CN105547558A - Anisotropic testing structure and measurement method for MEMS micro-beam stress gradient based on horizontal T-shaped beams - Google Patents

Anisotropic testing structure and measurement method for MEMS micro-beam stress gradient based on horizontal T-shaped beams Download PDF

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CN105547558A
CN105547558A CN201610028123.5A CN201610028123A CN105547558A CN 105547558 A CN105547558 A CN 105547558A CN 201610028123 A CN201610028123 A CN 201610028123A CN 105547558 A CN105547558 A CN 105547558A
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girder
accumbency
shaped
stress gradient
stress
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CN105547558B (en
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唐洁影
王磊
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Southeast University
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0047Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes measuring forces due to residual stresses

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  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The invention discloses an anisotropic testing structure and measurement method for a MEMS micro-beam stress gradient based on horizontal T-shaped beams, and the structure comprises a substrate, a square column, four anchor regions, and four horizontal T-shaped cantilever beams. The square column is fixed at the center of the upper surface of the substrate. Each horizontal T-shaped cantilever beam consists of a cantilever beam and a wing edge, wherein the width of a small cut part at the tail end of the cantilever beam is greater than the widths of other parts. The other end of each horizontal T-shaped cantilever beam is fixedly connected to a side surface of one corresponding anchor region. The upper surfaces of four horizontal T-shaped cantilever beams and the top surface of the square column are located in the same plane, and are symmetrically distributed at the periphery of the square column. When the cantilever beams are bent upwards or downwards because of the stress gradient, a square graph formed by the enclosing of the wing edges of the four horizontal T-shaped cantilever beams will be expanded. Therefore, the size of the stress gradient of a structural layer can be judged based on the above. The structure and method reduce the requirements for observation equipment, and are visual and convenient.

Description

The anisotropy test structure of the micro-stress beam gradient of a kind of MEMS based on accumbency tee girder and measuring method
Technical field
The present invention relates in MEMS (micro electro mechanical system) (being called for short MEMS in literary composition), the technical field of stress gradient test in the MEMS cantilever design manufactured by MEMS micromachining technology.Specifically, anisotropy test structure and the measuring method of the micro-stress beam gradient of a kind of MEMS based on tee girder is related to.
Background technology
Stress in MEMS (Micro-Electro-MechanicalSystems) structure is mainly derived from thermal stress, internal stress and external carbuncle.What each thin layer caused stress because of the difference of thermal expansivity is produced as thermal stress; Lattice mismatch, foreign atom, crystal boundary relaxation ... the stress produced etc. the change of micromechanism is internal stress (also claiming intrinsic stress); When material surface is not very fine and close, in environment, some polar molecules can be adsorbed on space, and the stress that the interaction between the polar molecule of absorption produces is external carbuncle.Therefore, in MEMS technology process, inevitably produce unrelieved stress, when through-thickness stress distribution is non-homogeneous namely there is stress gradient time, the fixed beam structure that cantilever beam structure or both-end are fixed, (erodes the support sacrifice layer of beam lower floor, beam is suspended) after structure is released, there will be or flexing bending from face, directly affect the performance of device.Therefore, pay attention to the testing and analysis of stress gradient in MEMS structure and in the design of feedback, to ensure that the MEMS of Design and manufacture possesses good performance index, be very important.About the test of stress gradient, modal method is the optical device by means of precision, utilizes optical interference techniques and knows the flexural deformation that beam stress gradient causes.But, by the specialized designs of test structure, often can reduce the requirement to testing apparatus, and be convenient to directly from measuring-signal, read properties of materials parameter.
The present invention proposes anisotropy test structure and the measuring method of the micro-stress beam gradient of a kind of MEMS based on accumbency tee girder, is designed to T-shaped by tested beam, allows the limit, the edge of a wing of four accumbency tee girders around fixing tetragonal prism, surround a untight square figure.Fixing tetragonal prism provides reference position, prolongs wide limit, the edge of a wing and expands square image, and the tee girder that horizontal and vertical is placed is that the anisotropy measurement of stress gradient provides possibility.What tested semi-girder stress gradient can be produced by structural design like this is bendingly changed with changing feature size or shape into, is convenient to the direct observation of optical instrument, reduces the requirement to testing apparatus, and test is simple, convenient.
Summary of the invention
The object of this invention is to provide the anisotropy test structure of the micro-stress beam gradient of a kind of MEMS based on accumbency tee girder, by the graphic change before and after microscope amplification and interrecord structure release, the specifying information of stress gradient can be obtained.Present invention also offers the concrete method of testing of the MEMS micro-stress beam gradient based on the deformation of accumbency tee girder simultaneously, easy to operate feasible.
The technical solution used in the present invention is: the anisotropy test structure of the micro-stress beam gradient of a kind of MEMS based on accumbency tee girder, comprises substrate, tetragonal prism, four Ge Mao districts and four velamens and surveys accumbency T-shaped semi-girder;
Described tetragonal prism is fixed on the middle position of substrate top surface;
The material that described four velamens survey accumbency T-shaped semi-girder is identical with size, is symmetrically distributed in the surrounding of tetragonal prism, and is suspended at the top of substrate; One end of tested accumbency T-shaped semi-girder is separately fixed at the side in respective anchor district, and the width of the other end at one little section of place close to terminal edge is wider than other local edge of a wing forming tee girder;
The end face of upper surface and tetragonal prism that described four velamens survey accumbency T-shaped semi-girders is in same plane, and limit, the edge of a wing in T-shaped respectively near and the four edges of parallel tetragonal prism end face, surround a not exclusively closed square figure in tetragonal prism periphery.
In test, when semi-girder stress gradient existence and to produce up or down bending time, the square figure surrounded by the limit, the edge of a wing of four accumbency T-shaped semi-girders will expand, and for anisotropic material, square figure will expand and becomes a rectangular figure do not closed.Accordingly, the shape of figure and the change of size can be utilized to judge the size of stress gradient, compare with conventional optical means, reduce the requirement to scope, directly perceived, convenient.
The test structure of the micro-stress beam gradient of the above-mentioned MEMS based on the deformation of accumbency tee girder, the concrete principle of its test stress gradient and step as follows:
1) test structure before and after release process is placed in optical microphotograph Microscopic observation respectively, enlargement factor is determined according to the size by geodesic structure, regulate microscopical focal length until visible by the clear picture of geodesic structure, record the overhead view image before and after tested structure release operation respectively;
2) contrast two images before and after release process, after analytical structure release, whether the square figure not exclusively closed that tetragonal prism periphery surrounds changes; Unchangedly show that tested semi-girder does not exist stress, otherwise have the existence of stress gradient;
If tested accumbency T-shaped semi-girder does not exist stress gradient, so after tee girder structure release, tee girder projected length is in the horizontal plane constant; So, the square figure surrounded by four tee girders also remains unchanged;
If there is stress gradient in tested accumbency T-shaped semi-girder, so tee girder be released unsettled after, semi-girder can be upturned or be bent downwardly, and causes projected length in the horizontal plane obviously to shorten, and the square figure thus surrounded by the T-shaped horizontal edge of four accumbency T-shaped semi-girders will expand;
3) for the square figure changed, measure the spacing variable quantity of each T-shaped horizontal edge and tetragonal prism corresponding sides, thus know accumbency T-shaped semi-girder degree of crook, judge the size of structural sheet stress gradient;
If the figure after change is still square, show that the accumbency T-shaped cantilever deflection of beam situation in same level in orthogonal both direction is identical, stress gradient and direction are substantially irrelevant;
If the figure after change becomes rectangle, it is variant that the accumbency T-shaped semi-girder showing in same level in orthogonal both direction bends situation, and stress gradient is relevant with direction, can measure and obtain the stress gradient of orthogonal both direction respectively.
Beneficial effect: tested Design of Cantilever Beam is become the T-shaped of horizontal accumbency by the present invention, and be distributed in the surrounding of tetragonal prism, by structural design, the bending change changing the planar graph that available optical microsurgical instrument observes directly into that tested semi-girder stress gradient is produced.Especially for the stress gradient caused by anisotropic material, also can directly change determine by planar graph size and shape.Compared with conventional optical interference method, reduce the requirement to testing apparatus, the anisotropy test for stress gradient provides a kind of simple, convenience, accurately new way.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further illustrated.
As shown in Figure 1, the anisotropy test structure of the micro-stress beam gradient of a kind of MEMS based on accumbency tee girder, comprises substrate 1, tetragonal prism 2, four Ge Mao district 31,32,33 and 34, and four velamens survey accumbency T-shaped semi-girder 41,42,43 and 44;
Described tetragonal prism 2 is fixed on the middle position of substrate 1 upper surface;
One end of described tested accumbency T-shaped semi-girder 41,42,43 and 44 is separately fixed at the side in respective anchor district 31,32,33 and 34, and the width of the other end at one little section of place close to terminal edge is wider than other local edge of a wing forming tee girder; The tee girder of whole horizontal accumbency is suspended at the top of substrate 1 by anchor district.
Described tested accumbency T-shaped semi-girder 41,42,43 is identical with size with the material of 44, be symmetrically distributed in the surrounding of tetragonal prism 2, the end face of upper surface and tetragonal prism 2 that four velamens survey accumbency T-shaped semi-girder is in same plane, and limit, each edge of a wing is parallel respectively with the four edges of tetragonal prism end face, surround a square figure not exclusively closed in the periphery of next-door neighbour's tetragonal prism.
In design, tested Design of Cantilever Beam becomes the T-shaped of horizontal accumbency, makes the square figure surrounded by four tee girder ends can be larger by the length suitably lengthening the edge of a wing, is convenient to observe and the change of measurement pattern; Heart place introduces the object of reference of a changeless tetragonal prism as graphic change in the substrate, make the observation of graphic change and measure more accurate.
In test, when tested accumbency semi-girder stress gradient existence and to produce up or down bending time, the square figure not exclusively closed surrounded by four accumbency T-shaped semi-girder edges of a wing will expand, and for anisotropic material, square figure expands and becomes a rectangular figure do not closed.Accordingly, graphic change can be utilized to judge the size of stress gradient, compare with conventional optical means, reduce the requirement to scope, directly perceived, convenient.
The preparation of this measurement structure can adopt conventional MEMS body processing technology or surface processing technique.For surface processing technique, the material of substrate 1 can use monocrystalline silicon, sacrifice layer often adopts phosphorosilicate glass (PSG), tetragonal prism 2 is identical with the material in anchor district is polysilicon, tee girder is polysilicon, the release of tee girder structure can adopt wet etching method to remove sacrifice layer, makes girder construction unsettled.
The test structure of the micro-stress beam gradient of the above-mentioned MEMS based on the deformation of accumbency tee girder, the concrete principle of its test stress gradient and step as follows:
1) test structure before and after release process is placed in optical microphotograph Microscopic observation respectively, enlargement factor is determined according to the size by geodesic structure, regulate microscopical focal length until visible by the clear picture of geodesic structure, record the overhead view image before and after tested structure release operation respectively.
2) contrast two images before and after release process, after analytical structure release, whether the square figure not exclusively closed that tetragonal prism periphery surrounds changes.Unchangedly show that tested semi-girder does not exist stress, otherwise have the existence of stress gradient.
If tested accumbency T-shaped semi-girder 41,42,43 and 44 does not exist stress gradient, so after tee girder structure release, tee girder projected length is in the horizontal plane constant.So, the square figure surrounded by four tee girders also remains unchanged.
If there is stress gradient in tested accumbency T-shaped semi-girder 41,42,43 and 44, so tee girder be released unsettled after, semi-girder can be upturned or be bent downwardly, cause projected length in the horizontal plane obviously to shorten, the square figure thus surrounded by the T-shaped horizontal edge of four accumbency T-shaped semi-girders will expand.
3) for the square figure changed, measure the spacing variable quantity of each T-shaped horizontal edge and tetragonal prism corresponding sides, thus know accumbency T-shaped semi-girder degree of crook, judge the size of structural sheet stress gradient.
If the figure after change is still square, show that the accumbency T-shaped cantilever deflection of beam situation in same level in orthogonal both direction is identical, stress gradient and direction are substantially irrelevant.
If the figure after change becomes rectangle, it is variant that the accumbency T-shaped semi-girder showing in same level in orthogonal both direction bends situation, and stress gradient is relevant with direction, can measure and obtain the stress gradient of orthogonal both direction respectively.
Below by reference to the accompanying drawings embodiments of the present invention are described in detail, but the present invention is not limited to described embodiment.For those of ordinary skill in the art, in the scope of principle of the present invention and technological thought, multiple change, amendment, replacement and distortion are carried out to these embodiments and still falls within the scope of protection of the present invention.

Claims (2)

1. based on an anisotropy test structure for the micro-stress beam gradient of MEMS of accumbency tee girder, it is characterized in that: comprise substrate, tetragonal prism, four Ge Mao districts and four velamens and survey accumbency T-shaped semi-girder;
Described tetragonal prism is fixed on the middle position of substrate top surface;
The material that described four velamens survey accumbency T-shaped semi-girder is identical with size, is symmetrically distributed in the surrounding of tetragonal prism, and is suspended at the top of substrate; One end of tested accumbency T-shaped semi-girder is separately fixed at the side in respective anchor district, and the width of the other end at one little section of place close to terminal edge is wider than other local edge of a wing forming tee girder;
The end face of upper surface and tetragonal prism that described four velamens survey accumbency T-shaped semi-girders is in same plane, and limit, the edge of a wing in T-shaped respectively near and the four edges of parallel tetragonal prism end face, surround a not exclusively closed square figure in tetragonal prism periphery.
2. the method for testing of the anisotropy test structure of the micro-stress beam gradient of a kind of MEMS based on accumbency tee girder according to claim 1, is characterized in that: concrete steps are as follows:
1) test structure before and after release process is placed in optical microphotograph Microscopic observation respectively, enlargement factor is determined according to the size by geodesic structure, regulate microscopical focal length until visible by the clear picture of geodesic structure, record the overhead view image before and after tested structure release operation respectively;
2) contrast two images before and after release process, after analytical structure release, whether the square figure not exclusively closed that tetragonal prism periphery surrounds changes; Unchangedly show that tested semi-girder does not exist stress, otherwise have the existence of stress gradient;
If tested accumbency T-shaped semi-girder does not exist stress gradient, so after tee girder structure release, tee girder projected length is in the horizontal plane constant; So, the square figure surrounded by four tee girders also remains unchanged;
If there is stress gradient in tested accumbency T-shaped semi-girder, so tee girder be released unsettled after, semi-girder can be upturned or be bent downwardly, and causes projected length in the horizontal plane obviously to shorten, and the square figure thus surrounded by the T-shaped horizontal edge of four accumbency T-shaped semi-girders will expand;
3) for the square figure changed, measure the spacing variable quantity of each T-shaped horizontal edge and tetragonal prism corresponding sides, thus know accumbency T-shaped semi-girder degree of crook, judge the size of structural sheet stress gradient;
If the figure after change is still square, show that the accumbency T-shaped cantilever deflection of beam situation in same level in orthogonal both direction is identical, stress gradient and direction are substantially irrelevant;
If the figure after change becomes rectangle, it is variant that the accumbency T-shaped semi-girder showing in same level in orthogonal both direction bends situation, and stress gradient is relevant with direction, can measure and obtain the stress gradient of orthogonal both direction respectively.
CN201610028123.5A 2016-01-15 2016-01-15 The anisotropy test structure and measuring method of a kind of micro- stress beam gradients of MEMS based on accumbency tee girder Active CN105547558B (en)

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CN1584493A (en) * 2003-08-21 2005-02-23 台达电子工业股份有限公司 Method and structure for measuring thin-membrane strain
EP1733999A1 (en) * 2005-06-15 2006-12-20 Interuniversitair Microelektronica Centrum Vzw Microelectromechanical device with stress and stress gradient compensation
CN101403693A (en) * 2008-11-04 2009-04-08 南京师范大学 Method for on-line measurement of MEMS membrane stress gradient
CN101634673A (en) * 2009-06-10 2010-01-27 东南大学 Method for measuring dielectrostrictive coefficient based on micro-cantilever structure
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