CN105556437A - Touch panel - Google Patents
Touch panel Download PDFInfo
- Publication number
- CN105556437A CN105556437A CN201480051087.3A CN201480051087A CN105556437A CN 105556437 A CN105556437 A CN 105556437A CN 201480051087 A CN201480051087 A CN 201480051087A CN 105556437 A CN105556437 A CN 105556437A
- Authority
- CN
- China
- Prior art keywords
- sensor component
- sub
- main part
- drive member
- induction main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Position Input By Displaying (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
A touch panel according to the present invention comprises a plurality of operational members and a plurality of sensing members. The plate-shaped operational members extend in the row-wise direction and are arrayed in the column-wise direction. The sensing members, forming a mesh, extend in the column-wise direction, and each comprises a plurality of sub-sensing members arrayed in the row-wise direction. Each sub-sensing member comprises a sensing body unit and a connecting wire for connecting adjacent sensing body units in the column-wise direction. The sensing body units, two or more of which are arranged so as to correspond to an operational member and which are provided in each corresponding sensing member, are arranged in the same columnar area.
Description
Technical field
Exemplary embodiment of the present invention relates to a kind of touch panel.More particularly, exemplary embodiment of the present invention relates to a kind of touch panel, even if the size of touch panel is large, and also can by the drive electrode identification touch coordinate of peanut.
Discussion of Related Art
The function of the type of the electronic equipment run in daily life with people diversification and electronic equipment gradually becomes first evolves and complicated, and in the urgent need to a user interface, user can learn like a cork and can handle intuitively.Touch panel device can meet this demand as input equipment and cause concern, and has been widely used in various electronic equipment.
Touch sensing device identification user's screen touch or gesture are as input information.The touch panel of touch sensing device is divided into resistance, electric capacity, ultrasound wave and infrared touch panel according to its driving method.These touch panels, capacitive touch panels cause numerous concern owing to being easy to multiple point touching input.
The structure of capacitive touch panels is the key factor of inductance capacitance change more accurately.Touch panel can have double-layer structure.Here, touch sensor can be realized by multiple induction electrode trace (trace as extended in the direction of the x axis) and being arranged on induction electrode trace and with a series of pixels that multiple drive electrode traces (trace as extended in the y-axis direction) of induction electrode trace crosses are formed.Driving and induction electrode trace can by dielectric material as polyethylene terephthalate (PET) or glass be separated.
Meanwhile, when the size of touch panel increases, output drive signal, for identifying that the number of the touch sensible chip channel of touch increases, has the problem of an increase sensitive time.In order to reduce computing time, developing the speed improving CPU, the function improving digital signal processor (DSP) or having passed through the aspects such as segmentation touch panel.
But, even if when using these methods, be also difficult to reduce the basic sensitive time.Such as, assuming that compared with having the contact panel of 4 inch dimension, transmission drive singal is its about 10 times to the number of the drive wire on the touch panel with 24 inch dimension, and induction Zone Full required time is more than 10 times.
Summary of the invention
Technical task
The present invention is the problem that design solves prior art, an object of the present invention is to provide a kind of touch panel, even if the size of touch panel is large, and also can by the drive electrode identification touch coordinate of peanut.
Problem solution
According to an aspect of the present invention, a kind of touch panel, comprising: multiple drive member and multiple sensor component, and drive member has the plate shape extending in low direction and arrange at column direction; Sensor component has the mesh shape extending at column direction and arrange in low direction, sensor component comprises sub-sensor component, the connecting wiring that sub-sensor component comprises induction main part and is connected to along column direction induction main part adjacent one another are, at least two induction main parts are arranged and are corresponded to drive member, so that each induction main part corresponding to sub-sensor component is arranged in identical column region.
In one exemplary embodiment, the induction main part of the first sub-sensor component and the induction main part of the second sub-sensor component, be arranged in same column region, can be overlapping with identical drive member.
In one exemplary embodiment, the induction main part of the first sub-sensor component, the induction main part of the second sub-sensor component and the induction main part of Sanya sensor component, be arranged in same column region, can be overlapping with identical drive member.
In one exemplary embodiment, described induction main part can have polygonal shape or round-shaped.
In one exemplary embodiment, induction main part can have rectangular shape, and each sub-sensor component can also be included in rectangular shape with the sub-sensing part being connected to induction main part that trapezoidal shape is formed.
In one exemplary embodiment, induction main part can have rectangular shape, and each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that X-shape is formed.
In one exemplary embodiment, induction main part can have rectangular shape, and each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that column direction is formed.
In one exemplary embodiment, induction main part can have rectangular shape, and each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that low direction is formed.
In one exemplary embodiment, drive member can have plate shape.
In an exemplary embodiment, at least one through hole can be formed in low direction, passes through drive member.
In one exemplary embodiment, sensor component can be arranged in drive member.
In one exemplary embodiment, touch panel also comprises: base component, has drive member formed thereon; And the insulation course be formed in drive member, at this, insulation course can be formed between drive member and sensor component.
In one exemplary embodiment, touch panel can also comprise: the first base component; And second base component, at this, drive member is formed on the first base component, and sensor component is formed on the second base component.
The effect of invention
According to described touch panel, because it can reduce the number of the drive member transmitting drive singal, the sweep time of touch recognition may be reduced, it is made likely to increase sweep velocity.In addition, the width of drive member increases, to make to reduce the end-to-end resistance corresponding to drive member.Therefore, because can improve the induction speed of each passage, it can with high sensitivity touch sensitive.
Brief Description Of Drawings
Fig. 1 is the floor map that touch panel is according to an embodiment of the invention described;
Fig. 2 is the blast perspective diagram of the embodiment that touch panel as shown in Figure 1 is described.
Fig. 3 is the blast perspective diagram of another embodiment that touch panel as shown in Figure 1 is described;
Fig. 4 is the floor map of the variant embodiment that drive member as shown in Figure 1 is described;
Fig. 5 is the floor map of the first variant embodiment that sensor component as shown in Figure 1 is described;
Fig. 6 is the floor map of the second variant embodiment that sensor component as shown in Figure 1 is described;
Fig. 7 is the floor map of the 3rd variant embodiment that sensor component as shown in Figure 1 is described;
Fig. 8 is the floor map of the 4th variant embodiment that sensor component as shown in Figure 1 is described;
Fig. 9 is the floor map of the 5th variant embodiment that sensor component as shown in Figure 1 is described;
Figure 10 is the floor map of the 6th variant embodiment that sensor component as shown in Figure 1 is described;
Figure 11 is the floor map that touch panel is in accordance with another embodiment of the present invention described; And
Figure 12 is the floor map that touch panel is in accordance with another embodiment of the present invention described.
Detailed description of the invention
Describe the present invention more fully below with reference to accompanying drawing, which show exemplary embodiment of the present invention.But, the present invention can comprise many different forms and this statement exemplary embodiment should as restricted explanation.On the contrary, provide these exemplary embodiments to make disclosure thoroughly complete, will the present invention's scope for those skilled in the art be fully demonstrated.The size in layer and region and relative size may be exaggerated in order to clear in the drawings.
When drawing is described, similar reference symbol is employed for similar constitutive requirements.For appended drawing, in figure, the size of component thing is the expansion diagram of actual size, in order to clearer and more definite expression the present invention.
Be understandable that, although first, second grade of term here can be used for describing different elements, assembly, region, layer and part, these elements, assembly, region, layer and part should by the restrictions of these terms.These terms are only used to region subelement, assembly, region, layer and part.Therefore, the first element discussed below, assembly, region, layer and part can be called as the second element, assembly, region, layer and part and can not deviate from instruction of the present invention.Singulative used herein " a ", " " an and " the " also comprise plural form, unless context separately has clear and definite instruction.
When using in explanation, term " comprises " and/or " comprising " can be understood further, clear and definite certain characteristic, entirety, step, operation, element and/or assembly, but do not get rid of and there is other characteristic one or more, entirety, step, operation, element, assembly and/or their combination.
Unless otherwise prescribed, all terms used herein (comprising technology and scientific terminology) are usually understood with those of ordinary skill in the art of the present invention and are had identical implication, understand these terms as those are in the definition of common dictionary further, the implication that should be interpreted as the field linguistic context relevant to them is consistent, a Utopian or too formal meaning can not be interpreted as, unless explicitly defined.
Hereinafter, " left side ", " left part " or " right side ", the description of " right part " refers to that observer observes the observation point of view.
In addition, " low direction " describes the horizontal direction referring to the observation point observing view with observer, and " column direction " describes the vertical direction referring to the observation point observing view with observer.
Fig. 1 is the floor map that touch panel 100 is according to an embodiment of the invention described.
About Fig. 1, comprise multiple drive member according to the touch panel 100 in one embodiment of the invention and be arranged in the multiple sensor components in drive member.Drive member and sensor component are formed on layer different from each other.Drive member can comprise optical clear conductive material, as indium tin oxide (ITO).In addition, sensor component can comprise optical clear conductive material, as indium tin oxide (ITO).In the present example embodiment, sensor component is formed with wire shaped, has the width of fine rule, so that sensor component can comprise superconductor, as gold (Au) or silver (Ag).
Insulation course (not shown in Figure 1) is arranged between drive member and sensor component.
Drive member has the plate shape extending in low direction and arrange at column direction.In the present example embodiment, the number of drive member is six.That is, the first drive member 111, second drive member 112, the 3rd drive member 113, four-wheel drive component 114, the 5th drive member 115 and the 6th drive member 116 are formed with plate shape.Each drive singal received in proper order from external unit in first to the 6th drive member 111,112,113,114,115 and 116, such as, touch sensible chip, has capacitive sensing circuit etc. and installs thereon.In the present example embodiment, first drive singal X0, second drive singal X1, the 3rd drive singal X2, four-wheel drive signal X3, the 5th drive singal X4 and the 6th drive singal X5 is applied to the first to the 6th drive member 111,112,113,114,115 and 116 respectively in proper order.
Each sensor component has the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 121, second sensor component 122, the 3rd sensor component 123, the 4th sensor component 124, the 5th sensor component 125,6th sense answer component 126, the 7th sensor component 127 and the 8th sensor component 128 to be formed with mesh shape.Each voltage that simultaneously transmits in first to the 8th sensor component 121,122,123,124,125,126,127 and 128 is to external unit, the responsively induced signal that causes of first to the 6th drive singal X0, X1, X2, X3, X4 and X5, such as, touch sensible chip.Such as, the first sensor component 121 transmits the first and second induced signal Y0 and Y1 to touch sensible chip, and the second sensor component 122 transmits third and fourth induced signal Y2 and Y3 to touch sensible chip.In addition, the 3rd sensor component 123 transmit the 5th and 6th sense induction signal Y4 and Y5 to touch sensible chip, and the 4th sensor component 124 transmits the 7th and the 8th induced signal Y6 and Y7 to touch sensible chip.In addition, the 5th sensor component 125 transmits the 9th and the tenth induced signal Y8 and Y9 to touch sensible chip, and 6th sense answers component 126 to transmit the 11 and 12 induced signal Y10 and Y11 to touch sensible chip.In addition, the 7th sensor component 127 transmits the 13 and the 14 induced signal Y12 and Y13 to touch sensible chip, and the 8th sensor component 128 transmits the 15 and the 16 induced signal Y14 and Y15 touch sensible chip.First to the 16 induced signal Y0, Y1, Y2, Y3 ..., Y14 and Y15 is sent to touch sensible chip simultaneously.
Each first to the 8th sensor component 121,122,123,124,125,126,127 and 128 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 121,122,123,124,125,126,127 and 128 comprises the first sub-sensor component 1211 and the second sub-sensor component 1212, and it is formed, and to correspond in the first to the 6th drive member 111,112,113,114,115 and 116 each.First sub-sensor component 1211 and the second sub-sensor component 1212 are the different passages of the touch sensible chip it being installed capacitive sensing circuit.In the present example embodiment, about a drive member (as the first drive member 111), overlapping with the first sub-sensor component 1211 and the second sub-sensor component 1212, the first sub-sensor component 1211 is arranged in the upper area of the first drive member 111 and the second sub-sensor component 1212 is arranged in lower area.
First sub-sensor component 1211 comprises the first induction main part 1213 and is connected to the first connecting wiring 1214 along column direction the first induction main part 1213 adjacent one another are.The width of the first induction main part 1213 can be less than or equal to the half of the first drive member 111 width.When observing in plan view, the first connecting wiring 1214 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 1212 comprises the second induction main part 1215 and is connected to the second connecting wiring 1216 along column direction the second induction main part 1215 adjacent one another are.The width of the second induction main part 1215 can be less than or equal to the half of the first drive member 111 width.When observing in plan view, the second connecting wiring 1216 is arranged in the right part of corresponding sensor component.
In the present example embodiment, the first induction main part 1213 and the second induction main part 1215 are arranged and are corresponded to a drive member, so that each induction main part of corresponding sub-sensor component is arranged in identical column region.In FIG, each sensor component has the belt shape formed at column direction, and the induction main part 1213 of the first sub-sensor component 1211 and the induction main part 1215 of the second sub-sensor component 1212 are arranged on a sensor component with zigzag fashion.
In the present example embodiment, the first sub-sensor component 1211 of the first sensor component 121 transmits the first induced signal Y0 to touch sensible chip, and the second sub-sensor component 1212 of the first sensor component 121 transmits the second induced signal Y1 to touch sensible chip.
First sub-sensor component 1211 of the second sensor component 122 transmits the 3rd induced signal Y2 to touch sensible chip, and the second sub-sensor component 1212 of the second sensor component 122 transmits the 4th induced signal Y3 to touch sensible chip.
By this way, the first sub-sensor component 1211 of the 8th sensor component 128 transmits the 15 induced signal Y14 to touch sensible chip, and the second sub-sensor component 1212 of the 8th sensor component 128 transmits the 16 induced signal Y15 to touch sensible chip.
In Fig. 1, to describe in the first and second induction main parts 1213 and 1215 each has closed loop shape; But closed loop shape upper part region can be opened.In addition, in FIG, to describe in the first and second induction main parts 1213 and 1215 each has rectangular shape; But each in the first and second induction main parts 1213 and 1215 can have round-shaped or as the polygonal shape of triangular shaped, pentagon shape, hex shape etc.
According to this exemplary embodiment, on touch panel, there is double-layer structure, drive member transmits and the sub-sensor component of different passages first communicates with the second sub-sensor component drive singal formed.Therefore, a drive member corresponds to two sub-sensor components, thus reduces the number of drive member.Therefore, the sweep time of touch recognition may be reduced, so just can improve sweep velocity.
In addition, being formed with a drive member and correspond to compared with a sub-sensor component, is sub-sensor component width twice according to the width of the drive member of this exemplary embodiment.The width of drive member increases, to lessen the end-to-end resistance corresponding to drive member.Owing to can improve the induction speed of each passage, it can with high sensitivity touch sensitive.
In addition, more energy is likely produced to reduce end-to-end resistance from drive member to sensor component.In addition, due to drive member by material as ITO is formed with plate shape, even if low end-to-end resistance also may be obtained in large size.Therefore, even if the size of touch panel also can realize the touch panel that can identify touch coordinate very greatly.
Fig. 2 is the blast perspective diagram of the embodiment that touch panel as shown in Figure 1 is described.
About Fig. 2, touch panel 200 comprises the first base component 210, the multiple drive member 220 be formed on the first base component 210, multiple sensor components 240 of being formed at the insulation course 230 in drive member 220 and being formed on insulation course 230.First base component 210 can comprise film, glass, plastics etc.
Drive member 220 can the first to the 6th drive member 111,112,113,114,115 and 116 described in Fig. 1.In addition, sensor component 240 can the first to the 8th sensor component 121,122,123,124,125,126,127 and 128 described in Fig. 1.
According to this exemplary embodiment, because drive member and sensor component are formed on base component, extra insulation course is namely between drive member and sensor component.
Fig. 3 is the blast perspective diagram of another embodiment that touch panel as shown in Figure 1 is described.
About Fig. 3, touch panel 300 comprises the first base component 310, the multiple drive member 320 be formed on the first base component 310, multiple sensor components 340 of being formed at the second base component 330 in drive member 320 and being formed on the second base component 330.First base component 310 and the second base component 330 can comprise film, glass, plastics etc.
Drive member 320 can the first to the 6th drive member 111,112,113,114,115 and 116 described in Fig. 1.In addition, sensor component 340 can the first to the 8th sensor component 121,122,123,124,125,126,127 and 128 described in Fig. 1.
According to this exemplary embodiment, drive member is formed at a base component, and sensor component is formed at another base component.In this case, the second base component is namely between drive member and sensor component to play the effect of insulation course.Therefore, compared with the touch panel described in Fig. 2, insulation course can omit.
Fig. 4 is the floor map of the variant embodiment that drive member as shown in Figure 1 is described.
About Fig. 4, each lower floor 130 being arranged in touch panel in drive member 131,132,133,134,135 and 136, has plate shape, and through hole 1311 is formed thereon to extend in low direction and to arrange at column direction.Each in drive member 131,132,133,134,135 and 136 receives drive singal X0, X1, X2, X3, X4 and X5 in proper order from external unit, and such as, touch sensible chip, has capacitive sensing circuit etc. and install thereon.
Through hole 1311 is formed and corresponds between the induction main part 1213 and 1215 (as shown in Figure 1) that column direction is adjacent one another are.In the diagram, describe through hole 1311 to be formed with dot shape; But the region connecting induction main part adjacent one another are is removed to form through hole.Therefore, nemaline through hole can unanimously with drive member be formed.
Or through hole 1311 can extend.Such as, can remove corresponding to first induction main part 1213 (as shown in Figure 1) and second induction main part 1215 (as shown in Figure 1) region with this formation through hole.
Fig. 5 is the floor map of the first variant embodiment that sensor component as shown in Figure 1 is described.Particularly, show and be included in diamond shape in rectangular shape to define sub-sensor component.
About Fig. 5, there is according to the sensor component of the first variant embodiment the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 421, second sensor component 422, the 3rd sensor component 423, the 4th sensor component 424, the 5th sensor component 425,6th sense answer component 426, the 7th sensor component 427 and the 8th sensor component 428 to be formed with mesh shape.In first to the 8th sensor component 421,422,423,424,425,426,427 and 428 each simultaneously transmit voltage to external unit, such as, touch sensible chip.
Each in first to the 8th sensor component 421,422,423,424,425,426,427,428 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 421,422,423,424,425,426,427,428 comprises the first sub-sensor component 4211 and the second sub-sensor component 4212, and it is formed, and to correspond in the first to the 6th drive member 111,112,113,114,115 and 116 (as shown in fig. 1) each.
First sub-sensor component 4211 comprises the first induction main part 4213, in the first induction main part 4213, forms the first sub-sensing part 4213a being connected to the first induction main part 4213 and the first connecting wiring 4214 be connected to along column direction the first induction main part 4213 adjacent one another are with diamond shape.Such as, the width of the first induction main part 4213 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the first connecting wiring 4214 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 4212 comprises the second induction main part 4215, in the second induction main part 4215, forms the second sub-sensing part 4215a being connected to the second induction main part 4215 and the second connecting wiring 4216 be connected to along column direction the second induction main part 4215 adjacent one another are with diamond shape.Such as, the width of the second induction main part 4215 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the second connecting wiring 4216 is arranged in the right part of corresponding sensor component.
Fig. 6 is the floor map of the second variant embodiment that sensor component as shown in Figure 1 is described.Particularly, show and be included in X-shape in rectangular shape to define sub-sensor component.
About Fig. 6, there is according to the sensor component of the second variant embodiment the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 521, second sensor component 522, the 3rd sensor component 523, the 4th sensor component 524, the 5th sensor component 525,6th sense answer component 526, the 7th sensor component 527 and the 8th sensor component 528 to be formed with mesh shape.In first to the 8th sensor component 521,522,523,524,525,526,527 and 528 each simultaneously transmit voltage to external unit, such as, touch sensible chip.
Each in first to the 8th sensor component 521,522,523,524,525,526,527 and 528 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 521,522,523,524,525,526,527 and 528 comprises the first sub-sensor component 5211 and the second sub-sensor component 5212, and it is formed, and to correspond in the first to the 6th drive member 111,112,113,114,115 and 116 (as shown in fig. 1) each.First sub-sensor component 5211 and the second sub-sensor component 5212 are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
First sub-sensor component 5211 comprises the first induction main part 5213, in the first induction main part 5213, forms the first sub-sensing part 5213a being connected to the first induction main part 5213 and the first connecting wiring 5214 be connected to along column direction the first induction main part 5213 adjacent one another are with X-shape.Such as, the width of the first induction main part 5213 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the first connecting wiring 5214 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 5212 comprises the second induction main part 5215, in the second induction main part 5215, forms the second sub-sensing part 5215a being connected to the second induction main part 5215 and the second connecting wiring 5216 be connected to along column direction the second induction main part 5215 adjacent one another are with X-shape.Such as, the width of the second induction main part 5215 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the second connecting wiring 5216 is arranged in the right part of corresponding sensor component.
Fig. 7 is the floor map of the 3rd variant embodiment that sensor component as shown in Figure 1 is described.Particularly, show multiple connecting member to be included in rectangular shape with column direction to define sub-sensor component.
About Fig. 7, there is according to the sensor component of the 3rd variant embodiment the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 621, second sensor component 622, the 3rd sensor component 623, the 4th sensor component 624, the 5th sensor component 625,6th sense answer component 626, the 7th sensor component 627 and the 8th sensor component 628 to be formed with mesh shape.In first to the 8th sensor component 621,622,623,624,625,626,627 and 628 each simultaneously transmit voltage to external unit, such as, touch sensible chip.
Each in first to the 8th sensor component 621,622,623,624,625,626,627 and 628 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 621,622,623,624,625,626,627 and 628 comprises the first sub-sensor component 6211 and the second sub-sensor component 6212, and it is formed, and to correspond in the first to the 6th drive member 111,112,113,114,115 and 116 (as shown in fig. 1) each.First sub-sensor component 6211 and the second sub-sensor component 6212 are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
The first sub-sensing part 6213a that first sub-sensor component 6211 comprises the first induction main part 6213, be included in the multiple connecting members formed with column direction in the first induction main part 6213 and the first connecting wiring 6214 be connected to along column direction the first induction main part 6213 adjacent one another are.Such as, the width of the first induction main part 6213 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the first connecting wiring 6214 is arranged in the left part of corresponding sensor component.
The second sub-sensing part 6215a that second sub-sensor component 6212 comprises the second induction main part 6215, be included in the multiple connecting members formed with column direction in the second induction main part 6215 and the second connecting wiring 6216 be connected to along column direction the second induction main part 6215 adjacent one another are.Such as, the width of the second induction main part 6215 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the second connecting wiring 6216 is arranged in the right part of corresponding sensor component.
Fig. 8 is the floor map of the 4th variant embodiment that sensor component as shown in Figure 1 is described.Particularly, show multiple connecting member and in rectangular shape, define sub-sensor component with sawtooth fashion connection at column direction.
About Fig. 8, there is according to the sensor component of the 4th variant embodiment the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 721, second sensor component 722, the 3rd sensor component 723, the 4th sensor component 724, the 5th sensor component 725,6th sense answer component 726, the 7th sensor component 727 and the 8th sensor component 728 to be formed with mesh shape.In first to the 8th sensor component 721,722,723,724,725,726,727 and 728 each simultaneously transmit voltage to external unit, such as, touch sensible chip.
Each in first to the 8th sensor component 721,722,723,724,725,726,727 and 728 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 721,722,723,724,725,726,727 and 728 comprises the first sub-sensor component 7211 and the second sub-sensor component 7212, and it is formed, and to correspond in the first to the 6th drive member 111,112,113,114,115 and 116 (as shown in fig. 1) each.First sub-sensor component 7211 and the second sub-sensor component 7212 are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
First sub-sensor component 7211 comprises the first induction main part 7213, be included in the first induction main part 7213 and form the first sub-sensing part 7213a being connected to multiple connecting members of the first induction main part 7213 and the first connecting wiring 7214 be connected to along column direction the first induction main part 7213 adjacent one another are with sawtooth fashion.Such as, the width of the first induction main part 7213 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the first connecting wiring 7214 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 7212 comprises the second induction main part 7215, be included in the second induction main part 7215 and form the second sub-sensing part 7215a being connected to the second induction main part 7215 and the second connecting wiring 7216 be connected to along column direction the second induction main part 7215 adjacent one another are with sawtooth fashion.Such as, the width of the second induction main part 7215 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the second connecting wiring 7216 is arranged in the right part of corresponding sensor component.
Fig. 9 is the floor map of the 5th variant embodiment that sensor component as shown in Figure 1 is described.Particularly, show multiple connecting member to be included in rectangular shape with low direction to define sub-sensor component.
About Fig. 9, there is according to the sensor component of the 5th variant embodiment the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 821, second sensor component 822, the 3rd sensor component 823, the 4th sensor component 824, the 5th sensor component 825,6th sense answer component 826, the 7th sensor component 827 and the 8th sensor component 828 to be formed with mesh shape.Each voltage that simultaneously transmits in first to the 8th sensor component 821,822,823,824,825,826,827 and 828 is to external unit, and such as, touch sensible chip, as comprising the induced signal caused corresponding to drive singal.
Each in first to the 8th sensor component 821,822,823,824,825,826,827 and 828 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 821,822,823,824,825,826,827 and 828 comprises the first sub-sensor component 8211 and the second sub-sensor component 8212, and it is each that it is formed corresponding in the first to the 6th drive member 111,112,113,114,115 and 116 (as shown in fig. 1) respectively.First sub-sensor component 8211 and the second sub-sensor component 8212 are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
The first sub-sensing part 8213a that first sub-sensor component 8211 comprises the first induction main part 8213, be included in the multiple connecting members formed with low direction in the first induction main part 8213 and the first connecting wiring 8214 be connected to along column direction the first induction main part 8213 adjacent one another are.Such as, the width of the first induction main part 8213 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the first connecting wiring 8214 is arranged in the left part of corresponding sensor component.
The second sub-sensing part 8215a that second sub-sensor component 8212 comprises the second induction main part 8215, be included in the multiple connecting members formed with low direction in the second induction main part 8215 and the second connecting wiring 8216 be connected to along column direction the second induction main part 8215 adjacent one another are.Such as, the width of the second induction main part 8215 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the second connecting wiring 8216 is arranged in the right part of corresponding sensor component.
Figure 10 is the floor map of the 6th variant embodiment that sensor component as shown in Figure 1 is described.Particularly, show multiple connecting member and in rectangular shape, define sub-sensor component with sawtooth fashion connection in low direction.
About Figure 10, there is according to the sensor component of the 6th variant embodiment the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 921, second sensor component 922, the 3rd sensor component 923, the 4th sensor component 924, the 5th sensor component 925,6th sense answer component 926, the 7th sensor component 927 and the 8th sensor component 928 to be formed with mesh shape.In first to the 8th sensor component 921,922,923,924,925,926,927 and 928 each simultaneously transmit voltage to external unit, such as, touch sensible chip.As comprising the induced signal caused corresponding to drive singal.
Each in first to the 8th sensor component 921,922,923,924,925,926,927 and 928 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 8th sensor component 921,922,923,924,925,926,927 and 928 comprises the first sub-sensor component 9211 and the second sub-sensor component 9212, and it is formed, and to correspond in the first to the 6th drive member 111,112,113,114,115 and 116 (as shown in fig. 1) each.First sub-sensor component 9211 and the second sub-sensor component 9212 are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
First sub-sensor component 9211 comprises the first induction main part 9213, to be included in the first induction main part 9,213 first sub-sensing part 9213a of the multiple connecting members connected with sawtooth fashion along low direction and to be connected to along column direction the first the first connecting wiring 9214 responding to main part 9213 adjacent one another are.Such as, the width of the first induction main part 9213 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the first connecting wiring 9214 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 9212 comprises the second induction main part 9215, to be included in the second induction main part 9,215 second sub-sensing part 9215a of the multiple connecting members connected with sawtooth fashion along low direction and to be connected to along column direction the second the second connecting wiring 9216 responding to main part 9215 adjacent one another are.Such as, the width of the second induction main part 9215 can be less than or equal to the half of the first drive member 111 (as shown in fig. 1) width.When observing in plan view, the second connecting wiring 9216 is arranged in the right part of corresponding sensor component.
Figure 11 is the floor map that touch panel is in accordance with another embodiment of the present invention described.
Comprise multiple drive member according to the touch panel 2000 in one embodiment of the invention and be arranged in the multiple sensor components in drive member.Drive member and sensor component are formed on layer different from each other.Insulation course (not shown) is arranged between drive member and sensor component.
Drive member has the plate shape extending in low direction and arrange at column direction.In the present example embodiment, the number of drive member is six.That is, the first drive member 2111, second drive member 2112, the 3rd drive member 2113, four-wheel drive component 2114, the 5th drive member 2115 and the 6th drive member 2116 are formed with plate shape.In fig. 11, describe the first to the 6th drive member 2111,2112,2113,2114,2115 and 2116 and there is plate shape, as illustrated in fig. 4, respectively by each formation through hole in the first to the 6th drive member 2111,2112,2113,2114,2115 and 2116, each drive singal received in proper order from external unit in first to the 6th drive member 2111,2112,2113,2114,2115 and 2116, such as, touch sensible chip, has capacitive sensing circuit etc. and installs thereon.In the present example embodiment, first drive singal X0, second drive singal X1, the 3rd drive singal X2, four-wheel drive signal X3, the 5th drive singal X4 and the 6th drive singal X5 is applied to the first to the 6th drive member 2111,2112,2113,2114,2115 and 2116 respectively in proper order.
Each sensor component has the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is eight.That is, the first sensor component 2121, second sensor component 2122, the 3rd sensor component 2123, the 4th sensor component 2124, the 5th sensor component 2125,6th sense answer component 2126, the 7th sensor component 2127 and the 8th sensor component 2128 to be formed with mesh shape.Each voltage that simultaneously transmits in first to the 8th sensor component 2121,2122,2123,2124,2125,2126,2127 and 2128 to external unit, the responsively induced signal that causes of drive singal, such as, touch sensible chip.
Each first to the 8th sensor component 2121,2122,2123,2124,2125,2126,2127 and 2128 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.That is, each in the first to the 8th sensor component 2121,2122,2123,2124,2125,2126,2127 and 2128 comprises the first sub-sensor component 2212 of sub-sensor component 2211, second and Sanya sensor component 2213, and it forms that to correspond in the first to the 6th drive member 2111,2112,2113,2114,2115 and 2116 each.The sub-sensor component 2212 of first sub-sensor component 2211, second, Sanya sensor component 2213 etc. are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
First sub-sensor component 2211 comprises the first induction main part 2214 and is connected to the first connecting wiring 2215 along column direction the first induction main part 2214 adjacent one another are.The width of the first induction main part 2214 can be less than or equal to 1/3 of the first drive member 2111 width.When observing in plan view, the first connecting wiring 2215 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 2212 comprises the second induction main part 2216 and is connected to the second connecting wiring 2217 along column direction the second induction main part 2216 adjacent one another are.The width of the second induction main part 2216 can be less than or equal to 1/3 of the first drive member 2111 width.When observing in plan view, the second connecting wiring 2217 is arranged in the core of corresponding sensor component.
Sanya sensor component 2213 comprises the 3rd induction main part 2218 and is connected to the 3rd connecting wiring 2219 along column direction the 3rd induction main part 2218 adjacent one another are.The width of the 3rd induction main part 2218 can be less than or equal to 1/3 of the first drive member 2111 width.When observing in plan view, the 3rd connecting wiring 2219 is arranged in the right part of corresponding sensor component.
In the above-described embodiments, describe the minor face extension that drive member is parallel to touch panel, and sensor component is parallel to the long limit extension of contact panel.Or described by following Figure 12, the long limit that drive member can be parallel to touch panel extends, and sensor component can be parallel to the minor face extension of contact panel.
In the present example embodiment, describe a kind of touch panel, on it, a driving element is formed and corresponds to three sub-sensing elements, but touch panel can realize a drive member and be formed corresponding to a four or more sub-sensor component.Therefore, induction medium-sized and sensitive time needed for the whole region of large-scale capacitor formula touch panel is decreased.
As mentioned above, according to the present embodiment, three sub-sensor components correspond to a drive member, thus compare with another exemplary embodiment such as described in Fig. 1 to Figure 10 the number decreasing drive member.Therefore, it can reduce the sweep time for touch sensitive, thus improves sweep velocity.
Figure 12 is the floor map that touch panel is in accordance with another embodiment of the present invention described.
About Figure 12, comprise multiple drive member according to the touch panel 3000 in one embodiment of the invention and be arranged in the multiple sensor components in drive member.Drive member and sensor component are formed on layer different from each other.Insulation course (not shown) is arranged between drive member and sensor component.
Drive member has the plate shape extending in low direction and arrange at column direction.In the present example embodiment, the number of drive member is four.That is, the first drive member 3111, second drive member 3112, the 3rd drive member 3113 and four-wheel drive component 3114 are formed with plate shape.Each drive singal received in proper order from external unit in first to fourth drive member 3111,3112,3113 and 3114, such as, touch sensible chip, has capacitive sensing circuit etc. and installs thereon.In the present example embodiment, the first drive singal X0, second drive singal X1, the 3rd drive singal X2 and four-wheel drive signal X3 are applied to first to fourth drive member 3111,3112,3113 and 3114 respectively in proper order.
Sensor component all has the mesh shape extending at column direction and arrange in low direction.In the present example embodiment, the number of sensor component is 12.That is, the first sensor component 3121, second sensor component 3122, the 3rd sensor component 3123, the 4th sensor component 3124, the 5th sensor component 3125,6th sense answer component 3126, the 7th sensor component 3127, the 8th sensor component 2128, the 9th sensor component 3129, the tenth sensor component the 3130, the 11 sensor component the 3131 and the 12 sensor component 3132 formed with mesh shape.Each voltage that simultaneously transmits in first to the 12 sensor component 3121,3122,3123,3124,3125,3126,3127,3128,3129,3130,3131 and 2132 is to external unit, the responsively induced signal that causes of drive singal, such as, touch sensible chip.
Each first to the 12 sensor component 3121,3122,3123,3124,3125,3126,3127,3128,3129,3130,3131 and 3132 comprises multiple sub-sensor component.In the present example embodiment, the number of sub-sensor component is two.Namely, each in first to the 12 sensor component 3121,3122,3123,3124,3125,3126,3127,3128,3129,3130,3131 and 3132 comprises the first sub-sensor component 3211 and the second sub-sensor component 3212, and it is formed, and to correspond in first to fourth drive member 3111,3112,3113 and 3114 each.First sub-sensor component 3211 and the second sub-sensor component 3212 are connected to the different passages of the touch sensible chip it being installed capacitive sensing circuit.
First sub-sensor component 3211 comprises the first induction main part 3213 and is connected to the first connecting wiring 3214 along column direction the first induction main part 3213 adjacent one another are.The width of the first induction main part 3213 can be less than or equal to the half of the first drive member 3111 width.When observing in plan view, the first connecting wiring 3214 is arranged in the left part of corresponding sensor component.
Second sub-sensor component 3212 comprises the second induction main part 3215 and is connected to the second connecting wiring 3216 along column direction the second induction main part 3215 adjacent one another are.The width of the second induction main part 3215 can be less than or equal to the half of the first drive member 3111 width.When observing in plan view, the second connecting wiring 3216 is arranged in the right part of corresponding sensor component.
As mentioned above, according to the touch panel 3000 in this exemplary embodiment, it compares the number that can reduce drive member further with the touch panel such as described in Fig. 1 to Figure 11, can reduce the overall sensitive time further to make it.Such as, touch panel 100 described is in FIG equipped with six drive member, and six drive singal to be applied to touch panel 100 be a frame.But touch panel 3000 described is in fig. 12 equipped with four drive member, and it is a frame that four drive singal are applied to touch panel 3000.Therefore, time interval drive singal being applied to the touch panel 100 described in Fig. 1 is shorter than the interval time of the touch panel 3000 be applied to by drive singal described in Figure 12.Therefore, compared with the touch panel 100 described in Fig. 1, the sweep time reducing the touch panel 3000 described in Figure 12 is possible.
Although described exemplary embodiment of the present invention, it is further noted that do not departing under the spirit and scope of the present invention defined by accessory claim, those skilled in the art will be easy to also can carry out various amendment to it.
Claims (14)
1. a touch panel, comprising:
Multiple drive member, has the plate shape extending in low direction and arrange at column direction;
Multiple sensor component, have the mesh shape extending at column direction and arrange in low direction, sensor component comprises sub-sensor component, the connecting wiring that sub-sensor component comprises induction main part and is connected to along column direction induction main part adjacent one another are,
Wherein, at least two induction main parts are arranged and are corresponded to drive member, so that each induction main part corresponding to sub-sensor component is arranged in identical column region.
2. touch panel as claimed in claim 1, wherein, the induction main part of the first sub-sensor component and the induction main part of the second sub-sensor component, be arranged in same column region, overlapping with identical drive member.
3. touch panel as claimed in claim 1, wherein, the induction main part of the first sub-sensor component, the induction main part of the second sub-sensor component and the induction main part of Sanya sensor component, be arranged in same column region, overlapping with identical drive member.
4. touch panel as claimed in claim 1, wherein, described induction main part has polygonal shape or round-shaped.
5. touch panel as claimed in claim 1, wherein, induction main part has rectangular shape, and
Each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that trapezoidal shape is formed.
6. touch panel as claimed in claim 1, wherein, induction main part has rectangular shape, and
Each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that X-shape is formed.
7. touch panel as claimed in claim 1, wherein, induction main part has rectangular shape, and
Each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that column direction is formed.
8. touch panel as claimed in claim 1, wherein, induction main part has rectangular shape, and
Each sub-sensor component is also included in rectangular shape with the sub-sensing part being connected to induction main part that low direction is formed.
9. touch panel as claimed in claim 1, wherein, drive member has plate shape.
10. touch panel as claimed in claim 1, wherein, at least one through hole is formed in low direction, passes through drive member.
11. touch panels as claimed in claim 10, wherein, described through hole corresponds to the region between the induction main part that column direction is adjacent one another are.
12. touch panels as claimed in claim 1, wherein, sensor component is arranged in drive member.
13. touch panels as claimed in claim 1, also comprise:
Base component, has drive member formed thereon; And
Be formed at the insulation course in drive member,
Wherein, insulation course is formed between drive member and sensor component.
14. touch panels as claimed in claim 1, comprise further:
First base component; And
Second base component,
Wherein, drive member is formed on the first base component, and
Sensor component is formed on the second base component.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0111371 | 2013-09-16 | ||
| KR1020130111371A KR102120776B1 (en) | 2013-09-16 | 2013-09-16 | Touch panel |
| PCT/KR2014/008174 WO2015037854A1 (en) | 2013-09-16 | 2014-09-02 | Touch panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105556437A true CN105556437A (en) | 2016-05-04 |
| CN105556437B CN105556437B (en) | 2019-12-13 |
Family
ID=52665911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480051087.3A Active CN105556437B (en) | 2013-09-16 | 2014-09-02 | Touch panel |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102120776B1 (en) |
| CN (1) | CN105556437B (en) |
| WO (1) | WO2015037854A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201570006U (en) * | 2009-10-23 | 2010-09-01 | 深圳市汇顶科技有限公司 | Capacitive sensing equipment and electronic device with touch function |
| WO2012153899A1 (en) * | 2011-05-12 | 2012-11-15 | (주)멜파스 | Touch sensor panel |
| CN103116427A (en) * | 2012-12-10 | 2013-05-22 | 漳州宝发光电科技有限公司 | Bridging and wire-leading sensor of monolayer multi-point touch screen and forming process thereof |
| CN203054788U (en) * | 2013-01-28 | 2013-07-10 | 北京京东方光电科技有限公司 | Embedded type touch screen and display device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101665148B1 (en) * | 2008-08-01 | 2016-10-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Methods of making composite electrodes |
| KR20100095988A (en) * | 2009-06-25 | 2010-09-01 | (주)이엔에이치 | Electrostatic capacity type touch screen panel |
| KR101144152B1 (en) * | 2009-11-17 | 2012-05-09 | (주)삼원에스티 | Touch panel sensor |
| KR101103825B1 (en) * | 2009-10-19 | 2012-01-06 | 주식회사 애트랩 | Touch panel is capable of sensing multi-touch and method for sensing multi-touch |
| KR101109382B1 (en) * | 2010-04-12 | 2012-01-30 | 삼성전기주식회사 | touch panel |
| US8860686B2 (en) | 2010-04-30 | 2014-10-14 | Atmel Corporation | Multi-chip touch screens |
| KR101768052B1 (en) * | 2010-12-29 | 2017-08-16 | 삼성디스플레이 주식회사 | Touch Screen Panel and Drinving Method thereof |
| KR20130074489A (en) | 2011-12-26 | 2013-07-04 | 삼성전기주식회사 | Sensing electrode patten |
-
2013
- 2013-09-16 KR KR1020130111371A patent/KR102120776B1/en active IP Right Grant
-
2014
- 2014-09-02 WO PCT/KR2014/008174 patent/WO2015037854A1/en active Application Filing
- 2014-09-02 CN CN201480051087.3A patent/CN105556437B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201570006U (en) * | 2009-10-23 | 2010-09-01 | 深圳市汇顶科技有限公司 | Capacitive sensing equipment and electronic device with touch function |
| WO2012153899A1 (en) * | 2011-05-12 | 2012-11-15 | (주)멜파스 | Touch sensor panel |
| CN103116427A (en) * | 2012-12-10 | 2013-05-22 | 漳州宝发光电科技有限公司 | Bridging and wire-leading sensor of monolayer multi-point touch screen and forming process thereof |
| CN203054788U (en) * | 2013-01-28 | 2013-07-10 | 北京京东方光电科技有限公司 | Embedded type touch screen and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150031768A (en) | 2015-03-25 |
| KR102120776B1 (en) | 2020-06-11 |
| CN105556437B (en) | 2019-12-13 |
| WO2015037854A1 (en) | 2015-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9841834B2 (en) | In-cell touch liquid crystal panels and the array substrates thereof | |
| CN108398822B (en) | Touch display substrate, display panel and display device | |
| KR101693132B1 (en) | In-cell touch panel and display device | |
| EP3151097B1 (en) | In-cell touch screen and display device | |
| CN104345984B (en) | Display device | |
| JP6615855B2 (en) | Touch screen using both electromagnetic induction and capacitance | |
| JP5439565B2 (en) | Touch panel and manufacturing method thereof | |
| CN102135833B (en) | Touch panel | |
| US9423918B2 (en) | Electrostatic capacitive touch screen panel | |
| CN103425347A (en) | Touch control display device | |
| JP2009230735A (en) | Touch panel device | |
| CN103913873A (en) | Liquid crystal display panel, display device and scanning method of display device | |
| CN103823599A (en) | Electrostatic capacitive type touch screen panel | |
| CN101738765B (en) | Liquid crystal display panel, device and touch detection method of integrated touch screen | |
| CN103513818A (en) | Touch control device and electrostatic screening method thereof | |
| US20180335878A1 (en) | Touch control display panel | |
| CN104635976A (en) | Touch screen panel and display device | |
| CN102768603A (en) | Touch control panel capable of reducing capacitive coupling effect | |
| CN101464743B (en) | Hybrid touch control panel and its forming method | |
| KR102140236B1 (en) | Touch panel | |
| CN111124184A (en) | Display module and display device | |
| CN107728354A (en) | Embedded touch display device | |
| KR102178197B1 (en) | Display device with touch screen | |
| CN203535608U (en) | Touch control display apparatus | |
| CN105556437A (en) | Touch panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |