CN105517347B - A kind of method of circuit board surface coating - Google Patents
A kind of method of circuit board surface coating Download PDFInfo
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- CN105517347B CN105517347B CN201410505145.7A CN201410505145A CN105517347B CN 105517347 B CN105517347 B CN 105517347B CN 201410505145 A CN201410505145 A CN 201410505145A CN 105517347 B CN105517347 B CN 105517347B
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- circuit board
- line
- hollow slots
- board mold
- mold
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Abstract
The invention discloses a kind of circuit board surface coating method, the method includes：The outer graphics of circuit board are produced, the outer graphics include needing to carry out the first line figure of the first surface coating；First circuit board mold is made, the position corresponding to the first line figure of the first circuit board mold is provided with the first hollow slots, the position of other outer graphics other than the first line figure is provided with the first holding tank；The first circuit board mold is placed on the circuit board and is laminated；The first heavy metal of chemistry on the first line figure appeared in first hollow slots.The embodiment of the present invention is for solving the problems of circuit board surface coating in the prior art.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of method of circuit board surface coating.
Background technology
The application that the coating of a variety of surfaces appears on same circuit board simultaneously is more and more, in recent years because chemistry silver with
The extensive use of the surfaces such as chemical tin coating, using chemical silver and chemical tin as representative and other surfaces coating composition selection
Property surface coating it is more and more, such as：Chemical nickel gold and chemistry silver, chemical nickel gold and chemical tin, chemistry silver and chemical tin, chemistry
It is silver-colored and gold-plated etc., but dry film is used to need to be removed dry film with strong alkali solution as resistance to surface coating agent, and chemistry is silver-colored
The problems such as alkaline solution will appear discoloration, oxidation is encountered with the coating of both surfaces of chemical tin, therefore dry film can not be used as anti-
Surface application agent.
It is using the technique progress for pasting red adhesive tape, such as chemical nickel gold and chemistry to overcome disadvantage mentioned above, current method
Silver-colored Selective coating using first chemical nickel gold in technique, then touch with red adhesive tape the region of chemical nickel gold, then chemistry silver again,
Red adhesive tape is removed again after chemical silver.This technique often encounter surface coating figure it is extremely complex (irregular, intensive, several
Amount is more) when due to surface patch position more than and paste red adhesive tape is troublesome in poeration, distance closely and small no red adhesive tape of the choice specimen of calligraphy in space etc.
Many reasons and can not use, so that such surface coating design is encountered great difficulty.
Invention content
The embodiment of the present invention provides a kind of method of circuit board surface coating, for solving circuit board surface in the prior art
The problems of coating.
First aspect present invention provides a kind of method of circuit board surface coating, including：Produce the outer layer figure of circuit board
Shape, the outer graphics include needing to carry out the first line figure of the first surface coating；Make first circuit board mold, institute
The position corresponding to the first line figure for stating first circuit board mold offers the first hollow slots, corresponds to described first
The position of other outer graphics other than line pattern is provided with the first holding tank；The first circuit board mold is placed on institute
It states on circuit board and is laminated；The first heavy metal of chemistry on the first line figure appeared in first hollow slots.
Therefore the embodiment of the present invention, using the outer graphics for producing circuit board, the outer graphics include needing
Carry out the first line figure of the first surface coating；Make first circuit board mold, the correspondence of the first circuit board mold
The position of the first line figure is provided with the first hollow slots, corresponds to other outer layers other than the first line figure
The position of figure is provided with the first holding tank；The first circuit board mold is placed on the circuit board and is laminated；Institute
The technical solution for stating the first heavy metal of chemistry on the first line figure appeared in the first hollow slots, achieves following skill
Art effect：Due to being provided with hollow slots and holding tank on the circuit board mold of making, when carrying out the surface coating of circuit board, engrave
Appear in empty slot and needs to carry out the line pattern that chemical turmeric belongs to, and All other routes figure then passes through the holding tank of circuit board mold
It is protected, which has the function of resistance to surface coating agent, can be suitably used for selective surface's coating of any situation,
Solves the problems of circuit board surface coating in the prior art.
Description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is one embodiment schematic diagram for the method that circuit board surface coats in the embodiment of the present invention；
Fig. 2 is a plan view of circuit board outer graphics in the embodiment of the present invention；
Fig. 3 is a sectional view of circuit board mold in the embodiment of the present invention；
Fig. 4 is a sectional view of circuit board mold and circuit board lamination in the embodiment of the present invention.
Specific implementation mode
The embodiment of the present invention provides a kind of method method of circuit board surface coating, is applied for solving surface in the prior art
The problems of cover.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model that the present invention protects
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of method of circuit board surface coating, it may include：
101, the outer graphics of circuit board are produced, outer graphics include the First Line for needing to carry out the first surface coating
Road figure；
Referring to FIG. 2, producing the outer graphics of circuit board 200, which includes needing to carry out the first surface
The first line figure 201 of coating.
It should be noted that after producing the outer graphics of circuit board, also need further to carry out welding resistance to the circuit board
And print character, concrete technology do not limit herein.
Optionally, outer graphics further include the second line pattern for needing to carry out second of surface coating.
It should be noted that since first line figure and the second line pattern need to carry out two different surface paintings
It covers, therefore first line figure and the second line pattern are intended only as distinguishing, without other Special Significances.
102, first circuit board mold is made, the position corresponding to first line figure of first circuit board mold is provided with
First hollow slots are provided with the first holding tank corresponding to the position of other outer graphics other than the first line figure；
Referring to FIG. 3, after producing the outer graphics of circuit board 200, first circuit board mold 202 is made, first electricity
The position corresponding to first line figure 201 of road board mold 202 is provided with the first hollow slots 203, corresponds to the First Line
The position of other outer graphics other than road figure 201 is provided with the first holding tank 204.
Optionally, second circuit board mold is made, the position corresponding to the second line pattern of second circuit board mold is set
The second hollow slots are equipped with, the position of other outer graphics other than second line pattern is provided with the second receiving
Slot.
It is understood that the first holding tank being arranged on first circuit board mold is for protecting other than first line figure
Other outer graphics from be coated and from be laminated damage；The second holding tank being arranged on second circuit board mold is used
In protect other outer graphics other than the second line pattern from be coated and from be laminated damage.
Optionally, making first circuit board mold 202 includes：
Blanking the first flexible glue identical with the planar dimension of circuit board, the thickness of the first flexible glue is between 0.5~1.0mm；
First flexible glue is layered in the first tooling, is bonded the first flexible glue and the first tooling by glue pressing machine；Using the method for controlled depth milling
First hollow slots 203 are milled out on first flexible glue, and corresponding to other outer graphics other than first line figure
Position setting the first holding tank 204, and remove the first tooling；
Making second circuit board mold includes：
Blanking the second flexible glue identical with the planar dimension of circuit board, the thickness of the second flexible glue is between 0.5~1.0mm；
Second flexible glue is layered in the second tooling, is bonded the second flexible glue and the second tooling by glue pressing machine；Using the method for controlled depth milling
The second hollow slots are milled out on second flexible glue, correspond to the position setting of other outer graphics other than the second line pattern
The second holding tank, and remove the second tooling.
It is understood that first blanking flexible glue, then flexible glue is bonded in tooling, it can be made on flexible glue by tooling
Milling hollow slots and holding tank can be positioned preferably, and will not arbitrarily be changed.
It should be noted that the first tooling and the second tooling can be same toolings, it can also be different tooling, work as system
After making first circuit board mold, the first tooling has been dismantled, can continue to make second circuit board mold using the first tooling, also may be used
Separately to take other toolings to carry out making second circuit board mold, it is not specifically limited herein.
It should be noted that the flexible glue is to be formed with plastics by being molded, the softer ﹐ of feel needs not move through vulcanization under room temperature
The material of processing, can heatproof, insulation, therefore disclosure satisfy that the flexible glue of characteristic may serve to make circuit board mold can be with
It is polyethylene, is not specifically limited herein.
Optionally, the single side size of the first hollow slots 203 is more than the single side size 0.2mm of first line figure 201；
The single side size of second hollow slots is more than the single side size 0.2mm of the second line pattern.
Optionally, the depth of the first holding tank 204 is 0.2mm, and the single side size of first holding tank 204, which is more than, to be held
The single side size 0.2mm of other outer graphics other than the first line figure received；
The depth of second holding tank is 0.2mm, and the single side size of second holding tank is more than the second accommodated circuit
The single side size 0.2mm of other outer graphics other than figure.
103, first circuit board mold is placed on circuit boards and is laminated；
Referring to FIG. 4, after making first circuit board mold 202, first circuit board mold 202 is placed on circuit board 200
It goes up and is laminated.
Optionally, first circuit board mold 202 is placed on circuit board 200 and is laminated and include：
First circuit board mold 202 is placed on circuit board 200, is positioned using pin, using laminating press pair first
Circuit board mold 202 and circuit board 200 are laminated, and the temperature of the press is 40~60 DEG C, pumpdown time 20min, and pressure is
60~100psi.
It should be noted that psi refers to sterling/square inch, 145psi=1MPa.
104, the first heavy metal of chemistry on the first line figure appeared in the first hollow slots.
First circuit board mold is placed to the first line figure appeared in the first hollow slots on circuit boards and after lamination
The first heavy metal of chemistry in shape.
Optionally, chemical nickel gold on the first line figure appeared in the first hollow slots.
It should be noted that can also be except chemical nickel gold on the first line figure appeared in the first hollow slots
Chemical silver, chemical tin, chemical NiPdAu etc. do not limit specifically herein.
Optionally, further include after the first heavy metal of chemistry on the first line figure appeared in the first hollow slots：
First circuit board mold is removed, second circuit board mold is placed on circuit board and is laminated, is engraved described second
Heavy second of the metal of chemistry on the second line pattern appeared in empty slot.
Optionally, second circuit board mold is placed on circuit board and is laminated and include：
Second circuit board mold is placed on circuit board, is positioned using pin, using laminating press to second circuit board
The temperature of mold and circuit board lamination, the press is 40~60 DEG C, pumpdown time 20min, and pressure is 60~100psi.
Optionally, heavy second of the metal of chemistry includes on the second line pattern appeared in the second hollow slots：
Chemistry silver on the second line pattern appeared in the second hollow slots.
It should be noted that can also be except chemistry silver on the second line pattern appeared in the second hollow slots
Chemical nickel gold, chemical tin, chemical NiPdAu are not specifically limited herein, it is however noted that, on first line figure
It is different with the metal that chemistry on the second line pattern is heavy, that is, chemistry has sunk a certain metal on first line figure, in the second line
What chemistry was heavy on the figure of road is another different metal.
It should be noted that the method that the embodiment of the present invention only illustrates the coating of two kinds of surfaces, it can be according to practical feelings
Condition selects two or more circuit board surfaces to coat using the surface coating process that the embodiment of the present invention is provided, and does not do and has herein
Body limits.
In conclusion the embodiment of the present invention, using the outer graphics for producing circuit board, outer graphics include needing to carry out
The first line figure of the first surface coating；First circuit board mold is made, first circuit board mold corresponds to First Line
The position of road figure is provided with the first hollow slots, is set corresponding to the position of other outer graphics other than the first line figure
It is equipped with the first holding tank；First circuit board mold is placed on circuit boards and is laminated；First appeared in the first hollow slots
The technical solution of the first heavy metal of chemistry, achieves following technique effect on line pattern：Due to the circuit board mold of making
On be provided with hollow slots and holding tank, when carrying out the surface coating of circuit board, needs are appeared in hollow slots and carry out chemical turmeric
The line pattern of category, and All other routes figure is then protected by the holding tank of circuit board mold, which has
The function of resistance to surface coating agent can be suitably used for selective surface's coating of any situation, solve circuit board table in the prior art
The problems of face coating.
The method for being provided for the embodiments of the invention a kind of coating of circuit board surface above is described in detail, but with
The explanation of upper embodiment is merely used to help understand the method and its core concept of the present invention, should not be construed as the limit to the present invention
System.Those skilled in the art in the technical scope disclosed by the present invention, can readily occur according to the thought of the present invention
Change or replacement, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of method of circuit board surface coating, which is characterized in that including：
The outer graphics of circuit board are produced, the outer graphics include needing to carry out the first line figure of the first surface coating
Shape；
First circuit board mold is made, the position corresponding to the first line figure of the first circuit board mold is provided with
First hollow slots are provided with the first holding tank corresponding to the position of other outer graphics other than the first line figure；
The first circuit board mold is placed on the circuit board and is laminated；
The first heavy metal of chemistry on the first line figure appeared in first hollow slots.
2. according to the method described in claim 1, it is characterized in that, the outer graphics further include needing to carry out second of surface
Second line pattern of coating；The method further includes：
Second circuit board mold is made, the position corresponding to second line pattern of the second circuit board mold is provided with
Second hollow slots are provided with the second holding tank corresponding to the position of other outer graphics other than second line pattern；
Further include after the first heavy metal of chemistry on the first line figure appeared in first hollow slots：
The first circuit board mold is removed, the second circuit board mold is placed on the circuit board and is laminated, in institute
Heavy second of the metal of chemistry on second line pattern appeared in the second hollow slots is stated, second of metal is difference
In another metal of the first metal.
3. according to the method described in claim 2, it is characterized in that,
The making first circuit board mold includes：
Blanking the first flexible glue identical with the planar dimension of the circuit board, the thickness of first flexible glue 0.5~1.0mm it
Between；First flexible glue is layered in the first tooling, is bonded first flexible glue and first tooling by glue pressing machine；It adopts
First hollow slots and first holding tank are milled out on first flexible glue with the method for controlled depth milling, and described in removal
First tooling；
The making second circuit board mold includes：
Blanking the second flexible glue identical with the planar dimension of the circuit board, the thickness of second flexible glue 0.5~1.0mm it
Between；Second flexible glue is layered in the second tooling, is bonded second flexible glue and second tooling by glue pressing machine；It adopts
Second hollow slots and second holding tank are milled out on second flexible glue with the method for controlled depth milling, and described in removal
Second tooling.
4. according to the method in claim 2 or 3, which is characterized in that
The single side size of first hollow slots is more than the single side size 0.2mm of the first line figure；
The single side size of second hollow slots is more than the single side size 0.2mm of second line pattern.
5. according to the method in claim 2 or 3, which is characterized in that
The depth of first holding tank is 0.2mm, and the single side size of first holding tank is more than accommodated First Line
The single side size 0.2mm of other outer graphics other than the figure of road；
The depth of second holding tank is 0.2mm, and the single side size of second holding tank is more than the second accommodated line
The single side size 0.2mm of other outer graphics other than the figure of road.
6. method according to any one of claim 1-3, which is characterized in that described to put the first circuit board mold
It sets on the circuit board and is laminated and include：
The first circuit board mold is placed on the circuit board, is positioned using pin, using laminating press to described
The temperature of one circuit board mold and circuit board lamination, the press is 40~60 DEG C, pumpdown time 20min, pressure
For 60~100psi.
7. method according to any one of claim 1-3, which is characterized in that described to appear in first hollow slots
The first line figure on chemistry sink the first metal include：
Chemical nickel gold on the first line figure appeared in first hollow slots.
8. according to the method in claim 2 or 3, which is characterized in that the removal first circuit board mold, it will be described
Second circuit board mold is placed on the circuit board and is laminated：
It adopts and removes the first circuit board mold with machinery method；
The second circuit board mold is placed on the circuit board, is positioned using pin, using laminating press to described
The temperature of two circuit board molds and circuit board lamination, the press is 40~60 DEG C, pumpdown time 20min, pressure
For 60~100psi.
9. according to the method in claim 2 or 3, which is characterized in that it is described appear in second hollow slots described in
Heavy second of the metal of chemistry includes on second line pattern：
Chemistry silver on second line pattern appeared in second hollow slots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410505145.7A CN105517347B (en) | 2014-09-26 | 2014-09-26 | A kind of method of circuit board surface coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410505145.7A CN105517347B (en) | 2014-09-26 | 2014-09-26 | A kind of method of circuit board surface coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517347A CN105517347A (en) | 2016-04-20 |
| CN105517347B true CN105517347B (en) | 2018-08-07 |
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| CN201410505145.7A Active CN105517347B (en) | 2014-09-26 | 2014-09-26 | A kind of method of circuit board surface coating |
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| CN113498271A (en) * | 2021-06-04 | 2021-10-12 | 深圳市信维通信股份有限公司 | Preparation process of PCB injection molded body |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100827620B1 (en) * | 2006-07-10 | 2008-05-07 | 삼성전기주식회사 | Method for manufacturing printed circuit board using imprint technology |
| CN101631427B (en) * | 2008-07-14 | 2011-07-27 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN102056417A (en) * | 2010-11-24 | 2011-05-11 | 深南电路有限公司 | Process for manufacturing partially gold-plated board |
| CN102045963B (en) * | 2010-12-28 | 2012-07-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |