CN105578730B - Rigid Flex and mobile terminal - Google Patents
Rigid Flex and mobile terminal Download PDFInfo
- Publication number
- CN105578730B CN105578730B CN201610105341.4A CN201610105341A CN105578730B CN 105578730 B CN105578730 B CN 105578730B CN 201610105341 A CN201610105341 A CN 201610105341A CN 105578730 B CN105578730 B CN 105578730B
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- Prior art keywords
- layer
- cooling fin
- copper foil
- rigid flex
- foil layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of Rigid Flex and mobile terminal, including flexible substrate layer, the copper foil layer being stacked in flexible substrate layer and the cover film for being covered in copper foil layer, Rigid Flex further includes cooling fin, hard layer and line layer, cooling fin is set on cover film, hard layer is laminated in cooling fin, and line layer is laminated in hard layer.The Rigid Flex and mobile terminal of the present invention, by setting cooling fin on the cover film of copper foil layer, while being distributed in time come the heat generated to copper foil layer electronic component using cooling fin, hard layer and line layer can be also further set on a heat sink, the cooling fin is made also to be able to distribute the heat that the electronic component on line layer generates, improves the use reliability of electronic component.It can be radiated simultaneously to the electronic component of copper foil layer and line layer using the cooling fin, so without setting cooling fin on copper foil layer and line layer respectively, save space so that Rigid Flex thinner thickness meets requirement of the user for product thickness.
Description
Technical field
The present invention relates to circuit board technology field more particularly to a kind of Rigid Flexs and mobile terminal.
Background technology
With the fast development of electronic product, the fuselage of electronic product is increasingly intended to thin, light and handyization.Interiors of products
Space layout is also more and more compacter.
However, electronic equipment can generate heat when working and running, the source of the heat is be loaded with electronic component soft
Harden plywood.Since electronic equipment internal space is less and less, topology layout is more and more compacter, intensive.Therefore, Rigid Flex
On electronic component generate heat also can not timely be spread, so can cause electronic component temperature rise can not expire
The corresponding standard value of foot so that electronic component works under the working condition of high temperature and causes under its use reliability for a long time
Drop, and then affect the use reliability of entire electronic product.
Invention content
In view of this, the present invention provides a kind of heat that can be generated in time to electronic component and distributes, and improving it makes
With the Rigid Flex and mobile terminal of reliability.
The present invention provides a kind of Rigid Flex, including flexible substrate layer, the copper foil being stacked in the flexible substrate layer
Layer and the cover film being covered on the copper foil layer, wherein, the Rigid Flex further includes cooling fin, hard layer and line
Road floor, the cooling fin are set on the side that the cover film deviates from the copper foil layer, and the hard layer is laminated in the cooling fin
On, the line layer is laminated in the side that the hard layer deviates from the cooling fin.
Wherein, perforation is offered on the line layer to the first through hole on the cooling fin, is set in the first through hole
The first earth conductor is equipped with, first earth conductor connects the line layer and the cooling fin.
Wherein, perforation is offered on the cooling fin to the second through-hole of the copper foil layer, second through-hole is interior to be set
There is the second earth conductor, second earth conductor connects the cooling fin and the copper foil layer.
Wherein, the first signal via is offered on the line layer, the corresponding first signal mistake on the cooling fin
Hole offers second signal via, and the second signal via is connected with first signal via.
Wherein, the second signal via is penetrated through by the cooling fin to the copper foil layer.
Wherein, the Rigid Flex further includes the first signal conductor, and first signal conductor is located at the described first letter
In number via, to connect the line layer and the cooling fin.
Wherein, the Rigid Flex further includes second signal conductor, and the second signal conductor is located at the described second letter
In number via, to connect the cooling fin and the copper foil layer.
Wherein, the cooling fin is graphite flake or copper foil.
Wherein, first positioning hole is offered on the cooling fin, is offered on the cover film and is through to the flexible base
Second location hole of material layer, when the cooling fin is attached on the cover film, the first positioning hole is fixed with described second
The perforation of position hole.
The present invention also provides a kind of mobile terminal, wherein, the mobile terminal includes ontology, set on the body interior
Mainboard and the Rigid Flex as described in above-mentioned any one, the Rigid Flex be set on the body interior, and with it is described
Mainboard is electrically connected.
The Rigid Flex and mobile terminal of the present invention, by the cooling fin that is sticked on the cover film of copper foil layer, using dissipating
It, can also on a heat sink further while backing distributes in time come the heat generated to the electronic component on copper foil layer
Be sticked hard layer and line layer, so that the cooling fin also is able to conduct the heat that the electronic component on line layer generates
It to hard layer and cover film, prevents heat from concentrating on electronic component periphery, improves the use reliability of electronic component.Together
When, it can be radiated simultaneously to the electronic component of copper foil layer and line layer using the cooling fin, so without existing respectively
Cooling fin on copper foil layer and line layer is set, saves space so that Rigid Flex thinner thickness meets user for product thickness
The requirement of degree.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings are can also be obtained according to these attached drawings.
Fig. 1 is the schematic cross-section of Rigid Flex provided by the invention；
Fig. 2 is the structure diagram of cooling fin provided by the invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
For ease of description, may be used herein such as " ... under ", " ... below ", " under ", " ... on ", " on "
Spaces relative terms are waited to describe the relationship of an elements or features and another (a little) elements or features as illustrated in the drawing.
It is appreciated that when an element or layer be referred to as another element or layer " on ", " being connected to " or " being couple to " another element or
Layer when, it can directly on another element or layer, be directly connected to or be couple to another element or layer or there may be residence
Between element or layer.
It is appreciated that terminology used here is merely to description specific embodiment, is not intended to limit the present invention.Herein
In use, clearly stating unless the context otherwise, otherwise singulative " one " and "the" are also intended to including plural form.Further
Ground, when used in this manual, term " comprising " and/or "comprising" show the feature, entirety, step, element and/or
The presence of component, but be not excluded for other one or more features, entirety, step, element, component and/or a combination thereof presence or
Increase.Specification subsequent descriptions are to implement the better embodiment of the present invention, and so description is to illustrate that the present invention's is general
For the purpose of principle, it is not limited to the scope of the present invention.Protection scope of the present invention is when regarding appended claims institute defender
Subject to.
Also referring to Fig. 1 to Fig. 2, a kind of Rigid Flex 100 provided by the invention, the Rigid Flex 100 wraps
Include flexible substrate layer 10, the copper foil layer 20 being stacked in the flexible substrate layer 10 and the covering for being covered in the copper foil layer 20
Film 30.The Rigid Flex 100 further includes cooling fin 40, hard layer 50 and line layer 60, and the cooling fin 40 is attached at
The cover film 30 deviates from the side of the copper foil layer 20.The hard layer 50 is laminated on the cooling fin 40, the circuit
Layer 60 is laminated in the side that the hard layer 50 deviates from the cooling fin 40.It is understood that the Rigid Flex 100 can
Applied in mobile terminal, which can be mobile phone, tablet computer, laptop etc., the Rigid Flex 100
The conduction being responsible between the electronic component in the mobile terminal.
Rigid Flex 100 provided in an embodiment of the present invention by the cooling fin 40 that is sticked on cover film 30, utilizes institute
The heat that cooling fin 40 simultaneously generates the electronic component on the copper foil layer 20 and the line layer 60 is stated to distribute,
It can not be conducted to other positions so as to which the heat that electronic component generates is prevented to be gathered in around electronic component always,
It is always worked at so as to cause electronic component in the environment of high temperature and so that the problem of electronic component breaks down, Jin Erbao
Demonstrate,prove the use reliability of electronic component.
In the present embodiment, polyimides or the double Phthalates of polyethylene can be used in the flexible substrate layer 10
Materials such as (Polyethylene terephthalate PET), in order to set the copper foil in the flexible substrate layer 10
Layer 20, and the flexible substrate layer 10 can be that the copper foil layer 20 provides insulation environment, in order in the copper foil layer 20
Upper etching signal cabling and ground connection cabling.Preferably, the thickness of the flexible substrate layer 10 can be 20 μm.The flexible substrate layer
10 can set flex area (not shown) and non-flex area 10a, and the flex area facilitates the Soft Bonding for flexibility to be presented
Plate 100 generates deformation, and then the Rigid Flex 100 is facilitated to connect external device, and the non-flex area 10a can be fixed firmly
Scutum part, so as to improve the rigidity of the Soft Bonding plate 100, so as to which the Soft Bonding plate 100 be facilitated to be assemblied in terminal.
In the present embodiment, plate of the copper foil layer 20 to set copper foil on film, the ground connection on the copper foil layer 20 is walked
Line and signal lead are that copper foil is formed according to the etched technique of prescribed route structure.Ground connection cabling on the copper foil layer 20 and
Signal lead can be wholely set, and surface mounting technology, which can be used, and be sticked on the copper foil layer 20 electronic component, described
Signal lead on copper foil layer 20 realizes the conduction between electronic component, and the ground connection cabling on the copper foil layer 20 is connect
Ground.
In the present embodiment, it is hot-forming that polyester material progress may be used in the cover film 30.The cover film 30 passes through
Paste adhesive is on the copper foil layer 20.Specifically, the cover film 30 is fitted in completely on the copper foil layer 20, and part is covered
Cover the signal lead on the copper foil layer 20 and ground connection cabling, i.e., described cover film 30 and the flex area of the flexible substrate layer 10
It is corresponding, signal lead and ground connection cabling on the copper foil layer 20 to be protected not lost or damaged, meanwhile, using viscose glue
The mode of stickup it is also possible that the cover film 30 and the connection of the copper foil layer 20 are closer, prevents the cover layer
30 shift and the part cabling for exposing the cover film 30 can not be protected.
The cooling fin 40 is set on the cover film 30.In the present embodiment, the cooling fin 40 can be used graphite flake or
Person's copper foil layer.Preferably, the cooling fin 40 uses graphite flake, while because of it with good heat dissipation performance, it may have good
Good electric conductivity.Since the cooling fin 40 is set under the cover film 30, so as to when the copper foil layer 20 or circuit
When electronic component on layer 60 carries out work generation heat, the cooling fin 40 can conduct the heat to the cover film
30 and the hard layer 50, so that the heat can be conducted, without being gathered in around electronic component always,
Prevent the situation that the temperature around electronic component is excessively high and electronic component is caused operation irregularity occur.The cooling fin 40 is adopted
With the design of graphite flake, ground plane can be formed between the copper foil layer 20 and the line layer 60, be dissipated using described
The form of ground via is opened up on backing 40 so that the cooling fin 60 can be further convenient for the line layer 60 and described
The ground connection of copper foil layer 20 ensures the ground connection performance of the two, and then ensures the normal use of the Rigid Flex 100.In addition, by
There is good flexibility in graphite flake, can be convenient for carrying out trepanning design on it, consequently facilitating processing.
Further, the cooling fin 40 is pressed on by the way of pressing on the cover film 30.Specifically, it is described to dissipate
First positioning hole 41 is offered on backing 40, is offered on the cover film 30 and is through to the second fixed of the flexible substrate layer 10
Position hole 31, when the cooling fin 40 is set on the cover film 30, the first positioning hole 41 and second location hole 31
Perforation.Using the first positioning hole 41 and the positioning action of second location hole 31, so that the cooling fin 40 exists
During pressing, it can ensure the pressing position of the cooling fin 40 and the cover film 30 and the copper foil layer 20, prevent
The problem of displacement either misplaces and causes heat dissipation performance bad, is further ensured that the use of the Rigid Flex 100 is reliable
Property.
Further, in order to enable the cooling fin 40 can form ground plane, ensure the line layer 60 and described
The ground connection performance of copper foil layer 20 offers perforation on the line layer 60 to the first through hole 61 of the cooling fin 40, and described the
It is provided with the first earth conductor 611 in one through-hole 61, first earth conductor 611 connects the line layer 60 and described dissipates
Backing 40.Specifically, first grounding through hole 611 can be one, two or more, first grounding through hole 61 to
It passes through for first earth conductor 611, so as to be grounded between the line layer 60 and the cooling fin 40, prevents described
Electronic component on line layer 60 is short-circuit due to that can not be grounded.Meanwhile the cooling fin 40 directly forms ground plane, it can
The existing design being grounded using two layers of copper foil layer or line layer is substituted, while reducing component, can also reduce institute
State the integral thickness of Rigid Flex 100.Preferably, first earth conductor can be copper post or conducting resinl.
Further, it is logical to the second through-hole of the copper foil layer 20, described second that perforation is offered on the cooling fin 40
The second earth conductor is provided in hole, second earth conductor connects the cooling fin 40 and the copper foil layer 20.Specifically
Ground, in order to process, second through-hole can be penetrated through with the first through hole 61 and be set, that is, only need to be in the circuit in processing
The first through hole 61 is opened up on layer 60, and the first through hole 61 is directly penetrated through to the copper foil layer 20.Together
When, second earth conductor is also connect with first earth conductor 611, therefore, only marks the first through hole herein
61st, the first earth conductor 611, without to second through-hole 42 and second earth conductor into line label.Using described
Cooling fin 40 is located between the copper foil layer 20 and the line layer 60, so as to the copper foil layer 20 and described
While the heat that electronic component on line layer 60 generates distributes in time, additionally it is possible in the copper foil layer 20 and the line
Ground plane layer is formed between road floor 60, meets the ground connection of the copper foil layer 20 and the electronic component on the line layer 60
Demand.Preferably, second earth conductor can be copper post or conducting resinl.
Further, since the cooling fin 40 uses graphite material, therefore its quality is softer, convenient for punching, so setting
During second through-hole, without being punched on the cooling fin 40 in advance, but it is described when the graphite flake is pressed together on
After cover film 30, when setting the first through hole 61 on the line layer 60 directly through the cooling fin 40, to be formed
State the second through-hole.
In the present embodiment, in order to ensure the signal conduction of the line layer 60, the first letter is offered on the line layer 60
Number via 62, corresponding first signal via 62 offers second signal via 42 on the cooling fin 40, and described second
Signal via 42 is connected with first signal via 62.Specifically, first signal via 62 and second signal via
It is circular hole.Preferably, it is connected for the ease of the signal of the line layer 60 and the copper foil layer 20, the second signal mistake
Hole is penetrated through to the copper foil layer 20.
Further, the Rigid Flex 100 further includes the first signal conductor 70, and first signal conductor 70 is located at
In first signal via 62, to connect the line layer 60 and the cooling fin 40.Preferably, first signal is led
Body 70 can be metallic conductor, such as copper post or conducting resinl.
Further, the Rigid Flex 100 further includes second signal conductor (not shown), the second signal conductor
In the second signal via 42, to connect the cooling fin 40 and the copper foil layer 20.Specifically, due to described
One signal via 62 connects setting with the second signal via, therefore, first signal conductor 70 and the second signal
Conductor is set in first signal via 62 and second signal via 42 simultaneously, therefore, here not to second signal conductor
It makes marks.Connect for the ease of the line layer 60 with the signal of the copper foil layer 20, the second signal conductor can with it is described
First signal conductor 70 is spliced to form a signal conductor, that is, can be by first signal conductor 70 directly from the line layer
60 are connected on the copper foil layer 20, are connect so as to fulfill the line layer 60 with the signal of the copper foil layer 20.It is appreciated that
, the second signal conductor can be as first signal conductor 70, such as metallic conduction post or conducting resinl.
In the present embodiment, the hard layer 50 uses polyethylene material, and the hard layer 50 has insulating properties characteristic so that
The line layer 60 and the cooling fin 40 mutually completely cut off, so as to facilitate the trace arrangements of the Rigid Flex 100 diversified.
The hard layer 50 can correspond to the non-flex area 10a settings of the flexible substrate layer 10, so as to utilize the hard layer 50
Rigidity so that intensity of the Rigid Flex 100 on the non-flex area 10a increases so that the Rigid Flex
100 are not easy bending in the non-flex area 10a, ensure the structural stability of the Rigid Flex 100.Specifically, it is described hard
Matter layer 50 can be two layers, in order to arrange different circuits.It is understood that in other embodiments, the hard layer 50
Can also be three layers, four layers or more layers.
In the present embodiment, the line layer 60 can also be the etched technological forming of copper foil.It can be on the line layer 60
Circuit is set, so as to increase the circuit configuration of the Rigid Flex 100.Preferably, the line layer 60 can be two layers,
In order to arrange different circuits on two layers of line layer 60, electronics member is connected so as to increase the Rigid Flex 100
The space of device.It is understood that in other embodiments, the line layer 60 can also be three layers, four layers or more layers.
Further, the Rigid Flex 100 may also include anti-solder ink layer 90, and the covering of anti-solder ink layer 90 is set
In on the line layer 60, the circuit on 60 pairs of the anti-solder ink layer line layer 60 is protected, and prevents the circuit
Line short on layer 60.
Further, in order to meet the wiring requirement of the Rigid Flex 100, the copper foil layer 20 can be two layers, point
Not Wei the first copper foil layer 21 and the second copper foil layer 22,21 and second copper foil layer 22 of the first copper foil layer is respectively arranged on described
The both sides of flexible substrate layer 10.Be also provided with being mutually communicated between first copper foil layer, 21 and second copper foil layer 22 walks
String holes, in order to be grounded cabling and signal lead.
Further, the setting ground connection cabling of the first copper foil layer 21 (not shown), the setting of the second copper foil layer 22 letter
Number cabling (not shown), first electric conductor 212 are connected between the signal lead and the ground connection cabling, the ground connection
Conductor 212 is connected to the ground connection cabling through the empty window 31.
In present embodiment, first copper foil layer 21 only sets ground connection cabling, i.e., described first copper foil layer 21 is public
Electrode.Signal lead on second copper foil layer 22 realizes circuit configuration, and electric conductor is then set to be connected to the ground connection and is walked
Between line and the signal lead, the electric conductor provides grounding electrode for the circuit on second copper foil layer 22, increases institute
State the use function of Rigid Flex 100.In other embodiments, it can also be that the setting of the second copper foil layer 22 ground connection is walked
Line.
The present invention also provides a kind of mobile terminal (not shown), the mobile terminal includes ontology (not shown), set on institute
The mainboard (not shown) of body interior and the Rigid Flex 100 are stated, the Rigid Flex 100 is set in the ontology
Portion, and be electrically connected with the mainboard.The mobile terminal can be mobile phone, computer, tablet, handheld device or media player
Deng.
The Rigid Flex and mobile terminal of the present invention, by the cooling fin that is sticked on the cover film of copper foil layer, using dissipating
It, can also on a heat sink further while backing distributes in time come the heat generated to the electronic component on copper foil layer
Be sticked hard layer and line layer, so that the cooling fin also is able to conduct the heat that the electronic component on line layer generates
It to hard layer and cover film, prevents heat from concentrating on electronic component periphery, improves the use reliability of electronic component.Together
When, it can be radiated simultaneously to the electronic component of copper foil layer and line layer using the cooling fin, so without existing respectively
Cooling fin on copper foil layer and line layer is set, saves space so that Rigid Flex thinner thickness meets user for product thickness
The requirement of degree.
In the description of this specification, reference term " one embodiment ", " example ", " is specifically shown " some embodiments "
The description of example ", " some examples " or similar " first embodiment " etc. mean to combine the specific features of the embodiment or example description,
Structure, material or feature are contained at least one embodiment of the present invention or example.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner combine in any one or more embodiments or example.
Embodiments described above does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (10)
1. a kind of Rigid Flex including flexible substrate layer, the copper foil layer being stacked in the flexible substrate layer and is covered in
Cover film on the copper foil layer, which is characterized in that the Rigid Flex further includes cooling fin, hard layer and line layer,
The cooling fin is set on the side that the cover film deviates from the copper foil layer, and the hard layer is laminated on the cooling fin, institute
It states line layer and is laminated in the side that the hard layer deviates from the cooling fin.
2. Rigid Flex according to claim 1, which is characterized in that perforation is offered on the line layer and is dissipated to described
First through hole on backing, the first earth conductor is provided in the first through hole, and first earth conductor connects the line
Road floor and the cooling fin.
3. Rigid Flex according to claim 1, which is characterized in that perforation is offered on the cooling fin to the copper
Second through-hole of layers of foil, the second earth conductor is provided in second through-hole, and second earth conductor connects the heat dissipation
Piece and the copper foil layer.
4. Rigid Flex according to claim 1, which is characterized in that the first signal mistake is offered on the line layer
Hole, corresponding first signal via offers second signal via, the second signal via and institute on the cooling fin
State the connection of the first signal via.
5. Rigid Flex according to claim 4, which is characterized in that the second signal via is passed through by the cooling fin
Pass to the copper foil layer.
6. Rigid Flex according to claim 4, which is characterized in that the Rigid Flex further includes the first signal and leads
Body, first signal conductor is located in first signal via, to connect the line layer and the cooling fin.
7. Rigid Flex according to claim 5, which is characterized in that the Rigid Flex further includes second signal and leads
Body, the second signal conductor is located in the second signal via, to connect the cooling fin and the copper foil layer.
8. Rigid Flex according to claim 1, which is characterized in that the cooling fin is graphite flake or copper foil.
9. Rigid Flex according to claim 1, which is characterized in that first positioning hole is offered on the cooling fin,
The second location hole for being through to the flexible substrate layer is offered on the cover film, when the cooling fin is attached at the covering
When on film, the first positioning hole is penetrated through with second location hole.
10. a kind of mobile terminal, which is characterized in that the mobile terminal include ontology, set on the body interior mainboard with
And the Rigid Flex as described in claim 1 to 9 any one, the Rigid Flex be set on the body interior, and with institute
State mainboard electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105341.4A CN105578730B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105341.4A CN105578730B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578730A CN105578730A (en) | 2016-05-11 |
| CN105578730B true CN105578730B (en) | 2018-07-06 |
Family
ID=55888235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105341.4A Active CN105578730B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and mobile terminal |
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| Country | Link |
|---|---|
| CN (1) | CN105578730B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102137543A (en) * | 2010-01-22 | 2011-07-27 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN203912313U (en) * | 2014-05-16 | 2014-10-29 | 宁波华远电子科技有限公司 | A novel rigidness-and-flexibility-combination circuit board |
| CN204721714U (en) * | 2015-07-01 | 2015-10-21 | 顾志情 | A kind of high heat radiation flex circuit application |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003218487A (en) * | 2002-01-24 | 2003-07-31 | O K Print:Kk | Wiring board |
| JPWO2009141929A1 (en) * | 2008-05-19 | 2011-09-29 | イビデン株式会社 | Wiring board and manufacturing method thereof |
| JP2011049375A (en) * | 2009-08-27 | 2011-03-10 | Panasonic Corp | Substrate connecting structure and electronic device |
-
2016
- 2016-02-25 CN CN201610105341.4A patent/CN105578730B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102137543A (en) * | 2010-01-22 | 2011-07-27 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| CN203912313U (en) * | 2014-05-16 | 2014-10-29 | 宁波华远电子科技有限公司 | A novel rigidness-and-flexibility-combination circuit board |
| CN204721714U (en) * | 2015-07-01 | 2015-10-21 | 顾志情 | A kind of high heat radiation flex circuit application |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578730A (en) | 2016-05-11 |
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