CN102964777B - Phosphorus-containing and halogen-free flame retardant resin adhesive as well as preparation method and application thereof - Google Patents
Phosphorus-containing and halogen-free flame retardant resin adhesive as well as preparation method and application thereof Download PDFInfo
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Abstract
The invention relates to a phosphorus-containing and halogen-free flame retardant resin adhesive as well as a preparation method and an application thereof. The phosphorus-containing and halogen-free flame retardant resin adhesive is composed of a solid matter and an organic solvent, wherein the content of the solid matter is 50-90wt%, the balance is the organic solvent, and the solid matter is composed of the following components in percentage by weight: 5-50% of phosphorus-containing epoxy resin, 10-60% of epoxy resin modified by isocyanic acid, 1-35% of phosphorus-containing curing agent, 1-30% of phenolic resin, 10-60% of inorganic filler and 0.002-0.015% of epoxy resin curing promoter. The phosphorus-containing and halogen-free flame retardant resin adhesive provided by the invention has the advantages of good heat resistance and flame retardancy and good toughness and peeling strength.
Description
Technical field
The present invention relates to tackiness agent preparing technical field, relate to a kind of flame retardant resin tackiness agent of phosphor-containing halogen-free element in particular, Preparation Method And The Use.
Background technology
Along with recent to the concern of Global Environmental Problems, the regulations about the formation of toxic substance in electronic and electronic product process are just further strict.The conventional resin compositions being generally used for prepreg and veneer sheet uses the dual functional epoxy resin of bromination and polyfunctional epoxy resin as main ingredient, use amino curing agent and curing catalyst, its epoxy resin contains the bromine of 15 ~ 20wt%, to meet the flame-retardant standard of UL (UnderwritersLaboratory Underwriters Laboratory).
Brominated halogenide has excellent flame retardant resistance, but produces malicious chlorine in its combustion processes.Because halogen-containing material can produce carcinogenic dioxin, its application is controlled extremely sternly.For this reason, it is fire-retardant that industry requires to use the fire retardant type of non-halogen, namely require to use halogen-free flame-retardant printed electronic circuit base material, and in detection, PCB processing and application, appliance fire, waste treatment (comprises recovery, bury, burn) etc. in process, such material can not produce the material harmful to human and environment, halogen-free flame-retardant printed electronic circuit base material comprises copper-clad laminate, prepreg, resin coated copper foil etc., halogen-free flame-retardant copper-clad laminate is also known as " green type copper-clad laminate " (Green CCL), " environmentally friendly copper-clad laminate ", " Environment-friendlycopper copper clad laminate ".At present, industry has developed mixture non-halogen based flame retardant in ordinary epoxy resin, as the composition of nitrogenous compound, P contained compound, inorganics etc.But still have following point in these flame retardant resin compositions: have detrimentally affect to epoxy cure, reduce the thermotolerance of hardening composition or make the shortcomings such as hardening composition fragility is large, stripping strength is low.
Summary of the invention
The object of the invention is to the shortcoming of the fire retardant tackiness agent overcoming existing halogen, provide a kind of flame retardant resin tackiness agent of phosphor-containing halogen-free element, this tackiness agent has good heat resistance and flame retardant resistance, and the good toughness of tool and stripping strength.
For realizing object of the present invention, technical scheme of the present invention is:
A flame retardant resin tackiness agent for phosphor-containing halogen-free element, this tackiness agent is made up of solid substance and organic solvent,
Wherein, the weight percentage of solid substance is 50-90%, and organic solvent is surplus,
Solid substance is made up of the component of following weight percentage:
In the preferred embodiment of the present invention, the weight percentage of solid substance is 55-75%, and organic solvent is surplus.
In the preferred embodiment of the present invention, described phosphorous epoxy resin physical property requires as shown in table 1:
Table 1
This phosphorous epoxy resin mainly provides the fire-retardant required phosphorus of material without element, and its chemical structure is as shown in the formula (1):
Wherein, n=1 ~ 3.
The structure of DOPO as shown in the formula:
In the preferred embodiment of the present invention, described phosphorous epoxy resin is preferably the PE-315 phosphorous epoxy resin of Shanxi, Taiwan one Chemical Manufacture, but is not limited only to this.
In the preferred embodiment of the present invention, the epoxy resin physical property of described isocyanic acid modification requires as shown in table 2:
Table 2
The epoxy resin of this isocyanic acid modification is one or both the mixture in the epoxy resin of the epoxy resin of aromatic series diphenylmethanediisocyanate modification, tolylene diisocyanate modification, it gives basic machinery required for tackiness agent of the present invention and thermal characteristics, and has good toughness and excellent copper-stripping intensity.
In the preferred embodiment of the present invention, the epoxy resin of described isocyanic acid modification preferably with the XZ-97103 epoxy resin that DOW Chemical is produced, but is not limited only to this.
In the preferred embodiment of the present invention, described phosphorous solidifying agent is bisphenol A-type phosphorus containing phenolic resin, and its physical property requires as shown in table 3:
Table 3
This phosphorus curing agent is bisphenol A-type phosphorus containing phenolic resin, and it reacts obtained by P contained compound and bisphenol A type epoxy resin, can select the resin of DOW Chemical production, trade mark XZ-92741, but be not limited only to this.
In the preferred embodiment of the present invention, described resol is the resol of phenol and formaldehyde crosslinking, and described phenol is one or more the mixture in phenol, xylenol, ethylphenol, n-propyl phenol, isopropyl-phenol, normal-butyl phenol, isobutyl-phenol, tert.-butyl phenol or dihydroxyphenyl propane.As the phenol novolacs that preferred described resol is phenol and formaldehyde crosslinking, or the bisphenol A phenolic resin of dihydroxyphenyl propane and formaldehyde crosslinking, or the mixture of phenol novolacs and bisphenol A phenolic resin.
Above resol can select Korea S can the KPH-L2003 resin of grand chemical production, but is not limited only to this.
In the preferred embodiment of the present invention, described mineral filler is one or more the mixture in talcum, silica powder, ceramics powder, aluminium hydroxide, silicon-dioxide, clay or boron nitride, is preferably one or both the mixture in silicon-dioxide or aluminium hydroxide.Mineral filler can improve chemical property and the electrical property of cured resin, as reduced thermal expansivity (CTE), increases modulus, accelerates Heat transmission and assists fire-retardant etc.
In the preferred embodiment of the present invention, described epoxy resin curing accelerator is imidazolium compounds, is preferably the mixture of 2-ethyl-4-methylimidazole or 1 benzyl 2 methyl imidazole or 2-ethyl-4-methylimidazole and 1 benzyl 2 methyl imidazole.
In the preferred embodiment of the present invention, described organic solvent is one or more the mixture in acetone, methyl ethyl ketone, toluene, dimethylbenzene, methyl iso-butyl ketone (MIBK), propylene glycol monomethyl ether or cyclohexanone.
Another object of the present invention is to provide a kind of preparation method of flame retardant resin tackiness agent of phosphor-containing halogen-free element, and it is characterized in that, the method comprises the following steps:
(1) in steel basin, add part organic solvent by formula ratio, turn on agitator, rotating speed 500 ~ 1500 revs/min, keep Keep agitation control flume temperature at 20 ~ 50 DEG C, then add mineral filler, Keep agitation 10 ~ 50 minutes after interpolation;
(2) in steel basin, phosphorous epoxy resin, the epoxy resin of isocyanic acid modification, phosphorus curing agent, resol is added successively by formula ratio, keep in reinforced process stirring with 1000 ~ 1500 revs/min of rotating speeds, open efficient shearing and emulsification 0.5 ~ 4 hour after interpolation, carry out simultaneously cooling water circulation with retentive control cell body temperature at 20 ~ 50 DEG C;
(3) take epoxy resin curing accelerator by formula ratio, joined in remaining organic solvent, after dissolving completely, this solution is added in steel basin, and continue maintenance 1000 ~ 1500 revs/min stirring 3 ~ 15 hours, be i.e. obtained tackiness agent.
Another object of the present invention is to provide the purposes of flame retardant resin tackiness agent in preparation copper-clad plate (copper-clad laminate) of phosphor-containing halogen-free element.
With copper-clad laminate prepared by the flame retardant resin tackiness agent of phosphor-containing halogen-free element of the present invention, there is >=the second-order transition temperature of 150 DEG C, good heat resistance and flame retardant resistance, and the toughness that tool is good and stripping strength, the halogen-free environmental printed-wiring board (PWB) of various characteristic good can be made, be applicable to the demand of PCB leadless process and multi-ply wood production completely.
Embodiment
The present invention is further illustrated below by embodiment and comparative example.
The characteristic of the copper-clad laminate of embodiment 1-4 and comparative example 1-2 is measured by following methods (with reference to IPC-TM-650).
(1) second-order transition temperature (Tg)
Second-order transition temperature refers to sheet material in the situation of being heated by the temperature (DEG C) of glassy transition corresponding to elastomeric state (rubbery state).
Detection method: adopt differential scanning calorimetry (DSC).
(2) the thermally stratified layer time (T-288)
The T-288 thermally stratified layer time refers to that sheet material is under the design temperature of 288 DEG C, because demixing phenomenon appears in the effect of heat, and duration before this.
Detection method: adopt thermo-mechanical analysis method (TMA).
(3) scolding tin thermotolerance
Scolding tin thermotolerance, refers to that sheet material immerses in the melting scolding tin of 288 DEG C, without occurring layering and bubbling duration.
Detection method: the substrate after etching is cut into 5.0cm × 5.0cm size, and edges of boards use 120 orders and 800 order sand paperings successively, pressure-cook certain hour, put into 288 DEG C of tin melting furnaces, observe with or without phenomenons such as layerings.
(4) stripping strength
According to the test of IPC-TM-650-2.4.8C method.
(5) flame retardant resistance
Surperficial Copper Foil is removed in etching, carries out preparation of samples and test according to the flammability test of UL94 veneer sheet.
The present invention is described in detail below in conjunction with specific embodiment, following examples unless expressly stated otherwise, the phosphorous epoxy resin mentioned is the PE-315 phosphorous epoxy resin of Shanxi, Taiwan one Chemical Manufacture, the epoxy resin of isocyanic acid modification is the XZ-97103 epoxy resin that DOW Chemical is produced, phosphorus curing agent is the trade mark XZ-92741 resin that DOW Chemical is produced, and resol is that Korea S can the KPH-L2003 resin of grand chemical production.Glasscloth can select E level, and specification can be selected from 101,104,106,1078,1080,1086,2113,2313,2116,1506 or 7628.Copper Foil used can select 1/3oz, Hoz, 1oz, 2oz, 3oz, 4oz or 5oz.Bisphenol A epoxide resin is the BNE200 resin of Changchun, Taiwan chemical industry.
Embodiment 1
1. the mass percentage of the solid substance in tackiness agent is 65.2%, and all the other are organic solvent (such as propylene glycol monomethyl ether),
Wherein, the formula of solid substance is in table 4 (by weight)
Table 4
2. the preparation method of tackiness agent:
(1) in steel basin, add organic solvent propylene glycol monomethyl ether 106 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, the epoxy resin of isocyanic acid modification, phosphorus curing agent, resol successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2E4MZ by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent propylene glycol monomethyl ether, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue.
3. prepare copper-clad laminate
The resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35um, through 195 DEG C, the heating under pressure of 25Kg/cm2, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
4. to prepare the performance perameter of the copper-clad laminate of gained as shown in table 5 for the present embodiment:
Table 5
Embodiment 2:
1. prepare tackiness agent
The mass percentage of the solid substance in adhesive therefor is 66%, and all the other are organic solvent (as propylene glycol monomethyl ether), and wherein, the formula of solid substance is in table 6 (by weight)
Table 6
| Raw material | Solid weight (gram) |
| Phosphorous epoxy resin | 45 |
| The epoxy resin of isocyanic acid modification | 55 |
| Phosphorus curing agent | 18 |
| Resol | 10 |
| Aluminium hydroxide | 39 |
| Silicon-dioxide | 24 |
| 2E4MZ | 0.03 |
2. the preparation method of tackiness agent:
(1) in steel basin, add organic solvent propylene glycol monomethyl ether 98 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, the epoxy resin of isocyanic acid modification, phosphorus curing agent, resol successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2E4MZ by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent propylene glycol monomethyl ether, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue.
3. prepare copper-clad laminate
The resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35um, through 195 DEG C, the heating under pressure of 25Kg/cm2, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
4. to prepare the performance perameter of the copper-clad laminate of gained as shown in table 7 for the present embodiment:
Table 7
| Project | Test result |
| Second-order transition temperature (DSC), DEG C | 159 |
| Peel strength of copper foil (1oz), lb/in | 9.7 |
| T288(TMA),min | >60 |
| Scolding tin thermotolerance (PCT/3h, 288 DEG C of wickings) | >10min |
| Flame retardant resistance (UL-94, rating) | V-0 |
Embodiment 3:
1. prepare tackiness agent
(1) mass percentage of the solid substance in adhesive therefor is 66%, and all the other are organic solvent (as propylene glycol monomethyl ether), and wherein, the formula of solid substance is in table 8 (by weight)
Table 8
| Raw material | Solid weight (gram) |
| Phosphorous epoxy resin | 30 |
| The epoxy resin of isocyanic acid modification | 70 |
| Phosphorus curing agent | 18 |
| Resol | 12 |
| Aluminium hydroxide | 53 |
| Silicon-dioxide | 10 |
| 2E4MZ | 0.03 |
2. the preparation method of tackiness agent:
(1) in steel basin, add organic solvent propylene glycol monomethyl ether 99 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, the epoxy resin of isocyanic acid modification, phosphorus curing agent, resol successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2E4MZ by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent propylene glycol monomethyl ether, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue.
3. prepare copper-clad laminate
The resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35um, through 195 DEG C, the heating under pressure of 25Kg/cm2, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
4. to prepare the performance perameter of the copper-clad laminate of gained as shown in table 9 for the present embodiment:
Table 9
| Project | Test result |
| Second-order transition temperature (DSC), DEG C | 156 |
| Peel strength of copper foil (1oz), lb/in | 9.5 |
| T288(TMA),min | >60 |
| Scolding tin thermotolerance (PCT/3h, 288 DEG C of wickings) | >10min |
| Flame retardant resistance (UL-94, rating) | V-0 |
Embodiment 4:
1. prepare tackiness agent
(1) mass percentage of the solid substance in adhesive therefor is 65%, and all the other are organic solvent (as propylene glycol monomethyl ether), and wherein, the formula of solid substance is in table 10 (by weight)
Table 10
| Raw material | Solid weight (gram) |
| Phosphorous epoxy resin | 40 |
| The epoxy resin of isocyanic acid modification | 60 |
| Phosphorus curing agent | 14 |
| Resol | 10 |
| Aluminium hydroxide | 45 |
| Silicon-dioxide | 18 |
| 2E4MZ | 0.01 |
2. the preparation method of tackiness agent:
(1) in steel basin, add organic solvent propylene glycol monomethyl ether 102 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, the epoxy resin of isocyanic acid modification, phosphorus curing agent, resol successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2E4MZ by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent propylene glycol monomethyl ether, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue.
3. prepare copper-clad laminate
The resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35um, through 195 DEG C, the heating under pressure of 25Kg/cm2, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
4. to prepare the performance perameter of the copper-clad laminate of gained as shown in table 11 for the present embodiment:
Table 11
| Project | Test result |
| Second-order transition temperature (DSC), DEG C | 157 |
| Peel strength of copper foil (1oz), lb/in | 9.9 |
| T288(TMA),min | >60 |
| Scolding tin thermotolerance (PCT/3h, 288 DEG C of wickings) | >10min |
| Flame retardant resistance (UL-94, rating) | V-0 |
Comparative example 1:
1. prepare tackiness agent
The mass percentage of the solid substance in adhesive therefor is 65%, and all the other are organic solvent (dimethyl formamide), and wherein, the formula of solid substance is in table 12 (by weight)
Table 12
| Raw material | Solid weight (gram) |
| Phosphorous epoxy resin | 70 |
| Bisphenol-A phenolic epoxy resin | 30 |
| Dicy-curing agent | 2.5 |
| Aluminium hydroxide | 23 |
| Silicon-dioxide | 7 |
| 2MI | 0.01 |
2. the preparation method of tackiness agent:
(1) in steel basin, add organic solvent dimethyl formamide 68 grams, dicy-curing agent 2.5 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, bisphenol-A phenolic epoxy resin successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2MI by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent dimethyl formamide, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue.
3. prepare copper-clad laminate
The resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35um, through 195 DEG C, the heating under pressure of 25Kg/cm2, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
4. to prepare the performance perameter of the copper-clad laminate of gained as shown in table 13 below for this comparative example:
Table 13
| Project | Test result |
| Second-order transition temperature (DSC), DEG C | 147 |
| Peel strength of copper foil (1oz), lb/in | 9.4 |
| T288(TMA),min | 3 |
| Scolding tin thermotolerance (PCT/3h, 288 DEG C of wickings) | 1min |
| Flame retardant resistance (UL-94, rating) | V-0 |
Comparative example 2:
1. prepare tackiness agent
The mass percentage of the solid substance in adhesive therefor is 65%, and all the other are organic solvent (dimethyl formamide), and wherein, the formula of solid substance is in table 14 (by weight)
Table 14
| Raw material | Solid weight (gram) |
| Phosphorous epoxy resin | 85 |
| Bisphenol-A phenolic epoxy resin | 15 |
| Dicy-curing agent | 3.2 |
| Aluminium hydroxide | 20 |
| Silicon-dioxide | 10 |
| 2MI | 0.02 |
2. the preparation method of tackiness agent:
(1) in steel basin, add organic solvent dimethyl formamide 70 grams, dicy-curing agent 3.2 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, bisphenol-A phenolic epoxy resin successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2MI by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent dimethyl formamide, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue.
3. prepare copper-clad laminate
The resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35um, through 195 DEG C, the heating under pressure of 25Kg/cm2, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
4. to prepare the performance perameter of the copper-clad laminate of gained as shown in table 15 below for this comparative example:
Table 15
| Project | Test result |
| Second-order transition temperature (DSC), DEG C | 151 |
| Peel strength of copper foil (1oz), lb/in | 9.2 |
| T288(TMA),min | 4 |
| Scolding tin thermotolerance (PCT/3h, 288 DEG C of wickings) | 2min |
| Flame retardant resistance (UL-94, rating) | V-0 |
In sum, the copper-clad plate of gained is prepared with not halogen-containing phosphor-containing flame-proof tackiness agent of the present invention, have good heat resistance and Zu Ran ﹐ and have good toughness and stripping strength, this copper-clad plate can make the halogen-free environmental printed-wiring board (PWB) of various characteristic good.
Claims (1)
1. a flame retardant resin tackiness agent for phosphor-containing halogen-free element, is characterized in that, this tackiness agent is made up of solid substance and organic solvent, and wherein, the weight percentage of solid substance is 66%, and all the other are propylene glycol monomethyl ether;
Described solid substance is made up of the component of following weight:
Described phosphorous epoxy resin is the PE-315 phosphorous epoxy resin of Shanxi, Taiwan one Chemical Manufacture, the epoxy resin of described isocyanic acid modification is the XZ-97103 epoxy resin that DOW Chemical is produced, described phosphorus curing agent is that DOW Chemical produces trade mark XZ-92741 resin, and described resol is that Korea S can the KPH-L2003 resin of grand chemical production;
The preparation method of this tackiness agent, comprises the steps:
(1) in steel basin, add organic solvent propylene glycol monomethyl ether 99 grams by above weight, turn on agitator, rotating speed 600 revs/min, then add aluminium hydroxide and silicon-dioxide, Keep agitation 20 minutes after interpolation;
(2) in steel basin, add phosphorous epoxy resin, the epoxy resin of isocyanic acid modification, phosphorus curing agent, resol successively by formula ratio, keep in reinforced process stirring with 1000 revs/min of rotating speeds;
(3) take 2E4MZ by formula ratio, after it is dissolved completely with the ratio of weight ratio 1:10 and organic solvent propylene glycol monomethyl ether, this solution is added in steel basin, and continue maintenance 1200 revs/min stirring 2 hours, obtained resin glue;
The processing step that copper-clad laminate prepared by this tackiness agent is: the resin glue continuously coating obtained in order to top method or impregnated glass fiber cloth, under 170 DEG C of baking conditions, drying obtains prepreg, by superimposed for 8 prepregs, the high temperature extension Copper Foil of its upper and lower each placement 1 35 μm, through 195 DEG C, 25Kg/cm
2heating under pressure, pressurization 140 minutes, obtain the copper-clad laminate of 1.6mm.
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| CN106166874B (en) * | 2016-06-29 | 2018-07-20 | 南亚新材料科技股份有限公司 | halogen-free copper-clad plate and preparation method thereof |
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| CN109851991A (en) * | 2018-12-04 | 2019-06-07 | 吉安市宏瑞兴科技有限公司 | A kind of halogen-free epoxy resin composition and preparation method thereof and application thereof |
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Address after: Shanghai city Chang Cheung Road 201802 Jiading District Nanxiang Town, No. 158 Patentee after: South Asia new materials Polytron Technologies Inc Address before: Shanghai city Chang Cheung Road 201802 Jiading District Nanxiang Town, No. 158 Patentee before: Shanghai Nanya Copper Clad Laminate Co., Ltd. |