CN105552507B - A kind of new structure chip wideband coupler - Google Patents
A kind of new structure chip wideband coupler Download PDFInfo
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- CN105552507B CN105552507B CN201510903691.0A CN201510903691A CN105552507B CN 105552507 B CN105552507 B CN 105552507B CN 201510903691 A CN201510903691 A CN 201510903691A CN 105552507 B CN105552507 B CN 105552507B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
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Abstract
The present invention discloses a kind of new structure chip wideband coupler, it uses lamination sheet type structure to constitute interior circuit layers, structure of the invention designs the particular electrical requirement for realizing lamination sheet type wide-band coupler using coupled microstrip line based on LTCC (low-temperature co-fired ceramics) technology.Structure of the invention effectively realizes the coupling function in broadband, has many advantages, such as low-loss, high reliability, low cost and is suitable for producing on a large scale, has in addition been also adapted to new electronic component miniaturization trend.
Description
Technical field
The present invention discloses a kind of coupler, especially a kind of new structure chip wideband coupler, can be used for mobile electricity
In words, tablet computer and other various communication apparatus.
Background technology
Low-temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC) technology in electronic component and
Encapsulation field has unique advantage, is widely used in the fields such as communication, automobile and medical instrument.Based on LTCC technology
The frequency microwave element and module of design and producing include filter, duplexer, antenna, coupler, balun, receiving front-end mould
Group, duplexer module etc..Because it has many advantages, such as high quality factor, high stability, high integration, with modern electronic equipment
It is continued to develop to miniaturization, high frequency direction, they largely apply to field of mobile phones.
Coupler is relatively common microwave device in mobile phone front end, it can be to sample of signal, to be surveyed
Amount and monitoring, signal distribution and synthesis.With the application of 4G technologies, mobile phone front end frequency range is more and more, needs to monitor
Signal frequency range is also continuously increased, while being reply mobile phone front end small form factor requirements, and wide band coupler is just at certainty
Selection.
Invention content
For the disadvantage that coupler volume in the prior art mentioned above is larger, the present invention provides a kind of new structure
Chip wideband coupler, the wideband coupler use the special construction of coupling line design, by transmission main line and transmission by-pass
Coupling composition, structure of the invention is integrated into using LTCC forming techniques in identity element, it is then low temperature co-fired using 900 DEG C and
At.
The present invention solve its technical problem the technical solution adopted is that：A kind of new structure chip wideband coupler, coupling
Clutch includes matrix, the terminal stud of surrounding is arranged on the outside of matrix and the circuit layer in intrinsic silicon is arranged, intrinsic silicon
Circuit layer is in laminated construction：
First layer is that one piece of first metal flat conductor, the first metal flat conductor two are printed on ceramic dielectric substrate
An inner terminal, respectively the first inner terminal and the second inner terminal, the first inner terminal and ground terminal are stretched out in side respectively
Mouth electrical connection, the second inner terminal are also electrically connected with grounding ports；
The second layer is to be printed on ceramic dielectric substrate there are one the first wire coil and a first metallic conductor substrate,
First wire coil is in " C " font, and the third inner terminal of first wire coil one end is electrically connected with input port to be connected, and first
The wire coil other end is the 4th inner terminal, and the 4th inner terminal is electrically connected with first column, the first metallic conductor substrate and
First wire coil mutually insulated, the first metallic conductor substrate are electrically connected with output port；
Third layer is that the second wire coil and one piece of second metal flat conductor are printed on ceramic dielectric substrate, second
Wire coil is L-shaped, and second wire coil one end is the 5th inner terminal, and the 5th inner terminal is electrically connected with output port,
The second wire coil other end is the 6th inner terminal, and the 6th inner terminal is electrically connected with first column, and the second metal flat is led
Body and the second wire coil mutually insulated, the second metal flat conductor are electrically connected with input port；
4th layer is there are two mutually insulated wire coils, respectively third wire coil for printing on ceramic dielectric substrate
With the 4th wire coil, third wire coil and the 4th wire coil are " U "-shaped, and the both ends of third wire coil are respectively
The centre position of seven inner terminals and the 8th inner terminal, third wire coil is equipped with the 9th inner terminal, the 7th inner terminal
It is electrically connected with isolated port, the 8th inner terminal is electrically connected with second point column, and the 9th inner terminal is electrically connected with thirdly column；The
The both ends of four wire coils are respectively the tenth inner terminal and the 11st inner terminal, and the tenth inner terminal is electrically connected with coupling port
It connects, the 11st inner terminal is electrically connected with the 4th column；
Layer 5 is that there are two mutually insulated wire coils, respectively fifth metal line for printing on ceramic dielectric substrate
Circle and the 6th wire coil, fifth metal coil and the 6th wire coil are " U "-shaped, and the both ends of fifth metal coil are respectively
12nd inner terminal and the 13rd inner terminal, the 12nd inner terminal are electrically connected with the 7th column, the 13rd inner terminal
It is electrically connected with second point column, the 14th inner terminal, the 14th inner terminal and thirdly column is additionally provided on fifth metal coil
Electrical connection；The both ends of 6th wire coil are respectively the 15th inner terminal and the 16th inner terminal, the 15th inner terminal
It is electrically connected with the 4th column, the 16th inner terminal is electrically connected with the 8th column；
Layer 6 is that printing is there are one third metal flat conductor on ceramic dielectric substrate, on third metal flat conductor
It is respectively equipped with outwardly directed inner terminal, respectively the 17th inner terminal and the 18th inner terminal, the 17th inside end
Point is electrically connected with grounding ports, and the 18th inner terminal is electrically connected with grounding ports；
Layer 7 is that there are two the metal flat conductor of mutually insulated, respectively the 4th gold medals for printing on ceramic dielectric substrate
Belong to planar conductor and fifth metal planar conductor, is stretched out on the 4th metal flat conductor and be provided with the 19th inner terminal, the tenth
Nine inner terminals are electrically connected with the 7th column, are stretched out on fifth metal planar conductor and are provided with the 20th internal heads, and the 20th
Internal heads are electrically connected with the 8th column；
8th layer of structure is identical as layer 6 structure；
9th layer is there are two the wire coil of mutually insulated, respectively the 7th metal wires for printing on ceramic dielectric substrate
Circle and the 8th wire coil, the 7th wire coil and the 8th wire coil are " U "-shaped, and the 7th wire coil both ends are respectively equipped with
21st internal heads and the 22nd internal heads, the 21st internal heads are electrically connected with the 5th column, and the 22nd
Internal heads are electrically connected with the 7th column；8th wire coil both ends are respectively equipped in the 23rd internal heads and the 24th
Portion end, the 23rd internal heads are electrically connected with the 8th column, and the 24th internal heads are electrically connected with the 6th column；
Tenth layer is that there are one the 9th wire coils for printing on ceramic dielectric substrate, and the 9th wire coil is " U "-shaped, the
Nine wire coil both ends are respectively the 25th internal heads and the 26th internal heads, the 25th internal heads and the
5 column electrical connections, the 26th internal heads are electrically connected with the 6th column；
Eleventh floor structure is identical as first layer structure.
The technical solution that the present invention solves the use of its technical problem further comprises：
There are six the terminal stud is set, six terminal studs are symmetrical in matrix both sides.
The matrix uses ceramic matrix.
First column, second point column, thirdly column, the 4th column, the 5th column and the 6th column are respectively side
Point column.
8th column and the 9th column is respectively dot column.
The beneficial effects of the invention are as follows：Structure of the invention is based on LTCC (low-temperature co-fired ceramics) technology, using coupling
Microstrip design realizes the particular electrical requirement of lamination sheet type wide-band coupler.Structure of the invention effectively realizes in broadband
Coupling function, have many advantages, such as low-loss, high reliability, low cost and be suitable for producing on a large scale, be in addition also adapted to
New electronic component miniaturization trend.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Description of the drawings
Fig. 1 structure of the invention surface structure stereoscopic schematic diagrams.
Fig. 2 is structure of the invention internal structure schematic diagram.
Fig. 3 is structure of the invention first layer circuit layer planar structure schematic diagram.
Fig. 4 is structure of the invention second layer circuit planes structural schematic diagram.
Fig. 5 is that point column connects planar structure schematic diagram between structure of the invention second and third layer.
Fig. 6 is structure of the invention third layer circuit planes structural schematic diagram.
Fig. 7 is the 4th layer of circuit planes structural schematic diagram of structure of the invention.
Fig. 8 puts column between fourth, fifth layer of structure of the invention and connects planar structure schematic diagram.
Fig. 9 is structure of the invention layer 5 circuit planes structural schematic diagram.
Figure 10 is between the five, the six layers of structure of the invention, between the six, the seven layers, between the seven, the eight layers and the eight, the nine
Point column connects planar structure schematic diagram between layer.
Figure 11 is structure of the invention layer 6, the 8th layer of circuit planes structural schematic diagram.
Figure 12 is structure of the invention layer 7 circuit planes structural schematic diagram.
Figure 13 is the 9th layer of circuit planes structural schematic diagram of structure of the invention.
Figure 14 puts column between the nine, the ten layers of circuit of structure of the invention and connects planar structure schematic diagram.
Figure 15 is the tenth layer of circuit planes structural schematic diagram of structure of the invention.
Specific implementation mode
The present embodiment is the preferred embodiment for the present invention, other its all principles and basic structure are identical or close as the present embodiment
As, within the scope of the present invention.
Attached drawing 1 and attached drawing 2 are please referred to, the present invention is mainly a kind of new structure chip wideband coupler comprising base
Body, the terminal stud that surrounding is set on the outside of matrix and the circuit layer in intrinsic silicon is set, the circuit of the intrinsic silicon
Layer is in laminated construction.In the present embodiment, there are six terminal stud is set, six terminal studs are symmetrical in matrix both sides, this reality
It applies in example, six terminal studs are respectively：P1 is input port, and P2 and P5 are grounding ports, and P3 is coupling port, P4 be every
From port, that is, load end, P6 output ports.In the present embodiment, matrix uses ceramic matrix, interior circuit layers to be divided into 11 layers.
Please refer to attached drawing 3, in the present embodiment, first layer is that one piece of first metal flat is printed on ceramic dielectric substrate
An inner terminal is stretched out in conductor 1,1 both sides of the first metal flat conductor respectively, in respectively the first inner terminal 1a and second
Portion endpoint 1b, the first inner terminal 1a are electrically connected with grounding ports P2, and the second inner terminal 1b is electrically connected with grounding ports P5；
Please refer to attached drawing 4, in the present embodiment, the second layer is that there are one the first metal wires for printing on ceramic dielectric substrate
A 2 and first metallic conductor substrate 2c is enclosed, in the present embodiment, the first wire coil 2 is in " C " font, or is known as not sealing
" mouth " font, the third inner terminal 2a of 2 one end of the first wire coil is arranged at edge placement, is electrically connected with input port P1
Connect connected, the setting of 2 other end of the first wire coil is the 4th inner terminal 2b in interior location, the 4th inner terminal 2b and the
One side's point column 19 is electrically connected, 2 mutually insulated of the first metallic conductor substrate 2c and the first wire coil, the first metallic conductor substrate 2c
It is electrically connected with output port P6；
Please refer to attached drawing 6, in the present embodiment, third layer is that 3 He of the second wire coil is printed on ceramic dielectric substrate
One piece of second metal flat conductor 3c, in the present embodiment, the second wire coil 3 is L-shaped, the setting of 3 one end of the second wire coil
It is the 5th inner terminal 3a at edge placement, the 5th inner terminal 3a is electrically connected with output port P6, the second wire coil 3
Other end setting is the 6th inner terminal 3b in interior location, and the 6th inner terminal 3b is electrically connected for first party point column 19, passes through
First party point column 19 can connect the second layer and third layer, and the second metal flat conductor 3c and the second wire coil 3 are mutually
Insulation, the second metal flat conductor 3c are electrically connected with input port P1；
Please refer to attached drawing 7, in the present embodiment, the 4th layer is there are two mutually insulated metals for printing on ceramic dielectric substrate
Coil, respectively third wire coil 17-1 and the 4th wire coil 17-2, in the present embodiment, third wire coil 17-1 and
Four wire coil 17-2 are in long " u "-shaped (i.e. two parallel edge lengths are longer than intermediate connection edge lengths), third wire coil 17-1
Both ends be respectively the 7th inner terminal 17a and the 8th inner terminal 17d, the centre position of third wire coil 17-1 is equipped with the
Nine inner terminal 17e, the 7th inner terminal 17a are electrically connected with isolated port P4, the 8th inner terminal 17d and second party point column 16
Electrical connection, the 9th inner terminal 17e are electrically connected with third party's point column 18；The both ends of 4th wire coil 17-2 are respectively in the tenth
Portion endpoint 17b and the 11st inner terminal 17c, the tenth inner terminal 17b are electrically connected with coupling port P3, the 11st inner terminal
17c is electrically connected with cardinal points column 14；
Please refer to attached drawing 9, in the present embodiment, layer 5 is that there are two mutually insulated metals for printing on ceramic dielectric substrate
Coil, respectively fifth metal coil 15-1 and the 6th wire coil 15-2, in the present embodiment, fifth metal coil 15-1 and
Six wire coil 15-2 are in short " u "-shaped (i.e. two parallel edges are shorter in length than intermediate connection edge lengths), fifth metal coil 15-1
Both ends be respectively the 12nd inner terminal 15a and the 13rd inner terminal 15d, the 12nd inner terminal 15a and the first dot
Column 5 is electrically connected, and the 13rd inner terminal 15d is electrically connected with second party point column 16, and the tenth is additionally provided on fifth metal coil 15-1
Four inner terminal 15e, the 14th inner terminal 15e are electrically connected with third party's point column 18；The both ends of 6th wire coil 15-2 point
Not Wei the 15th inner terminal 15b and the 16th inner terminal 15c, the 15th inner terminal 15b is electrically connected with cardinal points column 14
It connects, the 16th inner terminal 15c is electrically connected with the second dot column 4；
Please refer to attached drawing 11, in the present embodiment, layer 6 is that there are one third metals is flat for printing on ceramic dielectric substrate
Face conductor 13 is respectively equipped with outwardly directed inner terminal, respectively the 17th inner terminal on third metal flat conductor 13
13a and the 18th inner terminal 13b, the 17th inner terminal 13a are electrically connected with grounding ports P5, the 18th inner terminal 13b
It is electrically connected with grounding ports P2；
Please refer to attached drawing 12, in the present embodiment, layer 7 is that there are two mutually insulateds for printing on ceramic dielectric substrate
Metal flat conductor, respectively the 4th metal flat conductor 6-1 and fifth metal planar conductor 6-2, the 4th metal flat conductor
It is stretched out on 6-1 and is provided with the 19th inner terminal 6a, the 19th inner terminal 6a is electrically connected with the first dot column 5, fifth metal
It is stretched out on planar conductor 6-2 and is provided with the 20th internal heads 6b, the 20th internal heads 6b is electrically connected with the second dot column 4；
Please refer to attached drawing 11, in the present embodiment, the 8th layer of structure and layer 6 structure are just the same, and details are not described herein again；
Please refer to attached drawing 13, in the present embodiment, the 9th layer is there are two mutually insulateds for printing on ceramic dielectric substrate
Wire coil, respectively the 7th wire coil 7-1 and the 8th wire coil 7-2, in the present embodiment, the 7th wire coil 7-1 and
8th wire coil 7-2 is " U "-shaped, and the 7th both ends wire coil 7-1 are respectively equipped with the 21st internal heads 7a and second
12 internal heads 7b, the 21st internal heads 7a are electrically connected with the 5th side's point column 11, the 22nd internal heads 7b and
One dot column 5 is electrically connected；8th both ends wire coil 7-2 are respectively equipped with the 23rd internal heads 7c and the 24th inside end
Head 7d, the 23rd internal heads 7c is electrically connected with the second dot column 4, and the 24th internal heads 7d and the 6th side's point column 8 are electric
Connection；
Please refer to attached drawing 15, in the present embodiment, the tenth layer is there are one the 9th metal wires for printing on ceramic dielectric substrate
Circle 10, in the present embodiment, the 9th wire coil 10 is " U "-shaped, and 10 both ends of the 9th wire coil are distinguished inside protruding formation
End, respectively the 25th internal heads 10a and the 26th internal heads 10b, the 25th internal heads 10a and the 5th
Side's point column 11 is electrically connected, and the 26th internal heads 10b is electrically connected with the 6th side's point column 8；
Please refer to attached drawing 3, in the present embodiment, eleventh floor structure and first layer structure are just the same, and details are not described herein again.
Structure of the invention is designed using coupled microstrip line based on LTCC (low-temperature co-fired ceramics) technology and is realized laminated sheet
The particular electrical requirement of formula wide-band coupler.Structure of the invention effectively realizes the coupling function in broadband, has low damage
Consumption, high reliability, low cost and the advantages that be suitable for producing on a large scale, have in addition been also adapted to new electronic component miniaturization hair
Exhibition trend.
Claims (4)
1. a kind of new structure chip wideband coupler, it is characterized in that：The coupler includes matrix, is arranged outside matrix
The terminal stud of side surrounding and the circuit layer in intrinsic silicon is set, the circuit layer of intrinsic silicon is in laminated construction：
First layer is that one piece of first metal flat conductor is printed on ceramic dielectric substrate, the first metal flat conductor both sides point
Not Shen Chu an inner terminal, respectively the first inner terminal and the second inner terminal, the first inner terminal and grounding ports electricity
Connection, the second inner terminal are also electrically connected with grounding ports；
The second layer is that printing is there are one the first wire coil and a first metallic conductor substrate on ceramic dielectric substrate, first
Wire coil is in " C " font, and the third inner terminal of first wire coil one end is electrically connected with input port to be connected, the first metal
The coil other end is the 4th inner terminal, and the 4th inner terminal is electrically connected with first column, the first metallic conductor substrate and first
Wire coil mutually insulated, the first metallic conductor substrate are electrically connected with output port；
Third layer is that the second wire coil and one piece of second metal flat conductor, the second metal are printed on ceramic dielectric substrate
Coil is L-shaped, and second wire coil one end is the 5th inner terminal, and the 5th inner terminal is electrically connected with output port, and second
The wire coil other end is the 6th inner terminal, and the 6th inner terminal is electrically connected with first column, the second metal flat conductor and
Second wire coil mutually insulated, the second metal flat conductor are electrically connected with input port；
4th layer for printing is there are two mutually insulated wire coil on ceramic dielectric substrate, respectively third wire coil and the
Four wire coils, third wire coil and the 4th wire coil are " U "-shaped, and the both ends of third wire coil are respectively in the 7th
Portion's endpoint and the 8th inner terminal, the centre position of third wire coil are equipped with the 9th inner terminal, the 7th inner terminal with every
It is electrically connected from port, the 8th inner terminal is electrically connected with second point column, and the 9th inner terminal is electrically connected with thirdly column；4th gold medal
The both ends for belonging to coil are respectively the tenth inner terminal and the 11st inner terminal, and the tenth inner terminal is electrically connected with coupling port,
11st inner terminal is electrically connected with the 4th column；
Layer 5 is that printing is there are two mutually insulated wire coil on ceramic dielectric substrate, respectively fifth metal coil and the
Six wire coils, fifth metal coil and the 6th wire coil are " U "-shaped, and the both ends of fifth metal coil are respectively the 12nd
Inner terminal and the 13rd inner terminal, the 12nd inner terminal are electrically connected with the 7th column, the 13rd inner terminal and second
Point column is electrically connected, and is additionally provided with the 14th inner terminal on fifth metal coil, the 14th inner terminal is electrically connected with thirdly column；
The both ends of 6th wire coil are respectively the 15th inner terminal and the 16th inner terminal, the 15th inner terminal and the 4th point
Column is electrically connected, and the 16th inner terminal is electrically connected with the 8th column；
Layer 6 is that printing is there are one third metal flat conductor on ceramic dielectric substrate, on third metal flat conductor respectively
Equipped with outwardly directed inner terminal, respectively the 17th inner terminal and the 18th inner terminal, the 17th inner terminal with
Grounding ports are electrically connected, and the 18th inner terminal is electrically connected with grounding ports；
Layer 7 is that there are two the metal flat conductor of mutually insulated, respectively the 4th metal is flat for printing on ceramic dielectric substrate
Face conductor and fifth metal planar conductor stretch out on the 4th metal flat conductor and are provided with the 19th inner terminal, in the 19th
Portion's endpoint is electrically connected with the 7th column, is stretched out on fifth metal planar conductor and is provided with the 20th internal heads, inside the 20th
End is electrically connected with the 8th column；
8th layer of structure is identical as layer 6 structure；
9th layer on ceramic dielectric substrate printing there are two mutually insulated wire coil, respectively the 7th wire coil and
8th wire coil, the 7th wire coil and the 8th wire coil are " U "-shaped, and the 7th wire coil both ends are respectively equipped with second
11 internal heads and the 22nd internal heads, the 21st internal heads are electrically connected with the 5th column, inside the 22nd
End is electrically connected with the 7th column；8th wire coil both ends are respectively equipped with the 23rd internal heads and the 24th inside end
Head, the 23rd internal heads are electrically connected with the 8th column, and the 24th internal heads are electrically connected with the 6th column；
Tenth layer is that there are one the 9th wire coils for printing on ceramic dielectric substrate, and the 9th wire coil is " U "-shaped, the 9th gold medal
It is respectively the 25th internal heads and the 26th internal heads to belong to coil both ends, the 25th internal heads with the 5th point
Column is electrically connected, and the 26th internal heads are electrically connected with the 6th column；
Eleventh floor structure is identical as first layer structure；First column, second point column, thirdly column, the 4th column,
5 columns and the 6th column are respectively side's point column.
2. new structure chip wideband coupler according to claim 1, it is characterized in that：The terminal stud is equipped with
Six, six terminal studs are symmetrical in matrix both sides.
3. new structure chip wideband coupler according to claim 1, it is characterized in that：The matrix is using ceramics
Matrix.
4. new structure chip wideband coupler according to claim 1, it is characterized in that：8th column and
9 columns are respectively dot column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510903691.0A CN105552507B (en) | 2015-12-08 | 2015-12-08 | A kind of new structure chip wideband coupler |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510903691.0A CN105552507B (en) | 2015-12-08 | 2015-12-08 | A kind of new structure chip wideband coupler |
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| CN105552507A CN105552507A (en) | 2016-05-04 |
| CN105552507B true CN105552507B (en) | 2018-09-14 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109687081A (en) * | 2018-12-13 | 2019-04-26 | 南京理工大学 | Novel 3dB180 degree plane electric bridge based on LTCC |
| CN110165352B (en) * | 2019-05-20 | 2021-10-15 | 中国电子科技集团公司第十三研究所 | Directional coupler and manufacturing method thereof |
| CN111010106B (en) * | 2019-12-20 | 2023-02-28 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized lamination formula low pass filter |
| CN111010107B (en) * | 2019-12-23 | 2023-07-21 | 深圳市麦捷微电子科技股份有限公司 | Miniaturized lamination sheet type coupling band-pass filter |
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| CN2845193Y (en) * | 2005-10-31 | 2006-12-06 | 浙江正原电气股份有限公司 | Multiple layer ceramic filter with three openings |
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| CN104241737A (en) * | 2014-09-03 | 2014-12-24 | 华南理工大学 | LTCC filtering Balun based on resonator coupling |
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| US20060238271A1 (en) * | 2005-04-25 | 2006-10-26 | Alexander Dornhelm | Low temperature co-fired ceramic 90 degree power splitter |
| WO2012020317A2 (en) * | 2010-08-09 | 2012-02-16 | King Abdullah University Of Science And Technology | Gain enhanced ltcc system-on-package for umrr applications |
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|---|---|---|---|---|
| CN2845193Y (en) * | 2005-10-31 | 2006-12-06 | 浙江正原电气股份有限公司 | Multiple layer ceramic filter with three openings |
| TWM331766U (en) * | 2007-10-05 | 2008-05-01 | Advanced Ceramic X Corp | Miniaturized power divider (combiner) |
| CN201430202Y (en) * | 2009-01-20 | 2010-03-24 | 深圳市麦捷微电子科技股份有限公司 | Laminated sheet type Balun band-pass filter |
| CN104241737A (en) * | 2014-09-03 | 2014-12-24 | 华南理工大学 | LTCC filtering Balun based on resonator coupling |
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