CN105537062B - Can the accurate glue point disc loading method of impregnation pot type - Google Patents
Can the accurate glue point disc loading method of impregnation pot type Download PDFInfo
- Publication number
- CN105537062B CN105537062B CN201510891570.9A CN201510891570A CN105537062B CN 105537062 B CN105537062 B CN 105537062B CN 201510891570 A CN201510891570 A CN 201510891570A CN 105537062 B CN105537062 B CN 105537062B
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- Prior art keywords
- glue
- bonded adhesives
- adjustable
- tank
- ullage
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
Abstract
One kind can the accurate glue point disc loading method of impregnation pot type, including：Some adjustable glue tanks, tool base plate and bonded adhesives, the height such as each adjustable glue tank are arranged at tool base plate and treat that between the workpiece of glue point bonding, bonded adhesives fills the glue ullage intracavitary in adjustable glue tank to realize disk in glue point.The present invention solves optical element in dispensing in disk, the uncertainty of glued bondline thickness, by the malalignment of upper disk workpiece, the uncertainty of firmness, the problem of to the stress deformation of upper disk workpiece.
Description
Technical field
Can be in the accurate glue point of impregnation pot type the present invention relates to optical element dispensing bond processing technical field, particularly one kind
Disk method.
Background technology
Disk in the glue point of optical element, can accomplish to reduce the influence of upper lower burrs during to work pieces process to greatest extent, be
Preferred upper disk mode in the processing of high-precision optical part.The upper disk of general optical element is using disk on pitch, with large stretch of drip
Green grass or young crops, which is coated in, to be sticked to the pan, heated rear asphalt melting, and the optical element that then will be processed is by the pitch sticked to the pan, and visually
Adjust after posture, the upper disk process for waiting it to complete part after cooling down, heating sticks to the pan the entirety with workpiece during lower wall, treats pitch
After thawing, optical element is removed, is cleaned after cooling.
But sheet of pitch is gone up in disk cooling procedure again, is generated larger stress, is changed the original of optical element
Face shape state, after polished or other processing, although precision is qualified when being measured in frock, but due to stress release after lower wall,
Part surface type resilience is caused, workpiece is become unqualified.To solve such problem, the method being just bonded using glue point, using number
Limited, the less capsule and pill of diameter is measured, uniformly at intervals on sticking to the pan, optical element is placed in the glue point of star cloth battle array after heating, profit
With the weight and the temperature of preheating of workpiece itself, melt glue point, reach the purpose for being bonded with disk.
The weak point of disk is in this glue point, and the size shape of each glue point is different, and the thickness of glue-line is not after bonding
Equally, it can cause to stick to the pan not parallel with the bonding plane of workpiece, influence follow-up optical manufacturing.
The content of the invention
It is an object of the invention to provide one kind can the accurate glue point disc loading method of impregnation pot type, to solve optical element in dispensing
In upper disk, the uncertainty of glued bondline thickness, by the malalignment of upper disk workpiece, the uncertainty of firmness, to upper disk work
The problem of stress deformation of part.
In order to solve the above technical problems, the present invention includes some adjustable glue tanks, tool base plate and bonded adhesives, each is adjustable
Formula glue tank etc. height be arranged at tool base plate and treat glue point bonding workpiece between, bonded adhesives is filled in the glue tank of adjustable glue tank
To realize disk in glue point in cavity, including following steps：
Step 1: bonded adhesives is heated with warm water, soften it, be positioned over the glue ullage intracavitary of adjustable glue tank；
Step 2: the tool base plate for being bonded with adjustable glue tank is integrally put into baking oven, while will also treat glue point bonding
Workpiece is put into baking oven together；
Step 3: being heated to the melting point of bonded adhesives and being incubated to ensure that bonded adhesives melts completely, after caking glue, protect
The upper surface for demonstrate,proving the bonded adhesives melted is less than the upper surface of adjustable glue tank；
Step 4: the workpiece for treating glue point bonding is put in into the upper surface of each adjustable glue tank, and adjust and frock bottom
Horizontal relative position between plate causes the height setting such as each adjustable glue tank；
Step 5: design temperature is heated to, by bonded adhesives precession after heating so that bonded adhesives overflows.
Described adjustable glue tank is provided with top glue screw and top Jiao Kou for precession bonded adhesives, and overflows bonded adhesives
Excessive glue mouthful.
Described top glue screw is when its precession glue ullage chamber central point, occupy-place volume of the top glue screw in glue ullage chamber
Volume plus bonded adhesives is more than the volume of glue ullage chamber, to ensure in top glue screw in glue point bonding process, along with top
In the adjustable glue tank of precession of glue screw, there is enough glue to be overflowed from excessive glue mouthful, it is ensured that bonded adhesives is full of glue ullage chamber.
Described tool base plate thickness is more than 19.9~20.1 millimeters；The size of length and width is required to unilateral ratio and treats glue
The length and width of the workpiece of spot gluing is more than 5 millimeters, and the upper and lower surface depth of parallelism is 50 microns；It is micro- that top surface plane degree is less than 1
Rice.
The diameter of bonded adhesives is less than the diameter of the glue ullage chamber of adjustable glue tank in described step one, highly more than adjustable
The height of the glue ullage chamber of formula glue tank.
Take out bonded adhesives to ensure the upper surface of bonded adhesives less than adjustable glue tank using pocket knife in described step three
At least 0.5 millimeter of upper surface.
Design temperature in described step five is 70 degrees Celsius.
The top outer round surface of excessive glue mouthful is pasted by adhesive tape in described step five, pushes up glue screw precession bonded adhesives
Until top is opened the adhesive tape and overflowed from overfall.
Described adjusts the internal cavities sectional area of adjustable glue tank to control the bonding force of bonded adhesives.
The depth of parallelism precision of workpiece is controllable after gluing of the invention, the bondline thickness control accuracy of gluing is reached 2 microns, puts down
Disk precision in the dispensing that 2 microns of row degree；The spot size controllable precise of glued glue point, glued power is controllable；The planted agent that gluing is produced
Power is small, beneficial follow-up polishing；The gluing method has versatility, and the big I of glue point is arbitrarily set, and frock reusability is good；
Product qualification rate is high, meets high-quality requirement.
Brief description of the drawings
Fig. 1 is dish structure figure in the present invention；
Fig. 2 is adjustable glue jar structure figure of the invention；
Fig. 3 is the sectional view of adjustable glue tank of the invention；
Sectional view when Fig. 4 is disk in the present invention.
Embodiment
The parcel plating structure to automobile electronic switch appearance member of the present invention is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the present embodiment comprises the following steps：
Step 1, tool base plate 1 are one piece of smooth metal sheets, and it requires that thickness is more than 20 ± 0.1 millimeters；Length and width
Size is required to unilateral than being wider than more than 5 millimeters, 50 microns of the upper and lower surface depth of parallelism by the long of upper disk workpiece；Top surface plane
Degree is less than 1 micron；
Step 2, bonded adhesives 7 heated with 70 degree of warm water, soften it, be less than adjustable glue tank 2 into diameter with hand rubbing
The diameter of glue ullage chamber 8, the highly bonded adhesives 7 more than the height of glue ullage chamber 8 makes the volume of bonded adhesives 7 be less than glue ullage chamber 8
Volume, when top glue screw 6 is threaded into glue ullage chamber 8, during precession cavity center point, the accounting in glue ullage chamber 8 of top glue screw 6
Position volume is more than the volume of glue ullage chamber 8 plus the volume of bonded adhesives 7.To ensure in top glue screw 6 in glue point bonding process,
In the adjustable glue tank 2 of precession along with top glue screw 6, there is enough glue to be overflowed from excessive glue mouthful 4, it is ensured that bonded adhesives, which is tried one's best, to be filled
Full glue ullage chamber 8.
Step 3, the specified location that 3 adjustable glue tanks 2 are placed on to tool base plate 1, the outer surface of adjustable glue tank 2
Bottom is fixed with AB glue and the upper surface dispensing of tool base plate 1, treats fixation in more than 5 hours.Note top glue screw 6 and excessive glue
The punching of mouth 4 is outer, to push up convenient observation during glue.Notice that the height of adjustable glue tank 2 must be contour, error is less than 3 microns；
Step 4, baking oven is put into by the tool base plate 1 for being bonded with adjustable glue tank 2 is overall, while will also treat glue point bonding
Workpiece 3 is put into baking oven together, notices that workpiece 3 and tool base plate 1 are separated, should not stack placement；
Step 5,3 bonded adhesives 7 are put into glue ullage chamber 8 respectively, and the adjustable glue tank 2 of the precession of glue screw 6 will be pushed up
Push up in glue mouthful 5, the depth of precession is the wall thickness of adjustable glue tank 2, should not protrude the inner surface of adjustable glue tank 2；
Step 6, with adhesive tape excessive glue mouthful 4 is pasted from the top outer round surface of adjustable glue tank 2, and will with pocket knife
The adhesive tape of the prominent adjustable upper surface of glue tank 2 is cut flat with；
Step 7, closing oven door, oven temperature are set to 75 degree, i.e. the melting point of bonded adhesives 7；Open baking oven heating
To design temperature, 10 minutes are incubated, to ensure that bonded adhesives 7 melts completely in glue ullage chamber 8；
Whether step 8, opening oven door, observation 7 have overflowed across the upper surface of adjustable glue tank 2, have been used if overflowing after melting
Pocket knife takes out a part of bonded adhesives 7, to ensure that the upper surface of bonded adhesives 7 melted is less than the upper surface of adjustable glue tank 2 at least
0.5 millimeter；
Step 9, workpiece 3 put down gently in the upper surface of 3 adjustable glue tanks 2, and adjust the water between tool base plate 1
Flat relative position；
Step 10, closing oven door, are reheated to design temperature, and be incubated 10 minutes；
Step 11, opening oven door, inside precession of the glue screws 6 to adjustable glue tank 2 is pushed up with instrument by 3, precession
Depth is to be that adhesive tape is opened on the top at excessive glue mouthful 4 of bonded adhesives 7 and outflow is bonded compared with untill a little；
Step 12, holding oven door are opened, and are closed baking oven power supply, are made the workpiece after gluing 3 and the Temperature fall of tool base plate 1
To room temperature, after being taken out from baking oven, whole gluing procedures are to accuse to complete.
Claims (9)
1. one kind can the accurate glue point disc loading method of impregnation pot type, it is characterised in that including：Some adjustable glue tanks, tool base plate
And bonded adhesives, the height such as each adjustable glue tank is arranged at tool base plate and treats that between the workpiece of glue point bonding, bonded adhesives is filled
In adjustable glue tank glue ullage intracavitary to realize disk in glue point, including following steps：
Step 1: bonded adhesives is heated with warm water, soften it, be positioned over the glue ullage intracavitary of adjustable glue tank；
Step 2: the tool base plate for being bonded with adjustable glue tank is integrally put into baking oven, while will also treat the workpiece of glue point bonding
Baking oven is put into together；
Step 3: being heated to the melting point of bonded adhesives and being incubated to ensure that bonded adhesives melts completely, after caking glue, it is ensured that melt
The upper surface for the bonded adhesives changed is less than the upper surface of adjustable glue tank；
Step 4: will treat glue point bonding workpiece be put in the upper surface of each adjustable glue tank, and adjust with tool base plate it
Between horizontal relative position cause each adjustable glue tank etc. height setting；
Step 5: design temperature is heated to, by bonded adhesives precession after heating so that bonded adhesives overflows.
2. according to the method described in claim 1, it is characterised in that described adjustable glue tank is provided with for precession bonded adhesives
Glue screw and top Jiao Kou are pushed up, and overflows the excessive glue mouthful of bonded adhesives.
3. method according to claim 2, it is characterised in that described top glue screw works as its precession glue ullage chamber central point
When, occupy-place volume of the top glue screw in glue ullage chamber is more than the volume of glue ullage chamber plus the volume of bonded adhesives, to ensure
Glue screw is pushed up in glue point bonding process, in the adjustable glue tank of precession along with top glue screw, has enough glue can be from excessive glue
Mouth overflows, it is ensured that bonded adhesives is full of glue ullage chamber.
4. the method according to claim 1,2 or 3, it is characterised in that described tool base plate thickness is more than 20.1 millimeters；
The size of length and width be required to it is unilateral than treat glue point bonding workpiece length and width it is big 5 millimeters, upper and lower surface is parallel
Spend for 50 microns；Top surface plane degree is less than 1 micron.
5. the method according to claim 1,2 or 3, it is characterised in that the diameter of bonded adhesives is less than in described step one
The diameter of the glue ullage chamber of adjustable glue tank, highly more than adjustable glue tank glue ullage chamber height.
6. the method according to claim 1,2 or 3, it is characterised in that take out bonding using pocket knife in described step three
Glue is less than at least 0.5 millimeter of the upper surface of adjustable glue tank with the upper surface for ensureing bonded adhesives.
7. the method according to claim 1,2 or 3, it is characterised in that the design temperature in described step five is taken the photograph for 70
Family name's degree.
8. according to the method in claim 2 or 3, it is characterised in that the cylindrical table in top of excessive glue mouthful in described step five
Face is pasted by adhesive tape, and top glue screw precession bonded adhesives is until top is opened the adhesive tape and overflowed from excessive glue mouthful.
9. the method according to claim 1,2 or 3, it is characterised in that the internal cavities of the described adjustable glue tank of adjustment
Sectional area is to control the bonding force of bonded adhesives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510891570.9A CN105537062B (en) | 2015-12-07 | 2015-12-07 | Can the accurate glue point disc loading method of impregnation pot type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510891570.9A CN105537062B (en) | 2015-12-07 | 2015-12-07 | Can the accurate glue point disc loading method of impregnation pot type |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105537062A CN105537062A (en) | 2016-05-04 |
| CN105537062B true CN105537062B (en) | 2017-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510891570.9A Active CN105537062B (en) | 2015-12-07 | 2015-12-07 | Can the accurate glue point disc loading method of impregnation pot type |
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| CN (1) | CN105537062B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108906495B (en) * | 2018-09-11 | 2020-01-03 | 盐城威布三维科技有限公司 | Drum-type glue spreader for thermoplastic plate |
| CN112916314B (en) * | 2021-01-21 | 2022-05-10 | 中国工程物理研究院激光聚变研究中心 | Low-strain disc loading device of thin plate element and method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143807A (en) * | 2008-09-05 | 2011-08-03 | 贝尔直升机泰克斯特龙公司 | Method and apparatus for reticulating an adhesive to the surface network of a cellular core structure |
| CN204052062U (en) * | 2014-07-10 | 2014-12-31 | 成其实业股份有限公司 | The packing element structure of hot melt adhesive machine |
| JP2015066537A (en) * | 2013-09-30 | 2015-04-13 | 三菱化学株式会社 | Die, die coater comprising the die, manufacturing method for optical device using the die coater, optical device manufactured by the manufacturing method, and liquid crystal device comprising the optical device |
| CN204261887U (en) * | 2014-11-18 | 2015-04-15 | 泉州新日成热熔胶设备有限公司 | A kind of high accuracy PUR nozzle and thermosol gelgun |
| CN204638463U (en) * | 2015-03-09 | 2015-09-16 | 厦门市五翔盛环保科技有限公司 | A kind of heat-conducting cream apparatus for coating |
-
2015
- 2015-12-07 CN CN201510891570.9A patent/CN105537062B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143807A (en) * | 2008-09-05 | 2011-08-03 | 贝尔直升机泰克斯特龙公司 | Method and apparatus for reticulating an adhesive to the surface network of a cellular core structure |
| JP2015066537A (en) * | 2013-09-30 | 2015-04-13 | 三菱化学株式会社 | Die, die coater comprising the die, manufacturing method for optical device using the die coater, optical device manufactured by the manufacturing method, and liquid crystal device comprising the optical device |
| CN204052062U (en) * | 2014-07-10 | 2014-12-31 | 成其实业股份有限公司 | The packing element structure of hot melt adhesive machine |
| CN204261887U (en) * | 2014-11-18 | 2015-04-15 | 泉州新日成热熔胶设备有限公司 | A kind of high accuracy PUR nozzle and thermosol gelgun |
| CN204638463U (en) * | 2015-03-09 | 2015-09-16 | 厦门市五翔盛环保科技有限公司 | A kind of heat-conducting cream apparatus for coating |
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| CN105537062A (en) | 2016-05-04 |
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