CN105578725A - Circuit board and mobile terminal - Google Patents
Circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105578725A CN105578725A CN201511030687.4A CN201511030687A CN105578725A CN 105578725 A CN105578725 A CN 105578725A CN 201511030687 A CN201511030687 A CN 201511030687A CN 105578725 A CN105578725 A CN 105578725A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper foil
- splicing ear
- ground connection
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000011889 copper foil Substances 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 abstract description 2
- 230000003068 static effect Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a circuit board and a mobile terminal. The circuit board comprises a substrate layer, a copper foil layer, a connecting terminal and a covering film, wherein the copper foil layer is stacked on the substrate layer and comprises a circuit zone and a grounding zone placed at one side of the circuit zone; the circuit zone is provided with an electric conduction wiring; the grounding zone is provided with a grounding copper foil which is used for grounding; the connecting terminal is fixed on the circuit zone and electrically connected with the electric conduction wiring; the covering film covers the copper foil layer and is provided with a first window through which the connecting terminal passes and a second window corresponding to the grounding zone; the second window exposes the grounding copper foil so that the ground copper foil can introduce static electricity at the periphery of the connecting terminal to realize grounding, thus improving the quality of the circuit board and enhancing the safety.
Description
Technical field
The present invention relates to the communications field, particularly relate to a kind of circuit board and mobile terminal.
Background technology
Connection Block on circuit boards carries out welding, keep in repair, all need manual operation or utilize mechanical hand to operate when installing, usual maintenance tool or assembling fixture etc. all need directly to touch the Connection Block on circuit board, also can touch the electronic component of Connection Block periphery simultaneously, thus easily make the periphery of Connection Block or Connection Block produce electrostatic, and this electrostatic cannot ground connection be eliminated, thus affect the switching performance of Connection Block or affect electronic component and the conducting wire of Connection Block periphery, thus affect the use of circuit board, easily there is security incident.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides a kind of circuit board and the mobile terminal that improve quality and improve fail safe.
The invention provides a kind of circuit board, wherein, described circuit board comprises substrate layer, copper foil layer, splicing ear and coverlay, described copper foil layer is laminated on described substrate layer, described copper foil layer comprises line areas and is positioned at the access area of side, described line areas, described line areas arranges electric conduction routing, described access area is provided with ground connection Copper Foil, described ground connection Copper Foil is in order to ground connection, described splicing ear is fixed on described line areas, and be electrically connected described electric conduction routing, described coverlay is covered on described copper foil layer, and be provided with the first empty window passed for described splicing ear, and corresponding described access area is provided with the second empty window.
Wherein, the inner edge of described first empty window fits tightly in side of described splicing ear week.
Wherein, described circuit board also comprises Connection Block, and described Connection Block is fixed on described coverlay, and relatively described line areas is arranged, and is electrically connected described splicing ear.
Wherein, described Connection Block comprises shell and is fixed on the pin in described shell, and described shell is fixed on described coverlay, and described pin is electrically connected on described splicing ear.
Wherein, described enclosure material is insulator.
Wherein, described shell is electric conductor, and described Connection Block also comprises electrostatic conductor, and described electrostatic conductor is connected between described shell and described ground connection Copper Foil.
Wherein, described second empty window is around side of described shell week.
Wherein, described circuit board also comprises ground plane, and described ground plane is laminated in described substrate layer and deviates from described copper foil layer side, is connected with the earthing conductor through described substrate layer between described ground connection Copper Foil and described ground plane.
Wherein, described substrate layer is flexible layer.
The present invention also provides a kind of mobile terminal, wherein, described mobile terminal comprises body, is located at the mainboard of described body interior and circuit board as described in claim 1 ~ 9 any one, and described flexible PCB is located at described body interior, and is electrically connected with described mainboard.
Circuit board provided by the invention and mobile terminal, by the line areas of described copper foil layer, electric conduction routing is set, described access area is connected to the side of described line areas, and the ground connection Copper Foil of ground connection is set, described splicing ear is electrically connected described electric conduction routing, described coverlay is provided with the first empty window passed for described splicing ear, and corresponding described access area is provided with the second empty window, thus make described splicing ear can connect external electronic component, and described ground connection Copper Foil carries out exposed by described second empty window, thus make described ground connection Copper Foil the electrostatic of all for described splicing ear sides can be introduced ground connection, thus improve the quality of described circuit board, improve fail safe.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the circuit board that the more excellent execution mode of the present invention provides;
Fig. 2 is the structural representation of the circuit board that another execution mode of the present invention provides;
Fig. 3 is the structural representation of the circuit board that another execution mode of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the invention provides a kind of mobile terminal of embodiment, comprise body (not indicating in figure), be located at the mainboard (not indicating in figure) of described body interior and circuit board 100, described body interior is located at by described circuit board 100, and is electrically connected with described mainboard.
Described mobile terminal can be the intelligent mobile terminals such as mobile phone, computer, flat board, handheld device or media player.In the present embodiment, for described mobile terminal for mobile phone is described.
Described circuit board 100 comprises substrate layer 10, copper foil layer 20, splicing ear 30 and coverlay 40.Described copper foil layer 20 is laminated on described substrate layer 10, described copper foil layer 20 comprises line areas 21 and is positioned at the access area 22 of 21 weeks sides, described line areas, described line areas 21 arranges electric conduction routing 211, and described access area 22 is provided with ground connection Copper Foil 221, and described ground connection Copper Foil 221 is in order to ground connection.Described splicing ear 30 is fixed on described line areas 21, and is electrically connected described electric conduction routing 211.Described coverlay 40 is covered on described copper foil layer 20, and is provided with the first empty window 41 passed for described splicing ear 30, and corresponding described access area 22 is provided with the second empty window 42.
By the line areas 21 of described copper foil layer 20, electric conduction routing 211 is set, described access area 22 is positioned at 21 weeks sides, described line areas, and the ground connection Copper Foil 221 of ground connection is set, described splicing ear 30 is electrically connected described electric conduction routing 211, described coverlay 40 is provided with the first empty window 41 passed for described splicing ear 30, and corresponding described access area 22 is provided with the second empty window 42, thus make described splicing ear 30 can connect external electronic component, and described ground connection Copper Foil 221 carries out exposed by described second empty window 42, thus make described ground connection Copper Foil 221 electrostatic of described splicing ear 30 weeks sides can be introduced ground connection, thus improve the quality of described circuit board 100, improve fail safe.
In present embodiment, described substrate layer 10 is flexible layer, thus described circuit board 100 can be flexible PCB.Described substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described copper foil layer 20 on described substrate layer 10, and insulation environment can be provided, so that the etching of described electric conduction routing 211 and described ground connection Copper Foil 221.Preferably, the thickness of described substrate layer 10 can be 20 μm.In other embodiments, described substrate layer 10 can also be hard plate.
In present embodiment, described copper foil layer 20 is made up of Copper Foil, described line areas 21 can be the geometric center position being positioned at described substrate layer 10, when described line areas 21 is positioned at the geometric center position of described substrate layer 10, described access area 22 is positioned at described line areas 21 around, because described earth terminal 30 is fixed on described line areas 21, be electrically connected described conducting wire 211, thus described access area 22 is positioned at described earth terminal 30 around, thus the ground connection Copper Foil 221 in described access area 22 is positioned at described earth terminal 30 around, namely described ground connection Copper Foil 221 can by the ambient static electricity ground connection of described earth terminal 30, thus prevent splicing ear 30 described in electrostatic damage, and prevent from damaging described splicing ear 30 weeks side electronic components.In other embodiments, described line areas 21 can also be the periphery being positioned at described substrate layer 10, thus described access area 22 is positioned at inside described line areas 21, relatively near the geometric center of described substrate layer 10.
In present embodiment, the number of described splicing ear 30 is multiple, and the multiple described electric conduction routing 211 of multiple described splicing ear 30 correspondence electrical connection, multiple described splicing ear 30 is arranged in described line areas 21.Multiple described splicing ear 30 can be connected on Connection Block jointly, or is connected on external electronic component.
In present embodiment, it is hot-forming that described coverlay 40 can adopt polyester material to carry out.Described coverlay 40 by paste adhesive on described copper foil layer 20; thus protect the electric conduction routing 211 of described line areas 21 do not lost or damage; simultaneously; adopt the mode of paste adhesive; also described coverlay 30 can be made tightr with the connection of described copper foil layer 20, prevent described coverlay 30 be shifted and cannot protect the electric conduction routing 211 exposing described coverlay 30.Described first empty window 41 makes described splicing ear 30 through described coverlay 40, thus can realize the signal of telecommunication being imported described electric conduction routing 211.The corresponding described ground connection Copper Foil 221 of described second empty window 42, thus make described ground connection Copper Foil 221 exposed, thus described splicing ear 30 weeks side electrostatic can be accessed described ground connection Copper Foil.In other embodiments, described coverlay 30 can also be adopt spraying plated film mode to carve to be plated on described copper foil layer 20.
Further, the inner edge of described first empty window 41 fits tightly in described splicing ear 30 weeks sides, namely described coverlay 30 is closely around described splicing ear 30 weeks sides, thus prevent described electric conduction routing 211 to be exposed to described coverlay 30, prevent described electric conduction routing 211 from accessing electrostatic, and then prevent described electric conduction routing 211 from electrostatic is conducted to electronic component or other electronics module, improve the fail safe of described circuit board 100.
Further, described circuit board 100 also comprises Connection Block 50, and described Connection Block 50 is fixed on described coverlay 40, and relatively described line areas 21 is arranged, and is electrically connected described splicing ear 30.In present embodiment, described Connection Block 50 is welded on multiple described splicing ear 30, described Connection Block 50 rectangular-blocklike, the contiguous described second empty window 42 in all sides of described Connection Block 50, thus conveniently described Connection Block 50 weeks side electrostatic is accessed described ground connection Copper Foil 221 through described second empty window 42, thus elimination electrostatic, to the electric conduction routing 211 of described Connection Block 50 and described Connection Block 50 weeks sides, and electronic component plays protective action.Utilize described Connection Block 50 to be electrically connected on described splicing ear 30, thus make described circuit board 100 that described Connection Block 50 can be utilized to realize more conducting function.In other embodiments, described Connection Block 50 can also replace with chip or other functional units.
Further, the pin 52 that described Connection Block 50 comprises shell 51 and is fixed in described shell 51, described shell 51 is fixed on described coverlay 40, and described pin 52 is electrically connected on described splicing ear 30.
In present embodiment, described pin 52 can be welded on described splicing ear 30, described shell 51 can be fixed on described coverlay 40 through SMT technique, described shell 51 protects described pin 52, and realize the grafting of external electronic component, described pin 52 realizes the electrical signal conduction with external electronic component.The number of described pin 52 can be multiple, and multiple described pin 52 is corresponding with multiple described splicing ear 30.In other embodiments, the number of described Connection Block 50 also can be multiple.
Further, provide one more excellent execution mode, described shell 51 material is insulator.Described shell 51 adopts plastic cement to make.When installing, dismantling or keep in repair described Connection Block 50, described shell 51 cannot access electrostatic, thus electrostatic is present in around described shell 51 through air, thus affects the performance of the electronic component of described Connection Block 50 periphery.Utilize around the contiguous described shell 51 of described second empty window 42, thus make electrostatic import described ground connection Copper Foil 221 through described second empty window 42, thus eliminate electrostatic.
Further, described second empty window 42 around described shell 51 weeks sides, thus makes described ground connection Copper Foil 221 near described shell 51 weeks sides, thus conveniently described shell 51 weeks side electrostatic is directed into described ground connection Copper Foil 221.
Further, as shown in Figure 2, provide another execution mode, described shell 51 material is electric conductor, and described Connection Block 50 also comprises electrostatic conductor 53, and described electrostatic conductor 53 is connected between described shell 51 and described ground connection Copper Foil 221.Described shell 51 adopts metal material.In installation, dismounting or when keeping in repair described Connection Block 50, described shell 51 can receive electrostatic, and electrostatic is passed to described ground connection Copper Foil 221 through described electrostatic conductor 53.Thus there is not electrostatic around described Connection Block 50, thus the electronic component of described circuit board 100 is not affected.Concrete, described electrostatic conductor 53 is connected with described ground connection Copper Foil 221 through described second empty window 42.
Further, as shown in Figure 3, another execution mode is provided, described circuit board 100 also comprises ground plane 60, described ground plane 60 is laminated in described substrate layer 10 and deviates from described copper foil layer 20 side, is connected with the earthing conductor 61 through described substrate layer 10 between described ground connection Copper Foil 221 and described ground plane 60.Concrete, described ground connection Copper Foil 221 offers via hole (sign) towards described ground plane 60, described via hole is through described substrate layer 10, described earthing conductor 61 is arranged in described via hole, and the electrostatic that described ground connection Copper Foil 221 receives is directed into described ground plane 60, thus make to there is not electrostatic around described Connection Block 50, thus described circuit board 100 is made to obtain electrostatic defending.
By the line areas of described copper foil layer, electric conduction routing is set, described access area is positioned at described line areas week side, and the ground connection Copper Foil of ground connection is set, described splicing ear is electrically connected described electric conduction routing, described coverlay is provided with the first empty window passed for described splicing ear, and corresponding described access area is provided with the second empty window, thus make described splicing ear can connect external electronic component, and described ground connection Copper Foil carries out exposed by described second empty window, thus make described ground connection Copper Foil the electrostatic of all for described splicing ear sides can be introduced ground connection, thus improve the quality of described circuit board, improve fail safe.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a circuit board, it is characterized in that: described circuit board comprises substrate layer, copper foil layer, splicing ear and coverlay, described copper foil layer is laminated on described substrate layer, described copper foil layer comprises line areas and is connected to the access area of described line areas side, described line areas arranges electric conduction routing, described access area is provided with ground connection Copper Foil, described ground connection Copper Foil is in order to ground connection, described splicing ear is fixed on described line areas, and be electrically connected described electric conduction routing, described coverlay is covered on described copper foil layer, and be provided with the first empty window passed for described splicing ear, and corresponding described access area is provided with the second empty window.
2. circuit board as claimed in claim 1, is characterized in that: the inner edge of described first empty window fits tightly in side of described splicing ear week.
3. circuit board as claimed in claim 2, it is characterized in that: described circuit board also comprises Connection Block, described Connection Block is fixed on described coverlay, and relatively described line areas is arranged, and is electrically connected described splicing ear.
4. circuit board as claimed in claim 3, is characterized in that: described Connection Block comprises shell and is fixed on the pin in described shell, and described shell is fixed on described coverlay, and described pin is electrically connected on described splicing ear.
5. circuit board as claimed in claim 4, it is characterized in that, described enclosure material is insulator.
6. circuit board as claimed in claim 4, it is characterized in that: described shell is electric conductor, and described Connection Block also comprises electrostatic conductor, described electrostatic conductor is connected between described shell and described ground connection Copper Foil.
7. circuit board as claimed in claim 4, is characterized in that: described second empty window is around side of described shell week.
8. circuit board as claimed in claim 1, it is characterized in that: described circuit board also comprises ground plane, described ground plane is laminated in described substrate layer and deviates from described copper foil layer side, is connected with the earthing conductor through described substrate layer between described ground connection Copper Foil and described ground plane.
9. circuit board as claimed in claim 1, is characterized in that: described substrate layer is flexible layer.
10. a mobile terminal, it is characterized in that: described mobile terminal comprises body, is located at the mainboard of described body interior and circuit board as described in claim 1 ~ 9 any one, described flexible PCB is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030687.4A CN105578725B (en) | 2015-12-29 | 2015-12-29 | Circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030687.4A CN105578725B (en) | 2015-12-29 | 2015-12-29 | Circuit board and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578725A true CN105578725A (en) | 2016-05-11 |
| CN105578725B CN105578725B (en) | 2018-07-06 |
Family
ID=55888230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511030687.4A Expired - Fee Related CN105578725B (en) | 2015-12-29 | 2015-12-29 | Circuit board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578725B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316665A (en) * | 2010-07-09 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
| JP2013229505A (en) * | 2012-04-26 | 2013-11-07 | Sharp Corp | Flexible printed circuit board, display device, and electronic apparatus |
| CN103889142A (en) * | 2012-12-21 | 2014-06-25 | 三菱电机株式会社 | Electronic Equipment And Flexible Printed Circuit |
-
2015
- 2015-12-29 CN CN201511030687.4A patent/CN105578725B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102316665A (en) * | 2010-07-09 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
| JP2013229505A (en) * | 2012-04-26 | 2013-11-07 | Sharp Corp | Flexible printed circuit board, display device, and electronic apparatus |
| CN103889142A (en) * | 2012-12-21 | 2014-06-25 | 三菱电机株式会社 | Electronic Equipment And Flexible Printed Circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578725B (en) | 2018-07-06 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180706 |