CN105603433A

CN105603433A - Additive formula for acidic etching solution copper extracting system

Info

Publication number: CN105603433A
Application number: CN201610063971.XA
Authority: CN
Inventors: 龙正; 欧阳锋; 花慧洋
Original assignee: Jiangsu Jingtuo Environment Protection Technology Co Ltd
Current assignee: Jiangsu Jingtuo Environment Protection Technology Co Ltd
Priority date: 2016-01-29
Filing date: 2016-01-29
Publication date: 2016-05-25

Abstract

The invention discloses an additive formula for an acidic etching solution copper extracting system. The additive formula is characterized by comprising the following components in percentage by weight: 15%-25% of an etching mother solution, 12%-22% of hydrochloric acid, 6%-12% of sodium hypochlorite, 2%-10% of an accelerant, 1%-5% of a stabilizer and the balance of water. The additive formula has the beneficial effects that by adding the stabilizer, the etching speed can be stabilized at a constant speed, the etching coefficient can be increased, the etching uniformity can be improved, and the etching speed can be increased by virtue of the cooperation of the accelerant; the consumption of HCl is effectively reduced, so that the production efficiency is improved in process; the additive formula is economic and practical; a preparation method is simple; and no harmful gas is produced in the etching process.

Description

A kind of acidic etching liquid is carried copper system additive formulations

Technical field

The present invention relates to PCB etching field, be specifically related to a kind of acidic etching liquid and carry copper system additive and joinSide, belongs to chemical industry additive agent field.

Background technology

In printed substrate production process, acid etching is an important step. Along with etched enterOK, in etching solution, copper ion concentration is more and more higher, and etching speed is more and more slower, can be serious if do not changedAffect etching progress rate and quality. Acidic etching waste liquid not only contains a large amount of copper ions, and also containing other has valencyThe chemical substance of value. Therefore producer all can by oneself or entrust titular businessman to return substantiallyReceive and process.

At present, have various ways to reclaim the copper in etching waste liquor, representational technology comprise chemical method,Extraction electrolysis, ion-exchange membrane electrolysis etc., wherein chemical method be by chemical means by adding reagent,Regulator solution component, to meet etching requirement. Because its cost is low, equipment is simple, is beneficial to the advantage of popularization,In actual production, there are a large amount of utilizations. In traditional handicraft, comprise for the copper regeneration technology of carrying of etching solution:1 adds NaOH in waste liquid, is combined and generates Kocide SD precipitation, then make CuO or CuSO with copper ion₄Crystallization etc., this method can reclaim Cu, but it is higher to consume chemicals, and energy consumption is large, and generation is difficult toThe waste water of processing, in waste water, Cu ion concentration exceeds standard, and the also hard degradation of a large amount of ammonia in waste liquid needsSpend a large amount of costs to process again; Also has a kind of characteristic of utilizing cuprous ion to be easy to oxidation, in etchingIn liquid, add as the method such as potassium chlorate or injection of ozone, cuprous ion in spent etching solution can be oxidized to twoValency copper ion, to reach repetition etching object, this method is because the strong oxidation that potassium chlorate and ozone haveProperty, easily produce chlorine, to environment.

Summary of the invention

For solving the problems of the technologies described above, the invention provides a kind of acidic etching liquid and carry copper system additive and joinSide, this formula can make copper ion in etching solution recycle, and does not produce any pernicious gas.

For achieving the above object, technical scheme of the present invention is as follows: a kind of acidic etching liquid is carried copper system additiveFormula, is characterized in that: the content of its component and each component is:

All the other are water; Wherein percentage be quality very.

Preferably, described etching mother liquor is copper chloride, and described promoter is sodium chloride or ammonium chloride, described inStabilizing agent is hydroxy sulfonate.

Preferably, the mass percent of described etching mother liquor is 20%-22%.

Preferably, the mass percent of described hydrochloric acid is 15%-20%.

Preferably, the mass percent of described clorox is 8%-10%.

Preferably, the mass percent of described promoter is 2%-5%.

Preferably, the mass percent of described stabilizing agent is 1%-3%.

Preferably, the mass percent of described water is 40%-54%.

Preferably, also comprise that a kind of acidic etching liquid puies forward the preparation method of copper system additive formulations, compriseFollowing steps:

(1) water and copper chloride are added in stirring pool and stirred, copper to be chlorinated dissolves completely;

(2) in above-mentioned solution, add hydrochloric acid, then stir, make uniform liquid;

(3) in above-mentioned solution, add sodium chloride, then stir, make uniform liquid;

(4) finally add clorox and stabilizing agent to stir.

The invention has the beneficial effects as follows: in the present invention, adding stabilizing agent, can to stablize etching speed constant, improveEtching coefficient is uniformity when, coordinates promoter can promote etching speed simultaneously; Effective reduction hydrochloric acidUse amount is conducive to production efficiency in technique, and economical and practical, and compound method is simple, etching processIn do not produce pernicious gas.

Detailed description of the invention

Technical scheme in the embodiment of the present invention is clearly and completely described, obviously, describedEmbodiment is only the present invention's part embodiment, instead of whole embodiment. Based in the present inventionEmbodiment, those of ordinary skill in the art do not make under creative work prerequisite, obtain all itsHis embodiment, belongs to the scope of protection of the invention.

Embodiment 1

Concentration 38% hydrochloric acid 22%, copper chloride is anhydrous cupric chloride 20%, and clorox is 8%, and promoter is excellentSelect sodium chloride 5.0%, the preferred hydroxyl sulfoacid sodium 3.0% of stabilizing agent, water 42.0%. Preparation method: by water andCopper chloride adds in stirring pool and stirs, and copper chloride dissolves completely, then adds hydrochloric acid and promoter chlorinationSodium, then stirs, and makes uniform liquid; Finally add clorox and stabilizing agent to stir. ThisIn embodiment, promoter sodium chloride can increase Chlorine in Solution ion concentration, suppresses the hydrolysis of copper chloride,Clorox in etching solution has oxidisability, can make the cuprous ion in solution be oxidized to bivalent cupric ion,Reach etching solution recycling, and in product, comprise copper chloride, sodium chloride and water, these are all etchingsThe constituent of liquid, therefore can not pollute etching solution, and adding of stabilizing agent hydroxyl sulfoacid sodium, canSo that reaction is more steadily controlled.

Embodiment 2

Concentration 38% hydrochloric acid 20%, copper chloride is anhydrous cupric chloride 25%, clorox is 10%, promoterFor sodium chloride 2.0%, stabilizing agent is hydroxyl sulfoacid sodium 1.0%, water 42.0%. Preparation method and embodiment 1Identical. The main feature of the present embodiment is that in etching solution, copper ion concentration is high, and etch-rate is obviously accelerated,Meanwhile, etch-rate is stablized controlled, reduces hydrochloric acid use amount. When clorox can cuprous oxide ion,Do not produce any pernicious gas.

Embodiment 3

Concentration 38% hydrochloric acid 20%, copper chloride is anhydrous cupric chloride 23%, clorox is 10%, promoterFor sodium chloride 3.0%, stabilizing agent is hydroxyl sulfoacid sodium 3.0%, water 41.0%. Preparation method and embodiment 1Identical. The main feature of the present embodiment is that etch-rate is steadily even, reduces hydrochloric acid use amount simultaneously. InferiorWhen sodium chlorate can cuprous oxide ion, do not produce any pernicious gas.

Embodiment 4

Concentration 38% hydrochloric acid 20%, copper chloride is anhydrous cupric chloride 15%, and clorox is 8%, and promoter isSodium chloride 2.0%, stabilizing agent is hydroxyl sulfoacid sodium 1.0%, water 54.0%. Preparation method and embodiment 1 phaseWith. The main feature of the present embodiment is that in solution, each concentration of component is low, and etching quality is good, reasonable mixture ratio,Waste liquid is recycled convenient.

To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field can be realized or useThe present invention. To be aobvious and easy for those skilled in the art to the multiple amendment of these embodimentSee, General Principle as defined herein can be in the situation that not departing from the spirit or scope of the present invention,Realize in other embodiments. Therefore, the present invention will can not be restricted to these embodiment shown in this article,But to meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims

1. acidic etching liquid is carried a copper system additive formulations, it is characterized in that: according to mass percent meter,Its formula comprises:

Wherein, described etching mother liquor is copper chloride, and described promoter is sodium chloride or ammonium chloride, described steadyDetermining agent is hydroxy sulfonate.

2. a kind of acidic etching liquid according to claim 1 is carried copper system additive formulations, and its feature existsIn: the mass percent of described etching mother liquor is 20%-22%.

3. a kind of acidic etching liquid according to claim 1 is carried copper system additive formulations, and its feature existsIn: the mass percent of described hydrochloric acid is 15%-20%.

4. a kind of acidic etching liquid according to claim 1 is carried copper system additive formulations, and its feature existsIn: the mass percent of described clorox is 8%-10%.

5. a kind of acidic etching liquid according to claim 1 is carried copper system additive formulations, and its feature existsIn: the mass percent of described promoter is 2%-5%.

6. a kind of acidic etching liquid according to claim 1 is carried copper system additive formulations, and its feature existsIn: the mass percent of described stabilizing agent is 1%-3%.

7. a kind of acidic etching liquid according to claim 1 is carried copper system additive formulations, and its feature existsIn: the mass percent of described water is 40%-54%.

8. prepare the acidic etching liquid described in claim 1-7 any one and carry copper system additive formulations for one kindMethod, it is characterized in that, comprise the following steps:

(2) in (1) middle solution, add hydrochloric acid, then stir, make uniform liquid;

(3) in (2) middle solution, add sodium chloride, then stir, make uniform liquid;

(4) finally add clorox and stabilizing agent to stir.