CN105504675A - Halogen-free and non-phosphorus flame-retardant epoxy resin composition and preparation method thereof - Google Patents
Halogen-free and non-phosphorus flame-retardant epoxy resin composition and preparation method thereof Download PDFInfo
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- CN105504675A CN105504675A CN201410505081.0A CN201410505081A CN105504675A CN 105504675 A CN105504675 A CN 105504675A CN 201410505081 A CN201410505081 A CN 201410505081A CN 105504675 A CN105504675 A CN 105504675A
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Abstract
The invention discloses a halogen-free and non-phosphorus flame-retardant epoxy resin composition and its preparation method. According to the preparation method, 10-15 parts by weight of polyphenol borate, 20-50 parts by weight of bisphenol-S epoxy resin, 0.5-15 parts by weight of a-methacrylic acid deactivated imidazole and 0.5-10 parts by weight of gamma-glycidoxypropyltrimethoxysilane are dissolved in acetone or an anhydrous ethanol solvent, and after the solution become transparent, the halogen-free and non-phosphorus flame-retardant epoxy resin composition is prepared. The product has good insulativity, flame resistance, heat resistance, wet fastness and good drilling performance, and is green and environmentally friendly.
Description
Technical field
The present invention relates to a kind of environment-friendlyflame-retardant flame-retardant material, can be used for more specifically to a kind of the batching manufacturing printed electronic circuit plate substrate.
Background technology
Traditional fire-retardant printed circuit board (PCB) base material adopts halogen-system fire retardant, this kind of halogen-containing compounds can produce when carrying out incomplete combustion and very be harmful to dioxin material to human body, environment, many countries formulate, have promulgated the base material regulation of restriction or forbidding halogen-containing flame retardant in the world, therefore, the non-halogen focus becoming the development of PCB field of base material.Currently used halogen-free flameproof PCB substrate adds P contained compound, although can be fire-retardant well, there is thermotolerance, wet fastness is low and adhesiveness between layers is poor problem.Disclose in Japanese Patent Laid-Open No. Sho 61-148219 and prepare P contained compound fire retardant with on fatty compounds in conjunction with phosphorus atom, for the manufacture of halogen-free flame retardant PC B.Although improve flame retardant resistance, thermotolerance, wet fastness are inadequate.Japanese Patent Laid-Open No. Sho 11-60689 proposes technological line epoxy resin and phosphenylic acid compound being carried out reacting, but wet fastness is improved not obvious.Prepare halogen-free phosphorus-free inflaming retarding pcb board with benzoxazine in " copper-clad plate information " magazine the 4th base PP14-15 page that 2005 publish, although there is higher carbon forming rate, certain flame retardant resistance and mechanical property, flame retardant resistance can not reach the requirement of UL94-V0 level.A kind of use in printed circuit board high thermal conductivity, no halogen phosphorus-free flame-retarding type resin combination of Chinese patent application 200310121169 (publication date 20050639) public Jian.Comprise that (1) epoxy resin has difunctionality base or multifunctional fiduciary point component 10 to 50 % by weight; (2) fire retardant has amido, sub-acyl nitrogen base and oxyhydroxide base functional group structure, accounts for composition 10 to 30 % by weight; (3) inorganic powder accounts for 10 to 50 % by weight of composition; (4) high-thermal conductive metal powder accounts for composition 10 to 30 % by weight.This kind of high thermal conductivity, no halogen phosphorus-free flame-retarding resin does not have phosphonium flame retardant, therefore, can not cause problem of environmental pollution because of hydrolysis, and shortcoming is insulativity and the boring performance that inorganic powder and metal-powder reduce pcb board.The polynuclear plane compound of non-halogen non-phosphate high nitrogen content is used to be used as fire retardant in Chinese patent application 200410039268 (publication date is 20050817), owing to there is amido and hydroxy functional group in this fire retardant, therefore chemical bonding reaction can be carried out with fire retarding epoxide resin, the fire-retardant semicure epoxy resin of forming reactions type, again this fire-retardant semicure epoxy resin collocation inorganic additives is added on epoxy resin, the combustion-proof epoxide resin composition that the environment friendly non-halogen that can be used for PCB or semiconductor packages is without phosphorus can be mixed with, it is poor that shortcoming is also that inorganic additives brings PCB wet fastness.
Summary of the invention
One of the object of the invention is the technical problem that will solve is overcome deficiency of the prior art, and provide a kind of non-halogen non-phosphate epoxy resin component, this constituent has good insulativity, flame retardant resistance, thermotolerance, wet fastness, and boring property is good, environmental protection.
The present invention includes following composition by weight: multi-phenol boric acid ester 10-50 part, bisphenol-s epoxy resin 20-50 part, A-methacrylic acid passivation imidazoles 0.5-15 part and r-glycidyl ether propyl trimethoxy silicane 0.5-10 part.
The present invention also can comprise following composition by weight: trimeric cyanamide 2-8 part and nano-zinc borate 3-10 part.
Described multi-phenol boric acid fat is three Resorcinol boric acid esters or three Resorcinol boric acid esters or three bisphenol S three boric acid esters.
Described a-methacrylic acid passivation imidazoles is reacted by the a-methacrylic acid and 2-ethyl, 4-methylimidazole that wait chemical quantity and generates.React in ice-water bath and can use for one hour.
Above-mentioned multi-phenol boric acid fat is boric acid and phenol, formaldehyde reaction product, has commercially available.
Two of the object of the invention is to provide the above manufacture method Wu Tooth non-phosphorus flame-retardant epoxy resin component:
10-50 parts by weight of polyol phenol boric acid ester, 20-50 parts by weight of bisphenol S epoxy resin, 0.5-15 weight part a-methacrylic acid passivation imidazoles and 0.5-10 weight part Y-glycidyl ether propyl trimethoxy silicane are dissolved in acetone or anhydrous ethanol solvent, after transparent, namely make halogen-free phosphor-free combustion-proof epoxide resin composition.Separately, also 2-8 weight part trimeric cyanamide and 3-10 weight part nano-zinc borate can be dissolved in acetone or anhydrous ethanol solvent.
By E-glass fibre plain thick for above-mentioned halogen-free phosphor-free combustion-proof epoxide resin composition proofing 0.05-0.2mm, removing acetone or anhydrous ethanol solvent, make E-woven fiber glass/epoxy prepreg, after prepreg laminated multi-layer, be placed in steel die to suppress on flat-bed press, obtain E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet; By technique same as described above, be pressed into copper-clad plate with Copper Foil together with E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet.Test layer pressing plate or copper-clad plate, its properties is all more than the performance index that FR-4 fire retardant material standard specifies.
The beneficial effect that the present invention compared with prior art has is:
1, the methylol in the present invention in multi-phenol boric acid fat, under the katalysis of a-methacrylic acid passivation imidazoles, can reflect with trimeric cyanamide, again can with epoxy group(ing) complete reaction, the product after solidification has higher second-order transition temperature; B-O key in boron phenolic aldehyde, have very high chemical bond energy and thermo-oxidative stability, flame resistant incendivity is good; Multi-phenol boric acid ester has very high residual weight under high temperature thermal oxidation condition, and 700 DEG C of residual volumes are greater than 65%; B-O key has good toughness, is conducive to improving pcb board antistripping ability; In atomic structure in boron bakelite resin, outermost layer is 6 electronics, has very strong catching and to go out free radical electronic action, can postpone flame, reduce aflame smokiness; Sulfobenzide group in bisphenol-s epoxy resin in the present invention, has very high thermo-oxidative stability, high residual weight and high-vitrification invert point, and sulfuryl and glass fibre and Copper Foil have very strong cementability, is conducive to improving copper-clad plate peeling resistance.
2, trimeric cyanamide can with boron phenol-formaldehyde reaction, also can with epoxy reaction, can produce a large amount of N2 during trimeric cyanamide burning, having can starvation, plays fire retardation.
3, after the a-methacrylic acid passivation imidazoles in the present invention mixes with boron phenolic aldehyde and bisphenol S epoxy, room-temperature stable is good, higher than can catalysis phenolic hydroxyl group and epoxy rapid reaction when 100 DEG C, be conducive to the processing of PCB; In the present invention, Y-glycidyl ether propyl trimethoxy silicane can improve the wetting property of mixed resin solution and woven fiber glass and Copper Foil, be conducive to improving interfacial adhesion strength, this material is a kind of fire retardant material of-Si-O-key, and nano-zinc borate is a kind of highly effective flame-retardant additive.
4, the non-halogen non-phosphate epoxy resin in the present invention is a kind of resin system of organic inorganic hybridization, has the over-all propertieies such as excellent flame retardant properties, electrical property, thermotolerance, wet fastness and mechanical property.
Embodiment
Embodiment 1
Halogen-free phosphor-free combustion-proof epoxide resin composition of the present invention, compares by following composition by weight:
Above-mentioned each component is dissolved in acetone or anhydrous ethanol solvent, after homogeneous transparent, is mixed and made into halogen-free phosphor-free combustion-proof epoxide resin composition.
Above-mentioned a-methacrylic acid passivation imidazoles be by etc. stoichiometric a-methacrylic acid and 2-ethyl, 4-methylimidazole react and generate.
By E-glass fibre plain thick for above-mentioned halogen-free phosphor-free combustion-proof epoxide resin composition dipping 0.05-0.2mm, removing acetone or anhydrous ethanol solvent, make E-woven fiber glass/epoxy prepreg, after prepreg laminated multi-layer, be placed in steel die to suppress on flat-bed press, obtain E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet; By technique same as described above, be pressed into copper-clad plate with Copper Foil together with E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet.Test layer pressing plate or copper-clad plate, its second-order transition temperature (DSC method) 152 DEG C, oxygen index 61.2%, flame retardant properties reaches UL94-V0 level, stripping strength 288 DEG C, 10s condition is 1.9N/mm, and water-intake rate is 0.25%, flexural strength is 510MPa, and properties is all more than the performance index that FR-4 ignition resistant substrate standard specifies.
Embodiment 2
Halogen-free phosphor-free combustion-proof epoxide resin composition of the present invention compares by following composition by weight:
Above-mentioned each component is dissolved in acetone or anhydrous ethanol solvent, after homogeneous transparent, is mixed and made into halogen-free phosphor-free combustion-proof epoxide resin composition.
The E-glass fibre plain that above-mentioned halogen-free phosphor-free combustion-proof epoxide resin composition proofing 0.05-0.2mm is thick, removing acetone or anhydrous ethanol solvent, make E-woven fiber glass/epoxy prepreg, after prepreg laminated multi-layer, be placed in steel die to suppress on flat-bed press, obtain E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet; By technique same as described above, be pressed into copper-clad plate with Copper Foil together with E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet.Test layer pressing plate or copper-clad plate, its second-order transition temperature (DSC method) 154 DEG C, oxygen index 61.6%, flame retardant properties reaches UL94-VO level, stripping strength 289 DEG C, 10s condition is 1.9N/mm, and water-intake rate is 0.25%, flexural strength is 510MPa, and properties is all more than the performance index that FR-4 ignition resistant substrate standard specifies.
Embodiment 3
Halogen-free phosphor-free combustion-proof epoxide resin composition of the present invention compares by following composition by weight:
Above-mentioned each component is dissolved in acetone or anhydrous ethanol solvent, after homogeneous transparent, is mixed and made into halogen-free phosphor-free combustion-proof epoxide resin composition.
Above-mentioned a-methacrylic acid passivation imidazoles be by etc. stoichiometric a-methacrylic acid and 2-ethyl, 4-methylimidazole reaction generate.
By E-glass fibre plain thick for above-mentioned halogen-free phosphor-free combustion-proof epoxide resin composition dipping 0.05-0.2mm, removing acetone or anhydrous ethanol solvent, make E-woven fiber glass/epoxy prepreg, after prepreg laminated multi-layer, be placed in steel die to suppress on flat-bed press, obtain E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet; By technique same as described above, be pressed into copper-clad plate with Copper Foil together with E-woven fiber glass/halogen-free phosphor-free combustion-proof epoxide resin veneer sheet.Test layer pressing plate or copper-clad plate, its second-order transition temperature (DSC method) 153 DEG C, oxygen index 61.6%, flame retardant properties reaches UL94VO level, stripping strength 289 DEG C, 10s condition is 1.9N/mm, and water-intake rate is 0.25%, flexural strength is 510MPa, and properties is all more than the performance index that the fire-retardant basic material of FR-4 specifies.
Claims (6)
1. a halogen-free phosphor-free combustion-proof epoxide resin composition, is characterized in that following composition by weight: multi-phenol boric acid ester 10-50 part, bisphenol-s epoxy resin 20-50 part, a-methacrylic acid passivation imidazoles 0.5-15 part and ,-glycidyl ether propyl trimethoxy silicane 0.5-10 part.
2. halogen-free phosphor-free combustion-proof epoxide resin composition according to claim 1, is characterized in that also can comprising following composition by weight: trimeric cyanamide 2-8 part and nano-zinc borate 3-10 part.
3. halogen-free phosphor-free combustion-proof epoxide resin composition according to claim 1 or 2, is characterized in that: described multi-phenol boric acid fat is three Resorcinol boric acid esters or three Resorcinol boric acid esters or three bisphenol S three boric acid esters.
4. halogen-free phosphor-free combustion-proof epoxide resin composition according to claim 1 or 2, is characterized in that: described a-methacrylic acid passivation imidazoles is reacted by the a-methacrylic acid and 2-ethyl, 4-methylimidazole that wait chemical quantity and generates.
5. the manufacture method of a halogen-free phosphor-free combustion-proof epoxide resin composition as claimed in claim 1, it is characterized in that 10-50 parts by weight of polyol phenol boric acid ester, 20-50 parts by weight of bisphenol S epoxy resin, 0.5-15 weight part a-methacrylic acid passivation imidazoles and 0.5-10 weight part Y-glycidyl ether propyl trimethoxy silicane to be dissolved in acetone or anhydrous ethanol solvent, after transparent, namely make halogen-free phosphor-free combustion-proof epoxide resin composition.
6. the manufacture method of halogen-free phosphor-free combustion-proof epoxide resin composition according to claim 5, is characterized in that also to dissolve in 2-8 weight part trimeric cyanamide and 3-10 weight part nano-zinc borate in acetone or anhydrous ethanol solvent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410505081.0A CN105504675A (en) | 2014-09-26 | 2014-09-26 | Halogen-free and non-phosphorus flame-retardant epoxy resin composition and preparation method thereof |
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| CN201410505081.0A CN105504675A (en) | 2014-09-26 | 2014-09-26 | Halogen-free and non-phosphorus flame-retardant epoxy resin composition and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108641294A (en) * | 2018-05-08 | 2018-10-12 | 北京工商大学 | A kind of fire retarding epoxide resin based on the biradical compound of phospho hetero phenanthrene borate |
| CN113045864A (en) * | 2021-04-26 | 2021-06-29 | 上海方乾科技有限公司 | Halogen-free flame-retardant epoxy resin containing naphthalene ring structure and preparation method thereof |
-
2014
- 2014-09-26 CN CN201410505081.0A patent/CN105504675A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108641294A (en) * | 2018-05-08 | 2018-10-12 | 北京工商大学 | A kind of fire retarding epoxide resin based on the biradical compound of phospho hetero phenanthrene borate |
| CN113045864A (en) * | 2021-04-26 | 2021-06-29 | 上海方乾科技有限公司 | Halogen-free flame-retardant epoxy resin containing naphthalene ring structure and preparation method thereof |
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Application publication date: 20160420 |