CN105482376A - High temperature resistant resin material composition for printer and preparation method of high temperature resistant resin - Google Patents
High temperature resistant resin material composition for printer and preparation method of high temperature resistant resin Download PDFInfo
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- CN105482376A CN105482376A CN201510975726.1A CN201510975726A CN105482376A CN 105482376 A CN105482376 A CN 105482376A CN 201510975726 A CN201510975726 A CN 201510975726A CN 105482376 A CN105482376 A CN 105482376A
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- 239000011347 resin Substances 0.000 title claims abstract description 45
- 229920005989 resin Polymers 0.000 title claims abstract description 45
- 239000000463 material Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 74
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 56
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 56
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229920000728 polyester Polymers 0.000 claims abstract description 38
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 36
- 239000004593 Epoxy Substances 0.000 claims abstract description 34
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims abstract description 28
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 claims abstract description 28
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 28
- 239000001361 adipic acid Substances 0.000 claims abstract description 28
- 238000003723 Smelting Methods 0.000 claims description 13
- 239000002518 antifoaming agent Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 230000000052 comparative effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Developing Agents For Electrophotography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The invention discloses a high temperature resistant resin material composition for a printer and a preparation method of high temperature resistant resin. The composition is prepared from epoxy acrylic resin, polyester acrylic resin, cyclohexanone, 2-hydroxy ethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone; relative to 100 parts by weight of the epoxy acrylic resin, the content of the polyester acrylic resin is 20-60 parts by weight, the content of the cyclohexanone is 10-30 parts by weight, the content of the 2-hydroxy ethyl acrylate is 5-20 parts by weight, the content of the tetramethylammonium chloride is 1-10 parts by weight, the content of the adipic acid is 10-20 parts by weight, the content of the dibutyl phthalate is 3-15 parts by weight, and the content of the acetone is 10-20 parts by weight. The effects that high temperature resistance is better, deformation under higher temperature cannot occur, and the use scope of an obtained product is widened are achieved.
Description
Technical Field
The invention relates to the field of production and preparation of photosensitive resin materials for printers, in particular to a high-temperature-resistant resin material composition for a printer and a preparation method of high-temperature-resistant resin.
Background
With the progress of science and technology and the continuous progress of 3D printer technology, the use of 3D printer has become more and more common, and in the use of 3D printer, the consumptive material that often is used for preparing the product just can determine the quality of the product that makes, and photosensitive resin material is as a used consumptive material frequently, and its uses is extensive, but in the in-service use, often its high temperature resistance is relatively poor to make the finished product that prints through this kind of consumptive material high temperature resistance also relatively poor, therefore can influence the application range of product greatly.
Therefore, the present invention provides a high temperature resistant resin material composition for a printer, which has good high temperature resistance, does not deform at a high temperature, and greatly improves the application range of the prepared product, and a preparation method of the high temperature resistant resin.
Disclosure of Invention
Aiming at the prior art, the invention aims to overcome the problems that in the prior art, a photosensitive resin material is widely applied as a consumable material which is frequently used, but in the actual use process, the high temperature resistance of the photosensitive resin material is poor, so that the high temperature resistance of a finished product printed by the consumable material is also poor, and the use range of the product is greatly influenced, and further provides a high temperature resistant resin material composition for a printer, which has good high temperature resistance, can not deform at a high temperature, and greatly improves the use range of the prepared product, and a preparation method of the high temperature resistant resin.
In order to achieve the above object, the present invention provides a high temperature resistant resin material composition for a printer, wherein the composition comprises epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate, and acetone; wherein,
the polyester acrylate resin comprises, by weight, 20-60 parts of polyester acrylate resin, 10-30 parts of cyclohexanone, 5-20 parts of 2-hydroxyethyl acrylate, 1-10 parts of tetramethylammonium chloride, 10-20 parts of adipic acid, 3-15 parts of dibutyl phthalate, and 10-20 parts of acetone, relative to 100 parts of epoxy acrylate resin.
The invention also provides a preparation method of the high-temperature-resistant resin for the printer, wherein the preparation method comprises the following steps: mixing and smelting epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone to prepare high-temperature-resistant resin for a printer; wherein,
relative to 100 parts by weight of the epoxy acrylic resin, the amount of the polyester acrylate resin is 20-60 parts by weight, the amount of the cyclohexanone is 10-30 parts by weight, the amount of the 2-hydroxyethyl acrylate is 5-20 parts by weight, the amount of the tetramethylammonium chloride is 1-10 parts by weight, the amount of the adipic acid is 10-20 parts by weight, the amount of the dibutyl phthalate is 3-15 parts by weight, and the amount of the acetone is 10-20 parts by weight.
According to the technical scheme, the epoxy acrylic resin, the polyester acrylate resin, the cyclohexanone, the 2-hydroxyethyl acrylate, the tetramethylammonium chloride, the adipic acid, the dibutyl phthalate and the acetone are mixed according to a certain proportion and then are melted and formed, so that the resin material prepared from the materials has better high-temperature resistance compared with a conventional resin material in actual use, and the application range of a finished product printed by the resin material is further enlarged.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Detailed Description
The following describes in detail specific embodiments of the present invention. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The invention provides a high-temperature-resistant resin material composition for a printer, wherein the composition comprises epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone; wherein,
the polyester acrylate resin comprises, by weight, 20-60 parts of polyester acrylate resin, 10-30 parts of cyclohexanone, 5-20 parts of 2-hydroxyethyl acrylate, 1-10 parts of tetramethylammonium chloride, 10-20 parts of adipic acid, 3-15 parts of dibutyl phthalate, and 10-20 parts of acetone, relative to 100 parts of epoxy acrylate resin.
According to the design, epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone are mixed according to a certain proportion and then are melted and molded, so that the resin material prepared from the materials has better high-temperature resistance in actual use compared with a conventional resin material, and the application range of a finished product printed by the resin material is further enlarged.
In a preferred embodiment of the present invention, in order to obtain a resin material having better high temperature resistance, the polyester acrylate resin is contained in an amount of 30 to 50 parts by weight, the cyclohexanone is contained in an amount of 15 to 25 parts by weight, the 2-hydroxyethyl acrylate is contained in an amount of 10 to 15 parts by weight, the tetramethylammonium chloride is contained in an amount of 3 to 7 parts by weight, the adipic acid is contained in an amount of 13 to 17 parts by weight, the dibutyl phthalate is contained in an amount of 5 to 10 parts by weight, and the acetone is contained in an amount of 13 to 17 parts by weight, based on 100 parts by weight of the epoxy acrylic resin.
Of course, in order to make the mixing between the raw materials more uniform to further provide the stability of the prepared resin, in a more preferred embodiment of the present invention, the composition may further include a leveling agent and an antifoaming agent, wherein the leveling agent is included in an amount of 1 to 10 parts by weight and the antifoaming agent is included in an amount of 1 to 5 parts by weight with respect to 100 parts by weight of the epoxy acrylic resin.
The epoxy acrylic resin may be of a type conventionally used in the art, and may be selected by those skilled in the art according to the actual circumstances, for example, in a preferred embodiment of the present invention, in order to further improve high temperature resistance and ultraviolet resistance of the resulting resin material, the epoxy acrylic resin may be further selected from bisphenol a type epoxy acrylic resins.
The polyester acrylate resin may be selected to be of a type conventionally used in the art, and may be selected by those skilled in the art according to the actual circumstances, for example, in a more preferred embodiment of the present invention, the viscosity of the polyester acrylate resin may be further selected to be 400-800cps for the viscosity of the further prepared resin material. Of course, the present invention is not limited to such polyester acrylate resins, and the operator may select them according to the actual circumstances.
The invention also provides a preparation method of the high-temperature-resistant resin for the printer, wherein the preparation method comprises the following steps: mixing and smelting epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone to prepare high-temperature-resistant resin for a printer; wherein,
relative to 100 parts by weight of the epoxy acrylic resin, the amount of the polyester acrylate resin is 20-60 parts by weight, the amount of the cyclohexanone is 10-30 parts by weight, the amount of the 2-hydroxyethyl acrylate is 5-20 parts by weight, the amount of the tetramethylammonium chloride is 1-10 parts by weight, the amount of the adipic acid is 10-20 parts by weight, the amount of the dibutyl phthalate is 3-15 parts by weight, and the amount of the acetone is 10-20 parts by weight.
In a preferred embodiment of the present invention, in order to improve the high temperature resistance of the obtained resin, the polyester acrylate resin is used in an amount of 30 to 50 parts by weight, the cyclohexanone is used in an amount of 15 to 25 parts by weight, the 2-hydroxyethyl acrylate is used in an amount of 10 to 15 parts by weight, the tetramethylammonium chloride is used in an amount of 3 to 7 parts by weight, the adipic acid is used in an amount of 13 to 17 parts by weight, the dibutyl phthalate is used in an amount of 5 to 10 parts by weight, and the acetone is used in an amount of 13 to 17 parts by weight, based on 100 parts by weight of the epoxy acrylic resin.
Also, in a more preferred embodiment of the present invention, in order to make the mixing between the raw materials more uniform and further improve the stability of the prepared resin, the preparation method may further include adding a leveling agent and an antifoaming agent to perform melting, wherein the leveling agent is used in an amount of 1 to 10 parts by weight and the antifoaming agent is used in an amount of 1 to 5 parts by weight with respect to 100 parts by weight of the epoxy acrylic resin. The leveling agent and the defoaming agent may be of the type conventionally selected in the art and will not be described in detail herein.
The smelting process can be operated according to the conventional manner in the field, for example, the smelting process can be carried out by placing in a smelting furnace, the smelting conditions can be not limited, and the skilled person can select the smelting process according to the actual needs, of course, in a preferred embodiment of the invention, the smelting process can be carried out by placing in the condition of temperature of 180-.
The epoxy acrylic resin and the polyester acrylate resin are as described above and are not described in detail herein.
The present invention will be described in detail below by way of examples. In the following examples, the epoxy acrylic resin is a commercially available product of UV-2218, which is manufactured by the saint chemical company ltd, the mountain, the polyester acrylate resin is a commercially available product of B-574, which is manufactured by the new material science and technology ltd, boxing, the cyclohexanone, the 2-hydroxyethyl acrylate, the tetramethylammonium chloride, the adipic acid, the dibutyl phthalate, and the acetone are conventional commercially available products.
Example 1
100g of epoxy acrylic resin, 30g of polyester acrylate resin, 15g of cyclohexanone, 10g of 2-hydroxyethyl acrylate, 3g of tetramethylammonium chloride, 13g of adipic acid, 5g of dibutyl phthalate and 13g of acetone are mixed and then placed under the condition of a temperature of 180 ℃ for smelting to prepare the high-temperature-resistant resin A1 for the printer.
Example 2
100g of epoxy acrylic resin, 50g of polyester acrylate resin, 25g of cyclohexanone, 15g of 2-hydroxyethyl acrylate, 7g of tetramethylammonium chloride, 17g of adipic acid, 10g of dibutyl phthalate and 17g of acetone are mixed and then placed under the condition of the temperature of 260 ℃ for smelting to prepare the high-temperature-resistant resin A2 for the printer.
Example 3
100g of epoxy acrylic resin, 40g of polyester acrylate resin, 20g of cyclohexanone, 12g of 2-hydroxyethyl acrylate, 5g of tetramethylammonium chloride, 15g of adipic acid, 8g of dibutyl phthalate and 15g of acetone are mixed and then placed under the condition of a temperature of 220 ℃ for smelting to prepare the high-temperature-resistant resin A3 for the printer.
Example 4
The preparation was carried out according to the preparation method of example 1 except that the polyester acrylate resin was used in an amount of 20g, the cyclohexanone was used in an amount of 10g, the 2-hydroxyethyl acrylate was used in an amount of 5g, the tetramethylammonium chloride was used in an amount of 1g, the adipic acid was used in an amount of 10g, the dibutyl phthalate was used in an amount of 3g, and the acetone was used in an amount of 10g, to obtain a high-temperature resistant resin A4 for a printer.
Example 5
The preparation was carried out according to the preparation method of example 2 except that the polyester acrylate resin was used in an amount of 60g, the cyclohexanone was used in an amount of 30g, the 2-hydroxyethyl acrylate was used in an amount of 20g, the tetramethylammonium chloride was used in an amount of 10g, the adipic acid was used in an amount of 20g, the dibutyl phthalate was used in an amount of 15g, and the acetone was used in an amount of 20g, to obtain a high-temperature resistant resin A5 for a printer.
Comparative example 1
The preparation was carried out in accordance with the preparation method of example 3 except that the polyester acrylate resin was used in an amount of 10g, the cyclohexanone was used in an amount of 5g, the 2-hydroxyethyl acrylate was used in an amount of 2g, the tetramethylammonium chloride was used in an amount of 0.5g, the adipic acid was used in an amount of 5g, the dibutyl phthalate was used in an amount of 1g, and the acetone was used in an amount of 5g, to obtain printer resin D1.
Comparative example 2
The preparation was carried out in accordance with the preparation method of example 3 except that the polyester acrylate resin was used in an amount of 100g, the cyclohexanone was used in an amount of 50g, the 2-hydroxyethyl acrylate was used in an amount of 40g, the tetramethylammonium chloride was used in an amount of 20g, the adipic acid was used in an amount of 40g, the dibutyl phthalate was used in an amount of 30g, and the acetone was used in an amount of 40g, to obtain printer resin D2.
Comparative example 3
A commercially available epoxy acrylic resin D3, available from Ping Sheng chemical Co., Ltd, of Foshan under the trade designation UV-2218.
Comparative example 4
A commercially available polyester acrylate resin D4 manufactured by Guangdong Boxing New Material science and technology Co., Ltd under the designation B-574.
Test example
The results of the above A1-A5 and D1-D4 were shown in Table 1, after standing at 60 ℃ and 150 ℃ for 6 hours, respectively, and observing the degree of softening deformation.
TABLE 1
| Numbering | 60℃ | 150℃ |
| A1 | Is not softened | Is not softened |
| A2 | Is not softened | Is not softened |
| A3 | Is not softened | Is not softened |
| A4 | Is not softened | Without significant softening |
| A5 | Is not softened | Without significant softening |
| D1 | Is not softened | Apparent softening |
| D2 | Without significant softening | Apparent softening |
| D3 | Slightly soften | Apparent softening |
| D4 | Slightly soften | Apparent softening |
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. The high-temperature-resistant resin material composition for the printer is characterized by comprising epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone; wherein,
the polyester acrylate resin comprises, by weight, 20-60 parts of polyester acrylate resin, 10-30 parts of cyclohexanone, 5-20 parts of 2-hydroxyethyl acrylate, 1-10 parts of tetramethylammonium chloride, 10-20 parts of adipic acid, 3-15 parts of dibutyl phthalate, and 10-20 parts of acetone, relative to 100 parts of epoxy acrylate resin.
2. The composition according to claim 1, wherein the polyester acrylate resin is contained in an amount of 30 to 50 parts by weight, the cyclohexanone is contained in an amount of 15 to 25 parts by weight, the 2-hydroxyethyl acrylate is contained in an amount of 10 to 15 parts by weight, the tetramethylammonium chloride is contained in an amount of 3 to 7 parts by weight, the adipic acid is contained in an amount of 13 to 17 parts by weight, the dibutyl phthalate is contained in an amount of 5 to 10 parts by weight, and the acetone is contained in an amount of 13 to 17 parts by weight, based on 100 parts by weight of the epoxy acrylic resin.
3. The composition according to claim 1 or 2, further comprising a leveling agent and an antifoaming agent, wherein the leveling agent is contained in an amount of 1 to 10 parts by weight and the antifoaming agent is contained in an amount of 1 to 5 parts by weight, relative to 100 parts by weight of the epoxy acrylic resin.
4. The composition of claim 1 or 2, wherein the epoxy acrylic resin is a bisphenol a type epoxy acrylic resin.
5. The composition of claim 1 or 2, wherein the polyester acrylate resin has a viscosity of 400-800 cps.
6. A preparation method of high-temperature-resistant resin for a printer is characterized by comprising the following steps: mixing and smelting epoxy acrylic resin, polyester acrylate resin, cyclohexanone, 2-hydroxyethyl acrylate, tetramethylammonium chloride, adipic acid, dibutyl phthalate and acetone to prepare high-temperature-resistant resin for a printer; wherein,
relative to 100 parts by weight of the epoxy acrylic resin, the amount of the polyester acrylate resin is 20-60 parts by weight, the amount of the cyclohexanone is 10-30 parts by weight, the amount of the 2-hydroxyethyl acrylate is 5-20 parts by weight, the amount of the tetramethylammonium chloride is 1-10 parts by weight, the amount of the adipic acid is 10-20 parts by weight, the amount of the dibutyl phthalate is 3-15 parts by weight, and the amount of the acetone is 10-20 parts by weight.
7. The production method according to claim 6, wherein the polyester acrylate resin is used in an amount of 30 to 50 parts by weight, the cyclohexanone is used in an amount of 15 to 25 parts by weight, the 2-hydroxyethyl acrylate is used in an amount of 10 to 15 parts by weight, the tetramethylammonium chloride is used in an amount of 3 to 7 parts by weight, the adipic acid is used in an amount of 13 to 17 parts by weight, the dibutyl phthalate is used in an amount of 5 to 10 parts by weight, and the acetone is used in an amount of 13 to 17 parts by weight, relative to 100 parts by weight of the epoxy acrylic resin.
8. The preparation method according to claim 6 or 7, wherein the preparation method further comprises adding a leveling agent and an antifoaming agent for melting, wherein the leveling agent is used in an amount of 1 to 10 parts by weight and the antifoaming agent is used in an amount of 1 to 5 parts by weight, relative to 100 parts by weight of the epoxy acrylic resin.
9. The preparation method as claimed in claim 6 or 7, wherein the smelting process is carried out at a temperature of 180 ℃ and 260 ℃.
10. The production method according to claim 6 or 7, wherein the epoxy acrylic resin is a bisphenol A type epoxy acrylic resin;
the viscosity of the polyester acrylate resin is 400-800 cps.
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| CN201510975726.1A CN105482376A (en) | 2015-12-22 | 2015-12-22 | High temperature resistant resin material composition for printer and preparation method of high temperature resistant resin |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106633676A (en) * | 2016-12-05 | 2017-05-10 | 钦州市钦南区生产力促进中心 | 3D printing material and preparation method thereof |
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| CN102977683A (en) * | 2012-09-11 | 2013-03-20 | 湖南工业大学 | UV photoluminescence ink |
| CN103755889A (en) * | 2014-01-10 | 2014-04-30 | 上海那恒新材料有限公司 | Light-emitting high precision three-dimensionally moulded photosensitive resin composition |
| CN104250422A (en) * | 2013-06-26 | 2014-12-31 | 合肥杰事杰新材料股份有限公司 | Photosensitive resin used in 3D printing, and its preparation method |
| CN104765251A (en) * | 2014-11-06 | 2015-07-08 | 青岛科技大学 | High-toughness photosensitive resin for 3D printing and preparation method thereof. |
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2015
- 2015-12-22 CN CN201510975726.1A patent/CN105482376A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102977683A (en) * | 2012-09-11 | 2013-03-20 | 湖南工业大学 | UV photoluminescence ink |
| CN104250422A (en) * | 2013-06-26 | 2014-12-31 | 合肥杰事杰新材料股份有限公司 | Photosensitive resin used in 3D printing, and its preparation method |
| CN103755889A (en) * | 2014-01-10 | 2014-04-30 | 上海那恒新材料有限公司 | Light-emitting high precision three-dimensionally moulded photosensitive resin composition |
| CN104765251A (en) * | 2014-11-06 | 2015-07-08 | 青岛科技大学 | High-toughness photosensitive resin for 3D printing and preparation method thereof. |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106633676A (en) * | 2016-12-05 | 2017-05-10 | 钦州市钦南区生产力促进中心 | 3D printing material and preparation method thereof |
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