CN105485961A - Specific area cold and hot self-control heat pump - Google Patents
Specific area cold and hot self-control heat pump Download PDFInfo
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- CN105485961A CN105485961A CN201510713366.8A CN201510713366A CN105485961A CN 105485961 A CN105485961 A CN 105485961A CN 201510713366 A CN201510713366 A CN 201510713366A CN 105485961 A CN105485961 A CN 105485961A
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- copper groove
- heat pump
- temperature sensor
- pump
- cold
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Abstract
The invention relates to the field of control of cold and hot quantity systems of electroplating enterprises, in particular to a self-control heat pump. A specific area cold and hot self-control heat pump comprises a pump body shell; a refrigeration and heating management control system is arranged in the pump body shell, and includes a first cylinder and a second cylinder; a condenser is arranged in the first cylinder; the first cylinder is connected with a pyrophosphate copper tank through a first ppr pipe to form a heating loop; an evaporator is arranged in the second cylinder; the second cylinder is connected with an acid copper tank through a second ppr pipe to form a refrigeration loop; and the refrigeration and heating management control system includes a sensor, a controller and a heat pump system. A refrigeration end directly refrigerates liquid in an electrolytic cell according to the process temperature requirement; the condenser in the heat pump system recovers heat generated by refrigeration of the evaporator to heat the electrolytic cell needing high temperature through the heating loop; and the heating efficiency of the specific area cold and hot self-control heat pump is 3-4 times of the heating efficiency of a traditional electric heating mode.
Description
Technical field
The present invention relates to electroplating enterprise cold and hot amount Systematical control field, particularly relate to automatic control heat pump.
Background technology
Electroplating enterprise because of technique need control chemical reaction temperature, as sour copper groove temperature need control at 23 degree, and burnt copper groove temperature need control at 50 degree.Current Electroplate Factory adopts sour copper groove and burnt copper groove temperature to control respectively, use the equipment such as refrigerator, cooling tower and cooling water pump to control in low temperature 23 degree of states as sour copper groove temperature, burnt copper groove temperature is controlled the condition of high temperature 50 degree by equipment such as electrical heating.
Summary of the invention
The object of the present invention is to provide the cold and hot automatic control heat pump in a kind of special territory, to solve the problems of the technologies described above.
Technical problem solved by the invention can realize by the following technical solutions:
The cold and hot automatic control heat pump in special territory, comprise pump housing shell, it is characterized in that, be provided with a cooling and warming management control system in described pump housing shell, described cooling and warming management control system comprises the first cylinder body and the second cylinder body;
Be provided with a condenser in described first cylinder body, described first cylinder body connects and composes one by a ppr pipe with burnt copper groove and heats loop;
Be provided with an evaporimeter in described second cylinder body, described second cylinder body connects and composes a refrigerating circuit by the 2nd ppr pipe with sour copper groove;
Described cooling and warming management control system comprises sensor, controller and heat pump.
The requirement of liquid in electrolytic cell by technological temperature is directly freezed by refrigeration end of the present invention, condenser in heat pump will reclaim the heat of evaporator refrigeration generation, to needing the electrolytic cell of high temperature to heat by heating loop, the cold and hot automatic control in special territory heat pump heating efficiency is traditional Electric heating 3 to 4 times.Present invention optimizes tradition and use single cooler refrigeration, electric heater for heating, change into and utilize refrigeration used heat to ban electrical heating.The used heat that the present invention utilizes refrigeration to produce saves power consumption, reduces Electroplate Factory's production cost.
The first temperature sensor is provided with in described burnt copper groove, the second temperature sensor is provided with in described sour copper groove, described first temperature sensor is all connected with a microprocessor system with described second temperature sensor, and described microprocessor system connects described heat pump.
The present invention passes through the monitoring temperature of sour copper groove and burnt copper groove, once temperature does not reach the value of setting, first temperature sensor and the second temperature sensor just by collect signal transmission to microprocessor system, described microprocessor system makes heat pump start working.
Be full of electrolyte in described first cylinder body and described second cylinder body, described condenser and described evaporimeter are preferably titanium alloy heat exchanger.Titanium alloy heat exchanger can be corrosion-resistant.
Described burnt copper groove connects the first pump, and described first pump is positioned at and heats loop;
Described sour copper groove connects the second pump, and described second pump is positioned at refrigerating circuit.
The present invention is achieved by pump and heats the circularly cooling of sour copper groove and the circulation of burnt copper groove.
Described first pump and described second pump are preferably the Special Pump of acid-alkali-corrosive-resisting.
Described microprocessor system connects a communication module, and described communication module connects a host computer.
Information in microprocessor system is uploaded to host computer by communication module by the present invention, is convenient to collect data and statistics.
Described host computer can be a computer, mobile phone or panel computer.
Accompanying drawing explanation
Fig. 1 is part-structure schematic diagram of the present invention.
Detailed description of the invention
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, setting forth the present invention further below in conjunction with concrete diagram.
With reference to Fig. 1, the cold and hot automatic control heat pump in special territory, comprises pump housing shell, is provided with a cooling and warming management control system in pump housing shell, and cooling and warming management control system comprises the first cylinder body 1 and the second cylinder body 2; Be provided with condenser 3, first cylinder body in first cylinder body to connect and compose one by a ppr pipe heat loop with burnt copper groove 5; Be provided with evaporimeter 4, second cylinder body in second cylinder body and connect and compose a refrigerating circuit by the 2nd ppr pipe with sour copper groove 6; Cooling and warming management control system comprises sensor, controller and heat pump.The requirement of liquid in electrolytic cell by technological temperature is directly freezed by refrigeration end of the present invention, condenser in heat pump will reclaim the heat of evaporator refrigeration generation, to needing the electrolytic cell of high temperature to heat by heating loop, the cold and hot automatic control in special territory heat pump heating efficiency is traditional Electric heating 3 to 4 times.Present invention optimizes tradition and use single cooler refrigeration, electric heater for heating, change into and utilize refrigeration used heat to ban electrical heating.The used heat that the present invention utilizes refrigeration to produce saves power consumption, reduces Electroplate Factory's production cost.
Be provided with the first temperature sensor 8 in burnt copper groove, be provided with the second temperature sensor 9, first temperature sensor and be all connected with a microprocessor system with the second temperature sensor in sour copper groove, microprocessor system connects heat pump.The present invention by the monitoring temperature of sour copper groove and burnt copper groove, once temperature does not reach the value of setting, the first temperature sensor and the second temperature sensor just by the signal transmission of collection to microprocessor system, microprocessor system makes heat pump start working.Be full of electrolyte in first cylinder body and the second cylinder body, condenser and evaporimeter are preferably titanium alloy heat exchanger.Titanium alloy heat exchanger can be corrosion-resistant.Burnt copper groove connects the first pump, and the first pump is positioned at and heats loop; Acid copper groove connects the second pump, and the second pump is positioned at refrigerating circuit.The present invention is achieved by pump and heats the circularly cooling of sour copper groove and the circulation of burnt copper groove.First pump and the second pump are preferably the Special Pump of acid-alkali-corrosive-resisting.Microprocessor system connects a communication module, and communication module connects a host computer.Information in microprocessor system is uploaded to host computer by communication module by the present invention, is convenient to collect data and statistics.Host computer can be a computer, mobile phone or panel computer.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (6)
1. the cold and hot automatic control heat pump in special territory, comprises pump housing shell, it is characterized in that, is provided with a cooling and warming management control system in described pump housing shell, and described cooling and warming management control system comprises the first cylinder body and the second cylinder body;
Be provided with a condenser in described first cylinder body, described first cylinder body connects and composes one by a ppr pipe with burnt copper groove and heats loop;
Be provided with an evaporimeter in described second cylinder body, described second cylinder body connects and composes a refrigerating circuit by the 2nd ppr pipe with sour copper groove;
Described cooling and warming management control system also comprises a compressor, and described compressor, described condenser and described evaporimeter are linked in sequence.
2. the cold and hot automatic control heat pump in special territory according to claim 1, it is characterized in that, the first temperature sensor is provided with in described burnt copper groove, the second temperature sensor is provided with in described sour copper groove, described first temperature sensor is all connected with a microprocessor system with described second temperature sensor, and described microprocessor system connects described heat pump compressor.
3. the cold and hot automatic control heat pump in special territory according to claim 1, it is characterized in that, described burnt copper groove is provided with burnt copper groove electrolyte inlet and burnt copper groove electrolyte outlet, described burnt copper groove electrolyte outlet place is provided with three-temperature sensor, described burnt copper groove electrolyte inlet place is provided with the 4th temperature sensor, and described three-temperature sensor is all connected with described microprocessor system with described 4th temperature sensor;
Sour copper groove electrolyte inlet and sour copper groove electrolyte outlet is provided with in described sour copper groove, described sour copper groove electrolyte outlet is provided with the 5th temperature sensor, described sour copper groove electrolyte inlet is provided with the 6th temperature sensor, and described 5th temperature sensor is all connected with described microprocessor system with described 6th temperature sensor.
4. the cold and hot automatic control heat pump in special territory according to claim 1, is characterized in that, described burnt copper groove connects the first pump, and described first pump is positioned at and heats loop;
Described sour copper groove connects the second pump, and described second pump is positioned at refrigerating circuit.
5. the cold and hot automatic control heat pump in special territory according to claim 3, is characterized in that, described burnt copper groove electrolyte outlet, sour copper groove electrolyte outlet, burnt copper groove electrolyte inlet and sour copper groove electrolyte inlet all electroplate one deck titanium alloy layer.
6. the cold and hot automatic control heat pump in special territory according to claim 2, it is characterized in that, described microprocessor system connects a communication module, and described communication module connects a host computer.
Priority Applications (1)
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CN201510713366.8A CN105485961B (en) | 2015-10-28 | 2015-10-28 | The special cold and hot automatic control heat pump in domain |
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CN201510713366.8A CN105485961B (en) | 2015-10-28 | 2015-10-28 | The special cold and hot automatic control heat pump in domain |
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CN105485961A true CN105485961A (en) | 2016-04-13 |
CN105485961B CN105485961B (en) | 2018-10-09 |
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Citations (5)
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CN101259549A (en) * | 2008-04-16 | 2008-09-10 | 浙江工业大学 | Electrolytic machining technique and device for small bore diameter inner wall surface fine groove |
US20100122909A1 (en) * | 2008-11-18 | 2010-05-20 | Toru Murakami | Method of preparing chromium plating bath and method of forming plating film |
CN102589216A (en) * | 2012-03-26 | 2012-07-18 | 珠海福士得冷气工程有限公司 | Energy-saving system and control method for supplying cold and heat simultaneously |
CN102593487A (en) * | 2012-02-09 | 2012-07-18 | 国网电力科学研究院武汉南瑞有限责任公司 | Temperature control device for electrolyte storage device of vanadium redox battery |
CN102909446A (en) * | 2012-11-01 | 2013-02-06 | 东北林业大学 | Device for removing internally crossed tidy hole burrs by compositing electrolyte and micro-fine grinded powder |
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2015
- 2015-10-28 CN CN201510713366.8A patent/CN105485961B/en active Active
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CN101259549A (en) * | 2008-04-16 | 2008-09-10 | 浙江工业大学 | Electrolytic machining technique and device for small bore diameter inner wall surface fine groove |
US20100122909A1 (en) * | 2008-11-18 | 2010-05-20 | Toru Murakami | Method of preparing chromium plating bath and method of forming plating film |
CN102593487A (en) * | 2012-02-09 | 2012-07-18 | 国网电力科学研究院武汉南瑞有限责任公司 | Temperature control device for electrolyte storage device of vanadium redox battery |
CN102589216A (en) * | 2012-03-26 | 2012-07-18 | 珠海福士得冷气工程有限公司 | Energy-saving system and control method for supplying cold and heat simultaneously |
CN102909446A (en) * | 2012-11-01 | 2013-02-06 | 东北林业大学 | Device for removing internally crossed tidy hole burrs by compositing electrolyte and micro-fine grinded powder |
Non-Patent Citations (3)
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周小平,王应泉: "中温热泵在涂装、电镀工艺加热中的应用", 《第十届全国转化膜及表面精饰学术年会论文集》 * |
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蒋伟刚: "电镀溶液冷却系统的设计", 《材料保护》 * |
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Effective date of registration: 20180813 Address after: 226236 Jiangsu Qidong Nantong Binhai Industrial Park Hui Hai Road Applicant after: Worm Qidong environmental equipment Co. Ltd. Address before: 201499 Fengxian District, Shanghai, Wang Yuan Road, Lane 2066, 6, 2, 204 rooms. Applicant before: SHANGHAI WARM COOL ENVIRONMENT TECHNOLOGY CO., LTD. |
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