CN105525312B - A kind of tin plating solution and preparation method thereof - Google Patents
A kind of tin plating solution and preparation method thereof Download PDFInfo
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- CN105525312B CN105525312B CN201510911722.7A CN201510911722A CN105525312B CN 105525312 B CN105525312 B CN 105525312B CN 201510911722 A CN201510911722 A CN 201510911722A CN 105525312 B CN105525312 B CN 105525312B
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- plating solution
- sodium
- pyrovinic acid
- tin plating
- tin
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The present invention relates to electroplating technology, specifically discloses a kind of tin plating solution and preparation method thereof.Described tin plating solution includes following composition：Sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, sodium tartrate, dodecyl benzyl dimethyl ammonium chloride, ammoniacal liquor and tin methane sulfonate.Described tin plating solution can carry out plating production compared with existing tin plating solution at 25 ~ 35 DEG C, electroplate, be of wide application available for nonacidic solutions, and when being electroplated, electric current can improve 100%, plate speed and improve 100%；Electroplating cost reduces by 20%.
Description
Technical field
The present invention relates to electroplating technology, and in particular to a kind of tin plating solution and preparation method thereof.
Background technology
Tin plating solution is a kind of dedicated liquid for tin plating industry, and tin plating available for alloy surface progress, tin coating is
Bright silvery white, the weldability and dicoration of metal can be increased, do not influence electric conductivity, available for electronics industry, household goods, food
Product packaging etc..
But current tin plating solution pH value is 2-4, subacidity, is easily spread when high current is electroplated, plating solution will be refrigerated to
20-28 DEG C of use, electric current is small during plating, and speed is slow, and plating solution processing range is small.Therefore, existing tin plating solution use is limited to,
It is high to further result in plating production cost.
The content of the invention
The technical problems to be solved by the invention are, in order to overcome the above-mentioned deficiency of prior art, there is provided a kind of tin plating molten
Liquid.
Above-mentioned technical problem to be solved by this invention is achieved by the following technical programs：A kind of tin plating solution, bag
Containing following composition：Sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, sodium tartrate, ten
Dialkyl dimethyl benzyl ammonium chloride, ammoniacal liquor and tin methane sulfonate.
Preferably, described tin plating solution, the composition of following percentage by weight is included：Sodium gluconate or K-IAO
2%-30%, pyrovinic acid potassium or pyrovinic acid ammonium 0.3%-10%, sodium citrate 0.1%-10%, sodium tartrate 0.1%-10%, 12
Zephiran 0.03%-3%, ammoniacal liquor 0.1%-10% and tin methane sulfonate 0.2%-5%.
It is highly preferred that described tin plating solution, the composition of following percentage by weight is included：Sodium gluconate or gluconic acid
Potassium 5%-20%, pyrovinic acid potassium or pyrovinic acid ammonium 1%-5%, sodium citrate 1%-5%, sodium tartrate 1%-5%, dimethyl
Base benzyl ammonium chloride 0.1%-1%, ammoniacal liquor 0.1%-1% and tin methane sulfonate 2%-5%.
Most preferably, described tin plating solution, the composition of following percentage by weight is included：Sodium gluconate or gluconic acid
Potassium 15%, pyrovinic acid potassium or pyrovinic acid ammonium 4.5%, sodium citrate 2%, sodium tartrate 2%, dodecyl dimethyl Benzylmagnesium chloride
Ammonium 0.1%, ammoniacal liquor 0.2% and tin methane sulfonate 3.5%.
The preparation method of described tin plating solution, is comprised the following steps：By sodium gluconate or K-IAO, methyl sulphur
Sour potassium or pyrovinic acid ammonium, sodium citrate, sodium tartrate are added to the water dissolving together, then dodecyl dimethyl Benzylmagnesium chloride
Ammonium, tin methane sulfonate, ammoniacal liquor, it is sufficiently mixed uniformly.
Preferably, the preparation method of described tin plating solution, is comprised the following steps：By sodium gluconate or gluconic acid
Potassium, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, sodium tartrate are added to the water together, in 25-35 DEG C of dissolving, Ran Houyi
Secondary addition dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor, are sufficiently mixed uniformly.
Beneficial effect：（1）The invention provides a kind of tin plating solution being completely newly formulated；（2）Described tin plating solution can be with
Plating production is carried out at 25-35 DEG C, wide temperature range is spent than existing 20-28 DEG C of tin plating solution and temperature is high；（3）Described
Tin plating solution can carry out plating production under pH value 4-7, than the pH value of existing tin plating solution（3-3.5）Scope it is wide, can use
Electroplate, be of wide application in nonacidic solutions；（4）Compared with existing tin plating solution, enter in tin plating solution of the present invention
Electric current can improve 100% during row plating, plate speed and improve 100%；Electroplating cost reduces by 20%.
Embodiment
The present invention is explained further below in conjunction with specific embodiment, but embodiment does not do any type of limit to the present invention
It is fixed.
The tin plating solution percentage of weight formula of embodiment 1：Sodium gluconate 30%, pyrovinic acid potassium or pyrovinic acid ammonium
0.3%%th, sodium citrate 0.1%%, sodium tartrate 0.1%%, dodecyl benzyl dimethyl ammonium chloride 0.03%, ammoniacal liquor 0.1% and first
Base sulfonic acid tin 0.2%, surplus are water.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution percentage of weight formula of embodiment 2：Sodium gluconate or K-IAO 30%, pyrovinic acid potassium or
Pyrovinic acid ammonium 10%, sodium citrate 10%, sodium tartrate 10%, dodecyl benzyl dimethyl ammonium chloride 3%, ammoniacal liquor 10% and first
Base sulfonic acid tin 2.5%.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution percentage of weight formula of embodiment 3：Sodium gluconate or K-IAO 2%, pyrovinic acid potassium or first
Base ichthyodin 10%, sodium citrate 10%, sodium tartrate 10%, dodecyl benzyl dimethyl ammonium chloride 3%, ammoniacal liquor 10% and methyl
Sulfonic acid tin 2.5%.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution percentage of weight formula of embodiment 4：Sodium gluconate or K-IAO 5%, pyrovinic acid potassium or first
Base ichthyodin 5%, sodium citrate 5%, sodium tartrate 5%, dodecyl benzyl dimethyl ammonium chloride 2%, ammoniacal liquor 5% and pyrovinic acid
Tin 1%.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution percentage of weight formula of embodiment 5：Sodium gluconate or K-IAO 5%, pyrovinic acid potassium or
Pyrovinic acid ammonium 1%, sodium citrate 1%, sodium tartrate 1%, dodecyl benzyl dimethyl ammonium chloride 0.3%, ammoniacal liquor 1% and methyl
Sulfonic acid tin 2%.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution percentage of weight formula of embodiment 6：Sodium gluconate 15%, pyrovinic acid potassium or pyrovinic acid ammonium
4.5%%th, sodium citrate 2%%, sodium tartrate 2%%, dodecyl benzyl dimethyl ammonium chloride 0.1%, ammoniacal liquor 0.2% and pyrovinic acid
Tin 3.5%, surplus are water.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution percentage of weight formula of embodiment 7：Sodium gluconate or K-IAO 15%, pyrovinic acid potassium or
Pyrovinic acid ammonium 4.5%, sodium citrate 2%, sodium tartrate 2%, dodecyl benzyl dimethyl ammonium chloride 0.1%, the and of ammoniacal liquor 0.2%
Tin methane sulfonate 3.5%.
Preparation method：By sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, wine
Stone acid sodium is added to the water together, in 30 DEG C of dissolvings, then sequentially adds dodecyl benzyl dimethyl ammonium chloride, pyrovinic acid
Tin, ammoniacal liquor, it is sufficiently mixed uniformly.
The tin plating solution in above-described embodiment is proven compared with existing tin plating solution, can be entered at 25-35 DEG C
Row plating production, spend wide temperature range than existing 20-28 DEG C of tin plating solution and temperature is high；It can be electroplated under pH value 4-7
Production, than the pH value of existing tin plating solution（3-3.5）Scope it is wide, available for nonacidic solutions electroplate, be of wide application；Enter
Electric current can improve 100% during row plating, plate speed and improve 100%；Electroplating cost reduces by 20%.
Claims (3)
1. a kind of tin plating solution, it is characterised in that include the composition of following percentage by weight：
Sodium gluconate or K-IAO 15%, pyrovinic acid potassium or pyrovinic acid ammonium 4.5%, sodium citrate 2%, sodium tartrate
2%th, the .1% of dodecyl benzyl dimethyl ammonium chloride 0, the .2% of ammoniacal liquor 0 and the .5% of tin methane sulfonate 3.
2. the preparation method of the tin plating solution described in claim 1, it is characterised in that comprise the following steps：
Sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, sodium tartrate are added together
Dissolve, then dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor, be sufficiently mixed uniformly in water.
3. the preparation method of tin plating solution according to claim 2, it is characterised in that comprise the following steps：
Sodium gluconate or K-IAO, pyrovinic acid potassium or pyrovinic acid ammonium, sodium citrate, sodium tartrate are added together
In water, in 25-35 DEG C of dissolving, dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor are then sequentially added, fully
It is well mixed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510911722.7A CN105525312B (en) | 2015-12-11 | 2015-12-11 | A kind of tin plating solution and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510911722.7A CN105525312B (en) | 2015-12-11 | 2015-12-11 | A kind of tin plating solution and preparation method thereof |
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| CN105525312A CN105525312A (en) | 2016-04-27 |
| CN105525312B true CN105525312B (en) | 2017-12-29 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107914009B (en) * | 2017-12-15 | 2019-11-19 | 宁波广新纳米材料有限公司 | A kind of production method of tin plating copper powder |
| CN111962050A (en) * | 2020-09-11 | 2020-11-20 | 江苏佳华金属线有限公司 | Formula of tinning liquid for copper wire with good conductive effect |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200706707A (en) * | 2005-04-28 | 2007-02-16 | Meltex Inc | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
| CN101358361A (en) * | 2007-08-01 | 2009-02-04 | 太阳化学工业株式会社 | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4698904B2 (en) * | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | Tin or tin-based alloy plating bath, tin salt and acid or complexing agent solution for building bath, maintenance or replenishment of the plating bath, and electric / electronic parts manufactured using the plating bath |
| JP2007239076A (en) * | 2006-03-10 | 2007-09-20 | Meltex Inc | Tinning coat, tinning liquid for forming tinning coat, method for forming tinning coat and chip type electronic parts formed of electrode with tinning coat |
| JP2009191335A (en) * | 2008-02-15 | 2009-08-27 | Ishihara Chem Co Ltd | Plating solution and electronic parts |
| JP5278169B2 (en) * | 2009-05-29 | 2013-09-04 | Ｔｄｋ株式会社 | Electrotin plating solution and method for manufacturing electronic component |
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- 2015-12-11 CN CN201510911722.7A patent/CN105525312B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200706707A (en) * | 2005-04-28 | 2007-02-16 | Meltex Inc | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
| CN101358361A (en) * | 2007-08-01 | 2009-02-04 | 太阳化学工业株式会社 | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
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| CN105525312A (en) | 2016-04-27 |
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