CN105548350B - Impulse eddy current defects detection imaging system based on round rectangle array probe - Google Patents
Impulse eddy current defects detection imaging system based on round rectangle array probe Download PDFInfo
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- CN105548350B CN105548350B CN201610054632.5A CN201610054632A CN105548350B CN 105548350 B CN105548350 B CN 105548350B CN 201610054632 A CN201610054632 A CN 201610054632A CN 105548350 B CN105548350 B CN 105548350B
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- defect
- array probe
- round rectangle
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- eddy current
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9046—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents by analysing electrical signals
Abstract
The present invention relates to impulse eddy current defect detecting technique fields, especially a kind of impulse eddy current defects detection imaging system based on round rectangle array probe, including round rectangle array probe and computer impulse eddy current defect imaging system software, round rectangle array probe is equipped with excitation coil and Hall sensor, modular system is equipped with inside round rectangle array probe, round rectangle array probe bottom is equipped with test specimen, and test specimen is equipped with defect.Impulse eddy current defects detection imaging system based on round rectangle array probe is using the peak value and zero-crossing timing using transient state inductive signal as characteristic quantity, it is handled by computer impulse eddy current defect imaging system software, the sensitivity of ferromagnetic component detection signal is not only increased, and improves the accuracy of image border identification and the precision of imaging.
Description
Technical field
The present invention relates to impulse eddy current defect detecting technique field, especially a kind of arteries and veins based on round rectangle array probe
Punching vortex defects detection imaging system.
Background technique
With the high speed development of industrial society, high-strength steel sheet is in large ship, bridge, power station equipment, middle high-pressure pot
Furnace, high-pressure bottle, rolling stock, hoisting machinery, mining machinery have a wide range of applications, it has also become indispensable in modern industry
A part.In order to avoid the safety accident caused by the defect of high-strength steel sheet, the corrosion for inspecting periodically high-strength steel sheet is lacked
It falls into, abrasion condition and assesses its reliability and service life.Impulse eddy current has and penetrates as a kind of novel detection technique
The advantages that ability is strong, includes abundant information has a some superiority in ferromagnetic component detection, Pulsed eddy current testing to defect at
Picture, so that testing result is very intuitive and clear.Traditional pulse is vortexed defect imaging detection, adjusts figure using amplitude as characteristic quantity
The gray scale of picture, Defect Edge are difficult to extract, imaging inaccuracy, low precision.
Summary of the invention
In order to overcome existing deficiency, the present invention provides a kind of impulse eddy current defects based on round rectangle array probe
Detect imaging system.
The technical solution adopted by the present invention to solve the technical problems is: a kind of pulse based on round rectangle array probe
It is vortexed defects detection imaging system, including round rectangle array probe and computer impulse eddy current defect imaging system software, circle
Angular moment shape array probe is equipped with excitation coil and Hall sensor, and modular system, circle are equipped with inside round rectangle array probe
Angular moment shape array probe bottom is equipped with test specimen, and test specimen is equipped with defect.
It according to another embodiment of the invention, further comprise the lower surface of round rectangle array probe and tested
Part surface is parallel, and the distance of round rectangle array probe to test specimen surface is 1.2mm.
According to another embodiment of the invention, further comprise that Hall sensor is 4X4 array distribution, be located at fillet
The lower section of rectangular array probe.
It according to another embodiment of the invention, further comprise that modular system includes STC89C52 module, pulse signal
Module, power amplification circuit, five rank active low-pass filter circuits, signal conditioning circuit, 16 road high-speed data acquisition cards occurs,
Module, output duty cycle and the adjustable square-wave signal of frequency occur for STC89C52 module control wave, pass through power amplification
Circuit amplifies signal, and signal is passed to Hall sensor and is detected, and the signal of Hall sensor detection passes through
Five rank active low-pass filter circuits eliminate high-frequency noise, and detection signal is improved using signal conditioning circuit, defeated after conditioning
16 road high-speed data acquisition cards are given, and will test signal and be sent into computer in real time, transfer to computer impulse eddy current defect imaging
System software processing, exports defect image on computers.
It according to another embodiment of the invention, further comprise that the computer impulse eddy current defect imaging system is soft
The signal acquisition process of part is as follows:
(1) setting imaging software systems initial parameter value；
The signal data acquired in real time is sent into computer impulse eddy current defect imaging system by (2) 16 road high-speed data acquisition cards
It unites in software, in round rectangle array probe scanning process, computer impulse eddy current defect imaging system software will adopt every time
The peak value of the transient state inductive signal of collection is continuously displayed with image format, forms signal peak sweep waveform figure；
(3) data measured by improved Multisensor Data Fusion Algorithm to 16 road high-speed data acquisition cards is true
Property differentiated, find out the correlation between different sensors data, to these measurement data carry out consistency check, reject
Wherein data error retains greater than 8% array and at least 12 groups of data to get best fusion array, utilizes weighted mean method pair
It is merged by the data of consistency check, finally obtains optimal fusion results.
(4) after fused data-signal is using principal component analytical method processing, the round rectangle Jing Guo defect is only extracted
The signal characteristic quantity of array probe unit；
(5) the zero-crossing timing characteristic value of transient state inductive signal determines the depth of defect, is adjusted by characteristic quantity zero-crossing timing
Image grayscale, zero-crossing timing and its matched curve, determine the position of defect, to form depth of defect side view.
(6) when round rectangle array probe is scanned from defect, when entering and leaving defect, transient state inductive signal goes out
Existing two extreme points, the round rectangle array probe unit peak value sweep waveform Jing Guo defect is only extracted using Principal Component Analysis
Two extreme values, identify Defect Edge；The gray value of image, the degree of display defect, thus shape are adjusted by characteristic quantity peak value
At defect level top view.
The invention has the advantages that the impulse eddy current defects detection imaging system based on round rectangle array probe be with
Using the peak value and zero-crossing timing of transient state inductive signal as characteristic quantity, pass through computer impulse eddy current defect imaging system software
Processing, not only increase ferromagnetic component detection signal sensitivity, and improve image border identification accuracy and at
The precision of picture.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the impulse eddy current defects detection imaging system flow chart of round rectangle array probe；
Fig. 2 is the schematic diagram that the Hall sensor of 4X4 array distribution is arranged in excitation coil bottom surface；
Fig. 3 is the magnetic induction line distribution schematic diagram of test specimen internal vortex；
Fig. 4 is pulse signal generation circuit；
Fig. 5 is power amplification circuit；
Fig. 6 is active low-pass filter circuit；
Fig. 7 is signal conditioning circuit；
1 in figure, round rectangle array probe, 2, computer impulse eddy current defect imaging system software, 3, excitation coil, 4,
Hall sensor, 5, modular system, 6, test specimen, 7, defect, 8, STC89C52 module, 9, pulse signal generation module, 10,
Power amplification circuit, 11, five rank active low-pass filter circuits, 12, signal conditioning circuit, 13,16 road high-speed data acquisition cards.
Specific embodiment 3
If Fig. 1 is structural schematic diagram of the invention, a kind of impulse eddy current defects detection based on round rectangle array probe
Imaging system, including round rectangle array probe 1 and computer impulse eddy current defect imaging system software 2, characterized in that described
Round rectangle array probe 1 is equipped with excitation coil 3 and Hall sensor 4, is equipped with mould inside the round rectangle array probe 1
Block system 5,1 bottom of round rectangle array probe are equipped with test specimen 6, and the test specimen 6 is equipped with defect 7.
It according to another embodiment of the invention, further comprise the lower surface of the round rectangle array probe 1 and quilt
6 surface of test block is parallel, and the distance of round rectangle array probe 1 to 6 surface of test specimen is 1.2mm.
According to another embodiment of the invention, further comprise that the Hall sensor 4 is 4X4 array distribution, be located at
The lower section of round rectangle array probe 1.
It according to another embodiment of the invention, further comprise that the modular system 5 includes STC89C52 module 8, arteries and veins
Rush signal generating module 9, power amplification circuit 10, five rank active low-pass filter circuits 11, signal conditioning circuit 12,16 tunnels high speed
Module 9, output duty cycle and the adjustable square wave letter of frequency occur for data collecting card 13,8 control wave of STC89C52 module
Number, signal is amplified by power amplification circuit 10, and signal is passed into Hall sensor 4 and is detected, Hall passes
The signal that sensor 4 detects eliminates high-frequency noise by five rank active low-pass filter circuits 11, detects signal using signal condition
Circuit 12 is improved, and 16 road high-speed data acquisition cards 13 are conveyed to after conditioning, and be will test signal and be sent into computer in real time, is handed over
It is handled by computer impulse eddy current defect imaging system software 2, exports defect image on computers.
It according to another embodiment of the invention, further comprise that the computer impulse eddy current defect imaging system is soft
The signal acquisition process of part 2 is as follows:
1 setting imaging software systems initial parameter value；
The signal data acquired in real time is sent into computer impulse eddy current defect imaging system by 216 road high-speed data acquisition cards 13
It unites in software 2, in 1 scanning process of round rectangle array probe, computer impulse eddy current defect imaging system software 2 will be each
The peak value of the transient state inductive signal of acquisition is continuously displayed with image format, forms signal peak sweep waveform figure；
3 data that 16 road high-speed data acquisition cards 13 are measured by improved Multisensor Data Fusion Algorithm it is true
Property differentiated, find out the correlation between different sensors data, to these measurement data carry out consistency check, reject
Wherein data error retains greater than 8% array and at least 12 groups of data to get best fusion array, utilizes weighted mean method pair
It is merged by the data of consistency check, finally obtains optimal fusion results；
After 4 fused data-signals are using principal component analytical method processing, the round rectangle battle array Jing Guo defect 7 is only extracted
The signal characteristic quantity of column probe Unit 1；
The zero-crossing timing characteristic value of 5 transient state inductive signals determines the depth of defect 7, is adjusted and is schemed by characteristic quantity zero-crossing timing
As gray scale, zero-crossing timing and its matched curve determine the position of defect 7, to form depth of defect side view.
6 when round rectangle array probe 1 is scanned from defect 7, when entering and leaving defect 7, transient state inductive signal
There are two extreme points, 1 unit peak value of the round rectangle array probe scanning Jing Guo defect 7 is only extracted using Principal Component Analysis
Two extreme values of waveform, identify 7 edge of defect；By characteristic quantity peak value adjust image gray value, the degree of display defect, from
And form defect level top view.
Detailed process of the signal from generation to conditioning are as follows: module occurs for the pumping signal of this system using square wave as excitation
Source, the pulse signal generation module 9 being made of the control of STC89C52 module 8 AD9850 chip and peripheral circuit, such as Fig. 4 institute
Show, adjust the duty ratio of the adjustable output square wave of R6, frequency is adjusted then by process control.Using amplifier chip OPA549T other side
Wave signal amplifies processing, and OPA549T has the advantages that low-power consumption, high current, output voltage is high, and chip integration is high, such as
Shown in Fig. 5, by adjusting R2 and R3, amplifying power multiple, power amplification multiple is G=1+R3/R2.Using the active low pass of five ranks
Filter circuit 11, cutoff frequency 15Hz filter out the noise signal higher than 15Hz frequency completely, circuit parameter value
C11=C13=C14=22nf, R10=0.48K, R8=R11=R12=0.89K, R9=R13=R14=2.83K, as shown in Figure 6.It chooses
Amplifying circuit of the CLC1200 amplifier chip as signal condition, function have two aspects, on the one hand devise in chip input terminal
High-pass filter, main function are to filter off the included DC component of circuit；It on the other hand is weak signal amplification circuit, circuit
Amplification factor is G=1+49.4k/R11, and the resistance value by adjusting resistance R11 changes amplification factor.
Module 9, output duty cycle and the adjustable square wave letter of frequency occurs by 8 control wave of STC89C52 module
Number, signal is amplified by power amplification circuit 10, amplification factor is G=1+R3/R2, and the signal after amplifier enters
Excitation coil 3 on round rectangle array probe 1, excitation coil 3 generate Primary field in its surrounding space, work as round rectangle
When array probe 1 is placed on test specimen 6, coupling occurs for the secondary magnetic field and Primary field that 6 inside current vortex of test specimen generates
It closes, when round rectangle array probe 1 moves from left to right, when encountering defect 7, the magnetic density and magnetic induction line of vortex are distributed meeting
Change, promote the magnetic field of coupling to disturb, detect the variable quantity of coupled magnetic field by Hall sensor 4, in test specimen 6
Bilge vortex defect 7 can cause the variation of the corresponding magnetic induction intensity of each point on magnetic induction line, and the maximum place of changes of magnetic field is in defect 7
Surface at, but do not change substantially without the magnetic field value near fault location, so that signal detection peak value is defective
There is very big difference at place and zero defect.The signal that Hall sensor 4 detects is eliminated by five rank active low-pass filter circuits 11
High-frequency noise, reason are that being vortexed low-frequency component plays a major role for surface defects detection and filter out high-frequency noise.Detection letter
It number is improved using signal conditioning circuit 12,16 road high-speed data acquisition card, 13,16 road high-speed data is conveyed to after conditioning
Capture card 13 is responsible for 16 tunnels detection signal and square-wave signal acquisition simultaneously, and is sent into computer in real time, transfers to computer pulse whirlpool
It flows defect imaging system software 2 to handle, exports defect image on computers.
Claims (4)
1. a kind of impulse eddy current defects detection imaging system based on round rectangle array probe, including round rectangle array probe
(1) and computer impulse eddy current defect imaging system software (2), characterized in that the round rectangle array probe (1) is equipped with
Excitation coil (3) and Hall sensor (4), the round rectangle array probe (1) is internal to be equipped with modular system (5), the circle
Angular moment shape array probe (1) bottom is equipped with test specimen (6), and the test specimen (6) is equipped with defect (7)；
The signal acquisition process of the computer impulse eddy current defect imaging system software (2) is as follows:
1, setting imaging software systems initial parameter value；
2, the signal data acquired in real time is sent into computer impulse eddy current defect imaging system by 16 road high-speed data acquisition cards (13)
In system software (2), in round rectangle array probe (1) scanning process, computer impulse eddy current defect imaging system software (2)
The peak value of the transient state inductive signal acquired every time is continuously displayed with image format, forms signal peak sweep waveform figure；
3, the data measured by improved Multisensor Data Fusion Algorithm to 16 road high-speed data acquisition cards (13) is true
Property differentiated, find out the correlation between different sensors data, to these measurement data carry out consistency check, reject
Wherein data error retains greater than 8% array and at least 12 groups of data to get best fusion array, utilizes weighted mean method pair
It is merged by the data of consistency check, finally obtains optimal fusion results；
4, after fused data-signal is using principal component analytical method processing, the round rectangle battle array for passing through defect (7) is only extracted
The signal characteristic quantity of column probe (1) unit；
5, the zero-crossing timing characteristic value of transient state inductive signal determines the depth of defect (7), is adjusted and is schemed by characteristic quantity zero-crossing timing
As gray scale, zero-crossing timing and its matched curve determine the position of defect (7), to form depth of defect side view；
6, when round rectangle array probe (1) is scanned from defect (7), when entering and leaving defect (7), transient state induction letter
Number occur two extreme points, using Principal Component Analysis only extracts pass through defect (7) round rectangle array probe (1) unit peak
It is worth two extreme values of sweep waveform, identifies defect (7) edge；The gray value of image, display defect are adjusted by characteristic quantity peak value
Degree, to form defect level top view.
2. the impulse eddy current defects detection imaging system according to claim 1 based on round rectangle array probe, special
Sign is that the lower surface of the round rectangle array probe (1) is parallel with test specimen (6) surface, round rectangle array probe (1)
Distance to test specimen (6) surface is 1.2mm.
3. the impulse eddy current defects detection imaging system according to claim 1 based on round rectangle array probe, special
Sign is that the Hall sensor (4) is 4X4 array distribution, is located at the lower section of round rectangle array probe (1).
4. the impulse eddy current defects detection imaging system according to claim 1 based on round rectangle array probe, special
Sign is, the modular system (5) include STC89C52 module (8), pulse signal generation module (9), power amplification circuit (10),
Five rank active low-pass filter circuits (11), signal conditioning circuit (12), 16 road high-speed data acquisition cards (13), STC89C52 module
(8) module (9) occur for control wave, and output duty cycle and the adjustable square-wave signal of frequency pass through power amplification circuit
(10) signal is amplified, and signal is passed into Hall sensor (4) and is detected, the letter of Hall sensor (4) detection
Number by five rank active low-pass filter circuits (11) eliminate high-frequency noise, detection signal using signal conditioning circuit (12) carry out
Conditioning, is conveyed to 16 road high-speed data acquisition cards (13), and will test signal and be sent into computer in real time, transfers to computer after conditioning
Impulse eddy current defect imaging system software (2) processing, exports defect image on computers.
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| CN106596711B (en) * | 2016-10-24 | 2020-04-14 | 合肥工业大学 | Hydraulic cylinder detection system based on pulse eddy current |
| CN107167516B (en) * | 2017-05-24 | 2023-09-26 | 昆明理工大学 | Double differential pulse eddy current probe unit, array probe and detection device |
| CN109142514B (en) * | 2018-09-29 | 2022-04-01 | 东北大学 | Defect detection device and method based on pulse eddy current array |
| CN109406624B (en) * | 2018-12-30 | 2023-05-30 | 北方民族大学 | Double-frequency array eddy current probe and deep crack mixing detection signal extraction technology |
| JP7411594B2 (en) * | 2021-02-15 | 2024-01-11 | 株式会社ニューフレアテクノロジー | Defect inspection equipment and defect inspection method |
| CN113311064A (en) * | 2021-05-25 | 2021-08-27 | 国网湖南省电力有限公司 | Pulse eddy current detection method and system for lead sealing part of cable joint |
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