CN105624656B - A kind of chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings and preparation method thereof - Google Patents

A kind of chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings and preparation method thereof Download PDF

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CN105624656B
CN105624656B CN201511024375.2A CN201511024375A CN105624656B CN 105624656 B CN105624656 B CN 105624656B CN 201511024375 A CN201511024375 A CN 201511024375A CN 105624656 B CN105624656 B CN 105624656B
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plating
composite structure
ptfe
sodium
coating
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CN105624656A (en
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付传起
王宇
雍帆
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Dalian University
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The present invention discloses a kind of Electroless Plating Ni P/Ni Mo P PTFE composite structure platings and preparation method thereof, belongs to functional coating technical field.The composite structure plating is followed successively by from surface to metal base：Ni Mo P PTFE coating, Ni P coating, the preparation method of the composite structure plating comprise the following steps：Metal base is subjected to oil removing, pickling, activation process；In metallic substrate surface Electroless Plating Ni P coating as inducing layer；The Electroless Plating Ni Mo P PTFE coating on Ni P coating；Cleaning, drying；The Ni P/Ni Mo P PTFE composite structure platings prepared using the method for the present invention, by adjusting the microstructure of coating, and then are improved its physics, chemical property, can significantly increase anticorrosive, the scale-preventing performance of pipeline.

Description

A kind of chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings and preparation method thereof
Technical field
The present invention relates to a kind of method for carrying out anti-corrosion anti-scale coating technology processing in pipe surface, is specially a kind of chemistry Plate Ni-P/Ni-Mo-P-PTFE composite structure platings and preparation method thereof.
Background technology
There is an urgent need to new high-efficiency energy-saving technology, municipal sewage is a kind of city residual heat type cleaning energy for economy and social development Source, heat pump Cooling and Heat Source can utilize municipal sewage to freeze for building for warm, have energy-saving and environment-friendly social benefit.Source of sewage heat The difficult point of pump Technique Popularizing application is that dirty impurities in water easily forms dirty matter and causes heat-transfer surface pollution, fouling, and the dirt matter is molten The less inorganic salts of Xie Du crystallize the material for separating out and precipitating, fouling mechanisms process in wall surface under supersaturated condition The following steps can be roughly divided into：First, water intermediate ion react generation compared with low solubility salt quasi-molecule；Second, tying Under brilliant effect, wall surface generation metastable state crystal, then continues to give birth to wherein less stablizing the crystal that phase decomposition disappears and relatively stablizes Long accumulation, ultimately forms and stablizes dirty matter；3rd, under the influence of the conditions such as temperature, pH value, solution compatibility, ultimately forming property The various dirty matter that shape differs.Due to the particularity of sewage quality, the dirty matter of generation is micro- easily with sewage source heat pump pipeline adhesive bond The attached biofilm growth formation of biological paste, oil, which is attached on heat-transfer surface, forms oil film, and floating material and suspension solid content etc. block pipeline With the entrance of equipment, block the flowing of sewage, and thermal resistance increase and deteriorate diabatic process.Severe water quality sets pipeline, heat exchange Standby blocking causes the decay of the flow blockage and heat exchange amount of sewage, makes the operation of sewage source heat pump be difficult to manage and increases dimension Repair workload.
The content of the invention
To solve the above-mentioned problems, the present invention provide a kind of chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings and Its preparation method, can improve the heat endurance, wearability and corrosion resisting property of pipeline.Technical scheme is as follows：One kindization Plating Ni-P/Ni-Mo-P-PTFE composite structure platings are learned, are followed successively by from surface to metal base：Ni-Mo-P-PTFE coating, Ni- P coating.
The preparation method of the chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings is claimed in the present invention at the same time, This method is included following steps in sequence：
(1) oil removing, pickling, activation：After metal base is cleaned in deionized water, it is clear to be put into ultrasonic wave in acetone soln 2-3min, supersonic frequency 40KHz, power 2KW are washed, after reusing 20-30 DEG C of deionized water cleaning, is put into 10wt% hydrogen-oxygens Change oil removing in sodium solution, oil removing time 15-20min, places into 70 DEG C of deionized water and clean, be put into after the completion of cleaning 2-3min is activated in 36.5wt% concentrated hydrochloric acids；
(2) platings：Plating liquid A includes following component：Nickel sulfate 15-25g/L；Sodium hypophosphite 8-20g/L；Lemon Sour 1-5g/L；Sodium acetate 8-15g/L；Metal base after step (1) processing is put into chemical deposition plating 1h in plating liquid A；
(3) secondary plating：Plating liquid B includes following component：Nickel sulfate 12-30g/L；Sodium hypophosphite 10-20g/L；Contain There are the heteropolyacid salt or molybdic acid of molybdenum acid ion：0.1-3.3g/L；Sodium acetate 5-15g/L；Amion acetic acid 2-10mL/L；Boric acid 0- 2mL/L；PTFE particle lotions 2-10mL/L；Sodium fluoride 0.1-1.0g/L；PH=6.0-6.5；By the metal after step (2) processing Base material is put into chemical deposition plating in plating liquid B, plating solution is stirred continuously in deposition process, up to sample；Sedimentation time 1.5-2h, Mixing speed 550-600r/min；
(4) sample is cleaned with 70-80 DEG C of deionized water, removes the plating solution for remaining in plating piece surface；
(5) sample after step (4) processing is dried up.
Preferably, the plating liquid A includes following component：Nickel sulfate 20g/L；Sodium hypophosphite 10g/L；Citric acid 2g/L；Sodium acetate 10g/L；The plating liquid B includes following component：Nickel sulfate 20g/L；Sodium hypophosphite 16.5g/L；Contain The heteropolyacid salt or molybdic acid of molybdenum acid ion：1.5g/L；Sodium acetate 8.5g/L；Amion acetic acid 3mL/L；Boric acid 1mL/L；PTFE Sub- lotion 5mL/L；Sodium fluoride 0.6g/L；PH=6.5.
Preferably, the heteropolyacid salt containing molybdenum acid ion is sodium molybdate or ammonium molybdate.
As a preferred embodiment of the invention, the heteropolyacid salt containing molybdenum acid ion is sodium molybdate.
After the present invention does bottoming inducing layer in metallic substrate surface using deposition preparation Ni-P functional coatings, at it On the basis of deposit Ni-Mo-P-PTFE functional coatings, this method is remarkably improved Ni-Mo-P-PTFE functional coatings and metal base Degree of adhesion, in addition, this functional coating has the characteristics that low-surface-energy, dirt can be prevented in its surface adhesion and crystallization.
Compared with prior art, the present invention have the beneficial effect that：
(1) composite structure plating of Ni-P/Ni-Mo-P-PTFE provided by the invention, heat endurance is strong, and has low table The characteristics of face energy, can prevent dirt in its surface adhesion with crystallizing, anticorrosion, scale-preventing performance are strong；
(2) preparation method of the composite structure plating of Ni-P/Ni-Mo-P-PTFE provided by the invention, by adjusting with change Become the microstructure of coating, the further physics for improving coating in the case where plating attitude, chemical property, improve anticorrosion, Fouling resistant Energy；
(3) the Ni-P/Ni-Mo-P-PTFE coating uniformities formed by method provided by the invention, any surface finish, It is strong with the adhesiveness of metal base.
Brief description of the drawings
Fig. 1 is the metal base structure diagram containing Ni-P/Ni-Mo-P-PTFE composite structure platings of the present invention；
Wherein：1st, metal base, 2, Ni-P coating, 3, Ni-Mo-P-PTFE coating；
Fig. 2 is the XRD diagram of Ni-P/Ni-Mo-P-PTFE composite structure platings of the embodiment of the present invention；
Wherein：1st, embodiment 1,2, embodiment 2,3, embodiment 3,4, embodiment 4.
Embodiment
The present invention will be further described by 1-2 below in conjunction with the accompanying drawings, in following embodiments unless otherwise specified, used Experimental method is that conventional method, material therefor, reagent etc. can be bought from biological or chemical company, as preferred PTFE particles Lotion：JF-4DC-D is purchased from Suzhou Hua Mian trade Co., Ltds.
Embodiment 1
(1) oil removing, pickling, activation：After metal base is cleaned in deionized water, it is clear to be put into ultrasonic wave in acetone soln 2-3min, supersonic frequency 40KHz, power 2KW are washed, after reusing deionized water cleaning, it is molten to be put into 10wt% sodium hydroxides Oil removing in liquid, oil removing time 15-20min, places into 70 DEG C of deionized water and cleans, and it is dense that 36.5wt% is put into after the completion of cleaning 2-3min is activated in hydrochloric acid；
(2) platings：Plating liquid A includes following component：Nickel sulfate 20g/L；Sodium hypophosphite 10g/L；Citric acid 2g/ L；Sodium acetate 10g/L；Metal base after step (1) processing is put into chemical deposition plating in plating liquid A, sedimentation time is 1h；
(3) secondary plating：Plating liquid B includes following component：Nickel sulfate 20g/L；Sodium hypophosphite 16.5g/L；Sodium molybdate： 1.5g/L；Sodium acetate 8.5g/L；Amion acetic acid 3mL/L；Boric acid 1mL/L；PTFE particle lotions 5mL/L；Sodium fluoride 0.6g/L；pH =6.5；Metal base after step (2) processing is put into chemical deposition plating in plating liquid B, plating is stirred continuously in deposition process Liquid, sedimentation time 2h, stir speed (S.S.) 600r/min；After the completion of deposition, up to sample；
(4) sample is cleaned with 70-80 DEG C of deionized water, removes the plating solution for remaining in plating piece surface；
(5) sample after step (4) processing is dried up.
Detect the performance of the composite structure plating prepared according to the method described above：Chemically plating Ni-Mo-P-PTFE composite deposites For surface topography as shown in XRD spectrum in Fig. 21, structure of plating layer is amorphous state, is that 44.5 ° of position appearances are Ni in 2 θ (111), there is the appearance at an obvious F elements peak at 17.5 °, and coating surface institutional framework is fine and close, the thickness of coating is 24.3 μm, the percentage composition 5.22wt% of molybdenum, antiscaling rate 0.00000162g.m in coating-2.h-1。
Embodiment 2
(1) oil removing, pickling, activation：After metal base is cleaned in deionized water, it is clear to be put into ultrasonic wave in acetone soln 2-3min, supersonic frequency 40KHz, power 2KW are washed, after reusing deionized water cleaning, it is molten to be put into 10wt% sodium hydroxides Oil removing in liquid, oil removing time 15-20min, places into 70 DEG C of deionized water and cleans, and it is dense that 36.5wt% is put into after the completion of cleaning 2-3min is activated in hydrochloric acid；
(2) platings：Plating liquid A includes following component：Nickel sulfate 25g/L；Sodium hypophosphite 8g/L；Citric acid 1g/ L；Sodium acetate 8g/L；Metal base after step (1) processing is put into chemical deposition plating in plating liquid A, sedimentation time 1h；
(3) secondary plating：Plating liquid B includes following component：Nickel sulfate 12g/L；Sodium hypophosphite 10g/L；Sodium molybdate： 0.1g/L；Sodium acetate 5g/L；Amion acetic acid 2mL/L；PTFE particle lotions 2mL/L；Sodium fluoride 0.1g/L；PH=6.5；By step (2) metal base after handling is put into chemical deposition plating in plating liquid B, and plating solution, sedimentation time are stirred continuously in deposition process For 2h, stir speed (S.S.) 550r/min；After the completion of deposition, up to sample；
(4) sample is cleaned with 70-80 DEG C of deionized water, removes the plating solution for remaining in plating piece surface；
(5) sample after step (4) processing is dried up.
Detect the performance of the composite structure plating prepared according to the method described above：Chemically plating Ni-Mo-P-PTFE composite deposites For surface topography as shown in XRD spectrum in Fig. 22, structure of plating layer is amorphous state, is that 44.5 ° of position appearances are Ni in 2 θ (111), there is the appearance at an obvious F elements peak at 17.5 °, and coating surface institutional framework is fine and close, the thickness of coating is 28.3 μm, the percentage composition 3.87wt% of molybdenum, antiscaling rate 0.00000102g.m in coating-2.h-1。
Embodiment 3
(1) oil removing, pickling, activation：After metal base is cleaned in deionized water, it is clear to be put into ultrasonic wave in acetone soln 2-3min, supersonic frequency 40KHz, power 2KW are washed, after reusing deionized water cleaning, it is molten to be put into 10wt% sodium hydroxides Oil removing in liquid, oil removing time 15-20min, places into 70 DEG C of deionized water and cleans, and it is dense that 36.5wt% is put into after the completion of cleaning 2-3min is activated in hydrochloric acid；
(2) platings：Plating liquid A includes following component：Nickel sulfate 15g/L；Sodium hypophosphite 20g/L；Citric acid 5g/ L；Sodium acetate 15g/L；Metal base after step (1) processing is put into chemical deposition plating in plating liquid A, sedimentation time is 1h；
(3) secondary plating：Plating liquid B includes following component：Nickel sulfate 30g/L；Sodium hypophosphite 20g/L；Sodium molybdate： 3.3g/L；Sodium acetate 15g/L；Amion acetic acid 10mL/L；Boric acid 2.0mL/L；PTFE particle lotions 10mL/L；Sodium fluoride 1g/L； PH=6.5；Metal base after step (2) processing is put into chemical deposition plating in plating liquid B, is stirred continuously in deposition process Plating solution, sedimentation time 2h, stir speed (S.S.) 600r/min；After the completion of deposition, up to sample；
(4) sample is cleaned with 70-80 DEG C of deionized water, removes the plating solution for remaining in plating piece surface；
(5) sample after step (4) processing is dried up.
Detect the performance of the composite structure plating prepared according to the method described above：Chemically plating Ni-Mo-P-PTFE composite deposites For surface topography as shown in XRD spectrum in Fig. 23, structure of plating layer is amorphous state, is that 44.5 ° of position appearances are Ni in 2 θ (111), there is the appearance at an obvious F elements peak at 17.5 °, and coating surface institutional framework is fine and close, the thickness of coating is 25.9 μm, the percentage composition 6.69wt% of molybdenum, antiscaling rate 0.00000136g.m in coating-2.h-1。
Embodiment 4
(1) oil removing, pickling, activation：After metal base is cleaned in deionized water, it is clear to be put into ultrasonic wave in acetone soln 2-3min, supersonic frequency 40KHz, power 2KW are washed, after reusing deionized water cleaning, it is molten to be put into 10wt% sodium hydroxides Oil removing in liquid, oil removing time 15-20min, places into 70 DEG C of deionized water and cleans, and it is dense that 36.5wt% is put into after the completion of cleaning 2-3min is activated in hydrochloric acid；
(2) platings：Plating liquid A includes following component：Nickel sulfate 18g/L；Sodium hypophosphite 12g/L；Citric acid 5g/ L；Sodium acetate 12g/L；Metal base after step (1) processing is put into chemical deposition plating in plating liquid A, sedimentation time is 1h；
(3) secondary plating：Plating liquid B includes following component：Nickel sulfate 25g/L；Sodium hypophosphite 15g/L；Sodium molybdate： 1.5g/L；Sodium acetate 10g/L；Amion acetic acid 7mL/L；Boric acid 1.5mL/L；PTFE particle lotions 8mL/L；Sodium fluoride 0.8g/L； PH=6.5；Metal base after step (2) processing is put into chemical deposition plating in plating liquid B, is stirred continuously in deposition process Plating solution, sedimentation time 2h, stir speed (S.S.) 550r/min；After the completion of deposition, up to sample；
(4) sample is cleaned with 70-80 DEG C of deionized water, removes the plating solution for remaining in plating piece surface；
(5) sample after step (4) processing is dried up.
Detect the performance of the composite structure plating prepared according to the method described above：Chemically plating Ni-Mo-P-PTFE composite deposites For surface topography as shown in XRD spectrum in Fig. 24, structure of plating layer is amorphous state, is that 44.5 ° of position appearances are Ni in 2 θ (111), there is the appearance at an obvious F elements peak at 17.5 °, and coating surface institutional framework is fine and close, the thickness of coating is 19.2 μm, the percentage composition 4.02wt% of molybdenum, antiscaling rate 0.0000020g.m in coating-2.h-1。

Claims (3)

1. a kind of chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings, it is characterised in that the composite structure plating is from surface It is followed successively by metal base：Ni-Mo-P-PTFE coating, Ni-P coating；
The preparation method of the chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings includes the following steps：
（1）Oil removing, pickling, activation：After metal base is cleaned in deionized water, ultrasonic cleaning 2- in acetone soln is put into 3 min, supersonic frequency 40kHz, power 2kW, after reusing 20-30 DEG C of deionized water cleaning, is put into 10wt% sodium hydroxides Oil removing in solution, oil removing time 15-20min, places into 70 DEG C of deionized water and cleans, 36.5wt% is put into after the completion of cleaning 2-3 min are activated in concentrated hydrochloric acid；
（2）Plating：Plating liquid A includes following component：Nickel sulfate 15-25g/L；Sodium hypophosphite 8-20g/L；Citric acid 1- 5g/L；Sodium acetate 8-15g/L；By step（1）Metal base after processing is put into chemical deposition plating 1h in plating liquid A；
（3）Secondary plating：Plating liquid B includes following component：Nickel sulfate 12-30g/L；Sodium hypophosphite 10-20g/L；Contain molybdenum The heteropolyacid salt or molybdic acid of acid ion：0.1-3.3g/L；Sodium acetate 5-15g/L；Amion acetic acid 2-10mL/L；Boric acid 0-2mL/ L；PTFE particle lotions 2-10mL/L；Sodium fluoride 0.1-1.0 g/L；pH 6.0-6.5；By step（2）Metal base after processing Chemical deposition plating in plating liquid B is put into, plating solution is stirred continuously in deposition process, up to sample；Sedimentation time 1.5-2h, stirring Speed 550-600r/min；
（4）Sample is cleaned with 70-80 DEG C of deionized water, removes the plating solution for remaining in plating piece surface；
（5）By step（4）Sample drying after processing.
2. chemical Ni-P plating as claimed in claim 1/Ni-Mo-P-PTFE composite structure platings, it is characterised in that described applies Plating solution A includes following component：Nickel sulfate 20g/L；Sodium hypophosphite 10g/L；Citric acid 2g/L；Sodium acetate 10g/L；Described applies Plating solution B includes following component：Nickel sulfate 20g/L；Sodium hypophosphite 16.5g/L；Heteropolyacid salt or molybdenum containing molybdenum acid ion Acid：1.5g/L；Sodium acetate 8.5g/L；3 mL/L of amion acetic acid；1 mL/L of boric acid；PTFE particle lotions 5mL/L；Sodium fluoride 0.6 g/L；pH 6.5.
3. chemical Ni-P plating as claimed in claim 1/Ni-Mo-P-PTFE composite structure platings, it is characterised in that described contains The heteropolyacid salt for having molybdenum acid ion is sodium molybdate or ammonium molybdate.
CN201511024375.2A 2015-12-30 2015-12-30 A kind of chemical Ni-P plating/Ni-Mo-P-PTFE composite structure platings and preparation method thereof Active CN105624656B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101705480A (en) * 2009-11-03 2010-05-12 燕山大学 Chemical modification technology of chemical nickel phosphorus plating alloy coating
CN201538067U (en) * 2009-09-23 2010-08-04 比亚迪股份有限公司 Metal piece
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
CN104213106A (en) * 2014-09-26 2014-12-17 国家电网公司 Ni/Zn/P-particle composite chemical plating layer and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005256170A (en) * 2004-02-12 2005-09-22 National Institute Of Advanced Industrial & Technology Electroless nickel plating method and plated product thereby

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201538067U (en) * 2009-09-23 2010-08-04 比亚迪股份有限公司 Metal piece
CN101705480A (en) * 2009-11-03 2010-05-12 燕山大学 Chemical modification technology of chemical nickel phosphorus plating alloy coating
EP2671969A1 (en) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plating bath for electroless deposition of nickel layers
CN104213106A (en) * 2014-09-26 2014-12-17 国家电网公司 Ni/Zn/P-particle composite chemical plating layer and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Ni-P/Ni-Mo-P镀层耐腐蚀性研究;张翼等;《材料保护》;20021130;第35卷(第11期);第15-17页 *

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