CN105548215A - Method for observing and analyzing halos or PI cracks - Google Patents
Method for observing and analyzing halos or PI cracks Download PDFInfo
- Publication number
- CN105548215A CN105548215A CN201610008299.4A CN201610008299A CN105548215A CN 105548215 A CN105548215 A CN 105548215A CN 201610008299 A CN201610008299 A CN 201610008299A CN 105548215 A CN105548215 A CN 105548215A
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- China
- Prior art keywords
- sample
- haloing
- crackle
- sand paper
- polishing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The invention discloses a method for observing and analyzing halos or PI cracks. The method comprises the following steps that S1, a PCB sample to be observed and analyzed is fixed, and the surface of the sample is kept horizontal; S2, horizontal slices of the sample are prepared; S3, the section of the sample subjected to horizontal slicing is ground through first sandpaper; S4, when the sample is ground to the condition that the first sandpaper is close to the halos or the PI cracks, polishing is conducted through second sandpaper; S5, the polished sample is observed and measured through a dark field of a metallographic microscope, and halo distribution or PI crack distribution is obtained. By means of the method for observing and analyzing the halos or the PI cracks, the PI crack distribution or the halo distribution can be observed and analyzed accurately and comprehensively.
Description
Technical field
The present invention relates to a kind of observation analysis method of haloing, PI crackle.
Background technology
PCB is divided into rigid printed board and flexible printed board.The sheet material that rigid printed board uses is combined into material jointly for glass fabric and epoxy resin, and wherein glass fabric is right-angled intersection net distribution.Due to the stress of drill and pull and make to occur small crack between glass fabric and epoxy resin in boring procedure, adopt traditional terrace cut slice to observe, these small crackles present white under the details in a play not acted out on stage, but told through dialogues of metaloscope, form haloing.The base material that flex plate uses is by PI (Kapton, Polyimide, poly-imines film) material that is combined into TPI (flexible bonding agent), because the stress of drill and pullling makes PI produce crack equally in boring procedure, be called PI crackle, traditional observational technique is also terrace cut slice method.
The generation of haloing and PI crackle all can impact the reliability of PCB.Wherein the conference excessively of haloing causes the migration (CAF) at use procedure generation anode conducting silk between PCB heterogeneous networks, thus there is short circuit phenomenon, haloing is the important indicator of reflection PCB resistance to CAF performance, observes accurately and measurement seems particularly important to glass crackle in haloing.
In existing observational technique, due to boring and the irregular distribution of glass, the haloing in the through-hole diameter direction observed under terrace cut slice differs and is decided to be maximal value (sometimes even can't see), cannot accurately observe glass crackle and measure.PI crackle can bring short circuit between heterogeneous networks equally, because crackle can ooze copper in the electro-coppering process of rear operation, and the problem such as simultaneously also can cause that layering and hole copper are broken upon reflowing.Distribution due to PI crackle does not present the circle distribution of 360 ° of hole, and therefore, terrace cut slice can not reflect the situation of PI crackle accurately.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a kind of observation analysis method of haloing, PI crackle, can accurately, all sidedly observation analysis PI crackle, haloing distribution.
Object of the present invention realizes by the following technical solutions:
An observation analysis method for haloing, PI crackle, comprises the following steps:
S1, the PCB sample treating observation analysis are fixed, and keep the surface level of sample;
S2, to sample preparation dropping cut slice;
S3, to grind by the sample in cross section of the first sand paper to dropping cut slice;
S4, when being ground to close to haloing or PI crackle, the second sand paper is adopted to carry out polishing;
The details in a play not acted out on stage, but told through dialogues of S5, use metaloscope is observed the sample after polishing and is measured, and obtains haloing distribution or PI crack distribution.
Preferably, in described step S1, be poured on sample by epoxide-resin glue, for the preparation of blob of viscose or the rubber base of auxiliary grasping sample.
Preferably, the first sand paper and the second sand paper all adopt SiC sand paper.
Preferably, the fineness degree of the first sand paper is 500-800 order.
Preferably, the fineness degree of the second sand paper is 2000-3000 order.
Preferably, in described step S4, the sample after the second sand paper polishing is again through Al
2o
3polishing fluid carries out polishing, and then Al is removed in cleaning
2o
3polishing fluid.
Compared to existing technology, beneficial effect of the present invention is:
The present invention adopts and observes the mode of sample levels section, in conjunction with grinding, polishing and metaloscope, because sample is by dropping cut slice, metaloscope can run through along the axis in hole observes whole PCB, energy like this comprehensively, the position of clear view PI crackle, haloing and distribution, and it is measured accurately, be beneficial to resistance to CAF performance and the reliability of interpretation PCB.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of observation analysis method of haloing of the present invention, PI crackle.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the present invention is described further:
A kind of haloing as shown in Figure 1, the observation analysis method of PI crackle, comprise the following steps:
S1, the PCB sample treating observation analysis are fixed, and keep the surface level of sample;
S2, to sample preparation dropping cut slice;
S3, to grind by the sample in cross section of the first sand paper to dropping cut slice;
S4, when being ground to close to haloing or PI crackle, the second sand paper is adopted to carry out polishing;
The details in a play not acted out on stage, but told through dialogues of S5, use metaloscope is observed the sample after polishing and is measured, and obtains haloing distribution or PI crack distribution.
Adopt and the mode of sample levels section is observed, in conjunction with grinding, polishing and metaloscope, because sample is by dropping cut slice, metaloscope can run through along the axis in hole observes whole PCB, energy like this comprehensively, the position of clear view PI crackle, haloing and distribution, and it is measured accurately, be beneficial to resistance to CAF performance and the reliability of interpretation PCB.Wherein, sample is fixed, can be beneficial to and carry out follow-up grinding and polishing better and stablize observing.
For fixed sample more easily, and be beneficial to people's grasped, to facilitate grinding and polishing, in described step S1, be poured on sample by epoxide-resin glue, for the preparation of blob of viscose or the rubber base of auxiliary grasping sample.
Wherein, this example use the first sand paper and the second sand paper all adopt SiC sand paper.For reaching the effect of grinding fast, the fineness degree of the first sand paper is 500-800 order, preferably adopts 600 orders.And in order to polishing more smooth, the fineness degree of second sand paper of this example is 2000-3000 order, preferably adopts 2500 orders.
Further, for further facilitating observation haloing or the PI crackle of cleaning, in described step S4, the sample after the second sand paper polishing is again through Al
2o
3polishing fluid carries out polishing, and then Al is removed in cleaning
2o
3polishing fluid.After more smooth polishing, will be more clear through the haloing of metaloscope Dark display or PI crackle, decrease the interference that surfaceness is brought.
To one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and all these change and deformation all should belong within the protection domain of the claims in the present invention.
Claims (6)
1. an observation analysis method for haloing, PI crackle, is characterized in that comprising the following steps:
S1, the PCB sample treating observation analysis are fixed, and keep the surface level of sample;
S2, to sample preparation dropping cut slice;
S3, to grind by the sample in cross section of the first sand paper to dropping cut slice;
S4, when being ground to close to haloing or PI crackle, the second sand paper is adopted to carry out polishing;
The details in a play not acted out on stage, but told through dialogues of S5, use metaloscope is observed the sample after polishing and is measured, and obtains haloing distribution or PI crack distribution.
2. the observation analysis method of haloing according to claim 1, PI crackle, is characterized in that, in described step S1, is poured on sample by epoxide-resin glue, for the preparation of blob of viscose or the rubber base of auxiliary grasping sample.
3. the observation analysis method of haloing according to claim 1, PI crackle, is characterized in that, the first sand paper and the second sand paper all adopt SiC sand paper.
4. the observation analysis method of haloing according to claim 3, PI crackle, is characterized in that, the fineness degree of the first sand paper is 500-800 order.
5. the observation analysis method of haloing according to claim 3, PI crackle, is characterized in that, the fineness degree of the second sand paper is 2000-3000 order.
6. the observation analysis method of the haloing according to any one of claim 1-5, PI crackle, is characterized in that, in described step S4, the sample after the second sand paper polishing is again through Al
2o
3polishing fluid carries out polishing, and then Al is removed in cleaning
2o
3polishing fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008299.4A CN105548215A (en) | 2016-01-01 | 2016-01-01 | Method for observing and analyzing halos or PI cracks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610008299.4A CN105548215A (en) | 2016-01-01 | 2016-01-01 | Method for observing and analyzing halos or PI cracks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105548215A true CN105548215A (en) | 2016-05-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610008299.4A Pending CN105548215A (en) | 2016-01-01 | 2016-01-01 | Method for observing and analyzing halos or PI cracks |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846601A (en) * | 2010-03-31 | 2010-09-29 | 伟创力电子科技（上海）有限公司 | Preparation method for ball grid array package section test block |
| CN102914447A (en) * | 2011-08-03 | 2013-02-06 | 北大方正集团有限公司 | PCB (printed circuit board) cross-section and production method thereof |
| US20150062581A1 (en) * | 2013-08-30 | 2015-03-05 | Hitachi High-Technologies Corporation | Defect inspection apparatus and defect inspection method |
| US20150276623A1 (en) * | 2014-03-25 | 2015-10-01 | Hitachi High-Technologies Corporation | Defect Inspection Method and Defect Inspection Device |
-
2016
- 2016-01-01 CN CN201610008299.4A patent/CN105548215A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846601A (en) * | 2010-03-31 | 2010-09-29 | 伟创力电子科技（上海）有限公司 | Preparation method for ball grid array package section test block |
| CN102914447A (en) * | 2011-08-03 | 2013-02-06 | 北大方正集团有限公司 | PCB (printed circuit board) cross-section and production method thereof |
| US20150062581A1 (en) * | 2013-08-30 | 2015-03-05 | Hitachi High-Technologies Corporation | Defect inspection apparatus and defect inspection method |
| US20150276623A1 (en) * | 2014-03-25 | 2015-10-01 | Hitachi High-Technologies Corporation | Defect Inspection Method and Defect Inspection Device |
Non-Patent Citations (5)
| Title |
|---|
| 冯力等: "《现代电子装联质量管理》", 31 December 2009, 西安电子科技大学出版社 * |
| 刘仁志: "《印制板电镀》", 30 September 2008, 国防工业出版社 * |
| 文尚胜等: "《金相分析原理及技术》", 31 August 2013, 上海科学技术文献出版社 * |
| 简光沂等: "《新编实用五金手册》", 31 August 2005, 中国电力出版社 * |
| 萧泽新等: "《现代金相显微分析及仪器》", 31 May 2015, 西安电子科技大学出版社 * |
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Application publication date: 20160504 |