CN105517336A - Low-impedance electronic device - Google Patents
Low-impedance electronic device Download PDFInfo
- Publication number
- CN105517336A CN105517336A CN201410551020.8A CN201410551020A CN105517336A CN 105517336 A CN105517336 A CN 105517336A CN 201410551020 A CN201410551020 A CN 201410551020A CN 105517336 A CN105517336 A CN 105517336A
- Authority
- CN
- China
- Prior art keywords
- chip
- distance
- connector
- limit
- electronic installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses a low-impedance electronic device. The electronic device comprises a circuit board, a connector, at least one first chip and multiple wires. The connector, the first chips and the wires are arranged on the circuit board. The wires are connected with the first chips and the connector. A first biggest distance is formed in the first direction between the edge near the first chips of the connector and the edges most far away from the connector of the first chips. The first biggest distance is less than N times of 18.5mm, wherein the N is the line numbers of the first chips in the first direction.
Description
Technical field
The present invention relates to a kind of electronic installation, and particularly relate to a kind of low-impedance electronic installation.
Background technology
Wiring board is the critical elements required for a lot of electronic installation, its in order to carry in electronic installation in order to control, process or the electronic component of transmission of signal, as chip, passive device (passivecomponent), signal converter (signalconverter), timer (timer) etc.By wiring board, these electronic components are electrically connected to each other, and signal could transmit between these electronic components.
The device (as contact panel or display floater) be arranged in electronic installation outside wiring board need be electrically connected with the electronic component on wiring board, to perform specific function.For example, contact panel and the chip electrical be arranged on wiring board connect, to perform touch detection.Generally speaking, chip is electrically connected with corresponding device by arranging many wires in the circuit board.Due to the core parts that chip is in electronic installation, if the relation that is oppositely arranged between itself and wire designs improper, will easily cause the impedance of wire to increase, and the transmission of signal is exerted an adverse impact.Therefore, how to reduce the impedance of the wire that these are connected with chip, real is one of current research staff's problem of desiring most ardently solution.
Summary of the invention
The object of the present invention is to provide a kind of low-impedance electronic installation, it can make these wires be connected with chip maintain Low ESR.
For reaching above-mentioned purpose, the low-impedance electronic installation of one of the present invention comprises wiring board, connector, at least one first chip and many wires.Connector, the first chip and wire are arranged in the circuit board, and wire connects the first chip and connector, and wherein the edge of contiguous first chip of connector and the first chip to be separated by the first ultimate range in a first direction farthest away from the edge of connector.First ultimate range is less than the N of 18.5mm doubly, and wherein N is the first chip line number in a first direction.
Based on above-mentioned, the above embodiment of the present invention, by the first ultimate range between modulation first chip and connector, with the length of the wire of control connection between the first chip and connector, thus makes these wires be connected with chip maintain Low ESR.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and the accompanying drawing appended by coordinating is described in detail below.
Accompanying drawing explanation
Fig. 1 is the local upper schematic diagram of a kind of low-impedance electronic installation of the first embodiment of the present invention;
Fig. 2 to Fig. 4 is the local upper schematic diagram of the second embodiment of the present invention to the low-impedance electronic installation of the 4th embodiment;
Fig. 5 and Fig. 6 is the upper schematic diagram of the low-impedance electronic installation of the fifth embodiment of the present invention and the 6th embodiment.
Description of reference numerals:
100,200,300,400,500,600: low-impedance electronic installation;
110: wiring board;
120: connector;
130: the first chips;
140: wire;
150: microcontroller;
510: contact panel;
520: the first soft signal transmission circuits;
610: display floater;
612: the second chips;
614: the second soft signal transmission circuits;
B: bonding land;
D1: first direction;
D1max: the first ultimate range;
D2: second direction;
D2max: the second ultimate range;
DD1: the first distance;
DD2: second distance;
DD3: the three distance;
DD4: the four distance;
E1, E2: element;
S1: the first limit;
S2: Second Edge;
S3: the three limit;
S4: the four limit.
Embodiment
Fig. 1 is the local upper schematic diagram of a kind of low-impedance electronic installation according to the first embodiment of the present invention.Please refer to Fig. 1, low-impedance electronic installation 100 comprises a wiring board 110, a connector 120, at least one first chip 130 and many wires 140.In the present embodiment, the quantity of the first chip 130 is multiple, such as, be two, but not as limit.In addition, for clear illustrating is oppositely arranged relation between connector 120, first chip 130 and wire 140, Fig. 1 only shows the wiring board 110 of local.
Wiring board 120 is such as printed circuit board (PCB) or other are suitable for load-carrying unit and can receive and the conductive base of transmission of signal.Connector 120, first chip 130 and wire 140 are arranged on wiring board 110, and are such as positioned on the same surface of wiring board 110.Wire 140 connects the first chip 130 and connector 120, thus connector 120 can be used as in electronic installation 100 bridge between the first chip 130 of being arranged on device beyond wiring board 110 (as the contact panel that do not illustrate or display floater) and wiring board 110.That is, external device (ED) is electrically connected with the first chip 130 by connecting connector 120.In the present embodiment, connector 120 is fixed on wiring board 110, and external device (ED) is such as be connected with connector 120 removably.In addition, low-impedance electronic installation 100 also can comprise a microcontroller 150 (microcontrolunit) be electrically connected with the first chip 130.In another embodiment, microcontroller 150 also can be integrated in each first chip 130.
Because the length of wire 140 and the impedance of wire 140 are proportionate, and the length of wire 140 and the distance between connector 120 and the first chip 130 are proportionate, therefore the present embodiment makes the side of the contiguous connector 120 of the first chip 130 arrange, to reduce the impedance of wire 140.Furthermore, the edge of contiguous first chip 130 of connector 120 and the first chip 130 to be separated by one first ultimate range D1max farthest away from the edge of connector on a first direction D1, and wherein first direction D1 is perpendicular to the bearing of trend of connector 120.First ultimate range D1max is less than the N of 18.5mm doubly, and wherein N is the first chip 130 line number in the first direction dl.In the present embodiment, the first chip 130 line number is in the first direction dl 1, and therefore N is also 1, and that is, the edge of contiguous first chip 130 of connector 120 and the first chip 130 to be separated by 18.5mm in the first direction dl farthest away from the edge of connector.By the first ultimate range D1max between modulation first chip 130 and connector 120, with the length of the wire 140 of control connection between the first chip 130 and connector 120, thus these wires 140 be connected with chip 130 are made to maintain Low ESR.
In addition, be reduce the resistance difference between the wire 140 that connects of different first chip 130, the first chip 130 at least arranges along a second direction D2 of the bearing of trend being parallel to connector 120.In the present embodiment, connector 120 has the central shaft (not illustrating) of a parallel first direction D1, and is such as symmetry axis with central shaft from the wire 140 that different first chip 130 connects, and is that mirror is to setting in the both sides of central shaft.In addition, two wires 140 being positioned at outermost (referring to the central shaft farthest away from connector 120) are separated by with connector 120 one second ultimate range D2max respectively in a second direction d 2.The present embodiment can make the second ultimate range D2max be less than the N of 4mm doubly, to control the resistance value of two wires 140 being positioned at outermost further, and reduces the resistance difference between the wire 140 of inner side and periphery.For example, the live width being connected to each wire 140 between the first chip 130 and connector 120 is such as 5mm, and the spacing of adjacent two wires 140 is such as 6mm, but not as limit.
In the present embodiment, wiring board 110 has the bonding land B of a quadrangle, such as, be rectangular bonding land, and wire 140 and the first chip 130 are positioned at bonding land B.Bonding land B has interconnective one first limit S1, a Second Edge S2, one the 3rd limit S3 and the 4th limit S4 between two, wherein the first limit S1 and the 3rd limit S3 is parallel to second direction D2, Second Edge S2 and the 4th limit S4 is parallel to first direction D1, and Second Edge S2 and the 4th limit S4 connects the first limit S1 and the 3rd limit S3 respectively.
First limit S1, Second Edge S2, the 3rd limit S3 and the 4th limit S4 of bonding land B are demarcated by the element be arranged on wiring board 110.In detail, the first limit S1 trims the edge in contiguous first chip 130 of connector 120.3rd limit S3 trims in the edge of the first chip 130 farthest away from connector 120.Second Edge B2 and the 4th limit B4 trims in a second direction d 2 near the edge of element E1, E2 of the first chip 130 on wiring board 120 respectively, and described element E1, E2 are such as electric capacity, resistance or other circuit etc.
In a second direction d 2, connector 120 and Second Edge S2 are separated by one first distance DD1, a second distance DD2 and connector 120 and the 4th limit S4 are separated by.First distance DD1 and second distance DD2 is less than the N of 4mm doubly respectively, and the second ultimate range D2max that two wires 140 being positioned at outermost and connector 120 are separated by a second direction d 2 is such as less than or equal to the first distance DD1 and second distance DD2.In the present embodiment, the second ultimate range D2max equals the first distance DD1 and second distance DD2, and the two bars of wires 140 being positioned at outermost trim respectively in Second Edge B2 and the 4th limit B4.But, the invention is not restricted to above-mentioned.
Fig. 2 to Fig. 4 is to the local upper schematic diagram of the low-impedance electronic installation of the 4th embodiment according to the second embodiment of the present invention.Please refer to Fig. 2, the low-impedance electronic installation 200 of the present embodiment is approximately identical to the electronic installation 100 of Fig. 1, and identical element represents with identical label, repeats no more in this.Main Differences is, the second ultimate range D2max of the present embodiment is less than the first distance DD1 and second distance DD2, one the 3rd distance DD3 and the 4th distance DD4 and the two bars of wires 140 being positioned at outermost are separated by with Second Edge S2 and the 4th limit S4 respectively.Described 3rd distance DD3 and the 4th distance DD4 be also two bars of wires 140 and the most contiguous bonding land B being arranged in outermost in the B of bonding land other elements (as Fig. 2 element E1, E2 of illustrating) distance in a second direction d 2.By making the wire 140 in the B of bonding land keep at a distance with other elements, the electromagnetic interference (Electro-MagneticInterference, EMI) that wire 140 is subject to other adjacent circuits can be reduced.In one embodiment, the 3rd distance DD3 and the 4th distance DD4 is such as greater than 0 respectively and is less than 2mm.
In addition, the situation that the quantity that the design of above-mentioned first ultimate range D1max and the second ultimate range D2max of the present invention is also applicable to the first chip 130 is greater than 2.Please refer to Fig. 3, the low-impedance electronic installation 300 of the present embodiment is approximately identical to the electronic installation 100 of Fig. 1, and identical element represents with identical label, repeats no more in this.Main Differences is, the wiring board 110 of the present embodiment is provided with first chip 130 of more than 2, and is such as 3 the first chips 130, and these first chips 130 are arranged in a line along second direction D2, and namely N equals 1.In other words, the first ultimate range D1max maintains and is less than 18.5mm.On the other hand, because the quantity of wire 140 increases with the quantity increase of the first chip 130, and the pin count of connector 120 also increases with the quantity increase of the first chip 130, and therefore the second ultimate range D2max can maintain and be less than 4mm.Moreover, though the present embodiment illustrates the second ultimate range D2max equal the first distance DD1 and second distance DD2.But the second ultimate range D2max also can be less than the first distance DD1 and second distance DD2.
Please refer to Fig. 4, the low-impedance electronic installation 400 of the present embodiment is approximately identical to the electronic installation 100 of Fig. 1, and identical element represents with identical label, repeats no more in this.Main Differences is, the wiring board 110 of the present embodiment is provided with first chip 130 of more than 3, and is such as 4 the first chips 130.In the present embodiment, the first chip 130 such as arranges in array, and the first chip 130 line number is in the first direction dl 2, and namely N equals 2.In other words, the first ultimate range D1max is less than the twice of 18.5mm, and namely the first ultimate range D1max is less than 37mm.On the other hand, the second ultimate range D2max is less than the twice of 4mm, and namely the second ultimate range D2max is less than 8mm.Because the quantity of wire 140 increases with the quantity increase of the first chip 130, and the pin count of connector 120 also increases with the quantity increase of the first chip 130, therefore the present embodiment can make the second ultimate range D2max maintenance be less than 4mm, to control the resistance value of two wires 140 being positioned at outermost further, and the resistance difference reduced between the wire 140 of inner side and periphery, and the area that bonding land B occupies wiring board 110 can be reduced.Moreover, though the present embodiment illustrates the second ultimate range D2max equal the first distance DD1 and second distance DD2.But the second ultimate range D2max also can be less than the first distance DD1 and second distance DD2.
Fig. 5 and Fig. 6 is the upper schematic diagram of the low-impedance electronic installation according to the fifth embodiment of the present invention and the 6th embodiment.Please also refer to Fig. 5, the low-impedance electronic installation 500 of the present embodiment is approximately identical to the electronic installation 100 of Fig. 1, and identical element represents with identical label, repeats no more in this.Main Differences is, the low-impedance electronic installation 500 of the present embodiment also comprises contact panel 510 and an one first soft signal transmission circuit 520, and wherein the first soft signal transmission circuit 520 connects contact panel 510 and connector 120.Contact panel 510 can be capacitance type touch-control panel, electric resistance touch-control panel, optical touch control panel or other forms of contact panel.The present invention is not in order to limit the kind of contact panel 510.First soft signal transmission circuit 520 is such as a soft circuit.That is, the first soft signal transmission circuit 520 has flexibility, and visual demand and bending.
In the present embodiment, the first chip 130 is such as in order to drive contact panel 510.By by order to drive the first chip 130 of contact panel 510 to be configured on wiring board 110, and the first chip 130 is electrically connected with contact panel 510 by wire 140 and the first soft signal transmission circuit 520, the present embodiment can promote the bending nargin of the first soft signal transmission circuit 520.In addition, easily cause the cracked of the first chip 130 because the mechanical strength of the first chip 130 is not enough compared to when being arranged on by the first chip 130 and first soft signal transmission circuit 520 making the soft signal transmission circuit 520 of bending first, the first chip 130 is arranged on wiring board 110 by the present embodiment can the reliability of elevator system entirety.In addition, other also can may be affected the element (as resistance, electric capacity etc.) that the first soft signal transmission circuit 520 bends nargin and are transferred to wiring board 110 from the first soft signal transmission circuit 520 by the present embodiment further.Thus, the problem such as difficulty and the increase of manufacture craft cost be limited to because of component placement area on component placement that the first soft signal transmission circuit 520 causes can also be improved.
Please refer to Fig. 6, the low-impedance electronic installation 600 of the present embodiment is approximately identical to the electronic installation 500 of Fig. 5, and identical element represents with identical label, repeats no more in this.Main Differences is, the low-impedance electronic installation 600 of the present embodiment also comprises a display floater 610, wherein display floater 610 is positioned at the below of contact panel 510, and display floater 610 comprises multiple second chip 612 and multiple second soft signal transmission circuit 614.Second chip 612 arranges along second direction D2.Second soft signal transmission circuit 614 connection line plate 110 and the second chip 612, wherein the first soft signal transmission circuit 520 and the second soft signal transmission circuit 614 arrange along second direction D2 and do not overlap each other.
In the present embodiment, the second chip 612 is in order to drive display floater 610, and the second chip 612 is arranged on display floater 610, and the second chip 612 is connected with wiring board 110 by the second soft signal transmission circuit 614.Second soft signal transmission circuit 614 can be fixed on wiring board 110 by the electric conducting material do not illustrated.Described electric conducting material is such as anisotropic conductive film (AnisotropicConductiveFilm, ACF) or tin ball.That is, the second soft signal transmission circuit 614 is by pasting or being fixed on by the mode of scolding tin on wiring board 110.In other words, the second soft signal transmission circuit 614 and the wiring board 110 of the present embodiment are connected in the non-dismountable mode of one, but the present invention is not limited thereto.Second soft signal transmission circuit 614 is also connected with wiring board 110 by the mode (as connector) of aforenoted remov.
In sum, the above embodiment of the present invention, by the first ultimate range between modulation first chip and connector, keeps Low ESR to make the wire be connected between the first chip and connector.In one embodiment, be also positioned at the wire of outermost and the second ultimate range of connector by modulation, to control the resistance value of two wires being positioned at outermost further, and reduce the resistance difference between the wire of inner side and periphery.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.
Claims (10)
1. a low-impedance electronic installation, comprising:
Wiring board;
Connector, is arranged in the circuit board;
At least one first chip, is arranged in the circuit board; And
Many wires, arrange in the circuit board, and wire connects the first chip and connector, wherein the edge of contiguous first chip of connector and the first chip to be separated by the first ultimate range in a first direction farthest away from the edge of connector, first ultimate range is less than the N of 18.5mm doubly, and wherein N is the first chip line number in a first direction.
2. low-impedance electronic installation as claimed in claim 1, two wires being wherein positioned at outermost are separated by with connector the second ultimate range respectively in a second direction perpendicular to the first direction, and the second ultimate range is less than the N of 4mm doubly.
3. low-impedance electronic installation as claimed in claim 2, wherein wiring board has the bonding land of quadrangle, and wire and the first chip are positioned at bonding land, bonding land has interconnective first limit between two, Second Edge, 3rd limit and the 4th limit, wherein the first limit and the 3rd limit are parallel to second direction, Second Edge and the 4th limit are parallel to first direction, Second Edge and the 4th limit connect the first limit and the 3rd limit respectively, first limit trims the edge in contiguous first chip of connector, 3rd limit trims in the edge of the first chip farthest away from connector, wherein in a second direction, connector and Second Edge are separated by the first distance, the second distance and connector and the 4th limit are separated by, first distance and second distance are less than the N of 4mm doubly respectively, and the second ultimate range is less than or equal to the first distance and second distance.
4. low-impedance electronic installation as claimed in claim 3, wherein the second ultimate range equals the first distance and second distance, and the two bars of wires being positioned at outermost trim respectively in Second Edge and the 4th limit.
5. low-impedance electronic installation as claimed in claim 3, wherein the second ultimate range is less than the first distance and second distance, the 3rd distance and the 4th distance and the two bars of wires being positioned at outermost are separated by with Second Edge and the 4th limit respectively.
6. low-impedance electronic installation as claimed in claim 5, wherein the 3rd distance and the 4th distance are greater than 0 respectively and are less than 2mm.
7. low-impedance electronic installation as claimed in claim 1, wherein the quantity of the first chip is multiple, and the first chip at least arranges along the second direction perpendicular to first direction.
8. low-impedance electronic installation as claimed in claim 1, also comprises:
Contact panel; And
First soft signal transmission circuit, connects contact panel and connector.
9. low-impedance electronic installation as claimed in claim 8, also comprises:
Display floater, is positioned at the below of contact panel.
10. low-impedance electronic installation as claimed in claim 9, wherein display floater comprises:
Multiple the second chip along second direction arrangement; And
Multiple second soft signal transmission circuit, connection line plate and the second chip, wherein the first soft signal transmission circuit and the second soft signal transmission circuit arrange along second direction and do not overlap each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410551020.8A CN105517336B (en) | 2014-10-16 | 2014-10-16 | Low-impedance electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410551020.8A CN105517336B (en) | 2014-10-16 | 2014-10-16 | Low-impedance electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517336A true CN105517336A (en) | 2016-04-20 |
| CN105517336B CN105517336B (en) | 2018-05-25 |
Family
ID=55724859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410551020.8A Active CN105517336B (en) | 2014-10-16 | 2014-10-16 | Low-impedance electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105517336B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020132531A1 (en) * | 2001-03-19 | 2002-09-19 | Hiroaki Kukita | Electrical Connector |
| CN101097896A (en) * | 2006-06-28 | 2008-01-02 | 富士康(昆山)电脑接插件有限公司 | Power supply regulating device |
| TW200820508A (en) * | 2006-10-23 | 2008-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| CN101477261A (en) * | 2009-01-24 | 2009-07-08 | 矽创电子股份有限公司 | Modularized touch control panel |
-
2014
- 2014-10-16 CN CN201410551020.8A patent/CN105517336B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020132531A1 (en) * | 2001-03-19 | 2002-09-19 | Hiroaki Kukita | Electrical Connector |
| CN101097896A (en) * | 2006-06-28 | 2008-01-02 | 富士康(昆山)电脑接插件有限公司 | Power supply regulating device |
| TW200820508A (en) * | 2006-10-23 | 2008-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| CN101477261A (en) * | 2009-01-24 | 2009-07-08 | 矽创电子股份有限公司 | Modularized touch control panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517336B (en) | 2018-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111511100B (en) | Flexible circuit board and manufacturing method thereof, electronic device module and electronic device | |
| US11500489B2 (en) | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof | |
| CN106855847B (en) | Multi-slot plug-in card | |
| CN112930516B (en) | Display module and display device | |
| US20200295119A1 (en) | Electronic device and electronic apparatus | |
| US20170295649A1 (en) | Flexible substrate and display device | |
| CN105138161A (en) | Touch control display device | |
| US8422236B2 (en) | Pin module and chip on board type use device | |
| US20140333547A1 (en) | Touch panel | |
| US20070224878A1 (en) | Method for contacting flexible printed circuit with another flexible circuitry component and related circuitry assembly | |
| CN111276063B (en) | Display module and electronic equipment | |
| US20160162083A1 (en) | Touch display panel and touch display device | |
| US20100186995A1 (en) | Connecting device for cables and jumper wires | |
| CN104837294A (en) | Flexible circuit board, preparation method thereof, and display device | |
| EP4213067A1 (en) | Electronic device | |
| CN105100553A (en) | Camera module and electronic equipment | |
| CN102650978B (en) | Adapting card for peripheral component interface (PCI) Express X16 to compact peripheral component interconnect (CPCI) Express X16 | |
| CN112183396B (en) | Display assembly and display device | |
| US10319498B2 (en) | Flexible flat cable | |
| CN103338582A (en) | Soft circuit board, and electronic device with same | |
| CN103188869A (en) | Flexible printed circuit board | |
| CN105517336A (en) | Low-impedance electronic device | |
| CN212229619U (en) | Capacitive touch membrane assembly and interactive display device | |
| CN105511659B (en) | Touch device and touch control display apparatus | |
| KR102295106B1 (en) | Printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |