CN105633536A - Enhanced microstrip line power synthesizer - Google Patents
Enhanced microstrip line power synthesizer Download PDFInfo
- Publication number
- CN105633536A CN105633536A CN201410642564.5A CN201410642564A CN105633536A CN 105633536 A CN105633536 A CN 105633536A CN 201410642564 A CN201410642564 A CN 201410642564A CN 105633536 A CN105633536 A CN 105633536A
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- China
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- microstrip line
- power combiner
- line power
- copper strips
- reinforced
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Abstract
The present invention provides an enhanced microstrip line power synthesizer, comprising a microstrip line power synthesizer and a copper strip, wherein the copper strip is arranged on a microstrip line of the microstrip line power synthesizer, and covers the surface of the microstrip line; the width and the length of the copper strip are consistent with the width and the length of the microstrip line of the microstrip line power synthesizer, and the thickness of the copper strip is greater than the thickness of the microstrip line of the microstrip line power synthesizer. According to the enhanced microstrip line power synthesizer, the thickened copper strip is arranged on the surface of the microstrip line, so that heat of the microstrip line can be effectively dissipated, thereby solving the problem of heat dissipation of a printed board, and ensuring stable operation of the power synthesizer; in addition, when load changes, the microstrip line of which the surface is provided with the thickened copper strip can bear larger power and higher temperature, so that the microstrip line cannot burn out.
Description
Technical field
The present invention relates to a kind of power combiner, particularly relate to a kind of reinforced microstrip line power combiner for RF high power synthesis.
Background technology
Use microstrip design Wilkinson power combiner, be Radio Frequency Engineer through frequently with the method for designing of a kind of power combing. Refer to shown in Figure 1A and Figure 1B, be front view and the left view of existing a kind of microstrip line Wilkinson power combiner. Wherein, microstrip line power combiner 100 is main to be made up of printed board 110 and the microstrip line 120 with specified impedance being formed on printed board 110 surface, and usual microstrip line 120 is by covering the formation of copper printed board photoetching corrosion. As shown in Figure 1A, microstrip line 120 has two inputs 121,122 in the same side on printed board 110 surface, and the opposite side on printed board 110 surface has a synthesis outfan 123. The power combiner of this use microstrip design is not only processed simply, and debugging work load is only small, and has good concordance.
But the power combiner of this use microstrip design there is also certain limitation because printed board to cover copper thickness all very thin, conventional thickness has 0.018mm and 0.035mm, thickening can accomplish 0.07mm. When using power composite device high-power with the microstrip design of overlying copper thickness, when load input terminal impedance is with power combiner outfan matches impedances, power combiner can bear the peak power allowing to pass through on the microstrip line, and can steady operation. But when load changes, such as, when open circuit or short circuit, reflection power can be produced, the power that now power combiner bears can double, the temperature meeting rapid increase of microstrip line, and owing to load is not mated, resonance point is likely fallen on certain point of power combiner, cause sparking, burn microstrip line.
As can be seen here, above-mentioned existing microstrip line power combiner in structure and uses, it is clear that has still suffered from inconvenience and defect, and has urgently been further improved. In view of this, the present inventor is based on being engaged in practical experience and the Professional knowledge that this type of product design manufacture is enriched for many years, and coordinate the utilization of scientific principle, actively in addition research and innovation, to founding the reinforced microstrip line power combiner of a kind of new structure, general existing microstrip line power combiner can be improved, have more practicality. Through constantly research, design, and after repeatedly studying sample and improving, finally create the present invention having practical value.
Summary of the invention
It is an object of the invention to, overcome the defect that existing microstrip line power combiner exists, and the reinforced microstrip line power combiner of a kind of new structure is provided, technical problem to be solved is through arranging the copper strips of thickening on microstrip line surface, solve microstrip line power combiner problem of easy heating burnout when synthesizing for RF high power, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions. According to the reinforced microstrip line power combiner of one that the present invention proposes, comprising: microstrip line power combiner and copper strips, described copper strips is arranged on the microstrip line of described microstrip line power combiner, and covers the surface of described microstrip line; The width of described copper strips keeps consistent with length with the width of the microstrip line of described microstrip line power combiner and length, and the thickness of described copper strips is more than the thickness of the microstrip line of described microstrip line power combiner.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid reinforced microstrip line power combiner, the thickness of wherein said copper strips is 0.1mm to 0.3mm.
Aforesaid reinforced microstrip line power combiner, wherein said microstrip line power combiner includes: printed board and be formed at the microstrip line with specified impedance on described printing board surface; The thickness of described printed board is that on the basis that the impedance of described microstrip line is consistent with design load after ensureing to be arranged at by described copper strips on described microstrip line, thickness according to described copper strips is determined.
Aforesaid reinforced microstrip line power combiner, wherein said copper strips is on the surface of the microstrip line being welded on described microstrip line power combiner by Reflow Soldering, with described microstrip line compact siro spinning technology.
Aforesaid reinforced microstrip line power combiner, wherein said microstrip line power combiner is Wilkinson power combiner, its microstrip line the surface of the printed board of described microstrip line power combiner side be respectively arranged at two ends with an input, and be provided with a synthesis outfan in the centre of opposite side on the surface of the printed board of the described microstrip line power combiner relative with this side.
The present invention compared with prior art has clear advantage and beneficial effect. By technique scheme, the reinforced microstrip line power combiner of the present invention at least has following advantages and beneficial effect: the present invention by arranging the copper strips of thickening on microstrip line surface, effectively the heat of microstrip line can be dissipated, solve the heat dissipation problem of printed board, ensure the stable operation of power combiner, and when load changes, the microstrip line of the copper strips that surface configuration thickeies can bear the temperature of bigger power and Geng Gao, makes the microstrip line be burned out.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention, and can be practiced according to the content of description, and in order to the above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Accompanying drawing explanation
Figure 1A and Figure 1B is front view and the left view of existing a kind of microstrip line Wilkinson power combiner.
Fig. 2 is the schematic diagram of a preferred embodiment of the microstrip line power combiner of the reinforced microstrip line power combiner of the present invention.
Fig. 3 is the schematic diagram of a preferred embodiment of the copper strips of the reinforced microstrip line power combiner of the present invention.
Fig. 4 is the schematic side view of the reinforced microstrip line power combiner of the present invention.
Fig. 5 is the partial enlarged drawing of reinforced microstrip line power combiner in Fig. 4.
100: microstrip line power combiner 110: printed board
120: microstrip line 121,122: input
123: synthesis outfan 200: copper strips
Detailed description of the invention
For further setting forth that the present invention reaches technological means and effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, to reinforced its detailed description of the invention of microstrip line power combiner proposed according to the present invention, structure, feature and effect thereof, describe in detail as after.
Referring to shown in Fig. 2, Fig. 3, Fig. 4 and Fig. 5, Fig. 2 is the schematic diagram of a preferred embodiment of the microstrip line power combiner of the reinforced microstrip line power combiner of the present invention. Fig. 3 is the schematic diagram of a preferred embodiment of the copper strips of the reinforced microstrip line power combiner of the present invention. Fig. 4 is the schematic side view of the reinforced microstrip line power combiner of the present invention. Fig. 5 is the partial enlarged drawing of reinforced microstrip line power combiner in Fig. 4.
The reinforced microstrip line power combiner of the present invention is mainly made up of microstrip line power combiner 100 and copper strips 200. Wherein, microstrip line power combiner 100 is main is made up of printed board 110 and the microstrip line 120 with specified impedance being formed on printed board 110 surface. As shown in Figure 2, the microstrip line power combiner 100 of the present invention is Wilkinson power combiner, microstrip line 120 the surface of printed board 110 side be respectively arranged at two ends with an input 121,122, and be provided with a synthesis outfan 123 in the centre of the opposite side on the surface of the printed board 110 relative with this side. Copper strips 200 is arranged on the microstrip line 120 of microstrip line power combiner 100, and covers the surface of microstrip line 120. As it is shown on figure 3, the width of copper strips 200 keeps consistent with length with the width of the microstrip line 120 of microstrip line power combiner 100 and length, the thickness of copper strips 200 is more than the thickness of the microstrip line 120 of microstrip line power combiner 100.
Owing to micro-strip line impedance can be produced impact by different copper strips thickness, so the thickness of the printed board 110 of microstrip line rate merit clutch 100 needs the thickness according to set copper strips 200 to determine, after being arranged on microstrip line 120 with guarantee by copper strips 200, the impedance of microstrip line 120 is consistent with design load.
The present invention can first design a microstrip line rate merit clutch 100 during fabrication, then according to one width of dimensioned of the microstrip line 120 of microstrip line rate merit clutch 100 keeps consistent with length with microstrip line 120, and the copper strips 200 that thickness thickeies, wherein the thickness of copper strips 200 can need processing according to what design, general copper strips 200 thickness is 0.1mm to 0.3mm, again the copper strips 200 processed is welded on by Reflow Soldering afterwards on the surface of microstrip line 120 of the microstrip line rate merit clutch 100 designed, the smooth of copper strips 200 is ensured when welding, make itself and microstrip line 120 compact siro spinning technology, the phenomenon of copper strips 200 warpage can not occur.
The above, it it is only presently preferred embodiments of the present invention, not the present invention is done any pro forma restriction, although the present invention is disclosed above with preferred embodiment, but it is not limited to the present invention, any those skilled in the art, without departing within the scope of technical solution of the present invention, when the technology contents of available the disclosure above makes a little change or is modified to the Equivalent embodiments of equivalent variations, in every case it is without departing from technical solution of the present invention content, according to any simple modification that above example is made by the technical spirit of the present invention, equivalent variations and modification, all still fall within the scope of technical solution of the present invention.
Claims (5)
1. a reinforced microstrip line power combiner, it is characterised in that comprising: microstrip line power combiner and copper strips, described copper strips is arranged on the microstrip line of described microstrip line power combiner, and covers the surface of described microstrip line; The width of described copper strips keeps consistent with length with the width of the microstrip line of described microstrip line power combiner and length, and the thickness of described copper strips is more than the thickness of the microstrip line of described microstrip line power combiner.
2. reinforced microstrip line power combiner according to claim 1, it is characterised in that the thickness of wherein said copper strips is 0.1mm to 0.3mm.
3. reinforced microstrip line power combiner according to claim 1, it is characterised in that wherein said microstrip line power combiner includes: printed board and be formed at the microstrip line with specified impedance on described printing board surface; The thickness of described printed board is that on the basis that the impedance of described microstrip line is consistent with design load after ensureing to be arranged at by described copper strips on described microstrip line, thickness according to described copper strips is determined.
4. reinforced microstrip line power combiner according to claim 1, it is characterised in that wherein said copper strips is on the surface of the microstrip line being welded on described microstrip line power combiner by Reflow Soldering, with described microstrip line compact siro spinning technology.
5. the reinforced microstrip line power combiner according to any claim in Claims 1-4, it is characterized in that wherein said microstrip line power combiner is Wilkinson power combiner, its microstrip line the surface of the printed board of described microstrip line power combiner side be respectively arranged at two ends with an input, and be provided with a synthesis outfan in the centre of opposite side on the surface of the printed board of the described microstrip line power combiner relative with this side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410642564.5A CN105633536A (en) | 2014-11-07 | 2014-11-07 | Enhanced microstrip line power synthesizer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410642564.5A CN105633536A (en) | 2014-11-07 | 2014-11-07 | Enhanced microstrip line power synthesizer |
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| CN105633536A true CN105633536A (en) | 2016-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410642564.5A Pending CN105633536A (en) | 2014-11-07 | 2014-11-07 | Enhanced microstrip line power synthesizer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131169A (en) * | 2021-04-16 | 2021-07-16 | 成都泰格微电子研究所有限责任公司 | Assembly process of filtering annular assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1460889A3 (en) * | 2003-03-18 | 2005-01-05 | Sumitomo Metal (Smi) Electronics Devices Inc. | Plastic package with high heat dissipation and method for manufacturing the same |
| CN101930963A (en) * | 2009-06-19 | 2010-12-29 | 赫克斯科技股份有限公司 | Segment difference type ceramic copper-clad plate unit and manufacturing method thereof |
| KR101064793B1 (en) * | 2009-06-08 | 2011-09-14 | 박종진 | Radiant heat led board |
| CN202259649U (en) * | 2011-10-24 | 2012-05-30 | 伍鑫 | Three-combiner structure based on Wilkinson |
| CN203596405U (en) * | 2013-11-02 | 2014-05-14 | 李梓萌 | Broadband one-to-three power divider with small size, low intermodulation and high power |
-
2014
- 2014-11-07 CN CN201410642564.5A patent/CN105633536A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1460889A3 (en) * | 2003-03-18 | 2005-01-05 | Sumitomo Metal (Smi) Electronics Devices Inc. | Plastic package with high heat dissipation and method for manufacturing the same |
| KR101064793B1 (en) * | 2009-06-08 | 2011-09-14 | 박종진 | Radiant heat led board |
| CN101930963A (en) * | 2009-06-19 | 2010-12-29 | 赫克斯科技股份有限公司 | Segment difference type ceramic copper-clad plate unit and manufacturing method thereof |
| CN202259649U (en) * | 2011-10-24 | 2012-05-30 | 伍鑫 | Three-combiner structure based on Wilkinson |
| CN203596405U (en) * | 2013-11-02 | 2014-05-14 | 李梓萌 | Broadband one-to-three power divider with small size, low intermodulation and high power |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131169A (en) * | 2021-04-16 | 2021-07-16 | 成都泰格微电子研究所有限责任公司 | Assembly process of filtering annular assembly |
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Application publication date: 20160601 |