CN105583533A - 用于激光驱动的飞片结构及其制备方法 - Google Patents
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Abstract
本发明公开了一种用于激光驱动的飞片结构及其制备方法,该结构包括透明基底;所述透明基底上设置纳米铝阵列烧蚀层;所述纳米铝阵列烧蚀层上填充氧化铝阻热层;所述氧化铝阻热层上设置铝飞片层。本发明将烧蚀层制备成Al/Al2O3的复合纳米结构,使其与激光产生表面等离子共振吸收效应,降低金属铝对激光的反射作用,提高激光吸收,解决激光驱动飞片中金属铝烧蚀层对激光的高反射难题,促进激光驱动飞片技术的进步。
Description
技术领域
本发明涉及激光驱动飞片技术领域,具体涉及一种用于激光驱动的飞片结构及其制备方法。
背景技术
激光驱动飞片技术是用激光束辐照透明基底表面上的金属膜(飞片靶),激光能量将烧蚀一部分膜层产生高压等离子体,利用产生的等离子体推动剩余膜层(飞片)高速飞行,产生极高的瞬时冲击压力。飞片靶是激光驱动飞片中能量转换关键部件,其包含烧蚀层、阻热层和飞片层三层结构。其中烧蚀层的作用是吸收激光的能量,产生高压等离子体。由于铝金属的汽化热较低,容易形成等离子体,而被认为是理想的烧蚀层材料。但是金属铝表面对光的反射率很高,大部分激光能量被反射而浪费,从而导致需要输入高能量的激光去驱动飞片。在基底材料与烧蚀层间加入一层吸光度高的材料(碳黑、Ge、Mg)可以减少激光的反射,增强吸收,但是这些材料的加入影响了铝等离子的产生,激光能量与飞片动能间的转化率仅30%左右,飞片性能并没有得到明显改善。低的能量吸收和转换效率导致驱动高速飞片需要较高的激光能量,难以大规模推广使用激光驱动飞片技术。
发明内容
本发明克服了现有技术的不足,提供一种用于激光驱动的飞片结构及其制备方法。以期待解决传统多层飞片中铝烧蚀层对激光的吸收率低问题,提高激光的利用率,有利于实现该技术的光纤连接和小型化。
为解决上述的技术问题,本发明采用以下技术方案:
一种用于激光驱动的飞片结构,包括透明基底;所述透明基底上设置纳米铝阵列烧蚀层;所述纳米铝阵列烧蚀层上填充氧化铝阻热层;所述氧化铝阻热层上设置铝飞片层。
更进一步的技术方案是纳米铝阵列烧蚀层厚度为0.2μm至1μm。
更进一步的技术方案是纳米铝阵列烧蚀层是圆柱型纳米铝周期阵列结构。
更进一步的技术方案是相邻两个圆柱型纳米铝的中心之间距离为0.6μm至1.2μm。
更进一步的技术方案是圆柱型纳米铝的直径为0.5μm至1μm,长度为0.2μm至1μm。
更进一步的技术方案是氧化铝阻热层厚度为1μm至2μm。
更进一步的技术方案是铝飞片层厚度为4μm至10μm。
更进一步的技术方案是提供一种用于激光驱动的飞片结构制备方法,所述的方法包括以下步骤:
步骤一、在透明基底的表面物理沉积一层金属铝;
步骤二、将金属铝氧化成多孔的氧化铝,然后在孔中电沉积金属铝,孔填充满后得到圆柱型纳米铝周期阵列结构;
步骤三、在圆柱型纳米铝周期阵列结构表面磁控溅射一层氧化铝阻热层;
步骤四、在氧化铝阻热层表面沉积一层金属铝飞片层。
更进一步的技术方案是步骤一是采用阳极氧化或电子束刻蚀方式在在透明基底的表面物理沉积一层金属铝。
更进一步的技术方案是步骤四是采用磁控溅射或粘贴方式在氧化铝阻热层表面沉积一层金属铝飞片层。
与现有技术相比,本发明的有益效果是:本发明将烧蚀层制备成Al/Al2O3的复合纳米结构,使其与激光产生表面等离子共振吸收效应,降低金属铝对激光的反射作用,提高激光吸收,解决激光驱动飞片中金属铝烧蚀层对激光的高反射难题,促进激光驱动飞片技术的进步。
附图说明
图1为本发明一个实施例的结构示意图。
图2为本发明一个实施例中纳米铝直径变化对光的吸收性能分析曲线图。
附图标记说明:1.透明基底,2.纳米铝阵列烧蚀层,3.氧化铝阻热层,4.铝飞片层。
具体实施方式
本说明书中公开的所有特征,或公开的所有方法或过程中的步骤,除了互相排斥的特征和/或步骤以外,均可以以任何方式组合。
本说明书(包括任何附加权利要求、摘要和附图)中公开的任一特征,除非特别叙述,均可被其他等效或具有类似目的的替代特征加以替换。即,除非特别叙述,每个特征只是一系列等效或类似特征中的一个例子而已。
下面结合附图及实施例对本发明的具体实施方式进行详细描述。
实施例1
如图1所示,根据本发明的一个实施例,本实施例公开一种用于激光驱动的飞片结构,该结构包括透明基底1;所述透明基底上设置纳米铝阵列烧蚀层2;所述纳米铝阵列烧蚀层上填充氧化铝阻热层3;所述氧化铝阻热层上设置铝飞片层4。具体的,透明基底1材料可以为K9玻璃,透明陶瓷或透明晶体。本实施例中在YAG的透明陶瓷作为透明基底的表面物理沉积一层金属铝,厚度为1μm。采用阳极氧化的方法将金属铝氧化成多孔的氧化铝,然后在孔中电沉积金属铝,孔填充满后得到圆柱型纳米铝周期阵列结构。在周期结构的缝隙中填充氧化铝作为介质层。圆柱型纳米铝周期阵列结构作为纳米铝阵列烧蚀层2,圆柱型纳米铝周期阵列结构的周期为893nm,即相邻两个圆柱型纳米铝的中心之间距离为0.6-1.2μm;通过控制时间制备出多个直径Ф0.5μm-Ф1μm的圆柱型纳米铝结构。然后圆柱型纳米铝周期阵列结构表面磁控溅射一层氧化铝作为氧化铝阻热层3,氧化铝阻热层厚度为1μm。最后在氧化铝阻热层表面物理沉积一层5μm的金属铝作为铝飞片层4。
如图2所示,本实施例对纳米铝直径变化对光的吸收性能分析曲线图显示,分析发现制备的圆柱型纳米铝周期阵列结构作为纳米铝阵列烧蚀层,该圆柱型纳米铝结构的直径为600-660nm;最后成型的该用于激光驱动的飞片结构对1064nm的光吸收均大于70%。
实施例2
根据本发明的另一个实施例,本实施例进一步公开用于激光驱动的飞片结构的制备方法,该方法包括以下步骤:
步骤1、采用阳极氧化或电子束刻蚀方式在在透明基底的表面物理沉积一层金属铝。
步骤2、将金属铝氧化成多孔的氧化铝,然后在孔中电沉积金属铝,孔填充满后得到圆柱型纳米铝周期阵列结构;使其与激光产生表面等离子共振吸收效应,降低金属铝对激光的反射作用,提高激光吸收。
步骤3、在圆柱型纳米铝周期阵列结构表面磁控溅射一层氧化铝阻热层。
步骤4、采用磁控溅射或粘贴方式在氧化铝阻热层表面沉积一层金属铝飞片层,最终得到用于激光驱动的飞片结构。
本实施例解决了传统多层飞片中铝烧蚀层对激光的吸收率低问题,提高了激光的利用率,有利于实现该技术的光纤连接和小型化。
在本说明书中所谈到的“一个实施例”、“另一个实施例”、“实施例”等,指的是结合该实施例描述的具体特征、结构或者特点包括在本申请概括性描述的至少一个实施例中。在说明书中多个地方出现同种表述不是一定指的是同一个实施例。进一步来说,结合任一个实施例描述一个具体特征、结构或者特点时,所要主张的是结合其他实施例来实现这种特征、结构或者特点也落在本发明的范围内。
尽管这里参照发明的多个解释性实施例对本发明进行了描述,但是,应该理解,本领域技术人员可以设计出很多其他的修改和实施方式,这些修改和实施方式将落在本申请公开的原则范围和精神之内。更具体地说,在本申请公开权利要求的范围内,可以对主题组合布局的组成部件和/或布局进行多种变型和改进。除了对组成部件和/或布局进行的变型和改进外,对于本领域技术人员来说,其他的用途也将是明显的。
Claims (10)
1.一种用于激光驱动的飞片结构,包括透明基底(1);其特征在于:所述透明基底(1)上设置纳米铝阵列烧蚀层(2);所述纳米铝阵列烧蚀层(2)上填充氧化铝阻热层(3);所述氧化铝阻热层(3)上设置铝飞片层(4)。
2.根据权利要求1所述的用于激光驱动的飞片结构,其特征在于所述的纳米铝阵列烧蚀层(2)厚度为0.2μm至1μm。
3.根据权利要求1所述的用于激光驱动的飞片结构,其特征在于所述的纳米铝阵列烧蚀层(2)是圆柱型纳米铝周期阵列结构。
4.根据权利要求3所述的用于激光驱动的飞片结构,其特征在于相邻两个圆柱型纳米铝的中心之间距离为0.6μm至1.2μm。
5.根据权利要求3或4所述的用于激光驱动的飞片结构,其特征在于所述的圆柱型纳米铝的直径为0.5μm至1μm。
6.根据权利要求1所述的用于激光驱动的飞片结构,其特征在于所述的氧化铝阻热层(3)厚度为1μm至2μm。
7.根据权利要求1所述的用于激光驱动的飞片结构,其特征在于所述的铝飞片层(4)厚度为4μm至10μm。
8.一种用于激光驱动的飞片结构制备方法,其特征在于所述的方法包括以下步骤:
步骤一、在透明基底的表面物理沉积一层金属铝;
步骤二、将金属铝氧化成多孔的氧化铝,然后在孔中电沉积金属铝,孔填充满后得到圆柱型纳米铝周期阵列结构;
步骤三、在圆柱型纳米铝周期阵列结构表面磁控溅射一层氧化铝阻热层;
步骤四、在氧化铝阻热层表面沉积一层金属铝飞片层。
9.根据权利要求8所述的用于激光驱动的飞片结构制备方法,其特征在于所述的步骤一是采用阳极氧化或电子束刻蚀方式在在透明基底的表面物理沉积一层金属铝。
10.根据权利要求8所述的用于激光驱动的飞片结构制备方法,其特征在于所述的步骤四是采用磁控溅射或粘贴方式在氧化铝阻热层表面沉积一层金属铝飞片层。
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