CN105472881A - 一种3d打印石墨烯电路板 - Google Patents

一种3d打印石墨烯电路板 Download PDF

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CN105472881A
CN105472881A CN201510894894.8A CN201510894894A CN105472881A CN 105472881 A CN105472881 A CN 105472881A CN 201510894894 A CN201510894894 A CN 201510894894A CN 105472881 A CN105472881 A CN 105472881A
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岳巍
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Abstract

本发明公开了一种3D打印石墨烯电路板，由基板和导电电路组成，导电电路由石墨烯导电浆料经3D打印机打印形成。导电电路可以由1层石墨烯导电浆料构成，也可以由2～100层叠加的石墨烯导电浆料构成。与现有技术相比，本发明的电路板成本低、导电电路形貌和厚度可控、可实现电路板的柔性制造，在大功率LED电路基板、平板显示器、太阳能电池板电路板等领域有广阔的应用前景。

Description

一种3D打印石墨烯电路板
技术领域
本发明涉及一种电路板，尤其是一种3D打印石墨烯电路板。
背景技术
电路板是当前信息产业中不可或缺的构件。目前，信息产业中使用的电路板的导电电路大多是通过在覆铜基板上蚀刻或在基板上丝网印刷导电浆料(大多含银、铜)的方法获得。采用覆铜基板上蚀刻获得电路板，存在以下不足：电路板制备工艺流程长、铜成本较高、含铜蚀刻废液对环境有潜在污染、导电电路形貌调整难度大、导电电路的厚度可调性差等。采用丝网印刷导电浆料获得电路板，存在以下不足：整个电路板工艺流程长且繁琐、导电中常用的银、铜等成本高、由于网孔限制造成的电路尺寸精度差、易出现丝网孔堵塞造成印刷电路断路的缺陷等。
作为新型碳材料，石墨烯是只具有1个原子层厚度的二维纳米材料，其室温电阻率为10-6Ω·cm，比室温时电阻率最低的金属银还低，并且石墨烯的电流密度耐性好，达到0.2×109A/cm2(是铜的100倍)。同时，石墨烯的组成仅为碳，原材料来源丰富，随着石墨烯产业化制备技术的成熟，石墨烯的价格将日趋下降。综上，石墨烯可以替代铜或银作为电路板的导电线路的材料。如发明专利CN103895139A，公开了一种石墨烯导电复合膜，但该发明仅涉及了一种简单的单层石墨烯导电膜。
随着信息产业的发展，尤其是在新型电子产品性能提高、成本降低、环保要求高和开发周期缩短的形势下，对高导电、低成本、环保、高精度和柔性制备电路板的需求日益增加。同时，基于3D打印的增材制造技术具有低成本、短周期、适宜复杂产品、柔性化制造等优势，已成为工业化升级的重要技术。目前，基于3D打印技术制备电路板成为潜在的发展方向之一，而已公开资料对基于3D打印技术制备石墨烯电路板的研究尚未涉及。
发明内容
本发明的目的是提供一种基于增材制造技术、适宜于柔性制造工艺、低成本、导电电路尺寸精确可控的3D打印石墨烯电路板。
为了实现上述目的，本发明是通过以下技术方案来实现的：
一种3D打印石墨烯电路板，由基板和导电电路组成，所述的导电电路由石墨烯导电浆料经3D打印机打印形成。
一种3D打印石墨烯电路板的第一优选方案，导电电路由1层石墨烯导电浆料构成。
一种3D打印石墨烯电路板的第二优选方案，导电电路由2～100层叠加的石墨烯导电浆料构成。
一种3D打印石墨烯电路板的第三优选方案，石墨烯导电浆料中石墨烯的含量为20～70wt.％。
一种3D打印石墨烯电路板的第四优选方案，基板为氮化铝陶瓷板、碳化硅陶瓷板、硅片或经绝缘处理的铝板。
一种3D打印石墨烯电路板的第五优选方案，氮化铝陶瓷板的制备方法是，(1)将1000g的氮化铝粉体、50g的三氧化二钇、0.5g粒径为0.05μm的气相法白炭黑、230g的无水乙醇与丁醇按1：2(重量比)进行混合的混合物、20g的鱼油一起球磨混合24h，然后与200g的无水乙醇与丁醇按1：2(重量比)进行混合的混合物，100g的聚乙烯醇缩丁醛、50g的邻苯二甲酸二丁酯一起再混合12h，再经过真空除泡处理5h，得到粘度为20000cps的流延浆料；(2)将流延浆料经流延成型机，流延得到厚度为0.6mm的流延坯体，然后冲压成100×100mm的方片，将成型的方片在排胶炉中缓慢升温至600℃并保温2h，充分排出其中的有机物，得到氮化铝流延生坯；(3)陶瓷基板的制备：将氮化铝流延生坯放入高温钨真空电阻炉，在1850℃进行无压烧结，烧结时采用氢气氮气混合气氛保护，氢气氮气的流速比为1：2。
与最接近的现有技术相比，本发明具有以下优点：
导电电路材料及制备过程环境友好、成本低，导电电路的电导率高、导电电路形貌和厚度等可精确调整和控制，尤其适用于电路板的快速、柔性化制造。在大功率LED电路基板、平板显示器、太阳能电池板电路板等领域有广阔的应用前景。
附图说明
图1为电路板结构示意图；
图2为电路板结构示意图；
1基板；2导电电路。
具体实施方式
下面将结合附图和实施例，对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
一种3D打印石墨烯电路板，由基板1和导电电路2组成，如图1所示。基板为经绝缘处理的铝板，导电电路由石墨烯导电浆料经3D打印机通过喷嘴直接喷射到基板上形成。导电电路为3D打印的1层石墨烯导电浆料，石墨烯导电浆料中石墨烯的含量为20wt.％。
相对于传统的电路板，本实施例中的石墨烯导电板成本低、导电电路尺寸精确可控，可实现电路板的柔性制造。
实施例2
一种3D打印石墨烯电路板，由基板1和导电电路2组成，如图2所示。基板为氮化铝陶瓷板，导电电路由石墨烯导电浆料经3D打印机通过喷嘴直接喷射到基板上形成。导电电路为3D打印的2层石墨烯导电浆料，石墨烯导电浆料中石墨烯的含量为30wt.％。
氮化铝陶瓷板的制备方法是，(1)将1000g的氮化铝粉体、50g的三氧化二钇、0.5g粒径为0.05μm的气相法白炭黑、230g的无水乙醇与丁醇按1：2(重量比)进行混合的混合物、20g的鱼油一起球磨混合24h，然后与200g的无水乙醇与丁醇按1：2(重量比)进行混合的混合物，100g的聚乙烯醇缩丁醛、50g的邻苯二甲酸二丁酯一起再混合12h，再经过真空除泡处理5h，得到粘度为20000cps的流延浆料；(2)将流延浆料经流延成型机，流延得到厚度为0.6mm的流延坯体，然后冲压成100×100mm的方片，将成型的方片在排胶炉中缓慢升温至600℃并保温2h，充分排出其中的有机物，得到氮化铝流延生坯；(3)陶瓷基板的制备：将氮化铝流延生坯放入高温钨真空电阻炉，在1850℃进行无压烧结，烧结时采用氢气氮气混合气氛保护，氢气氮气的流速比为1：2。
相对于传统的电路板，本实施例中的石墨烯导电板成本低、导电电路尺寸精确可控，可实现电路板的柔性制造。
实施例3
一种3D打印石墨烯电路板，由基板和导电电路组成。电路板基板为碳化硅陶瓷板，导电电路由石墨烯导电浆料经3D打印机通过喷嘴直接喷射到基板上形成。导电电路为3D打印的30层石墨烯导电浆料，石墨烯导电浆料中石墨烯的含量为45wt.％。
相对于传统的电路板，本实施例中的石墨烯导电板成本低、导电电路尺寸精确可控，可实现电路板的柔性制造。
实施例4
一种3D打印石墨烯电路板，由基板和导电电路组成。电路板基板为硅片，导电电路由石墨烯导电浆料经3D打印机通过喷嘴直接喷射到基板上形成。导电电路为3D打印的100层石墨烯导电浆料，石墨烯导电浆料中石墨烯的含量为70wt.％。
相对于传统的电路板，本实施例中的石墨烯导电板成本低、导电电路尺寸精确可控，可实现电路板的柔性制造。
以上实施例仅用以说明本发明的技术方案而非对其限制，所属领域的普通技术人员应当理解，参照上述实施例可以对本发明的具体实施方式进行修改或者等同替换，这些未脱离本发明精神和范围的任何修改或者等同替换均在申请待批的权利要求保护范围之内。

Claims (6)

1.一种3D打印石墨烯电路板，包括基板和导电电路，其特征在于，所述的导电电路由石墨烯导电浆料经3D打印机打印形成。
2.根据权利要求1所述的3D打印石墨烯电路板，其特征在于，所述的导电电路由1层石墨烯导电浆料构成。
3.根据权利要求1所述的3D打印石墨烯电路板，其特征在于，所述的导电电路由2～100层叠加的石墨烯导电浆料构成。
4.根据权利要求1所述的3D打印石墨烯电路板，其特征在于，所述的石墨烯导电浆料中石墨烯的含量为20～70wt.％。
5.根据权利要求1所述的3D打印石墨烯电路板，其特征在于，所述的基板为氮化铝陶瓷板、碳化硅陶瓷板、硅片或经绝缘处理的铝板。
6.根据权利要求5所述的3D打印石墨烯电路板，其特征在于，所述氮化铝陶瓷板的制备方法是，(1)将1000g的氮化铝粉体、50g的三氧化二钇、0.5g粒径为0.05μm的气相法白炭黑、230g的无水乙醇与丁醇按1：2(重量比)进行混合的混合物、20g的鱼油一起球磨混合24h，然后与200g的无水乙醇与丁醇按1：2(重量比)进行混合的混合物，100g的聚乙烯醇缩丁醛、50g的邻苯二甲酸二丁酯一起再混合12h，再经过真空除泡处理5h，得到粘度为20000cps的流延浆料；(2)将流延浆料经流延成型机，流延得到厚度为0.6mm的流延坯体，然后冲压成100×100mm的方片，将成型的方片在排胶炉中缓慢升温至600℃并保温2h，充分排出其中的有机物，得到氮化铝流延生坯；(3)陶瓷基板的制备：将氮化铝流延生坯放入高温钨真空电阻炉，在1850℃进行无压烧结，烧结时采用氢气氮气混合气氛保护，氢气氮气的流速比为1：2。
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CN106230306A (zh) * 2016-08-09 2016-12-14 中山市天美能源科技有限公司 一种柔性发电薄膜及其制备方法
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CN106946581A (zh) * 2017-04-20 2017-07-14 哈尔滨工业大学 一种使用3d打印技术制备导电石墨烯/无机聚合物复合材料的方法
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CN108834319A (zh) * 2018-07-30 2018-11-16 北京大学东莞光电研究院 一种陶瓷基板多层电路的3d打印方法

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