CN105554660A - Electret microphone package structure with compression and interference resistance - Google Patents
Electret microphone package structure with compression and interference resistance Download PDFInfo
- Publication number
- CN105554660A CN105554660A CN201510932875.XA CN201510932875A CN105554660A CN 105554660 A CN105554660 A CN 105554660A CN 201510932875 A CN201510932875 A CN 201510932875A CN 105554660 A CN105554660 A CN 105554660A
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- China
- Prior art keywords
- output
- circuit board
- electret microphone
- pad
- shell
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present invention discloses an electret microphone package structure with compression and interference resistance. The package structure comprises an electret microphone device, a shell and a circuit board. The electret microphone device comprises a first output end and a second output end which are separately arranged. The second output end is adjacent to the shell. The electret microphone device is electrically connected to the circuit board through the first output end and the second output end. The second output end is also provided with a pad which is electrically connected to the shell. Two sides of the pad are electrically connected to the circuit board and the second output end. According to the electret microphone package structure, through arranging the pad to electrically connect the circuit board and the second output end and electrically connecting the pad to the shell, the contact resistance between the circuit board and the shell is effectively reduced, and the compression and interference resistance performance of the electret microphone package structure is improved.
Description
Technical field
The present invention relates to audio parts design field, particularly relate to the jamproof electret microphone encapsulating structure of a kind of resistance to compression.
Background technology
Electret microphone has the advantages that volume is little, structure is simple, electroacoustic performance is good, price is low, is widely used in the circuit such as cassette recorder, wireless microphone and acoustic control, belongs to the most frequently used capacitance microphone.Because input and output impedance is very high, so will arrange a field effect transistor as impedance transducer in this microphone case, electret microphone operationally needs direct-current working volts for this reason.
Shown in ginseng Fig. 1, electret microphone encapsulating structure generally includes electret microphone device, shell and circuit board, electret microphone device comprises the drain output and source ground output that are separated from each other setting, adopts the mode of " edge sealing " to be connected between shell with source ground output.When being subject to extruding to a certain extent, shell and circuit board easily disengage, and cause the contact resistance between circuit board and shell to become large, housing shroud hydraulic performance decline, thus are easily subject to extraneous interference, have a strong impact on user's communication and record and experience.
Therefore, for above-mentioned technical problem, be necessary to provide a kind of resistance to compression jamproof electret microphone encapsulating structure.
Summary of the invention
For overcoming the deficiencies in the prior art, the object of the present invention is to provide the jamproof electret microphone encapsulating structure of a kind of resistance to compression.
To achieve these goals, the technical scheme that provides of the embodiment of the present invention is as follows:
The jamproof electret microphone encapsulating structure of a kind of resistance to compression, described encapsulating structure comprises electret microphone device, shell and circuit board, described electret microphone device comprises the first output and the second output that are separated from each other setting, second output adjacent housings is arranged, described electret microphone device passes through described first output and the second output and circuit board and is electrically connected, described second output is also provided with the pad be electrically connected with shell, the both sides of described pad are electrically connected with circuit board and the second output respectively.
As a further improvement on the present invention, described first output is drain output, and described second output is source ground output.
As a further improvement on the present invention, the isolation strip of insulation is provided with between described first output and the second output.
As a further improvement on the present invention, described second output comprises the first efferent and protrudes from the second efferent on the first efferent, and described pad and described first efferent are electrically connected.
As a further improvement on the present invention, described second output and pad parallel connection are formed between circuit board and shell.
As a further improvement on the present invention, the contact resistance between described circuit board and shell is
wherein, R ' is the resistance of the second output, R " be the resistance of pad.
As a further improvement on the present invention, the height of described pad is equal with the height of the second efferent.
As a further improvement on the present invention, between described first output and circuit board, between the second output and circuit board, between pad and circuit board, weld layer is provided with.
As a further improvement on the present invention, described pad and the second output, be provided with weld layer between pad and shell.
As a further improvement on the present invention, between described second output and circuit board and be respectively equipped with the first weld layer and the second weld layer between pad and circuit board, described circuit board is provided with the connecting line for being electrically connected the first weld layer and the second weld layer.
The present invention is electrically connected circuit board and the second output by arranging pad, and pad and shell is electrically connected, and effectively reduces the contact resistance between circuit board and shell, improves the resistance to compression interference free performance of electret microphone encapsulating structure.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of electret microphone encapsulating structure in prior art embodiment 1.
Fig. 2 is the equivalent circuit diagram of electret microphone encapsulating structure in Fig. 1.
Fig. 3 is the schematic diagram of electret microphone encapsulating structure in the embodiment of the present invention 2.
Fig. 4 is the equivalent circuit diagram of electret microphone encapsulating structure in Fig. 3.
Embodiment
Technical scheme in the present invention is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Embodiment 1:
Ginseng Figure 1 shows that the schematic diagram of electret microphone encapsulating structure in prior art, in the present embodiment, encapsulating structure comprises electret microphone device 10, shell 20 and circuit board 30, electret microphone device 10 comprises some outputs, microphone device 10 is electrically connected by output and circuit board 30, shell 20 is located at the outside of microphone device 10, play the effect of shielding, prevent outer signals to the interference of microphone device.
Wherein, electret microphone device 10 comprises the first output 11 of being separated from each other setting and the second output 12, first output 11 is drain output, and the second output 12 is source ground output.Second output 12 adjacent housings is arranged, and electret microphone device 10 is electrically connected with circuit board 30 by the first output 11 and the second output 12.In addition, being provided with the isolation strip 13 of some insulation between the first output 11 and the second output 12, for realizing the insulation between the first output and the second output, preventing from outputing signal mutual interference.
Further, in the present embodiment, the second output 12 comprises the first efferent 121 and protrudes from the second efferent 122 on the first efferent 121, first efferent 121 and the second efferent 122 are formed in one setting, second efferent 122 is electrically connected, to realize the electric connection between the second output 12 and circuit board 30 with circuit board 30 by the first weld layer 141.
Further, be also electrically connected by the 3rd weld layer 143 between the first output 11 in the present embodiment and circuit board 30.
The mode of " edge sealing " is adopted to be connected between shell 20 with the second output 12, normal condition lower casing 20 can realize the electric connection of the first efferent 121 and circuit board 30 on the second output 12, but when being subject to extruding to a certain extent, as shown in Figure 1, shell 20 and circuit board 30 easily disengage.
In conjunction with Figure 2 shows that shell 20 and circuit board 30 disengage after equivalent circuit diagram, can find, contact resistance now between circuit board and shell is the resistance R ' of the second output, the resistance R ' of the second output is larger, the interference signal be attached on shell is larger, disturb more serious after JFET in electret microphone device amplifies, therefore electret microphone device is easily subject to extraneous interference.
Should be understood that, in the present invention should be mentioned that contact resistance between circuit board and shell, because circuit board and the second output are electrically connected, ignore the resistance of the first weld layer, this contact resistance also can be equivalent to the contact resistance between the upper surface of the second output in Fig. 1 and shell.
Embodiment 2:
Ginseng Figure 3 shows that the schematic diagram of electret microphone encapsulating structure in the present invention, in the present embodiment, encapsulating structure comprises electret microphone device 10, shell 20 and circuit board 30, electret microphone device 10 comprises some outputs, microphone device 10 is electrically connected by output and circuit board 30, shell 20 is located at the outside of microphone device 10, play the effect of shielding, prevent outer signals to the interference of microphone device.
Wherein, electret microphone device 10 comprises the first output 11 of being separated from each other setting and the second output 12, first output 11 is drain output, and the second output 12 is source ground output.Second output 12 adjacent housings is arranged, and electret microphone device 10 is electrically connected with circuit board 30 by the first output 11 and the second output 12.In addition, being provided with the isolation strip 13 of some insulation between the first output 11 and the second output 12, for realizing the insulation between the first output and the second output, preventing from outputing signal mutual interference.
Further, in the present embodiment, the second output 12 comprises the first efferent 121 and protrudes from the second efferent 122 on the first efferent 121, first efferent 121 and the second efferent 122 are formed in one setting, second efferent 122 is electrically connected, to realize the electric connection between the second output 12 and circuit board 30 with circuit board 30 by the first weld layer 141.
First efferent 121 is provided with pad 40, side and the shell 20 of pad 40 electrically conduct, the first efferent 121 in the lower surface of pad 40 and the second output 12 electrically conducts, and the upper surface of pad 40 is electrically conducted with shell 20 by the second weld layer 142.Preferably, in the present embodiment, the thickness of pad 40 is equal with the thickness of the second efferent 122, and pad 40 also can be set to the thickness being different from the second efferent 122 in other embodiments, is no longer described in detail at this.
Wherein, circuit board 30 is provided with the connecting line 31 for being electrically connected the first weld layer 141 and the second weld layer 142, so, can form the parallel-connection structure of the second output 12 and pad 40 between circuit board 30 and shell 20.
Further, be also electrically connected by the 3rd weld layer 143 between the first output 11 in the present embodiment and circuit board 30.
It is noted that, the first weld layer 141, second weld layer 142 in the present embodiment and the 3rd weld layer 143 can be soldering-tin layer etc., it is used on the one hand being fixedly connected with of realizing circuit plate 30 and mechanical structure between the first output 11, second output 12 or pad 40, is used for the electric connection of realizing circuit plate 30 and the first output 11, second output 12 or pad 40 on the other hand.Further, pad 40 and the second output 12, be also provided with weld layer between pad 40 and shell 20.Above-mentioned weld layer also can not be set in other embodiments or substitute with other parts that can realize being mechanically connected and being electrically connected simultaneously, as conducting resinl etc., being illustrated no longer one by one at this.
Second output 12 adopt pad 40 to be connected with circuit board 30, thus the electric connection of shell 20 and circuit board 30 can be realized, because shell welds on circuit boards, when being subject to upper and lower extruding force, as long as ensure that shell is not obviously out of shape, second output 12 and pad 40 parallel connection are all the time formed between circuit board 30 and shell 20, and shell and circuit board can not depart from, and there will not be the situation of open circuit in embodiment 1.
In conjunction with the equivalent circuit diagram that Figure 4 shows that the present embodiment, can find, the contact resistance in the present embodiment between circuit board 30 and shell 20 is
wherein, R ' is the resistance of the second output 12, R " be the resistance of pad 40, this contact resistance can not change because of situation about extruding up and down.
Should be understood that, in the present invention should be mentioned that contact resistance between circuit board and shell, because circuit board and the second output, pad are electrically connected, ignore the first weld layer, the second weld layer, weld layer between pad and circuit board, weld layer and weld layer resistance between pad and shell between pad and the second output, this contact resistance also can be equivalent to this three part of contact resistance, the contact resistance between pad and the upper surface of the second output and the contact resistance between pad and circuit board in Fig. 3 between pad and shell.
When electret microphone encapsulating structure extrudes up and down, the contact resistance in embodiment 1 and embodiment 2 is respectively R ' and R, R are the resistance R ' of the second output 12 and the resistance R of pad 40 " parallel resistance,
r < R ' can be drawn.Because contact resistance R is less, the interference signal be attached on shell is relatively little, and the interference after JFET in electret microphone device amplifies is also less.
As can be seen from the above technical solutions, the present invention is electrically connected circuit board and the second output by arranging pad, and pad and shell are electrically connected, effectively reduce the contact resistance between circuit board and shell, improve the resistance to compression interference free performance of electret microphone encapsulating structure.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (10)
1. the jamproof electret microphone encapsulating structure of resistance to compression, described encapsulating structure comprises electret microphone device, shell, and circuit board, described electret microphone device comprises the first output and the second output that are separated from each other setting, second output adjacent housings is arranged, described electret microphone device passes through described first output and the second output and circuit board and is electrically connected, it is characterized in that, described second output is also provided with the pad be electrically connected with shell, the both sides of described pad are electrically connected with circuit board and the second output respectively.
2. electret microphone encapsulating structure according to claim 1, is characterized in that, described first output is drain output, and described second output is source ground output.
3. electret microphone encapsulating structure according to claim 1, is characterized in that, is provided with the isolation strip of insulation between described first output and the second output.
4. electret microphone encapsulating structure according to claim 1, is characterized in that, described second output comprises the first efferent and protrudes from the second efferent on the first efferent, and described pad and described first efferent are electrically connected.
5. electret microphone encapsulating structure according to claim 4, is characterized in that, described second output and pad parallel connection are formed between circuit board and shell.
6. electret microphone encapsulating structure according to claim 5, is characterized in that, the contact resistance between described circuit board and shell is
wherein, R ' is the resistance of the second output, R " be the resistance of pad.
7. electret microphone encapsulating structure according to claim 4, is characterized in that, the height of described pad is equal with the height of the second efferent.
8. electret microphone encapsulating structure according to claim 1, is characterized in that, between described first output and circuit board, between the second output and circuit board, is provided with weld layer between pad and circuit board.
9. electret microphone encapsulating structure according to claim 8, is characterized in that, described pad and the second output, is provided with weld layer between pad and shell.
10. electret microphone encapsulating structure according to claim 8, it is characterized in that, between described second output and circuit board and be respectively equipped with the first weld layer and the second weld layer between pad and circuit board, described circuit board is provided with the connecting line for being electrically connected the first weld layer and the second weld layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510932875.XA CN105554660A (en) | 2015-12-14 | 2015-12-14 | Electret microphone package structure with compression and interference resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510932875.XA CN105554660A (en) | 2015-12-14 | 2015-12-14 | Electret microphone package structure with compression and interference resistance |
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| Publication Number | Publication Date |
|---|---|
| CN105554660A true CN105554660A (en) | 2016-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510932875.XA Pending CN105554660A (en) | 2015-12-14 | 2015-12-14 | Electret microphone package structure with compression and interference resistance |
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| CN (1) | CN105554660A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113055798A (en) * | 2019-12-26 | 2021-06-29 | 西人马联合测控（泉州）科技有限公司 | Electret condenser microphone and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020057812A1 (en) * | 2000-09-21 | 2002-05-16 | Tooru Himori | Electret condenser microphone and method of producing same |
| CN203406990U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Microphone terminal circuit board pad |
-
2015
- 2015-12-14 CN CN201510932875.XA patent/CN105554660A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020057812A1 (en) * | 2000-09-21 | 2002-05-16 | Tooru Himori | Electret condenser microphone and method of producing same |
| CN203406990U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Microphone terminal circuit board pad |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113055798A (en) * | 2019-12-26 | 2021-06-29 | 西人马联合测控（泉州）科技有限公司 | Electret condenser microphone and preparation method thereof |
| CN113055798B (en) * | 2019-12-26 | 2022-08-16 | 西人马联合测控（泉州）科技有限公司 | Electret condenser microphone and preparation method thereof |
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Application publication date: 20160504 |
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