CN105517347A - Circuit board surface coating method - Google Patents
Circuit board surface coating method Download PDFInfo
- Publication number
- CN105517347A CN105517347A CN201410505145.7A CN201410505145A CN105517347A CN 105517347 A CN105517347 A CN 105517347A CN 201410505145 A CN201410505145 A CN 201410505145A CN 105517347 A CN105517347 A CN 105517347A
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- circuit board
- line
- hollow slots
- flexible glue
- holding tank
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Abstract
The invention discloses a circuit board surface coating method. The circuit board surface coating method is characterized in that an outer layer pattern of a circuit board can be produced, and comprises a first line pattern requiring first surface coating; a first circuit board die can be produced, and the position of the first circuit board die corresponding to the first line pattern is provided with a first hollow groove, and the position of the first circuit board die corresponding to other outer layer patterns except the first line pattern is provided with a first accommodation groove; the first circuit board die is disposed on the circuit board for the lamination; and a first metal can be chemically deposited on the first line pattern exposed out of the first hollow groove. The problem of the prior art during the circuit board surface coating can be solved.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to the method for a kind of circuit board surface coating.
Background technology
The application that kinds of surface coating appears on same circuit board simultaneously gets more and more, in recent years, because the extensive use of the surface-coated such as chemistry silver and chemical tin, be representative with chemistry silver and chemical tin, apply more and more with the selective surface that other surface-coated form, such as: chemical nickel and gold and chemistry silver, chemical nickel and gold and chemical tin, chemistry silver and chemical tin, chemistry is silver-colored and gold-plated etc., but adopt dry film to need to carry out removal dry film with strong alkali solution as resistance to surface coating agent, and chemistry silver and these two kinds of surface-coated of chemical tin run into alkaline solution and there will be variable color, the problems such as oxidation, therefore dry film cannot be adopted as resistance to surface coating agent.
For overcoming above shortcoming, current method is adopt the technique of pasting red adhesive tape to carry out, such as chemical nickel and gold and chemistry silver Selective coating, technique adopts first chemical nickel and gold, the region of chemical nickel and gold is touched again with red adhesive tape, and then chemistry silver, remove red adhesive tape again after chemical silver.This technique position of often pasting due to surface when running into surface-coated figure very complicated (irregular, intensive, quantity is many) many and paste red adhesive tape troublesome poeration, distance is near and space is little cannot paste many reasons such as red adhesive tape and cannot adopt, and makes such surface-coated design encounter great difficulty.
Summary of the invention
A kind of method that the embodiment of the present invention provides circuit board surface to apply, for solving the problem in prior art existing for circuit board surface coating.
A kind of method that first aspect present invention provides circuit board surface to apply, comprising: the outer graphics producing circuit board, and described outer graphics comprises the first line figure needing to carry out the first surface-coated; Make first circuit board mould, the position corresponding to described first line figure of described first circuit board mould offers the first hollow slots, and the position corresponding to other outer graphics beyond described first line figure is provided with the first holding tank; Described first circuit board mould to be placed on described circuit board and lamination; Chemistry the first metal heavy on the described first line figure appeared in described first hollow slots.
Therefore the embodiment of the present invention adopts the outer graphics producing circuit board, and described outer graphics comprises the first line figure needing to carry out the first surface-coated, make first circuit board mould, the position corresponding to described first line figure of described first circuit board mould is provided with the first hollow slots, and the position corresponding to other outer graphics beyond described first line figure is provided with the first holding tank, described first circuit board mould to be placed on described circuit board and lamination, the technical scheme of chemistry the first metal heavy on the described first line figure appeared in described first hollow slots, achieve following technique effect: the circuit board mould due to making is provided with hollow slots and holding tank, when carrying out the surface-coated of circuit board, the line pattern needing to carry out chemical turmeric genus is appeared in hollow slots, All other routes figure is then protected by the holding tank of circuit board mould, this circuit board mould has the function of resistance to surface coating agent, selective surface's coating of any situation can be applicable to, solve the problem existing for circuit board surface coating in prior art.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is an embodiment schematic diagram of the method for circuit board surface coating in the embodiment of the present invention;
Fig. 2 is a plane graph of circuit board outer graphics in the embodiment of the present invention;
Fig. 3 is a profile of circuit board mould in the embodiment of the present invention;
Fig. 4 is a profile of circuit board mould and circuit board lamination in the embodiment of the present invention.
Embodiment
A kind of method method that the embodiment of the present invention provides circuit board surface to apply, for solving the problem in prior art existing for surface-coated.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, a kind of method that the embodiment of the present invention provides circuit board surface to apply, can comprise:
101, produce the outer graphics of circuit board, outer graphics comprises the first line figure needing to carry out the first surface-coated;
Please refer to Fig. 2, produce the outer graphics of circuit board 200, this outer graphics comprises the first line figure 201 needing to carry out the first surface-coated.
It should be noted that, when after the outer graphics producing circuit board, also need to carry out welding resistance and print character to this circuit board further, concrete technology does not limit herein.
Optionally, outer graphics also comprises the second line pattern needing to carry out the second surface-coated.
It should be noted that, because first line figure and the second line pattern need to carry out two kinds of different surface-coated, therefore first line figure and the second line pattern are just as difference, do not have other Special Significance.
102, make first circuit board mould, the position corresponding to first line figure of first circuit board mould is provided with the first hollow slots, and the position corresponding to other outer graphics beyond described first line figure is provided with the first holding tank;
Please refer to Fig. 3, after producing the outer graphics of circuit board 200, make first circuit board mould 202, the position corresponding to first line figure 201 of this first circuit board mould 202 is provided with the first hollow slots 203, and the position corresponding to other outer graphics beyond described first line figure 201 is provided with the first holding tank 204.
Optionally, make second circuit board mold, the position corresponding to the second line pattern of second circuit board mold is provided with the second hollow slots, and the position corresponding to other outer graphics beyond described second line pattern is provided with the second holding tank.
Be understandable that, the first holding tank that first circuit board mould is arranged avoids coated for the protection of other outer graphics beyond first line figure and avoids being laminated damage; The second holding tank that second circuit board mold is arranged avoids coated for the protection of other outer graphics beyond the second line pattern and avoids being laminated damage.
Optionally, make first circuit board mould 202 to comprise:
The first flexible glue that blanking is identical with the planar dimension of circuit board, the thickness of the first flexible glue is between 0.5 ~ 1.0mm; First flexible glue is layered in the first frock, by glue pressing machine by the first flexible glue and the bonding of the first frock; Adopt the method for the dark milling of control on described first flexible glue, mill out described first hollow slots 203, and the first holding tank 204 that the position corresponding to other outer graphics beyond first line figure is arranged, and remove the first frock;
Make second circuit board mold to comprise:
The second flexible glue that blanking is identical with the planar dimension of circuit board, the thickness of the second flexible glue is between 0.5 ~ 1.0mm; Second flexible glue is layered in the second frock, by glue pressing machine by the second flexible glue and the bonding of the second frock; Adopt the method for the dark milling of control on described second flexible glue, to mill out the second hollow slots, the second holding tank that the position corresponding to other outer graphics beyond the second line pattern is arranged, and remove the second frock.
Be understandable that, first blanking flexible glue, then flexible glue is bonded in frock, milling hollow slots and holding tank on flexible glue can be made better to locate by frock, and can not arbitrarily change.
It should be noted that, first frock and the second frock can be same frocks, also can be different frocks, when after making first circuit board mould, dismantle the first frock, the first frock can be utilized to continue to make second circuit board mold, also separately can get other frocks and carry out making second circuit board mold, be not specifically limited herein.
It should be noted that, this flexible glue is formed by injection moulding with plastics, and under normal temperature, the softer ﹐ of feel does not need the material through vulcanizing treatment, can heatproof, insulation, therefore, it is possible to the flexible glue meeting characteristic can be used for making circuit board mould, can be polyethylene, be not specifically limited herein.
Optionally, the single side size of the first hollow slots 203 is greater than the single side size 0.2mm of first line figure 201;
The single side size of the second hollow slots is greater than the single side size 0.2mm of the second line pattern.
Optionally, the first holding tank 204 the degree of depth be 0.2mm, the single side size of this first holding tank 204 is greater than the single side size 0.2mm of other outer graphics beyond held first line figure;
Second holding tank the degree of depth be 0.2mm, the single side size of this second holding tank is greater than the single side size 0.2mm of other outer graphics beyond the second held line pattern.
103, first circuit board mould is placed on circuit boards and lamination;
Please refer to Fig. 4, after making first circuit board mould 202, first circuit board mould 202 to be placed on circuit board 200 and lamination.
Optionally, first circuit board mould 202 to be placed on circuit board 200 and lamination comprises:
Be placed on by first circuit board mould 202 on circuit board 200, adopt pin location, adopt laminating press to first circuit board mould 202 and circuit board 200 lamination, the temperature of this press is 40 ~ 60 DEG C, and the pumpdown time is 20min, and pressure is 60 ~ 100psi.
It should be noted that, psi refers to sterling/square inch, 145psi=1MPa.
104, chemistry the first metal heavy on the first line figure appeared in the first hollow slots.
First circuit board mould to be placed on circuit boards and after lamination, chemistry the first metal heavy on the first line figure appeared in the first hollow slots.
Optionally, chemical nickel and gold on the first line figure appeared in the first hollow slots.
It should be noted that, on the first line figure appeared in the first hollow slots outside chemical nickel and gold, can also be chemistry silver, chemical tin, chemical nickel porpezite etc., specifically limit herein.
Optionally, the first line figure appeared in the first hollow slots also comprises after chemistry the first metal heavy:
Remove first circuit board mould, second circuit board mold to be placed on circuit board and lamination, the heavy the second metal of chemistry on the second line pattern appeared in described second hollow slots.
Optionally, second circuit board mold to be placed on circuit board and lamination comprises:
Be placed on circuit board by second circuit board mold, adopt pin location, adopt laminating press to second circuit board mold and circuit board lamination, the temperature of this press is 40 ~ 60 DEG C, and the pumpdown time is 20min, and pressure is 60 ~ 100psi.
Optionally, on the second line pattern appeared in the second hollow slots, the heavy the second metal of chemistry comprises:
Chemistry silver on the second line pattern appeared in the second hollow slots.
It should be noted that, on the second line pattern appeared in the second hollow slots outside chemical silver, can also be chemical nickel and gold, chemical tin, chemical nickel porpezite, be not specifically limited herein, but it should be noted that metal heavy with chemistry on the second line pattern on first line figure is different, namely, on first line figure, chemistry has sunk a certain metal, and what on the second line pattern, chemistry was heavy is another different metal.
It should be noted that, the embodiment of the present invention only illustrates the method for two kinds of surface-coated, and the surface coating process that the embodiment of the present invention can be adopted to provide according to actual conditions selects two or more circuit board surface coatings, is not specifically limited herein.
In sum, the embodiment of the present invention adopts the outer graphics producing circuit board, and outer graphics comprises the first line figure needing to carry out the first surface-coated, make first circuit board mould, the position corresponding to first line figure of first circuit board mould is provided with the first hollow slots, and the position corresponding to other outer graphics beyond described first line figure is provided with the first holding tank, first circuit board mould is placed on circuit boards and lamination, the technical scheme of chemistry the first metal heavy on the first line figure appeared in the first hollow slots, achieve following technique effect: the circuit board mould due to making is provided with hollow slots and holding tank, when carrying out the surface-coated of circuit board, the line pattern needing to carry out chemical turmeric genus is appeared in hollow slots, All other routes figure is then protected by the holding tank of circuit board mould, this circuit board mould has the function of resistance to surface coating agent, selective surface's coating of any situation can be applicable to, solve the problem existing for circuit board surface coating in prior art.
Above the method for a kind of circuit board surface coating that the embodiment of the present invention provides is described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (9)
1. a method for circuit board surface coating, is characterized in that, comprising:
Produce the outer graphics of circuit board, described outer graphics comprises the first line figure needing to carry out the first surface-coated;
Make first circuit board mould, the position corresponding to described first line figure of described first circuit board mould is provided with the first hollow slots, and the position corresponding to other outer graphics beyond described first line figure is provided with the first holding tank;
Described first circuit board mould to be placed on described circuit board and lamination;
Chemistry the first metal heavy on the described first line figure appeared in described first hollow slots.
2. method according to claim 1, is characterized in that, described outer graphics also comprises the second line pattern needing to carry out the second surface-coated; Described method also comprises:
Make second circuit board mold, the position corresponding to described second line pattern of described second circuit board mold is provided with the second hollow slots, and the position corresponding to other outer graphics beyond described second line pattern is provided with the second holding tank;
The described described first line figure appeared in described first hollow slots also comprises after chemistry the first metal heavy:
Remove described first circuit board mould, described second circuit board mold to be placed on described circuit board and lamination, the heavy the second metal of chemistry on described second line pattern appeared in described second hollow slots.
3. method according to claim 2, is characterized in that,
Described making first circuit board mould comprises:
The first flexible glue that blanking is identical with the planar dimension of described circuit board, the thickness of described first flexible glue is between 0.5 ~ 1.0mm; Described first flexible glue is layered in the first frock, by glue pressing machine by described first flexible glue and described first frock bonding; The method of the dark milling of control is adopted to mill out described first hollow slots on described first flexible glue, and described first holding tank, and remove described first frock;
Described making second circuit board mold comprises:
The second flexible glue that blanking is identical with the planar dimension of described circuit board, the thickness of described second flexible glue is between 0.5 ~ 1.0mm; Described second flexible glue is layered in the second frock, by glue pressing machine by described second flexible glue and described second frock bonding; The method of the dark milling of control is adopted to mill out described second hollow slots on described second flexible glue, and described second holding tank, and remove described second frock.
4. according to the method in claim 2 or 3, it is characterized in that,
The single side size of described first hollow slots is greater than the single side size 0.2mm of described first line figure;
The single side size of described second hollow slots is greater than the single side size 0.2mm of described second line pattern.
5. according to the method in claim 2 or 3, it is characterized in that,
Described first holding tank the degree of depth be 0.2mm, the single side size of described first holding tank is greater than the single side size 0.2mm of other outer graphics beyond held first line figure;
Described second holding tank the degree of depth be 0.2mm, the single side size of described second holding tank is greater than the single side size 0.2mm of other outer graphics beyond the second held line pattern.
6. the method according to any one of claim 1-3, is characterized in that, to be describedly placed on by described first circuit board mould on described circuit board and lamination comprises:
Described first circuit board mould is placed on described circuit board, employing pin is located, and adopt laminating press to described first circuit board mould and described circuit board lamination, the temperature of described press is 40 ~ 60 DEG C, pumpdown time is 20min, and pressure is 60 ~ 100psi.
7. the method according to any one of claim 1-3, is characterized in that, on the described described first line figure appeared in described first hollow slots, chemistry the first metal heavy comprises:
Chemical nickel and gold on the described first line figure appeared in described first hollow slots.
8. according to the method in claim 2 or 3, it is characterized in that, the described first circuit board mould of described removal, described second circuit board mold to be placed on described circuit board and lamination comprises:
The method of machinery is adopted to remove described first circuit board mould;
Described second circuit board mold is placed on described circuit board, employing pin is located, and adopt laminating press to described second circuit board mold and described circuit board lamination, the temperature of described press is 40 ~ 60 DEG C, pumpdown time is 20min, and pressure is 60 ~ 100psi.
9. according to the method in claim 2 or 3, it is characterized in that, on described described second line pattern appeared in described second hollow slots, the heavy the second metal of chemistry comprises:
Chemistry silver on described second line pattern appeared in described second hollow slots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410505145.7A CN105517347B (en) | 2014-09-26 | 2014-09-26 | A kind of method of circuit board surface coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410505145.7A CN105517347B (en) | 2014-09-26 | 2014-09-26 | A kind of method of circuit board surface coating |
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| Publication Number | Publication Date |
|---|---|
| CN105517347A true CN105517347A (en) | 2016-04-20 |
| CN105517347B CN105517347B (en) | 2018-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410505145.7A Active CN105517347B (en) | 2014-09-26 | 2014-09-26 | A kind of method of circuit board surface coating |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113498271A (en) * | 2021-06-04 | 2021-10-12 | 深圳市信维通信股份有限公司 | Preparation process of PCB injection molded body |
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| US20080008824A1 (en) * | 2006-07-10 | 2008-01-10 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board using imprinting |
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN102045963A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
| CN102056417A (en) * | 2010-11-24 | 2011-05-11 | 深南电路有限公司 | Process for manufacturing partially gold-plated board |
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2014
- 2014-09-26 CN CN201410505145.7A patent/CN105517347B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080008824A1 (en) * | 2006-07-10 | 2008-01-10 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board using imprinting |
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN102056417A (en) * | 2010-11-24 | 2011-05-11 | 深南电路有限公司 | Process for manufacturing partially gold-plated board |
| CN102045963A (en) * | 2010-12-28 | 2011-05-04 | 深南电路有限公司 | Method for plating gold on equilong connecting fingers |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113498271A (en) * | 2021-06-04 | 2021-10-12 | 深圳市信维通信股份有限公司 | Preparation process of PCB injection molded body |
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| CN105517347B (en) | 2018-08-07 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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