CN105483454A - 一种电子封装用层状铝基复合材料的制备方法 - Google Patents
一种电子封装用层状铝基复合材料的制备方法 Download PDFInfo
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- CN105483454A CN105483454A CN201511001261.6A CN201511001261A CN105483454A CN 105483454 A CN105483454 A CN 105483454A CN 201511001261 A CN201511001261 A CN 201511001261A CN 105483454 A CN105483454 A CN 105483454A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C21/00—Alloys based on aluminium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0408—Light metal alloys
- C22C1/0416—Aluminium-based alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
- C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
- C22C32/0063—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on SiC
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105922675A (zh) * | 2016-04-25 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | 一种铝基金刚石igbt散热基板材料及其制备方法 |
CN106086494A (zh) * | 2016-06-08 | 2016-11-09 | 航天材料及工艺研究所 | 一种电子封装用硅铝合金的制备方法 |
CN106967905A (zh) * | 2017-03-14 | 2017-07-21 | 郭和谦 | 一种低膨胀高温铝合金层状电子封装材料的制备方法 |
CN107335937A (zh) * | 2017-07-28 | 2017-11-10 | 成都盘涅科技有限公司 | 制造具有优良封装气密性的铝合金电子器件的方法 |
CN107790683A (zh) * | 2017-11-02 | 2018-03-13 | 哈尔滨工业大学 | 流延成型法、叠箔法和压力浸渗法结合制备层状铝基复合材料的方法 |
CN108397418A (zh) * | 2018-02-08 | 2018-08-14 | 合肥峰腾节能科技有限公司 | 一种高强度耐磨防蚀散热风扇叶片 |
CN108746637A (zh) * | 2018-06-26 | 2018-11-06 | 中南大学 | 铝硅/铝碳化硅梯度复合材料及其制备方法 |
CN109280794A (zh) * | 2018-10-17 | 2019-01-29 | 吉林大学 | 真空压力浸渗制备电子封装用多层累积镁基复合材料 |
CN109277578A (zh) * | 2018-11-21 | 2019-01-29 | 四川建筑职业技术学院 | 制备高体积分数Si颗粒增强铝基复合材料的粉末冶金工艺 |
CN109487130A (zh) * | 2018-12-26 | 2019-03-19 | 东莞理工学院 | 一种用于电子封装的铝硅复合材料及其制备方法 |
CN111804919A (zh) * | 2019-04-10 | 2020-10-23 | 中国科学院宁波材料技术与工程研究所 | 高导热石墨-金属复合材料及其制备方法 |
CN114635051A (zh) * | 2020-12-15 | 2022-06-17 | 哈尔滨尚圭科技有限公司 | 一种高硅含量的铝基梯度电子封装复合材料的制备方法 |
CN117165803A (zh) * | 2023-11-02 | 2023-12-05 | 国网山东省电力公司烟台供电公司 | 一种连接金具用铝基复合材料板材的制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1129830A (ja) * | 1997-07-11 | 1999-02-02 | Agency Of Ind Science & Technol | 微細構造の制御された繊維を用いた繊維強化複合材料 |
CN102114719A (zh) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | 一种包铝颗粒增强铝基复合材料及其制备方法 |
CN102534331A (zh) * | 2012-01-10 | 2012-07-04 | 上海交通大学 | 一种高导热金刚石/铝复合材料的制备方法 |
CN103911566A (zh) * | 2014-03-11 | 2014-07-09 | 上海交通大学 | 一种碳纳米管增强铝合金复合材料的粉末冶金制备方法 |
CN104213004A (zh) * | 2013-06-05 | 2014-12-17 | 北京有色金属研究总院 | 一种可激光焊接的铝基复合材料及其制备方法 |
-
2015
- 2015-12-28 CN CN201511001261.6A patent/CN105483454B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1129830A (ja) * | 1997-07-11 | 1999-02-02 | Agency Of Ind Science & Technol | 微細構造の制御された繊維を用いた繊維強化複合材料 |
CN102114719A (zh) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | 一种包铝颗粒增强铝基复合材料及其制备方法 |
CN102534331A (zh) * | 2012-01-10 | 2012-07-04 | 上海交通大学 | 一种高导热金刚石/铝复合材料的制备方法 |
CN104213004A (zh) * | 2013-06-05 | 2014-12-17 | 北京有色金属研究总院 | 一种可激光焊接的铝基复合材料及其制备方法 |
CN103911566A (zh) * | 2014-03-11 | 2014-07-09 | 上海交通大学 | 一种碳纳米管增强铝合金复合材料的粉末冶金制备方法 |
Non-Patent Citations (3)
Title |
---|
徐永东等: "层状梯度结构SiC颗粒增强铝基复合材料的损伤分析", 《兵器材料科学与工程》 * |
许富民: "梯度分布的SiC颗粒增强铝基复合材料的制备,组织和力学行为", 《中国优秀博士学位论文全文数据库 工程科技I辑》 * |
韩凤麟等: "《中国材料工程大典 第14卷 粉末冶金材料工程》", 31 January 2006, 化学工业出版社 * |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105922675B (zh) * | 2016-04-25 | 2018-06-12 | 东莞市联洲知识产权运营管理有限公司 | 一种铝基金刚石igbt散热基板材料及其制备方法 |
CN105922675A (zh) * | 2016-04-25 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | 一种铝基金刚石igbt散热基板材料及其制备方法 |
CN106086494A (zh) * | 2016-06-08 | 2016-11-09 | 航天材料及工艺研究所 | 一种电子封装用硅铝合金的制备方法 |
CN106086494B (zh) * | 2016-06-08 | 2017-12-22 | 航天材料及工艺研究所 | 一种电子封装用硅铝合金的制备方法 |
CN106967905A (zh) * | 2017-03-14 | 2017-07-21 | 郭和谦 | 一种低膨胀高温铝合金层状电子封装材料的制备方法 |
CN106967905B (zh) * | 2017-03-14 | 2018-06-26 | 上海爱邦新型包装材料有限公司 | 一种低膨胀高温铝合金层状电子封装材料的制备方法 |
CN107335937B (zh) * | 2017-07-28 | 2019-10-01 | 成都盘涅科技有限公司 | 制造具有优良封装气密性的铝合金电子器件的方法 |
CN107335937A (zh) * | 2017-07-28 | 2017-11-10 | 成都盘涅科技有限公司 | 制造具有优良封装气密性的铝合金电子器件的方法 |
CN107790683A (zh) * | 2017-11-02 | 2018-03-13 | 哈尔滨工业大学 | 流延成型法、叠箔法和压力浸渗法结合制备层状铝基复合材料的方法 |
CN108397418A (zh) * | 2018-02-08 | 2018-08-14 | 合肥峰腾节能科技有限公司 | 一种高强度耐磨防蚀散热风扇叶片 |
CN108746637A (zh) * | 2018-06-26 | 2018-11-06 | 中南大学 | 铝硅/铝碳化硅梯度复合材料及其制备方法 |
CN109280794A (zh) * | 2018-10-17 | 2019-01-29 | 吉林大学 | 真空压力浸渗制备电子封装用多层累积镁基复合材料 |
CN109277578A (zh) * | 2018-11-21 | 2019-01-29 | 四川建筑职业技术学院 | 制备高体积分数Si颗粒增强铝基复合材料的粉末冶金工艺 |
CN109487130A (zh) * | 2018-12-26 | 2019-03-19 | 东莞理工学院 | 一种用于电子封装的铝硅复合材料及其制备方法 |
CN111804919A (zh) * | 2019-04-10 | 2020-10-23 | 中国科学院宁波材料技术与工程研究所 | 高导热石墨-金属复合材料及其制备方法 |
CN114635051A (zh) * | 2020-12-15 | 2022-06-17 | 哈尔滨尚圭科技有限公司 | 一种高硅含量的铝基梯度电子封装复合材料的制备方法 |
CN117165803A (zh) * | 2023-11-02 | 2023-12-05 | 国网山东省电力公司烟台供电公司 | 一种连接金具用铝基复合材料板材的制备方法 |
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