CN210516490U - Platform type ceramic chip mechanism - Google Patents
Platform type ceramic chip mechanism Download PDFInfo
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- CN210516490U CN210516490U CN201921769104.3U CN201921769104U CN210516490U CN 210516490 U CN210516490 U CN 210516490U CN 201921769104 U CN201921769104 U CN 201921769104U CN 210516490 U CN210516490 U CN 210516490U
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Abstract
The utility model discloses a platform formula ceramic chip mechanism, including the ceramic chip body, ceramic chip body upper surface and lower surface protrusion respectively are provided with first electrode and second electrode, state that the structure size of first electrode and second electrode is the same, ceramic chip body, first electrode and second electrode all are cylindrical structure setting, the diameter size of first electrode and second electrode is less than the diameter size of ceramic chip body, first electrode and second electrode are obtained through printing or vacuum sputtering conductive metal by the ceramic chip base member, ceramic chip base member and ceramic chip body adopt the integral type structure that the punching press obtained. The utility model discloses a cascaded structure setting that smooth plane formed has improved the disappearance of the ceramic chip damage that produced when the electric current is too big, and fundamentally reduces the production of spark and the problem that the pseudo-breakdown that the spark stream cluster produced between two electrodes when traditional electric capacity discharges.
Description
Technical Field
The utility model relates to a platform formula ceramic chip mechanism.
Background
The ceramic chip capacitor is a capacitor which is formed by using a ceramic material as a medium, coating a layer of metal film on the surface of the ceramic material and then sintering the metal film at high temperature to be used as an electrode. The existing ceramic chip capacitor is generally a plane ceramic chip and a dish-shaped ceramic chip, the structure of the existing ceramic chip capacitor is generally a concave surface structure, and a reserved edge is arranged on the surface of the existing ceramic chip capacitor, so that sparks are easily generated when current discharges, current loss is caused, the capacitor is easily damaged due to overlarge sparks, and the sparks are easily strung between electrodes from the side edge, so that a false breakdown phenomenon occurs.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an adopt cascaded structure setting that smooth plane formed, improved the disappearance of the ceramic chip damage that produced when the electric current is too big, fundamentally reduces the platform formula ceramic chip mechanism of the problem of the pseudo breakdown that the production of spark and spark stream cluster produced between two electrodes when traditional electric capacity discharges.
The technical scheme of the utility model be, a platform formula ceramic chip mechanism, including the ceramic chip body, ceramic chip body upper surface and lower surface protrusion respectively are provided with first electrode and second electrode, state that the structure size of first electrode and second electrode is the same, ceramic chip body, first electrode and second electrode all are cylindrical structure setting, the diameter size of first electrode and second electrode is less than the diameter size of ceramic chip body, first electrode and second electrode are obtained through printing or vacuum sputtering conductive metal by the ceramic chip base member, ceramic chip base member and ceramic chip body are the integral type structure that adopts the punching press to obtain.
In a preferred embodiment of the present invention, the outer surface of the tile body is a smooth plane structure.
In a preferred embodiment of the present invention, the outer surfaces of the first electrode and the second electrode are disposed in a smooth planar structure.
In a preferred embodiment of the present invention, the first electrode and the second electrode form a stepped structure with the upper surface and the lower surface of the tile body.
A platform formula ceramic chip mechanism, the utility model discloses a cascaded structure setting that smooth plane formed has improved the disappearance of the ceramic chip damage that produced when the electric current is too big, and fundamentally reduces the production of spark and the problem that the pseudo breakdown that the spark stream cluster produced between two electrodes when traditional electric capacity discharges.
Drawings
Fig. 1 is a schematic structural diagram of a platform-type ceramic tile mechanism according to a preferred embodiment of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to more easily understand the advantages and features of the present invention, and to make more clear and definite definitions of the scope of the present invention.
The utility model relates to a platform formula ceramic chip mechanism, as shown in fig. 1, including ceramic chip body 1, the ceramic chip base member that the punching press was formed with the integral type structure respectively at the upper surface of ceramic chip body and lower surface, obtain first electrode 2 and second electrode 3 through printing or vacuum sputtering electrically conductive metal on the ceramic chip base member, first electrode 2 is the same with 3 structure sizes of second electrode, ceramic chip body 1, smooth planar structure setting is personally submitted in the outward appearance of first electrode 2 and second electrode 3, ceramic chip body 1, first electrode 2 and second electrode 3 all are cylindrical structure setting and the diameter size of first electrode 2 and second electrode 3 is less than the diameter size of ceramic chip body 1 for first electrode 2 and 3 protrusions of second electrode set up in 1 upper surface of ceramic chip body and lower surface and form cascaded mechanism with ceramic chip body 1.
The first electrode formed by the structure can obtain a full electrode, and the ceramic chip body is not provided with edges, so that the problem of edge leaving of the concave ceramic chip of the existing plane ceramic chip is improved, sparks generated during current discharge are reduced, the problem that the capacitor body is damaged due to overlarge sparks is solved, and the current loss can be solved simultaneously due to the fact that the sparks generated during discharge are reduced.
The ceramic chip body is used as a second layer of insurance to block sparks generated during discharge, thereby improving the problem of circuit breaking generated when the current amount of the existing plane ceramic chip and the existing dish-shaped ceramic chip is overlarge, preventing sparks from flowing between the first electrode and the second electrode from the side edge, avoiding the common problem of false breakdown of the existing capacitor, reducing the probability of capacitor damage, improving the design of the groove of the existing concave ceramic chip, improving the defect of ceramic chip damage generated when the current is overlarge due to the design of a step-type structure formed by a smooth plane, and fundamentally reducing the problems of spark generation and false breakdown generated when the spark flows between two electrodes during discharge of the traditional capacitor.
A platform formula ceramic chip mechanism, the utility model discloses a cascaded structure setting that smooth plane formed has improved the disappearance of the ceramic chip damage that produced when the electric current is too big, and fundamentally reduces the production of spark and the problem that the pseudo breakdown that the spark stream cluster produced between two electrodes when traditional electric capacity discharges.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can be covered within the protection scope of the present invention without the changes or substitutions thought by the inventive work within the technical scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (4)
1. The utility model provides a platform formula ceramic chip mechanism, includes the ceramic chip body, its characterized in that: the ceramic chip comprises a ceramic chip body, wherein the upper surface and the lower surface of the ceramic chip body are respectively provided with a first electrode and a second electrode in a protruding mode, the first electrode and the second electrode are the same in structure size, the ceramic chip body, the first electrode and the second electrode are all arranged in a cylindrical structure, the diameter size of the first electrode and the diameter size of the second electrode are smaller than that of the ceramic chip body, the first electrode and the second electrode are obtained by printing or vacuum sputtering of conductive metal on the ceramic chip base body, and the ceramic chip base body and the ceramic chip body are of an integrated structure obtained by stamping.
2. The platform tile mechanism of claim 1, wherein: the outer surface of the ceramic chip body is in a smooth plane structure.
3. The platform tile mechanism of claim 1, wherein: the outer surfaces of the first electrode and the second electrode are in a smooth plane structure.
4. The platform tile mechanism of claim 1, wherein: the first electrode and the second electrode form a stepped structure with the upper surface and the lower surface of the ceramic tile body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921769104.3U CN210516490U (en) | 2019-10-22 | 2019-10-22 | Platform type ceramic chip mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921769104.3U CN210516490U (en) | 2019-10-22 | 2019-10-22 | Platform type ceramic chip mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210516490U true CN210516490U (en) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921769104.3U Active CN210516490U (en) | 2019-10-22 | 2019-10-22 | Platform type ceramic chip mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210516490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739152A (en) * | 2019-10-22 | 2020-01-31 | 暄泰电子(苏州)有限公司 | platform type ceramic chip mechanism |
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2019
- 2019-10-22 CN CN201921769104.3U patent/CN210516490U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739152A (en) * | 2019-10-22 | 2020-01-31 | 暄泰电子(苏州)有限公司 | platform type ceramic chip mechanism |
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