CN101477261A - Modularized touch control panel - Google Patents
Modularized touch control panel Download PDFInfo
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- CN101477261A CN101477261A CNA2009100052984A CN200910005298A CN101477261A CN 101477261 A CN101477261 A CN 101477261A CN A2009100052984 A CNA2009100052984 A CN A2009100052984A CN 200910005298 A CN200910005298 A CN 200910005298A CN 101477261 A CN101477261 A CN 101477261A
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Abstract
The invention relates to a modularized touch control panel. The modularized touch control panel comprises a first substrate and a second substrate; the second substrate corresponds to the first substrate; and the touch control panel is integrated with a control chip so as to increase a touch control scanning beam of the touch control panel, reduce the complexity and the occupied area of a signal transmission circuit between an electronic device and the touch control panel and simplify an electronic device circuit. Moreover, the first substrate or the second substrate of the touch control panel is provided with a metal layer so as to reduce impedance and increase signal stability.
Description
Technical field
The invention relates to a kind of contact panel, be meant a kind of modularized touch control panel especially.
Background technology
Various now electronic installations mostly provide a panel, the function of watching electronic installation to provide for the user, and allowing the user according to the shown function of panel, and the button of operating electronic devices and carry out the function of electronic installation.Electronic installation manufacturer is for more convenient user's operating electronic devices now, so the panel that provides is a contact panel, contact panel is a kind of typical coordinate entering device, the user can get final product the function that simple and easy execution electronic installation is provided by by the shown function of simple touch panel.
Along with high-speedization, high-effectization of electronic product, and it is more and more obvious to be particular about light, thin, short, little trend, makes a lot of dealers propose modularized touch control panel, with in response to now development trend.For example Republic of China's patent I266172, I224745 and I249717 number, the I266172 patent is with the periphery printing of upper strata and the lower floor conductive materials with width, and conductive hole is set on conductive materials, with when binding with circuit board, upper strata and lower floor can be pressed on the position signal input circuit plate that is produced via conductive hole, reach the touch-control effect.The I224745 patent is that the touch control unit of touch panel module and mnemon are connected to a junction block altogether and are integrated into single module with winding displacement, and the in addition end of this junction block is connected with command unit with another winding displacement, provides a touch panel module with common memory effect by this.The I249717 patent is a LCD signal transmitting device, and it comprises one first and one second flexible printed wiring board, and second flexible printed wiring board electrically connects the liquid crystal display device module and first flexible printed wiring board.First, second flexible printed wiring board is by welding (hotbar soldering) or see through anisotropic conductive film (Anisotropic ConductiveFilm by hot, ACF) mode engages, therefore only need to use a connector to be connected with system, the simultaneity factor end only needs a Port.
Via these three of above-mentioned explanations formerly patent can learn, the modularized touch control panel that is proposed is all only integrated at the structure of contact panel now, and control chip is not integrated in contact panel, so contact panel now must by by transmission line be arranged at electronic installation in the control chip of circuit board be connected, to receive the signal of control chip, perhaps transmit the user when pressing this contact panel, the touch-control signal that contact panel produced is to the control chip of circuit board.Because, control chip is in order to detect the position of touch of learning this contact panel of user's touch-control, so control chip must connect all touch-control sweep traces of contact panel, the signal line of contact panel just, but because control chip is arranged at the circuit board of electronic installation, so the signal line of contact panel only can by by transmission line to join with circuit board, but owing to the circuit of circuit board also can't be accomplished quite trickle, so can take bigger area, so have under the situation of certain area constraints at circuit board, contact panel is used to scan this number of signal line that touches the position of blank panel of user's touch-control and just is subjected to certain limitation, so can't increase under the situation of signal line of contact panel, promptly can't promote the touch-control precision of contact panel.
Therefore, the present invention is promptly proposing a kind of modularized touch control panel at the problems referred to above, be control chip can be integrated in contact panel, with the circuit board of reduction electronic installation and the complexity of the circuit between contact panel, and shared area, and then reduce cost, the present invention and can reduce impedance and increase signal stabilization is to address the above problem.
Summary of the invention
One of purpose of the present invention, be to provide a kind of modularized touch control panel, it is by by with chip and touch panel moduleization, and is used for the complexity of the circuit of transmission signal between reduction electronic installation and contact panel, and reduce the shared area of circuit of electronic installation, and then reduce cost.
Two of purpose of the present invention is to provide a kind of modularized touch control panel, and it reduces impedance and the purpose that increases signal stabilization by by metal level being set in contact panel to reach.
To achieve the above object, the invention provides a kind of modularized touch control panel, it includes:
One first basic unit has one first end and one second end;
One second basic unit corresponds to this first basic unit and is electrically connected with this first basic unit, and this first basic unit has one first end and one second end, and this second end of this second basic unit is shorter than this second end of this first basic unit; And
One covers brilliant thin-film module, is arranged at this second end of this first basic unit and electrically connects this first basic unit.
Among the present invention, more comprise one first conductive layer and one second conductive layer, be arranged at this first basic unit and this second basic unit respectively.
Among the present invention, wherein this first conductive layer or this second conductive layer are provided with a metal level.
Among the present invention, more comprise:
One first conducting resinl is arranged at this second end of this first basic unit and this covers between the brilliant thin-film module; And
One second conducting resinl is arranged between this first basic unit and this second basic unit.
Among the present invention, wherein this first basic unit has plural first signal line and the middle signal line of plural number, this second basic unit has plural second signal line, signal line and those second signal line electrically connect in the middle of those, and this covers, and brilliant thin-film module electrically connects those first signal line and signal line in the middle of those.
Among the present invention, wherein this covers brilliant thin-film module and comprises:
One pliability wiring board is electrically connected at this second end of this first basic unit; And
One chip is arranged at this pliability wiring board.
Among the present invention, the external flexible circuit board of this pliability wiring board wherein.
Among the present invention, wherein this flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
Among the present invention, wherein this first basic unit is a diaphragm.
The present invention also discloses a kind of modularized touch control panel simultaneously, and it includes:
One first basic unit;
One second basic unit corresponds to this first basic unit; And
One covers brilliant thin-film module, is located between the end of an end of this first basic unit and this second basic unit, and is electrically connected at this first basic unit and this second basic unit respectively.
Among the present invention, more comprise one first conductive layer and one second conductive layer, be arranged at this first basic unit and this second basic unit respectively.
Among the present invention, wherein this first conductive layer or this second conductive layer are provided with a metal level.
Among the present invention, more comprise:
One first conducting resinl is arranged at this first basic unit and this covers between the brilliant thin-film module; And
One second conducting resinl is arranged at this second basic unit and this covers between the brilliant thin-film module.
Among the present invention, wherein this covers brilliant thin-film module and comprises:
One pliability wiring board is electrically connected between this first basic unit and this second basic unit; And
One chip is arranged at this pliability wiring board.
Among the present invention, the external flexible circuit board of this pliability wiring board wherein.
Among the present invention, wherein this flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
Among the present invention, wherein this first basic unit is a diaphragm.
A kind of modularized touch control panel, it includes:
One first basic unit;
One second basic unit corresponds to this first basic unit;
One flexible circuit board is located between the end of an end of this first basic unit and this second basic unit, and is electrically connected at this first basic unit and this second basic unit respectively; And
One covers brilliant thin-film module, is connected in this flexible circuit board.
Among the present invention, more comprise one first conductive layer and one second conductive layer, be arranged at this first basic unit and this second basic unit respectively.
Among the present invention, wherein this first conductive layer or this second conductive layer are provided with a metal level.
Among the present invention, more comprise:
One first conducting resinl is arranged between this first basic unit and this flexible circuit board; And
One second conducting resinl is arranged between this second basic unit and this flexible circuit board.
Plate among the present invention, wherein this covers brilliant thin-film module and more comprises:
One pliability wiring board is electrically connected at this flexible circuit board; And
One chip is arranged at this pliability wiring board.
Among the present invention, external another flexible circuit board of this pliability wiring board wherein.
Among the present invention, wherein this this external flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
Among the present invention, wherein this flexible circuit board of electrically connecting of this pliability wiring board, this first basic unit and this second basic unit has at least one input/output end port and electrically connects with at least one I/O port of this chip.
Among the present invention, wherein this first basic unit is a diaphragm.
Among the present invention, wherein this flexible circuit board has plural via.
The present invention also discloses a kind of modularized touch control panel simultaneously, and it includes:
One first basic unit has a perforation;
One second basic unit corresponds to this first basic unit;
One chip is through at this perforation and is arranged at this second basic unit, and electrically connects this second basic unit; And
One flexible circuit board, be located at an end of this first basic unit and this second basic unit an end between, and be electrically connected at this first basic unit and this chip respectively.
Among the present invention, more comprise one first conductive layer and one second conductive layer, be arranged at this first basic unit and this second basic unit respectively.
Among the present invention, wherein this first conductive layer or this second conductive layer are provided with a metal level.
Among the present invention, more comprise:
One first conducting resinl is arranged between this first basic unit and this flexible circuit board; And
One second conducting resinl is arranged between this second basic unit and this flexible circuit board.
Among the present invention, more comprise:
One conducting resinl is arranged between this chip and this second basic unit.
Among the present invention, wherein this flexible circuit board has plural via.
Among the present invention, wherein this flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
Among the present invention, wherein this first basic unit is a diaphragm.
Among the present invention, wherein this second basic unit is a glass substrate.
The present invention has following beneficial effect:
Modularized touch control panel of the present invention is owing to integrate control chip in contact panel, so when increasing the signal line of contact panel, can significantly reduce the complexity of the circuit of transmission signal between electronic installation and contact panel and shared area, so can simplify the circuit of electronic installation and can reduce cost.In addition, first basic unit or second basic unit of contact panel of the present invention more are provided with metal level, with the reduction impedance, and increase signal stabilization.
Description of drawings
Fig. 1 is the top view of a preferred embodiment of modularized touch control panel of the present invention;
Fig. 2 is the cut-open view of a preferred embodiment of modularized touch control panel of the present invention;
Fig. 3 is the top view of another preferred embodiment of modularized touch control panel of the present invention;
Fig. 4 A is the configuration synoptic diagram of a preferred embodiment of the signal line of first basic unit of the present invention;
Fig. 4 B is the configuration synoptic diagram of a preferred embodiment of the signal line of second basic unit of the present invention;
Fig. 5 A is the configuration synoptic diagram of another preferred embodiment of the signal line of first basic unit of the present invention;
Fig. 5 B is the configuration synoptic diagram of another preferred embodiment of the signal line of second basic unit of the present invention;
Fig. 6 is the cut-open view of the 3rd preferred embodiment of modularized touch control panel of the present invention;
Fig. 7 is the cut-open view of the 4th preferred embodiment of modularized touch control panel of the present invention;
Fig. 8 is the cut-open view of the 5th preferred embodiment of modularized touch control panel of the present invention;
Fig. 9 is the top view of the 6th preferred embodiment of modularized touch control panel of the present invention;
Figure 10 is the cut-open view of the 6th preferred embodiment of modularized touch control panel of the present invention;
Figure 11 is the top view of the 7th preferred embodiment of modularized touch control panel of the present invention; And
Figure 12 is the cut-open view of the 7th preferred embodiment of modularized touch control panel of the present invention.
[figure number simple declaration]
10 contact panels, 11 first basic units
Signal line in the middle of 112 first signal line 114
12 second basic units, 122 second signal line
13 glue frames, 14 first conductive layers
15 second conductive layers, 16 first conducting resinls
17 second conducting resinls, 18 the first metal layers
19 second metal levels 20 cover brilliant thin-film module
22 pliability wiring boards, 24 chips
26 conductting layers, 28 conductting layers
30 flexible circuit boards, 31 conductting layers
32 I/O ports, 33 conducting resinls
42 second basic units of 41 first basic units
44 first conductive layers, 45 second conductive layers
46 first conducting resinls, 47 second conducting resinls
50 cover brilliant thin-film module 52 pliability wiring boards
54 chips, 56 conductting layers
57 conductting layers, 58 conductting layers
60 flexible circuit boards, 62 vias
64 conductting layers, 66 conductting layers
68 conductting layers 70 cover brilliant thin-film module
74 chips, 76 conductting layers
78 conductting layers, 79 conducting resinls
815 perforation of 81 first basic units
82 second basic units, 86 first conducting resinls
87 second conducting resinls 88 the 3rd conducting resinl
90 chips, 95 flexible circuit boards
96 vias, 97 conductting layers
98 conductting layers
Embodiment
Further understand and understanding for making architectural feature of the present invention and the effect reached had, cooperate detailed explanation, be described as follows in order to preferred embodiment and accompanying drawing:
At first, seeing also Fig. 1, is the top view of a preferred embodiment of modularized touch control panel of the present invention.As shown in the figure, modularized touch control panel of the present invention comprises a contact panel 10, and covers brilliant thin-film module (Chip On Film, COF) 20 and one flexible circuit board 30.Cover brilliant thin-film module 20 and be located at contact panel 10, and flexible circuit board 30 is connected in and covers brilliant thin-film module 20, and be electrically connected with the circuit board (figure does not show) of an electronic installation, make electronic installation circuit board can with cover brilliant thin-film module 20 mutual transmitting signals.One preferred embodiment of flexible circuit board 30 be an elastic printing circuit plate (Flexible Print Circuit, FPC).
Seeing also Fig. 2, is the cut-open view of a preferred embodiment of modularized touch control panel of the present invention.As shown in the figure, contact panel 10 includes one first basic unit 11, one second basic unit, 12, one glue frames 13, one first conductive layer 14, one second conductive layer 15, one first conducting resinl 16 and one second conducting resinl 17.First basic unit 11 has one first end and one second end, second basic unit 12 corresponds to first basic unit 11, and have one first end and one second end, and the length that is shorter in length than first basic unit 11 of second basic unit 12, promptly second end of second basic unit 12 is shorter than second end of first basic unit 11, so can be different between first basic unit 11 and second basic unit 12 because of length, and have a little spacing, cover brilliant thin-film module 20 with connection.First basic unit 11 can be diaphragm (Film), and second basic unit 12 can be diaphragm or glass.Glue frame 13 is arranged between first basic unit 11 and second basic unit 12.First conductive layer 14 and second conductive layer 15 are arranged at first basic unit 11 and second basic unit 12 respectively.Second conducting resinl 17 is arranged between second conductive layer 15 of first conductive layer 14 of first basic unit 11 and second basic unit 12, makes the basic unit 11 that wins be electrically connected at second basic unit 12.First conducting resinl 16 and second conducting resinl 17 can be anisotropic conductive (Anisotropic Conductive Film/Paste, ACF/ACP).
Consult Fig. 2 again, cover brilliant thin-film module 20 and include a pliability wiring board 22, a chip 24 and two conductting layers 26,28.Two conductting layers 26,28 are arranged at the two ends of pliability wiring board 22 respectively, and chip 24 is arranged at pliability wiring board 22.The first set conducting resinl 16 of second end of the conductting layer 26 of pliability wiring board 22 and first basic unit 11 interconnects, make and to cover second end that brilliant thin-film module 20 is located at first basic unit 11, cover between the brilliant thin-film module 20 and first basic unit 11 transmitting signals mutually to allow.In addition, pliability wiring board 22 can be by being interconnected by conductting layer 28 circuit boards (figure does not look) direct and electronic installation, make between chip 24 and the circuit board transmitting signals mutually, perhaps can pass through by conductting layer 28 external flexible circuit boards 30, and interconnect, so that transmitting signals mutually between chip 24 and the circuit board via flexible circuit board 30 circuit board with electronic installation.Flexible circuit board 30 has a conductting layer 31, is provided with a conducting resinl 33 between conductting layer 31 and the conductting layer 28, covers brilliant thin-film module 20 and electrically connects mutually with flexible circuit board 30 to allow.
The present invention is by being arranged at first basic unit 11 by covering brilliant thin-film module 20, make that covering brilliant thin-film module 20 can interconnect and transmitting signals with the signal line of first basic unit 11, and cover brilliant thin-film module 20 can be by electrically connecting also transmitting signals with second conducting resinl 17 mutually with the signal line of second basic unit 11 by first basic unit 11.So, the chip 24 that covers brilliant thin-film module 20 can electrically connect with the signal line of first basic unit 11 and second basic unit 12, so when this contact panel 10 of user's touch-control, the touch-control signal that signal line produced of contact panel 10, promptly can be passed to chip 24, the position that chip 24 like this can be learnt this contact panel 10 of user's touch-control, and position of touch is passed to the circuit board of electronic installation, carry out follow-up respective action for electronic installation according to this position of touch, so the circuit board of electronic installation does not need to be connected with all signal line of contact panel 10, and only need several signal line and cover brilliant thin-film module 20 and be connected and get final product.
From the above, if improve the touch-control degree of accuracy of contact panel 10 or have the multi-point touch function, and when increasing the quantity of signal line, the present invention only can increase the pin that the chip 24 that covers brilliant thin-film module 20 is connected with the signal line of contact panel 10, and need not increase the pin that chip 24 is connected with the circuit board of electronic installation, just need not increase the circuit of circuit board, so can reduce the complexity of the circuit between electronic installation and the contact panel 10, and the circuit that reduces circuit board takies the area of circuit board, and then can reduce cost.Because the technology of chip is quite progressive now, can't increase too many area and cost compared to the pin count that increases circuit board so increase the pin count of chip 24.
Consult Fig. 1 again, the external flexible circuit board 30 of the present invention has more an I/O port 32, and be used to connect the circuit board of electronic installation, with and circuit board between transmitting signals mutually, the I/O port 32 of flexible circuit board 30 is that the conductting layer 28 with pliability wiring board 22 electrically connects, with mutual transmitting signals, and conductting layer 28 is I/O ports that are electrically connected at chip 24.
In addition, as shown in Figure 3, flexible circuit board 30 of the present invention more can have plural I/O port 32, and the position at those input/output end port 32 places is inequality, and pliability wiring board 22 correspondences have plural conductting layer 28, to electrically connect with those I/O ports 32, those conductting layers 28 are to electrically connect with at least one I/O port of chip 24, so can be positioned at diverse location, and make flexible circuit board 30 be convenient to the connecting circuit plate in response to the set input/output end port of various circuit boards.
Seeing also Fig. 4 A and Fig. 4 B, is the configuration synoptic diagram of a preferred embodiment of the signal line of first basic unit of the present invention and second basic unit.As shown in the figure, first basic unit 11 has plural first signal line 112 and the middle signal line 114 of plural number, and those first signal line 112 are electrically connected with the chip 24 that covers brilliant thin-film module 20 via first conducting resinl 16 with those middle signal line 114.Second basic unit 12 has plural second signal line 122, those second signal line 122 electrically connect with those middle signal line 114 of first basic unit 11 via second conducting resinl 17, and the chip 24 that so covers brilliant thin-film module 20 can electrically connect with those second signal line 122 of second basic unit 12.From the above, those middle signal line 114 that are in the layout of first basic unit 11 are used to connect those second signal line 122 and chips 24 of second basic unit 12, so signal line 112 only is in the layout of the part area of first basic unit 11 in the middle of those, and does not exceed the position at second conducting resinl, 17 places.Those of this embodiment first signal line 112 is to be in the layout of first basic unit 11 in the space mode with those middle signal line 114.
Seeing also Fig. 5 A and Fig. 5 B, is the configuration synoptic diagram of another preferred embodiment of the signal line of first basic unit of the present invention and second basic unit.This embodiment is different from an embodiment part and is that those first signal line 112 of this embodiment and those middle signal line 114 are not to be in the layout of first basic unit 11 with interval mode.Signal line 114 is in the layout of the both sides of first basic unit 11 respectively in the middle of those of this embodiment, and those first signal line 112 then are in the layout of the centre position of first basic unit 11.
Seeing also Fig. 6, is the cut-open view of the 3rd preferred embodiment of modularized touch control panel of the present invention.As shown in the figure, this embodiment is different from Fig. 2 embodiment part and is that this embodiment increases a first metal layer 18 and one second metal level 19, the first metal layer 18 and second metal level 19 lay respectively at first conductive layer 14 and second conductive layer 15, be used to reduce impedance and interference, and improve the stability of signal.The present invention also can only be provided with metal level in first conductive layer 14 or second conductive layer 15.
Seeing also Fig. 7, is the cut-open view of the 4th preferred embodiment of modularized touch control panel of the present invention.As shown in the figure.This embodiment is different from an embodiment part and is that the first metal layer 18 of this embodiment and second metal level 19 do not contain first conductive layer 14 and second conductive layer 15, the first metal layer 18 of this embodiment only letter lid with respect to first conductive layer 14 of first conducting resinl 16 and second conducting resinl, 17 positions, and second metal level 19 only letter cover second conductive layer 15 with respect to second conducting resinl, 17 positions.This mode can allow the frame of contact panel 10 can not be subjected to the first metal layer 18 and the 19 opaque influences of second metal level, so that the frame of contact panel 10 can keep is transparent.
Seeing also Fig. 8, is the cut-open view of the 5th preferred embodiment of modularized touch control panel of the present invention.As shown in the figure, this embodiment is different from Fig. 2 embodiment part and is that first basic unit 41 of this embodiment and second basic unit 42 are isometric, and cover brilliant thin-film module 50 and be located between the end of the end of first basic unit 41 and second basic unit 42, and be electrically connected at first basic unit 41 and second basic unit 42 respectively, but the both sides of the pliability wiring board 52 that covers brilliant thin-film module 50 of this embodiment are transmission signal to the first basic unit 41 and second basic unit 42 all, for example utilize plural via (VIA) to make the chip 54 that is arranged at pliability wiring board 52 can be electrically connected at the both sides of pliability wiring board 52, can be electrically connected at first basic unit 41 and second basic unit 42 respectively so cover brilliant thin-film module 50.
Accept above-mentionedly, pliability wiring board 52 has three conductting layers 56,57,58, and conductting layer 56,57 is arranged at the both sides of an end of pliability wiring board 52 respectively, and conductting layer 58 then is arranged at the other end of pliability wiring board 52.First conducting resinl 46 is arranged between the conductting layer 56 of first conductive layer 44 of first basic unit 41 and pliability wiring board 52, and second conducting resinl 47 then is arranged between the conductting layer 57 of second conductive layer 45 of second basic unit 42 and pliability wiring board 52.58 external flexible circuit boards 30 of the conductting layer of pliability wiring board 52 are provided with conducting resinl 33 between the conductting layer 31 of conductting layer 58 and external flexible circuit board 30.Flexible circuit board 30 is same as previous embodiment to have at least one I/O port and electrically connects with at least one I/O port of the chip 54 that covers brilliant thin-film module 50.In addition, this embodiment can be as aforesaid embodiment, and increases metal level in first conductive layer 44 or second conductive layer 45, reducing impedance and interference, and improves the stability of signal.
Seeing also Fig. 9 and Figure 10, is the top view and the cut-open view of the 6th preferred embodiment of modularized touch control panel of the present invention.As shown in the figure, this embodiment is different between the end that an embodiment part is the end of first basic unit 41 of this embodiment and second basic unit 42 and is provided with a flexible circuit board 60, and be electrically connected and transmitting signals with first basic unit 41 and second basic unit 42, flexible circuit board 60 has more plural via 62, make the both sides of flexible circuit board 60 to be electrically connected, and transmitting signals.Flexible circuit board 60 has three conductting layers 64,66,68, conductting layer 64 and 66 is arranged at the both sides of an end of flexible circuit board 60, conductting layer 68 then is arranged at the other end of flexible circuit board 60, the conductting layer 64 and first conducting resinl 46 are electrically connected, make flexible circuit board 60 be electrically connected at first basic unit 41, and the conductting layer 66 and second conducting resinl 47 are electrically connected, and make flexible circuit board 60 be electrically connected at second basic unit 42.
Cover brilliant thin-film module 70 and have two conductting layers 76,78, conductting layer 76,78 is located at the two ends of the pliability wiring board 72 that covers brilliant thin-film module 70, be provided with a conducting resinl 79 between the conductting layer 68 of conductting layer 76 and flexible circuit board 60, make that covering brilliant thin-film module 70 is connected in flexible circuit board 60, the chip 74 that so covers brilliant thin-film module 70 promptly is electrically connected with flexible circuit board 60, so chip 74 can be by being electrically connected by flexible circuit board 60 and first basic unit 41 and second basic unit 42, and transmitting signals mutually.Cover between the conductting layer 31 of the conductting layer 78 of brilliant thin-film module 70 and flexible circuit board 30 and be provided with conducting resinl 33, make and cover brilliant thin-film module 70 external flexible circuit boards 30.Flexible circuit board 30 is same as previous embodiment to have at least one I/O port 32 and electrically connects with at least one I/O port of the chip 74 that covers brilliant thin-film module 70.In addition, this embodiment can be as aforesaid embodiment, and increases metal level in first conductive layer 44 or second conductive layer 45, reducing impedance and interference, and improves the stability of signal.In addition, flexible circuit board 60 also can have at least one I/O port and electrically connect with at least one I/O port of the chip 74 that covers brilliant thin-film module 70, so can not need external flexible circuit board 30.
Seeing also Figure 11 and Figure 12, is the top view and the cut-open view of the 7th preferred embodiment of modularized touch control panel of the present invention.As shown in the figure, first basic unit 81 has a perforation 815, the position of perforation 815 shown in Figure 11, and it is one embodiment of the invention only, is not to limit to the 815 set positions of boring a hole, it can determine according to user demand.One chip 90 is through at the perforation 815 of first basic unit 81 and is arranged at second conductive layer 85 of second basic unit 82, be that chip 90 is arranged at second basic unit 82, chip 90 covers crystal glass joining technique (Chip On Glass) for utilization and is arranged at second basic unit 82 and is electrically connected at second basic unit 82, first basic unit 81 of this embodiment is a diaphragm, and second basic unit 82 is a glass.One flexible circuit board 95, be arranged between the end of the end of first basic unit 81 and second basic unit 82, and be electrically connected at first conductive layer 84 of first basic unit 81 and second conductive layer 85 of second basic unit 82 respectively, be that flexible circuit board 95 is electrically connected at first basic unit 81 and second basic unit 82, because second basic unit 82 is electrically connected at chip 90, so flexible circuit board 95 is electrically connected at chip 90.Flexible circuit board 95 has plural via 96, with by allowed first basic unit 81 and second basic unit 82 electrically connect by flexible circuit board 90.
Accept above-mentioned, flexible circuit board 95 has two conductting layers 97,98, and the conductting layer 97 and first conducting resinl 86 are electrically connected, and makes flexible circuit board 95 be electrically connected at first basic unit 81, and the conductting layer 98 and second conducting resinl 87 are electrically connected, and make flexible circuit board 95 be electrically connected at second basic unit 82.One the 3rd conducting resinl 88 is arranged between second conductive layer 85 of the chip 90 and second basic unit 82.Chip 90 by by second conductive layer 85 of second basic unit 82 to be electrically connected with flexible circuit board 95, and the via 96 via flexible circuit board 95 is electrically connected with first conductive layer 84 with first basic unit 81, so chip 90 can with first basic unit, 81 mutual transmitting signals.Chip 90 is used for the both sides that pin that the signal line with the signal line of first basic unit 81 and second basic unit 82 electrically connects can be arranged at chip 90 respectively, in this embodiment, the pin that chip 90 is used for electrically connecting with the signal line of second basic unit 82 is the left side that is arranged at chip 90, and the pin that chip 90 is used for electrically connecting with the signal line of second basic unit 82 is the right side that is arranged at chip 90, so can allow the pin of chip 90 on average be arranged at chip 90 both sides, and can not concentrate on a side, to reduce impedance and can avoid pin too concentrated, and avoid the phase mutual interference, and then improve the stability of signal.
In addition, this embodiment can increase metal level in first conductive layer 84 or second conductive layer 85 as aforesaid embodiment, with reduction impedance and interference, and the stability of raising signal.In addition, flexible circuit board 95 also can have at least one input/output end port 92 and electrically connect with at least one I/O port of chip 90.
In sum, modularized touch control panel of the present invention is owing to integrate control chip in contact panel, so when increasing the signal line of contact panel, can significantly reduce the complexity of the circuit of transmission signal between electronic installation and contact panel and shared area, so can simplify the circuit of electronic installation and can reduce cost.In addition, first basic unit or second basic unit of contact panel of the present invention more are provided with metal level, with the reduction impedance, and increase signal stabilization.
In sum, it only is a preferred embodiment of the present invention, be not to be used for limiting scope of the invention process, all according to impartial for it variation of the described shape of claim scope of the present invention, structure, feature and spiritual institute and modification, all should be included in the claim scope of the present invention.
Claims (36)
1. modularized touch control panel is characterized in that it includes:
One first basic unit has one first end and one second end;
One second basic unit corresponds to this first basic unit and is electrically connected with this first basic unit, and this first basic unit has one first end and one second end, and this second end of this second basic unit is shorter than this second end of this first basic unit; And
One covers brilliant thin-film module, is arranged at this second end of this first basic unit and electrically connects this first basic unit.
2. modularized touch control panel according to claim 1 is characterized in that, more comprises one first conductive layer and one second conductive layer, is arranged at this first basic unit and this second basic unit respectively.
3. modularized touch control panel according to claim 2 is characterized in that, wherein this first conductive layer or this second conductive layer are provided with a metal level.
4. modularized touch control panel according to claim 1 is characterized in that, more comprises:
One first conducting resinl is arranged at this second end of this first basic unit and this covers between the brilliant thin-film module; And
One second conducting resinl is arranged between this first basic unit and this second basic unit.
5. modularized touch control panel according to claim 1, it is characterized in that, wherein this first basic unit has plural first signal line and the middle signal line of plural number, this second basic unit has plural second signal line, signal line and those second signal line electrically connect in the middle of those, and this covers, and brilliant thin-film module electrically connects those first signal line and signal line in the middle of those.
6. modularized touch control panel according to claim 1 is characterized in that, wherein this covers brilliant thin-film module and comprises:
One pliability wiring board is electrically connected at this second end of this first basic unit; And
One chip is arranged at this pliability wiring board.
7. modularized touch control panel according to claim 6 is characterized in that, wherein the external flexible circuit board of this pliability wiring board.
8. modularized touch control panel according to claim 7 is characterized in that, wherein this flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
9. modularized touch control panel according to claim 1 is characterized in that, wherein this first basic unit is a diaphragm.
10. modularized touch control panel is characterized in that it includes:
One first basic unit;
One second basic unit corresponds to this first basic unit; And
One covers brilliant thin-film module, is located between the end of an end of this first basic unit and this second basic unit, and is electrically connected at this first basic unit and this second basic unit respectively.
11. modularized touch control panel according to claim 10 is characterized in that, more comprises one first conductive layer and one second conductive layer, is arranged at this first basic unit and this second basic unit respectively.
12. modularized touch control panel according to claim 11 is characterized in that, wherein this first conductive layer or this second conductive layer are provided with a metal level.
13. modularized touch control panel according to claim 10 is characterized in that, more comprises:
One first conducting resinl is arranged at this first basic unit and this covers between the brilliant thin-film module; And
One second conducting resinl is arranged at this second basic unit and this covers between the brilliant thin-film module.
14. modularized touch control panel according to claim 10 is characterized in that, wherein this covers brilliant thin-film module and comprises:
One pliability wiring board is electrically connected between this first basic unit and this second basic unit;
And
One chip is arranged at this pliability wiring board.
15. modularized touch control panel according to claim 14 is characterized in that, wherein the external flexible circuit board of this pliability wiring board.
16. modularized touch control panel according to claim 15 is characterized in that, wherein this flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
17. modularized touch control panel according to claim 10 is characterized in that, wherein this first basic unit is a diaphragm.
18. a modularized touch control panel is characterized in that it includes:
One first basic unit;
One second basic unit corresponds to this first basic unit;
One flexible circuit board is located between the end of an end of this first basic unit and this second basic unit, and is electrically connected at this first basic unit and this second basic unit respectively; And
One covers brilliant thin-film module, is connected in this flexible circuit board.
19. modularized touch control panel according to claim 18 is characterized in that, more comprises one first conductive layer and one second conductive layer, is arranged at this first basic unit and this second basic unit respectively.
20. modularized touch control panel according to claim 19 is characterized in that, wherein this first conductive layer or this second conductive layer are provided with a metal level.
21. modularized touch control panel according to claim 18 is characterized in that, more comprises:
One first conducting resinl is arranged between this first basic unit and this flexible circuit board; And
One second conducting resinl is arranged between this second basic unit and this flexible circuit board.
22. modularized touch control panel according to claim 18 is characterized in that, wherein this covers brilliant thin-film module and more comprises:
One pliability wiring board is electrically connected at this flexible circuit board; And
One chip is arranged at this pliability wiring board.
23. modularized touch control panel according to claim 22 is characterized in that, wherein external another flexible circuit board of this pliability wiring board.
24. modularized touch control panel according to claim 23 is characterized in that, wherein this this external flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
25. modularized touch control panel according to claim 22, it is characterized in that wherein this flexible circuit board of electrically connecting of this pliability wiring board, this first basic unit and this second basic unit has at least one input/output end port and electrically connects with at least one I/O port of this chip.
26. modularized touch control panel according to claim 18 is characterized in that, wherein this first basic unit is a diaphragm.
27. modularized touch control panel according to claim 18 is characterized in that, wherein this flexible circuit board has plural via.
28. a modularized touch control panel is characterized in that it includes:
One first basic unit has a perforation;
One second basic unit corresponds to this first basic unit;
One chip is through at this perforation and is arranged at this second basic unit, and electrically connects this second basic unit; And
One flexible circuit board, be located at an end of this first basic unit and this second basic unit an end between, and be electrically connected at this first basic unit and this chip respectively.
29. modularized touch control panel according to claim 28 is characterized in that, more comprises one first conductive layer and one second conductive layer, is arranged at this first basic unit and this second basic unit respectively.
30. modularized touch control panel according to claim 29 is characterized in that, wherein this first conductive layer or this second conductive layer are provided with a metal level.
31. modularized touch control panel according to claim 28 is characterized in that, more comprises:
One first conducting resinl is arranged between this first basic unit and this flexible circuit board; And
One second conducting resinl is arranged between this second basic unit and this flexible circuit board.
32. modularized touch control panel according to claim 28 is characterized in that, more comprises:
One conducting resinl is arranged between this chip and this second basic unit.
33. modularized touch control panel according to claim 28 is characterized in that, wherein this flexible circuit board has plural via.
34. modularized touch control panel according to claim 28 is characterized in that, wherein this flexible circuit board has at least one input/output end port and electrically connects with at least one I/O port of this chip.
35. modularized touch control panel according to claim 28 is characterized in that, wherein this first basic unit is a diaphragm.
36. modularized touch control panel according to claim 28 is characterized in that, wherein this second basic unit is a glass substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100052984A CN101477261A (en) | 2009-01-24 | 2009-01-24 | Modularized touch control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100052984A CN101477261A (en) | 2009-01-24 | 2009-01-24 | Modularized touch control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101477261A true CN101477261A (en) | 2009-07-08 |
Family
ID=40838003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2009100052984A Pending CN101477261A (en) | 2009-01-24 | 2009-01-24 | Modularized touch control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101477261A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346322A (en) * | 2010-07-27 | 2012-02-08 | 群康科技(深圳)有限公司 | Touch-control type display device |
| CN103345346A (en) * | 2013-07-19 | 2013-10-09 | 信利光电股份有限公司 | Capacitive touch screen and method for binding flexible circuit board thereof |
| WO2014183366A1 (en) * | 2013-05-15 | 2014-11-20 | 京东方科技集团股份有限公司 | Display panel and display device having same |
| CN105517336A (en) * | 2014-10-16 | 2016-04-20 | 南京瀚宇彩欣科技有限责任公司 | Low-impedance electronic device |
| CN106201052A (en) * | 2015-05-28 | 2016-12-07 | 凌巨科技股份有限公司 | Flexible printed circuit board and touch display module |
| CN107104088A (en) * | 2016-02-23 | 2017-08-29 | 致伸科技股份有限公司 | Identification of fingerprint module and its manufacture method |
| WO2018072266A1 (en) * | 2016-10-19 | 2018-04-26 | 武汉华星光电技术有限公司 | Flexible touch screen, manufacturing method therefor, and touch device |
| CN110597416A (en) * | 2019-09-17 | 2019-12-20 | 京东方科技集团股份有限公司 | Flexible circuit board, touch display panel and touch display device |
-
2009
- 2009-01-24 CN CNA2009100052984A patent/CN101477261A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102346322A (en) * | 2010-07-27 | 2012-02-08 | 群康科技(深圳)有限公司 | Touch-control type display device |
| CN102346322B (en) * | 2010-07-27 | 2016-01-20 | 群康科技(深圳)有限公司 | Touch control display device |
| WO2014183366A1 (en) * | 2013-05-15 | 2014-11-20 | 京东方科技集团股份有限公司 | Display panel and display device having same |
| CN103345346A (en) * | 2013-07-19 | 2013-10-09 | 信利光电股份有限公司 | Capacitive touch screen and method for binding flexible circuit board thereof |
| CN105517336A (en) * | 2014-10-16 | 2016-04-20 | 南京瀚宇彩欣科技有限责任公司 | Low-impedance electronic device |
| CN105517336B (en) * | 2014-10-16 | 2018-05-25 | 南京瀚宇彩欣科技有限责任公司 | Low-impedance electronic device |
| CN106201052A (en) * | 2015-05-28 | 2016-12-07 | 凌巨科技股份有限公司 | Flexible printed circuit board and touch display module |
| CN107104088A (en) * | 2016-02-23 | 2017-08-29 | 致伸科技股份有限公司 | Identification of fingerprint module and its manufacture method |
| CN107104088B (en) * | 2016-02-23 | 2019-11-12 | 致伸科技股份有限公司 | Identification of fingerprint module and its manufacturing method |
| WO2018072266A1 (en) * | 2016-10-19 | 2018-04-26 | 武汉华星光电技术有限公司 | Flexible touch screen, manufacturing method therefor, and touch device |
| CN110597416A (en) * | 2019-09-17 | 2019-12-20 | 京东方科技集团股份有限公司 | Flexible circuit board, touch display panel and touch display device |
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Open date: 20090708 |