CN1055134A - Gold soldering flux alloy for fine gold adornment - Google Patents

Gold soldering flux alloy for fine gold adornment Download PDF

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Publication number
CN1055134A
CN1055134A CN 90108030 CN90108030A CN1055134A CN 1055134 A CN1055134 A CN 1055134A CN 90108030 CN90108030 CN 90108030 CN 90108030 A CN90108030 A CN 90108030A CN 1055134 A CN1055134 A CN 1055134A
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China
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gold
soldering
paste
powder
alloy
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CN 90108030
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CN1019646B (en
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刘泽光
顾开源
杨德永
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KUNMING NOBLE METAL INST CHINA NONFERROUS METAL INDUSTRY GENERAL Co
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KUNMING NOBLE METAL INST CHINA NONFERROUS METAL INDUSTRY GENERAL Co
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Priority to CN 90108030 priority Critical patent/CN1019646B/en
Publication of CN1055134A publication Critical patent/CN1055134A/en
Publication of CN1019646B publication Critical patent/CN1019646B/en
Expired legal-status Critical Current

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Abstract

Gold soldering flux alloy for fine gold adornment, be made up of following component: (a) solder powder 70~92%, and this powder is the gold-base alloy powder of Au94.5~96.5%, and alloying element is 1~3 kind among Zn, Cd, Ge, Si, Cu, the Ag, (b) the brazing flux powder 2.0~5.0%, are from B 2O3, Na 2, select among B4O7, KF, the KBF4 at least a, (c) the paste stablizer 0.5~5.0%, be select from paraffin and polyoxyethylene glycol at least a, (d) solvent 3.0~20%, are at least two kinds that select from turps, petrolatum, vacuum pump oil, silicone oil.This soldering paste has advantages such as Gold Content height, temperature of fusion wide ranges, good stability, is applicable to the step brazing of baroque proof gold ornaments.

Description

Gold soldering flux alloy for fine gold adornment
The present invention relates to the auri paste soldering material that a kind of auri braze, particularly proof gold ornaments are used.
Be used for proof gold (or pure gold, its purity 〉=99.9%) the gold solder cream of jewelry component soldering, except that must having certain viscosity and stability, main is that this soldering paste must have enough Gold Content, after guaranteeing that ornaments are by soldering, the color of its whole Gold Content and pricker joint all can reach the requirement of proof gold ornaments, otherwise the product after the soldering will demote or scrap.In addition, baroque for some, as to have multiple assembly formation proof gold ornaments often need to carry out the above soldering of two-stage.This just requires when carrying out the next stage soldering, and the weld seam that the processing temperature of fine weldering should not make upper level weld snaps, and therefore, used soldering paste not only should have higher Gold Content, and its temperature of fusion can widen the difference between different grades, and uses for step brazing.
But the solder that gold ornaments uses in the prior art all is gold brazing filler metal or the paste scolder that Gold Content low (22 karat golds are following), melting temperature can not widen the difference between different grades.For example, U.S. Pat 4014690 discloses a kind of dentistry and jewellery are lower than 17 karat golds with Gold Content 60~70%() the Au-Pt-Pd-Cu-Ir solder.U.S. Pat 3892564 also discloses a kind of dentistry and jewelry gold base solder alloy, and its composition is (wt.%) Gal~10, CuO~25, and AgO~33, ZnO~10, surplus is a gold, and its exemplary alloy composition is Au 75%, and Ga 10%, and Cm 15%.The Japanese Patent spy opens the gold soldering alloy that is used for clock and watch and jewellery that clear 58-151992 also discloses a kind of Gold Content 50~67%.The Japanese Patent spy opens clear 59-140336 and discloses a kind of jewellery (Au-Ni or Au-Pd alloy jewellery) to use welding flux alloy, its Gold Content be 70~85% or 70~90%.Switzerland HILDERBRAND ﹠amp; The soldering paste that is used for gold and platinum of CitSA production and selling, solder alloy Gold Content wherein is karat gold all≤22, all is to be used for the following gold ornaments soldering of 22 karat golds.For example: the soldering paste of its trade mark CF22KYS, CF22KYES, its Gold Content is the 91.66%(22 karat gold), the product of all the other trades mark of the said firm is as CF18KYH, CF14KYH, CF12KYM etc., all be the following soldering paste of 18 karat golds, be used for the soldering of the following jewellery of 18 karat golds.
Above-mentioned patent and product, because its Gold Content is low, can not reach the requirement of the fine weldering of proof gold ornaments at all, be of the requirement of the Gold Content of ornaments integral body after the soldering well below proof gold ornaments 99.9%, and these solders or soldering paste also are difficult to be used for the step brazing of baroque proof gold ornaments because its melting temperature can not draw away class.
Purpose of the present invention, be to overcome the deficiency of existing auri soldering paste, provide a kind of Gold Content higher, temperature of fusion can be adjusted in 350~990 ℃, the weld seam color can reach or near the auri soldering paste of proof gold ornaments color after the soldering, to improve proof gold ornaments gold content qualification rate, satisfy fine and complex structure, the multistage soldering requirement of proof gold ornaments that weld seam is numerous.
Another object of the present invention is to improve the stability of soldering paste, strengthens its delamination resistance so that soldering paste can be in prolonged preservation composition evenly, stable.
Technical scheme of the present invention is to improve the Gold Content of solder alloy in the soldering paste, and suitably select alloy element, other components of suitable simultaneously apolegamy soldering paste.
Feature of the present invention is, soldering paste of the present invention is formed (by wt.%) by following component: (a) solder powder 70~92, this solder powder is a kind of gold-base alloy powder, its granularity is 100~400 orders, its composition is (wt.%) Au94.5~96.5, and 1 to 3 kind of from following constituent element, selecting: Zn1.0~5.0, Cd1.0~4.3, Ge0.1~4.0, Si0.1~3.0, Cu0.1~3.0, Ag0.1~3.0, and selecting the total content of constituent element is 3.5~5.5% of alloy gross weight, (b) the brazing flux powder 2.0~5.0, its granularity 100~400 orders, and said brazing flux is from boric anhydride (B 2O 3), sodium tetraborate (Na 2B 4O 7), Potassium monofluoride (KF), potassium fluoborate (KBF 4) among select at least a, (c) the paste stablizer 0.5~5.0, is select from paraffin wax and polyoxyethylene glycol at least a, (d) solvent 3.0~20, are at least two kinds that select from turps, phenyl alkylsulfonate, vacuum pump oil, silicone oil.
The effect of each component is as follows in the soldering paste:
Solder as main ingredient, is used to guarantee the quality of proof gold ornaments and satisfies the step brazing requirement.
Brazing flux, protection solder alloy composition does not produce oxidation under brazing temperature, and mother metal surface tension when reducing soldering is removed by the pricker surface contaminants, increases solder wetting and flowability.
Paste stablizer, its effect are mainly to prevent that the solder particle from sinking, and make soldering paste can not produce layering in staging life, thereby but make the soldering paste long-term storage, guarantee that its each moiety is even, stable.
Solvent as carrier, makes above-mentioned each component homodisperse therein, forms paste.
Compare with prior art, the present invention has following advantage:
1, have higher Gold Content, solder powder Gold Content is generally more than 95% and (is equivalent to 22.78 karat golds) in the cream;
2, soldering paste has lower brazing temperature, is fit to trickle member soldering;
3, have in gradient temperature of fusion and brazing temperature range, the gold ornaments step brazing that be particularly suitable for complex structure, needs multiple tracks to be welded into;
4, the postwelding connector color is close with proof gold ornaments color or mates;
5, cream attitude stability is strong, has good delamination resistance;
6, after the soldering, residues such as the fine agent on the ornaments are easy to clean up with hot water.
7, apply the soldering paste except that manual, being specially adapted to pressurized air is that the syringe of power adds cream on welded part, is easy to realize that soldering adds the cream semi-automation;
8, prescription is simple, suitable.
Embodiment 1
Soldering paste consists of: solder alloy powder 80%, and granularity 200 orders, alloying constituent is: Au95%, Zn4%, Cu1%; Brazing flux (Na 2B 4O 7) powder 4%; Paste stablizer paraffin wax 2%; Solvent 14%, wherein turps 8%, phenyl alkylsulfonate 6%.Each component is mixed, stir soldering paste.The solid-liquid phase line temperature range of this soldering paste interalloy powder is 848~927 ℃.With this soldering paste in atmosphere under 930~960 ℃, use the 99.98% 24K Gold Necklace clasp of gasoline-pressurized air flame brazing diameter 0.2~0.5mm.The postwelding weld seam is full, level and smooth, no scar, and the joint color is consistent with matrix, and the total gold content of postwelding necklace finished product 〉=99.9% meets outlet quality, quality of colour requirement.
Embodiment 2
Soldering paste consists of: granularity 300 purpose soldering alloyed metal powders 85%, alloying constituent are (wt.%) Au95.5, Zn3.0, Si1.5; Brazing flux powder (granularity 200 orders) 3%, wherein B 2O 31.0%, KBF 41.0%, KF 1%; Paste stablizer 3%, wherein paraffin wax 1%, polyoxyethylene glycol 2%; Solvent 9%, wherein turps 3.5%, silicone oil 3.5%, petrolatum 2%.Mentioned component is just made operational soldering paste after thorough mixing is even.
630 ℃ of this solder paste melts temperature, available flame or in stove, under atmospheric condition, in 640~680 ℃ of scopes, implement soldering.
Embodiment 3
Soldering paste consists of: granularity 300 purpose soldering alloyed metal powders 90%, and alloying constituent is (wt.%): Au96, Cu1.0 Cd2.0, Si1.0; Granularity 300 purpose brazing flux powder 2.5%, wherein B 2O 31.5%, Na 2B 3O 71.0%; Paste stablizer polyoxyethylene glycol 1.5%; Solvent 6%, wherein petrolatum 3%, vacuum pump oil 3%.Above-mentioned each component mix the back operational soldering paste.This soldering paste is solid-and the phase line temperature is 370~910 ℃, can implement soldering in 915~940 ℃ of scopes under atmospheric condition.
Embodiment 4
Soldering paste consists of: granularity 350 purpose solder alloy powder 75%, and alloying constituent is (wt.%) Au95, Ge4.0, Si1.0; Brazing flux powder (granularity 350 orders) 5%, KF2.5% wherein, KBF 42.5%; Paste stablizer paraffin wax 5%; Solvent 15%, wherein turps, petrolatum and silicone oil each 5%.Above-mentioned four kinds of components mix, operational soldering paste.This soldering paste solid-liquid phase line temperature is 353~810 ℃, can implement soldering in 820~880 ℃.
Embodiment 5
The soldering paste component is: granularity 200 purpose solder alloy powder 80%, and alloying constituent is (wt.%) Au95, Ag2.0, Si3.0; Granularity 200 purpose brazing flux powder 3%, wherein B 2O 32%, KF1%; Paste stablizer paraffin wax 3%; Solvent 14%, wherein vacuum pump oil 10%, silicone oil 4%.Above-mentioned four component thorough mixing evenly the back for the soldering paste of use.This soldering paste solid-liquid phase line temperature is 363~584, can implement soldering in 600~650 ℃ of scopes in atmosphere.
One of the actual soldering of soldering paste in use the above embodiment of the present invention will be inlayed the gold bangle ornaments blank of jewelry.Soldering paste (930~960 ℃ of brazing temperatures) with embodiment 1 carries out first step soldering earlier, with flame heating soldering bracelet body great circle joint.The soldering paste (820~880 ℃ of brazing temperatures) of embodiment 4 is used in second stage soldering, with flame heating with the lace soldering of fine complexity on the bracelet body.The soldering paste (600~650 ℃ of brazing temperatures) of embodiment 5 is used in third stage soldering, with flame heating meticulous gem holder soldering is designed on the position at the bracelet body, and the whole soldering operation of bracelet body finishes.Because three grades of solderings are carried out at three different warm areas respectively, so the parts that do not cause upper level to weld during the next stage soldering snap, displacement, can guarantee integrated member pattern precision.

Claims (1)

1, gold soldering flux alloy for fine gold adornment, it is characterized in that, said soldering paste is formed (by wt.%) by following component: (a) solder powder 70~92, its granularity is 100~400 orders, its composition is a kind of gold-base alloy, this alloy contains (wt.%) Au94.5~96.5, and 1~3 kind of selecting from following constituent element: Zn1.0~5.0, Cd1.0~4.3, Si0.1~3.0, Cu0.1~3.0, Ag0.1~3.0, Ge0.1~4.0, and selecting the total content of constituent element is 3.5~5.5% of alloy gross weight, (b) the brazing flux powder 2.0~5.0, and its granularity is 100~400 orders, and said brazing flux powder is from boric anhydride (B 2O 3), sodium tetraborate (Na 2B 4O 7), Potassium monofluoride (KF), potassium fluoborate (KBF 4) among select at least a, (c) the paste stablizer 0.5~5.0, is select from paraffin wax and polyoxyethylene glycol at least a, (d) solvent 3.0~20, are at least two kinds that select from turps, petrolatum, vacuum pump oil, silicone oil.
CN 90108030 1990-09-22 1990-09-22 Gold soldering flux alloy for fine gold adornment Expired CN1019646B (en)

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CN1019646B CN1019646B (en) 1992-12-30

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102601540A (en) * 2012-03-08 2012-07-25 青岛多真工艺品有限公司 Welding powder composition for ornament metal wire and processing method of welding powder composition
CN105081598A (en) * 2014-05-06 2015-11-25 烟台市固光焊接材料有限责任公司 Solder paste and application thereof
CN106271230A (en) * 2016-08-30 2017-01-04 郑州机械研究所 A kind of coating silver solder and preparation method thereof
CN107151748A (en) * 2016-03-02 2017-09-12 广州先艺电子科技有限公司 A kind of method of smelting of gold-germanium alloy solder
CN108941973A (en) * 2018-08-15 2018-12-07 深圳市荟艺珠宝实业有限公司 A kind of gold solder and its preparation method and application
CN109382594A (en) * 2017-08-08 2019-02-26 上海老凤祥首饰研究所有限公司 A kind of pure gold ornaments solder and its manufacturing process
CN111344105A (en) * 2017-12-19 2020-06-26 郑州机械研究所有限公司 Brazing filler metal sheath and preparation method thereof, in-situ synthesized metal coating flux-cored silver brazing filler metal and preparation method thereof, welding method and connector
CN112080744A (en) * 2020-08-20 2020-12-15 西安交通大学 Blade tip cutting coating capable of improving bonding strength with blade tip and preparation method thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102601540A (en) * 2012-03-08 2012-07-25 青岛多真工艺品有限公司 Welding powder composition for ornament metal wire and processing method of welding powder composition
CN102601540B (en) * 2012-03-08 2014-07-02 青岛多真工艺品有限公司 Welding powder composition for ornament metal wire and processing method of welding powder composition
CN105081598A (en) * 2014-05-06 2015-11-25 烟台市固光焊接材料有限责任公司 Solder paste and application thereof
CN107151748A (en) * 2016-03-02 2017-09-12 广州先艺电子科技有限公司 A kind of method of smelting of gold-germanium alloy solder
CN107151748B (en) * 2016-03-02 2019-08-06 广州先艺电子科技有限公司 A kind of method of smelting of gold-germanium alloy solder
CN106271230A (en) * 2016-08-30 2017-01-04 郑州机械研究所 A kind of coating silver solder and preparation method thereof
CN109382594A (en) * 2017-08-08 2019-02-26 上海老凤祥首饰研究所有限公司 A kind of pure gold ornaments solder and its manufacturing process
CN109382594B (en) * 2017-08-08 2021-01-15 上海老凤祥首饰研究所有限公司 Solder for pure gold ornaments and manufacturing process thereof
CN111344105A (en) * 2017-12-19 2020-06-26 郑州机械研究所有限公司 Brazing filler metal sheath and preparation method thereof, in-situ synthesized metal coating flux-cored silver brazing filler metal and preparation method thereof, welding method and connector
CN108941973A (en) * 2018-08-15 2018-12-07 深圳市荟艺珠宝实业有限公司 A kind of gold solder and its preparation method and application
CN112080744A (en) * 2020-08-20 2020-12-15 西安交通大学 Blade tip cutting coating capable of improving bonding strength with blade tip and preparation method thereof
CN112080744B (en) * 2020-08-20 2021-12-28 西安交通大学 Blade tip cutting coating capable of improving bonding strength with blade tip and preparation method thereof

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