then passed at position corresponding with radiator fan 202 and in radiator fan 202
The lower heat dissipation of effect, heat eliminating medium flow to part corresponding with heat source electronic component 201 and absorbs heat again later, and so on, real
Now radiate to heat source electronic component 201.
The heat pipe that electronic apparatus application provided by the invention above-described embodiment provides, thickness can be set as compared with
It is small, conducive to meeting the needs of user is lightening to electronic equipment.Certainly, which also has with what above-described embodiment provided
Other effects of heat pipe are closed, details are not described herein.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (11)
1. a kind of heat pipe is used for electronic equipment, which is characterized in that including：
Shell, the shell are surrounded by two groups of opposite side walls, wherein along opposite one group of the thickness direction of the electronic equipment
The distance between internal face of side wall is not more than 2mm；
Heat eliminating medium, the heat eliminating medium constantly can be fluidly arranged in the shell, and the heat eliminating medium is used for
In flow process, absorbs the heat of the heat source electronic component of the electronic equipment and make the heat loss；
The heat eliminating medium is liquid heat eliminating medium, and the heat eliminating medium is absorbing heat and remaining liquid in radiation processes.
2. heat pipe according to claim 1, which is characterized in that the heat eliminating medium is can be in the first preset temperature range
Inside without phase-change, the heat eliminating medium of liquid is kept.
3. heat pipe according to claim 2, which is characterized in that first preset temperature range is -20 ° -100 °.
4. heat pipe according to claim 1, which is characterized in that the shell is that inner wall is infiltrated with the liquid heat eliminating medium
Shell.
5. heat pipe according to claim 4, which is characterized in that the inner wall of the shell is equipped with soakage layer.
6. heat pipe according to claim 5, which is characterized in that the soakage layer is plastic coating or nickel coating.
7. heat pipe according to claim 6, which is characterized in that the shell is the copper pipe or interior that inner wall is equipped with nickel coating
Wall is equipped with the aluminum pipe of nickel coating.
8. according to the heat pipe described in claim 1-7 any one, which is characterized in that the heat eliminating medium is liquid metal heat radiation
Medium.
9. heat pipe according to claim 8, which is characterized in that the liquid metal heat radiation medium is that gallium-indium alloy heat dissipation is situated between
Matter or sodium-potassium eutectic heat eliminating medium.
10. heat pipe according to claim 1, which is characterized in that the internal face of another group of opposite side wall in the shell
The distance between be not more than 25mm.
11. a kind of electronic equipment, which is characterized in that including heat source electronic component and for the heat source electronic element radiating
Heat pipe, the heat pipe are the heat pipe described in claim 1-10 any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001274.3A CN105636410B (en) | 2015-12-28 | 2015-12-28 | Heat pipe and electronic equipment |
| US15/392,053 US10031564B2 (en) | 2015-12-28 | 2016-12-28 | Heat dissipation apparatus and system for an electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001274.3A CN105636410B (en) | 2015-12-28 | 2015-12-28 | Heat pipe and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105636410A CN105636410A (en) | 2016-06-01 |
| CN105636410B true CN105636410B (en) | 2018-10-12 |
Family
ID=56050734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511001274.3A Active CN105636410B (en) | 2015-12-28 | 2015-12-28 | Heat pipe and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105636410B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2681341Y (en) * | 2003-12-03 | 2005-02-23 | 鸿富锦精密工业（深圳）有限公司 | Heat sink using heat pipe |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal radiating mechanism |
| CN102811588A (en) * | 2011-05-30 | 2012-12-05 | 富准精密工业(深圳)有限公司 | Electronic equipment |
-
2015
- 2015-12-28 CN CN201511001274.3A patent/CN105636410B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2681341Y (en) * | 2003-12-03 | 2005-02-23 | 鸿富锦精密工业（深圳）有限公司 | Heat sink using heat pipe |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal radiating mechanism |
| CN102811588A (en) * | 2011-05-30 | 2012-12-05 | 富准精密工业(深圳)有限公司 | Electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105636410A (en) | 2016-06-01 |
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