CN105551984B - The production method of waterproof and dampproof temperature sensor and its temperature sensor obtained - Google Patents
The production method of waterproof and dampproof temperature sensor and its temperature sensor obtained Download PDFInfo
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- CN105551984B CN105551984B CN201511033100.5A CN201511033100A CN105551984B CN 105551984 B CN105551984 B CN 105551984B CN 201511033100 A CN201511033100 A CN 201511033100A CN 105551984 B CN105551984 B CN 105551984B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 46
- 238000004382 potting Methods 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 18
- 239000003085 diluting agent Substances 0.000 claims description 15
- 210000002105 tongue Anatomy 0.000 claims description 6
- WZZBNLYBHUDSHF-DHLKQENFSA-N 1-[(3s,4s)-4-[8-(2-chloro-4-pyrimidin-2-yloxyphenyl)-7-fluoro-2-methylimidazo[4,5-c]quinolin-1-yl]-3-fluoropiperidin-1-yl]-2-hydroxyethanone Chemical compound CC1=NC2=CN=C3C=C(F)C(C=4C(=CC(OC=5N=CC=CN=5)=CC=4)Cl)=CC3=C2N1[C@H]1CCN(C(=O)CO)C[C@@H]1F WZZBNLYBHUDSHF-DHLKQENFSA-N 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 2
- 230000032683 aging Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 86
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 86
- 238000001723 curing Methods 0.000 description 30
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 23
- 239000000306 component Substances 0.000 description 11
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 9
- 239000002131 composite material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000000386 microscopy Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- PKMUHQIDVVOXHQ-HXUWFJFHSA-N C[C@H](C1=CC(C2=CC=C(CNC3CCCC3)S2)=CC=C1)NC(C1=C(C)C=CC(NC2CNC2)=C1)=O Chemical compound C[C@H](C1=CC(C2=CC=C(CNC3CCCC3)S2)=CC=C1)NC(C1=C(C)C=CC(NC2CNC2)=C1)=O PKMUHQIDVVOXHQ-HXUWFJFHSA-N 0.000 description 4
- 229940126179 compound 72 Drugs 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000035772 mutation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Abstract
A kind of production method of waterproof and dampproof temperature sensor, comprises the following steps：(1) line is cut out：The consistent TPU electric wires of length are cut by setting line length size；(2) chip welds：In TPU electric wires one end, welding one carries the chip of temp sensing function；(3) it is epoxy resin enclosed：Deployed epoxy resin enclosed material is encapsulated into the chip and exposed conducting wire, and is heating and curing；(4) TPU is encapsulated：Liquid TPU encapsulating materials, and the one layer of liquid TPU encapsulating material of epoxy resin layer outer encapsulating formed in step 3) are prepared, and is formed by curing encapsulated layer in TPU；Then one layer of liquid TPU encapsulating material of encapsulated layer outer encapsulating in TPU again, and it is formed by curing TPU outer package layers.The production method of waterproof and dampproof temperature sensor of the present invention, it is encapsulated by TPU, make temperature sensor obtained that there is weatherable, waterproof and dampproof, wear-resisting, oil resistant, ageing-resistant performance, and it has higher shear strength and impact flexibility, electrical property is reliable and stable.
Description
Technical field
Production method more particularly to a kind of waterproof and dampproof temperature sensor the present invention relates to a kind of electronic component
Production method and its temperature sensor obtained.
Background technology
Using temperature element as core component, the temperature sensor that different packing forms are formed is taken to be widely used in respectively
Kind temperature sensing, temperature-control circuit, play the core into required electronic signal by the variables transformations of temperature in circuit
Effect.
Referring to Fig. 1, its structure diagram for the temperature sensor of the prior art.Existing temperature sensor is by pressing
It is made according to following steps：
(1) chip 1 with temp sensing function is welded on electric wire 4；
(2) chip 1 being welded on electric wire 4 is first encapsulated once and is heating and curing with deployed epoxy resin, ring
Oxygen resin-encapsulated layer 2, then encapsulates once and is heating and curing again, forms epoxy resin outer package layer 3.
According to the temperature sensor that above-mentioned steps encapsulation forms, there is following defect：
1) adhesive force of epoxy resin and electric wire 4 is bad, when product is subject to thermal shock for a long time, epoxy resin and electricity
Gap can be generated between sub-line 4 to cause to soak, and makes product electrical property unstable or even damages；
2) tear resistance is bad, bends intensity difference；
3) the insulating layer compactness of electric wire 4 is bad；
4) compactness of epoxy resin is also poor.
The content of the invention
In order to solve the above technical problem, the present invention provides a kind of production method is simple, production efficiency is high, it is at low cost,
It is easily achieved the production method of the waterproof and dampproof temperature sensor of mass production.
The technical solution adopted in the present invention is：
A kind of production method of waterproof and dampproof temperature sensor, comprises the following steps：
(1) line is cut out：The consistent TPU electric wires of length are cut by setting line length size；
(2) chip welds：In TPU (Thermoplastic polyurethane:Thermoplastic polyurethane) electric wire one end
Welding one carries the chip of temp sensing function；
(3) it is epoxy resin enclosed：Deployed epoxy resin enclosed material is encapsulated into the chip and exposed conducting wire, and is added
Heat cure；The epoxy resin enclosed material is identical with existing epoxy resin enclosed material；
(4) TPU is encapsulated：Prepare liquid TPU encapsulating materials, and the one layer of liquid of epoxy resin layer outer encapsulating formed in step 3)
TPU encapsulating materials, and it is formed by curing encapsulated layer in TPU；Then one layer of liquid TPU encapsulating material of encapsulated layer outer encapsulating in TPU again, and
It is formed by curing TPU outer package layers.
Compared with the prior art, the production method of waterproof and dampproof temperature sensor of the present invention, is sealed by TPU
Dress makes temperature sensor obtained have weatherable, waterproof and dampproof, wear-resisting, oil resistant, an ageing-resistant performance, and its have compared with
High shear strength and impact flexibility, electrical property are reliable and stable.
Further, the liquid TPU encapsulating materials in the step (4) are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF (tetrahydrofuran), to be made, the TPU particles and THF's
Mass ratio is 1:2~1:1.Preferably, the diluent selects environmentally friendly organic composite solvent.Curing agent is added in TPU host agents,
The TPU encapsulated layers that liquid TOU encapsulating materials are formed can be made with solvent resistant, high adhesion force, water-fastness, corrosion-resistant, reaction is fast, hardness
High performance；Add diluent in TPU host agents, the mobility of liquid encapsulating material can be increased, convenient for control coating thickness and
Uniformly, and the use of environmentally friendly organic composite solvent also makes product more environmentally friendly.
Further, the one-component TPU particles be dissolved in before THF at 80~110 DEG C dry about 3 it is small when.
Further, in the step (4) by cure at room temperature 6~8 it is small when formed in TPU outside encapsulated layer and TPU
Encapsulated layer.
Further, as another optional curing mode, the baking-curing at 80~90 DEG C is passed through in the step (4)
2~3 form encapsulated layer and TPU outer package layers in TPU when small.
Further, the production method of the waterproof and dampproof temperature sensor is further comprising the steps of：
(5) the bottom filling heat-conductive resin in encapsulating shell；Temperature sensor and encapsulating shell is enable efficiently to conduct heat；
(6) temperature sensor made from step (4) is put into encapsulating shell；
(7) compound potting compound is prepared；
(8) compound potting compound is injected in encapsulating shell；
(9) baking-curing.
By the embedding of compound potting compound, temperature sensor can be made to be packaged in securely in encapsulating shell, it is not easily to fall off.
Further, the compound potting compound in the step (7) is mixed by each component of following mass percent：
Liquid TPU potting compounds 30%~70%
Liquid-state epoxy resin potting compound 30%~70%
The liquid TPU potting compounds are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF, to be made, and the mass ratio of the TPU particles and THF are 1:2
~1:1.
The liquid-state epoxy resin potting compound be conventional use of potting compound, usually by 100 parts of epoxy resin host agent,
It is made after 20~22 parts of intermediate temperature curing agent and the mixing of 6~8 parts of diluent by sufficiently stirring to defoam with vacuum.It is described multiple
Potting compound is closed by being defoamed after the liquid TPU potting compounds and the mixing of liquid-state epoxy resin potting compound by sufficiently stirring with vacuum
It is made.The compound potting compound has certain hardness, and can be securely joined with the insulating layer of TPU electric wires, effectively prevents
Sealing sub-dip enters and causes the mutation of the performance of temperature sensor.
Further, by the way that temperature sensor is made when baking-curing 2~3 is small at 80~90 DEG C in the step (9)
Finished product.
Further, the encapsulating shell forms multiple tongues close to opening outwardly convex.The setting makes compound potting compound
It can be firmly embedded into after curing in tongue, so as to ensure temperature sensor in encapsulating shell by carrying out firm packaging, not easily to fall off.
The present invention also provides a kind of waterproof and dampproof temperature sensor, according to above-mentioned waterproof and dampproof temperature sensor
Production method be made.
Compared with the prior art, there is waterproof and dampproof temperature sensor of the present invention weatherable, waterproof to prevent
Damp, wear-resisting, oil resistant, ageing-resistant performance, and it has higher shear strength and impact flexibility, electrical property is reliable and stable.
In order to better understand and implement, the invention will now be described in detail with reference to the accompanying drawings.
Description of the drawings
Fig. 1 is the structure diagram of the temperature sensor of the prior art；
Fig. 2 is the structure diagram of the temperature sensor described in the embodiment of the present invention 1；
Fig. 3 is the structure diagram of the temperature sensor described in the embodiment of the present invention 2.
Specific embodiment
Embodiment 1
Referring to Fig. 2, its structure diagram for the temperature sensor described in the present embodiment.The present embodiment it is waterproof and dampproof
Temperature sensor be made according to following steps：
(1) line is cut out：The consistent TPU electric wires 40 of length are cut by setting line length size；
(2) chip welds：In 40 one end of TPU electric wires, welding one carries the chip 10 of temp sensing function；
(3) it is epoxy resin enclosed：Deployed epoxy resin enclosed material is encapsulated into the chip and exposed conducting wire, and is added
Heat cure forms epoxy encapsulation layer 20；The epoxy resin enclosed material is identical with existing epoxy resin enclosed material；
(4) TPU is encapsulated：Prepare liquid TPU encapsulating materials, and the one layer of liquid of epoxy resin layer outer encapsulating formed in step 3)
TPU encapsulating materials, and it is formed by curing encapsulated layer 30 in TPU；Then one layer of liquid TPU encapsulating material of encapsulated layer outer encapsulating in TPU again,
And it is formed by curing TPU outer package layers 50.Encapsulated layer 30 and TPU outer package layers 50 by curing 6~8 at room temperature in the TPU
Hour or when baking-curing 2~3 is small at 80~90 DEG C formed.
The liquid TPU encapsulating materials are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF (tetrahydrofuran), to be made, the TPU particles and THF's
Mass ratio is 1:2~1:1.The one-component TPU particles be dissolved in before THF at 80~110 DEG C dry about 3 it is small when.Preferably,
The diluent selects environmentally friendly organic composite solvent.Curing agent is added in TPU host agents, can make what liquid TOU encapsulating materials were formed
TPU encapsulated layers have solvent resistant, high adhesion force, water-fastness, corrosion-resistant, reaction performance fast, with high hardness；Add in TPU host agents
Add diluent, the mobility of liquid encapsulating material can be increased, convenient for controlling the thickness of coating and uniformly, and environmentally friendly organic composite solvent
Use also make product more environmentally friendly.
Compared with the prior art, the production method of waterproof and dampproof temperature sensor of the present invention, is encapsulated by TPU
Encapsulated layer and TPU outer package layers in TPU are sequentially formed outside epoxy encapsulation layer 20, there is temperature sensor obtained anti-
Cold heat-resisting, waterproof and dampproof, wear-resisting, oil resistant, ageing-resistant performance, and it has higher shear strength and impact flexibility, electrically
It can be reliable and stable.
By temperature sensor made from above-mentioned steps, include the TPU electric wires that chip 10, one end and chip 10 weld
40th, in the epoxy encapsulation layer 20 that is encapsulated in outside chip 10 and exposed electric wire, the TPU being encapsulated in outside epoxy encapsulation layer 20
Encapsulated layer 30 and the TPU outer package layers 50 being encapsulated in TPU outside encapsulated layer 30.
A series of tests are carried out to temperature sensor made from the present embodiment, it is as a result as follows：
1) electric wire 40 is surveyed with crossing microscopy after the bending experiment of 50 engaging portion of TPU outer package layers, no peeling；
2) cross microscopy after thermal shock experiment to survey also without peeling, electrical property detection shows its performance change rate also just
In normal scope；
3) drop resistant, which is beaten, tested microscopy survey, and electrical property detection shows its performance change rate also in normal scope；
4) detected after immersion and the 0.5Mpa that pressurizes, free from dampness and immersion phenomenon inside temperature sensor.
Embodiment 2
Referring to Fig. 3, its structure diagram for the waterproof and dampproof temperature sensor described in the present embodiment.The present embodiment
Waterproof and dampproof temperature sensor be made according to following steps：
(1) line is cut out：The consistent TPU electric wires 40 of length are cut by setting line length size；
(2) chip welds：In 40 one end of TPU electric wires, welding one carries the chip 10 of temp sensing function；
(3) it is epoxy resin enclosed：Deployed epoxy resin enclosed material is encapsulated into the chip and exposed conducting wire, and is added
Heat cure forms epoxy encapsulation layer 20；The epoxy resin enclosed material is identical with existing epoxy resin enclosed material；
(4) TPU is encapsulated：Prepare liquid TPU encapsulating materials, and the one layer of liquid of epoxy resin layer outer encapsulating formed in step 3)
TPU encapsulating materials, and it is formed by curing encapsulated layer 30 in TPU；Then one layer of liquid TPU encapsulating material of encapsulated layer outer encapsulating in TPU again,
And it is formed by curing TPU outer package layers 50.Encapsulated layer 30 and TPU outer package layers 50 by curing 6~8 at room temperature in the TPU
Hour or when baking-curing 2~3 is small at 80~90 DEG C formed.
The liquid TPU encapsulating materials are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF (tetrahydrofuran), to be made, the TPU particles and THF's
Mass ratio is 1:2~1:1.The one-component TPU particles be dissolved in before THF at 80~110 DEG C dry about 3 it is small when.Preferably,
The diluent selects environmentally friendly organic composite solvent.Curing agent is added in TPU host agents, can make what liquid TOU encapsulating materials were formed
TPU encapsulated layers have solvent resistant, high adhesion force, water-fastness, corrosion-resistant, reaction performance fast, with high hardness；Add in TPU host agents
Add diluent, the mobility of liquid encapsulating material can be increased, convenient for controlling the thickness of coating and uniformly, and environmentally friendly organic composite solvent
Use also make product more environmentally friendly.
(5) the bottom filling heat-conductive resin 71 in encapsulating shell 60；The encapsulating shell 60 is formed close to opening outwardly convex
Multiple tongues 61.The setting of the tongue 61 makes compound potting compound that can be firmly embedded into tongue 61 after curing, so as to ensure temperature
Sensor is spent in encapsulating shell by carrying out firm packaging, not easily to fall off.
(6) temperature sensor made from step (4) is put into encapsulating shell 60；
(7) compound potting compound is prepared；
The compound potting compound is mixed by each component of following mass percent：
Liquid TPU potting compounds 30%~70%
Liquid-state epoxy resin potting compound 30%~70%
The liquid TPU potting compounds are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF, to be made, and the mass ratio of the TPU particles and THF are 1:2
~1:1.
The liquid-state epoxy resin potting compound be conventional use of potting compound, usually by 100 parts of epoxy resin host agent,
It is made after 20~22 parts of intermediate temperature curing agent and the mixing of 6~8 parts of diluent by sufficiently stirring to defoam with vacuum.It is described multiple
Potting compound is closed by being defoamed after the liquid TPU potting compounds and the mixing of liquid-state epoxy resin potting compound by sufficiently stirring with vacuum
It is made.The compound potting compound has certain hardness, and can be securely joined with the insulating layer of TPU electric wires, effectively prevents
Sealing sub-dip enters and causes the mutation of the performance of temperature sensor.
(8) compound potting compound 72 is injected in encapsulating shell；
(9) when baking-curing 2~3 is small at 80~90 DEG C.
By the temperature sensor obtained by above-mentioned steps, due in the encapsulating shell with chip one end outer enclosure
60, and heat-conducting silicone grease 71 and compound potting compound 72 are implanted sequentially in encapsulating shell 60, after curing, compound potting compound 72 will be real
Temperature sensor carrying out firm packaging made from example 1 is applied in the temperature sensor in encapsulating shell 60, therefore described in the present embodiment compared to real
The temperature sensor for applying example 1 has higher shear strength and impact flexibility, and its compactness is more preferably, and weatherable and waterproof are prevented
The performance of tide is further enhanced.
A series of tests are carried out to temperature sensor made from the present embodiment, it is as a result as follows：
1) electric wire 40 is surveyed with crossing microscopy after the bending experiment of compound 72 engaging portion of potting compound, no peeling；
2) cross microscopy after thermal shock experiment to survey also without peeling, electrical property detection shows its performance change rate also just
In normal scope；
3) drop resistant, which is beaten, tested microscopy survey, and electrical property detection shows its performance change rate also in normal scope；
4) detected after immersion and the 0.5Mpa that pressurizes, free from dampness and immersion phenomenon inside temperature sensor.
The invention is not limited in the above embodiment, if the various changes or deformation to the present invention do not depart from the present invention
Spirit and scope, if these changes and deformation belong within the scope of the claim and equivalent technologies of the present invention, then this hair
It is bright to be also intended to comprising these changes and deformation.
Claims (9)
1. a kind of production method of waterproof and dampproof temperature sensor, it is characterised in that comprise the following steps：
(1) line is cut out：The consistent TPU electric wires of length are cut by setting line length size；
(2) chip welds：In TPU electric wires one end, welding one carries the chip of temp sensing function；
(3) it is epoxy resin enclosed：Deployed epoxy resin enclosed material is encapsulated into the chip and exposed conducting wire, and is heated solid
Change；
(4) TPU is encapsulated：Prepare liquid TPU encapsulating materials, and the one layer of liquid TPU of epoxy resin layer outer encapsulating formed in step 3)
Encapsulating material, and it is formed by curing encapsulated layer in TPU；Then one layer of liquid TPU encapsulating material of encapsulated layer outer encapsulating in TPU again, and it is solid
Change forms TPU outer package layers；
Liquid TPU encapsulating materials in the step (4) are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF, to be made, and the mass ratio of the TPU particles and THF are 1:2~1:1.
2. the production method of waterproof and dampproof temperature sensor according to claim 1, it is characterised in that：The one-component
TPU particles be dissolved in before THF at 80~110 DEG C dry 3 it is small when.
3. the production method of waterproof and dampproof temperature sensor according to claim 1, it is characterised in that：The step
(4) in by cure at room temperature 6~8 it is small when formed TPU in encapsulated layer and TPU outer package layers.
4. the production method of waterproof and dampproof temperature sensor according to claim 1, it is characterised in that：The step
(4) by forming encapsulated layer and TPU outer package layers in TPU when baking-curing 2~3 is small at 80~90 DEG C in.
5. according to the production method of the waterproof and dampproof temperature sensor of Claims 1 to 4 any one of them, it is characterised in that：
It is further comprising the steps of：
(5) the bottom filling heat-conductive resin in encapsulating shell；
(6) temperature sensor made from step (4) is put into encapsulating shell；
(7) compound potting compound is prepared；
(8) compound potting compound is injected in encapsulating shell；
(9) baking-curing.
6. the production method of waterproof and dampproof temperature sensor according to claim 5, it is characterised in that：The step
(7) the compound potting compound in is mixed by each component of following mass percent：
Liquid TPU potting compounds 30%~70%
Liquid-state epoxy resin potting compound 30%~70%
The liquid TPU potting compounds are grouped by each group of following number：
100 parts of TPU host agents
15~46 parts of curing agent
0~20 part of diluent
The TPU host agents, which are dissolved in by one-component TPU particles in THF, to be made, and the mass ratio of the TPU particles and THF are 1:2~1:1.
7. the production method of waterproof and dampproof temperature sensor according to claim 5, it is characterised in that：The step
(9) by the way that temperature sensor finished product is made when baking-curing 2~3 is small at 80~90 DEG C in.
8. the production method of waterproof and dampproof temperature sensor according to claim 5, it is characterised in that：The encapsulating shell
Multiple tongues are formed close to opening outwardly convex.
9. a kind of waterproof and dampproof temperature sensor, it is characterised in that：Prevented according to claim 1~8 any one of them waterproof
The production method of the temperature sensor of tide is made.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511033100.5A CN105551984B (en) | 2015-12-31 | 2015-12-31 | The production method of waterproof and dampproof temperature sensor and its temperature sensor obtained |
| PCT/CN2016/093046 WO2017113788A1 (en) | 2015-12-31 | 2016-08-03 | Method for manufacturing waterproof and moisture-proof temperature sensor and temperature sensor manufactured thereby |
| PCT/CN2016/107996 WO2017114084A1 (en) | 2015-12-31 | 2016-11-30 | Manufacturing method for waterproof and moisture-proof temperature sensor, and prepared temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511033100.5A CN105551984B (en) | 2015-12-31 | 2015-12-31 | The production method of waterproof and dampproof temperature sensor and its temperature sensor obtained |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105551984A CN105551984A (en) | 2016-05-04 |
| CN105551984B true CN105551984B (en) | 2018-05-25 |
Family
ID=55831093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511033100.5A Active CN105551984B (en) | 2015-12-31 | 2015-12-31 | The production method of waterproof and dampproof temperature sensor and its temperature sensor obtained |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105551984B (en) |
| WO (2) | WO2017113788A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105551984B (en) * | 2015-12-31 | 2018-05-25 | 广东爱晟电子科技有限公司 | The production method of waterproof and dampproof temperature sensor and its temperature sensor obtained |
| CN108871483A (en) * | 2018-07-13 | 2018-11-23 | 深圳电通纬创微电子股份有限公司 | A kind of corrosion-resistant fuel gas table temperature and pressure compensation integrated transducer and its manufacturing method |
| KR102640844B1 (en) * | 2020-04-14 | 2024-02-27 | 삼성에스디아이 주식회사 | Battery pack |
| CN113074764B (en) * | 2021-02-26 | 2022-04-15 | 兖矿集团有限公司 | Embedment device for gradient sensor buckler |
| CN114010165A (en) * | 2021-12-09 | 2022-02-08 | 东莞荣瑞医疗器械有限公司 | Intracavity body temperature sensor and manufacturing method thereof |
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| WO2017113788A1 (en) | 2017-07-06 |
| WO2017114084A1 (en) | 2017-07-06 |
| CN105551984A (en) | 2016-05-04 |
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