CN105471257A - Novel interleaved boost soft-switch circuit - Google Patents
Novel interleaved boost soft-switch circuit Download PDFInfo
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- CN105471257A CN105471257A CN201510991470.3A CN201510991470A CN105471257A CN 105471257 A CN105471257 A CN 105471257A CN 201510991470 A CN201510991470 A CN 201510991470A CN 105471257 A CN105471257 A CN 105471257A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
- H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
- H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0048—Circuits or arrangements for reducing losses
- H02M1/0054—Transistor switching losses
- H02M1/0058—Transistor switching losses by employing soft switching techniques, i.e. commutation of transistors when applied voltage is zero or when current flow is zero
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
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Abstract
一种新型交错并联boost软开关电路，包括boost电路以及与boost电路连接的软开关电路，所述软开关电路中由谐振电感、第一二极管和第二二极管组成的谐振电路支路中多串联了一个第三二极管，增大该支路的压降，使得在相同电流情况下，谐振电路支路中的压降比与之并联连接的主二级管支路的压降大，这样电流才会主要从boost电路中的主二极管的支路流过，而流经谐振电路支路的电流相对减小；进而可以解决在传统的软开关+boost电路中使用sic二极管所带来的软开关电路损耗较大以及谐振电感过热的问题。
A novel interleaved parallel boost soft switch circuit, comprising a boost circuit and a soft switch circuit connected to the boost circuit, the resonant circuit branch composed of a resonant inductor, a first diode and a second diode in the soft switch circuit A third diode is connected in series to increase the voltage drop of this branch, so that under the same current condition, the voltage drop in the resonant circuit branch is higher than the voltage drop of the main diode branch connected in parallel with it Large, so that the current will mainly flow through the branch of the main diode in the boost circuit, while the current flowing through the branch of the resonant circuit is relatively reduced; thus, it can solve the problem caused by using the sic diode in the traditional soft switching + boost circuit The problem of the large loss of the soft switching circuit and the overheating of the resonant inductor.
Description
技术领域technical field
本发明涉及Boost电路技术领域，具体涉及一种新型交错并联boost软开关电路。The invention relates to the technical field of Boost circuits, in particular to a novel interleaved parallel boost soft switch circuit.
背景技术Background technique
风能、太阳能等新能源均需要经过电力电子变换装置将直流电转换成交流电后才能接入电网，随着新能源发电量的逐年攀升，市场对电力电子变换器的要求朝向大功率、高频率、低损耗的方向快步前进。作为传统电力电子变换的开关已难以满足需求，而新型半导体sic器件具有超快的开关速度、超低的开关损耗以及更好的性能，被普遍认为是新一代的功率器件。而Boost电路作为一种最基本的DC/DC拓扑而广泛应用于各种电源产品中，而在光伏发电系统中采用两级系统，前级的Boost升压电路既可以提高并稳定太阳能光伏电池的输出电压，又可以最大功率跟踪控制放到前级升压侧，简单方便。而两级系统在提高效率方面，前级boost电路开关频率都在10KHz以上，这时其开关损耗以及电磁干扰问题对整机的影响已不可忽视，因此受限于传统的开关器件会带来boost电路效率低下、开关损耗大、散热器体积大以及开关管电压电流应力等问题，而使用新型半导体sic器件提高系统的效率与性能。然后再配合软开关电路后，可近一步提高boost电路的效率。而在传统的软开关+boost电路中，由于boost电路使用sic二极管，会使得电流大部分从软开关电路流过，使得软开关电路的损耗比较大，而且谐振电感流过的有效值增大，温升很高。若软开关电路也采用sic二极管，会降低谐振电感温度，但这样成本会增加很多。New energy sources such as wind energy and solar energy need to be converted from direct current into alternating current through power electronic conversion devices before they can be connected to the grid. The direction of loss is fast-paced. As a switch for traditional power electronic conversion, it is difficult to meet the demand, and the new semiconductor sic device has ultra-fast switching speed, ultra-low switching loss and better performance, and is generally considered to be a new generation of power devices. As the most basic DC/DC topology, the Boost circuit is widely used in various power supply products, and a two-stage system is used in the photovoltaic power generation system. The output voltage can also be placed on the boost side of the front stage under maximum power tracking control, which is simple and convenient. In terms of improving the efficiency of the two-stage system, the switching frequency of the front-stage boost circuit is above 10KHz. At this time, the impact of the switching loss and electromagnetic interference on the whole machine cannot be ignored, so the traditional switching devices will bring boost The efficiency and performance of the system are improved by using new semiconductor sic devices due to problems such as low circuit efficiency, large switching loss, large radiator size, and voltage and current stress of the switch tube. Then with the soft switching circuit, the efficiency of the boost circuit can be further improved. In the traditional soft switching + boost circuit, since the boost circuit uses a sic diode, most of the current will flow through the soft switching circuit, which will cause a relatively large loss in the soft switching circuit, and the effective value of the resonant inductance will increase. The temperature rise is high. If the soft switching circuit also uses sic diodes, the temperature of the resonant inductor will be reduced, but the cost will increase a lot.
现有技术中存在的问题分析：Analysis of problems existing in the prior art:
图1为现有boost软开关电路拓扑结构，boost电路由一个PV输入直流源Uin正极端串联一主电感L，主开关管S1和S2并联连接在电感L和直流电源Uin负极端，电感的输出端串联一二极管D，二极管D的阳极与电感L的输出端相连接，二极管D的阴极与后级电路相连接，输出电容C1的正极与二极管D的阴极相连接，输出电容C1的负极与直流电源Uin负极端相连接，负载电阻R与输出电容并联连接。软开关电路由一个谐振电感Lr与一开关管Sa的漏极相连接，谐振电感Lr的另一端与boost电路中的电感L的输出端相连接，开关管Sa的源极与直流电源Uin负极端相连接，二极管D1的阴极与D2的阳极先串联，然后二极管D1的阳极与谐振电感Lr与开关管Sa串联连接点相连接，二极管D2的阴极与boost电路中的二极管D的阴极相连接，谐振电容Cr的一端与boost电路中的二极管D的阳极相连接，另一端与二极管D1和D2的串联连接点相连接。Figure 1 shows the topological structure of the existing boost soft switching circuit. The boost circuit consists of a PV input DC source Uin positive terminal connected in series with a main inductor L. The main switch tubes S1 and S2 are connected in parallel between the inductor L and the DC power supply Uin negative terminal. The output of the inductor A diode D is connected in series with the terminal, the anode of the diode D is connected to the output terminal of the inductor L, the cathode of the diode D is connected to the subsequent stage circuit, the anode of the output capacitor C1 is connected to the cathode of the diode D, and the cathode of the output capacitor C1 is connected to the DC The negative terminals of the power supply Uin are connected, and the load resistor R is connected in parallel with the output capacitor. The soft switching circuit is connected by a resonant inductance Lr to the drain of a switching tube Sa, the other end of the resonant inductance Lr is connected to the output terminal of the inductance L in the boost circuit, the source of the switching tube Sa is connected to the negative terminal of the DC power supply Uin The cathode of the diode D1 is connected in series with the anode of D2 first, then the anode of the diode D1 is connected to the series connection point of the resonant inductor Lr and the switching tube Sa, the cathode of the diode D2 is connected to the cathode of the diode D in the boost circuit, and the resonance One end of the capacitor Cr is connected to the anode of the diode D in the boost circuit, and the other end is connected to the series connection point of the diodes D1 and D2.
电路工作时，boost电路中的两个主开关管S1、S2交错导通，软开关电路中的软开关Sa的工作频率是其boost电路中主开关管S1、S2频率的两倍。由于软开关电路中开关管Sa是在boost电路中的主开关管S1和S2开通前先开通，且Sa管的导通时间比boost电路中主管S1和S2的导通时间短，所以在boost电路中主开关管S1和S2开通时流过谐振电感Lr的电流有效值非常小，而主开关管S1和S2关断后，谐振电容Cr很快的将能量释放到母线电容C1之后，主二极管D导通，而此时在D与Lr、D1、D2组成的并联电路中，由于D管采用sic二极管，相同电流流过时，其自身的压降比普通的二极管产生的压降较高，电流大时压降会更高，这样使得负载电流大部分从谐振电路中的Lr、D1、D2组成的支路中流过，这样整个周期内流过谐振电感Lr的电流有效值非常大，从而导致谐振电感的温度较高，为了减小谐振电感Lr的发热，则需要将谐振电感设计得更大或对谐振电感采取风冷等措施，这样使得系统更复杂，成本更高。When the circuit is working, the two main switch tubes S1 and S2 in the boost circuit are alternately turned on, and the working frequency of the soft switch Sa in the soft switch circuit is twice the frequency of the main switch tubes S1 and S2 in the boost circuit. Since the switching tube Sa in the soft switching circuit is turned on before the main switching tubes S1 and S2 in the boost circuit are turned on, and the conduction time of the Sa tube is shorter than that of the main switches S1 and S2 in the boost circuit, so in the boost circuit When the main switch tubes S1 and S2 are turned on, the effective value of the current flowing through the resonant inductor Lr is very small, and after the main switch tubes S1 and S2 are turned off, the resonant capacitor Cr quickly releases energy to the bus capacitor C1, and the main diode D At this time, in the parallel circuit composed of D and Lr, D1, and D2, since the D tube uses a sic diode, when the same current flows, its own voltage drop is higher than that of an ordinary diode, and the current is large The voltage drop will be higher, so that most of the load current flows through the branch composed of Lr, D1, and D2 in the resonant circuit, so that the effective value of the current flowing through the resonant inductance Lr in the entire cycle is very large, resulting in the resonant inductance The temperature of the resonant inductor is relatively high. In order to reduce the heating of the resonant inductor Lr, it is necessary to design a larger resonant inductor or take measures such as air cooling for the resonant inductor, which makes the system more complex and costly.
发明内容Contents of the invention
为了克服上述现有技术存在的问题，本发明的目的在于提供一种新型交错并联boost软开关电路，可减小软开关电路流过的电流，进而可以解决在传统的软开关+boost电路中使用sic二极管所带来的软开关电路损耗较大以及谐振电感过热的问题。In order to overcome the problems existing in the above-mentioned prior art, the object of the present invention is to provide a new type of interleaved parallel boost soft switch circuit, which can reduce the current flowing through the soft switch circuit, and then solve the problem of using in the traditional soft switch + boost circuit. The soft switching circuit loss caused by the sic diode and the problem of overheating of the resonant inductor.
为达到上述目的，本发明所采用的技术方案是：In order to achieve the above object, the technical scheme adopted in the present invention is:
一种新型交错并联boost软开关电路，包括boost电路以及与boost电路连接的软开关电路，所述软开关电路由一个谐振电感Lr与一开关管Sa的漏极相连接，第一二极管D1的阴极与第二二极管D2的阳极先串联，然后第一二极管D1的阳极与谐振电感Lr与开关管Sa串联连接点相连接，第二二极管D2的阴极与boost电路中的主二极管D的阴极相连接，谐振电容Cr的一端与boost电路中的主二极管D的阳极相连接，另一端与第一二极管D1和第二二极管D2的串联连接点相连接；所述软开关电路中由谐振电感Lr、第一二极管D1和第二二极管D2组成的谐振电路支路中多串联了一个第三二极管D3，增大该支路的压降，使得在相同电流情况下，谐振电路支路中的压降比与之并联连接的主二级管D支路的压降大，这样电流才会主要从boost电路中的主二极管D的支路流过，而流经谐振电路支路的电流相对减小。A novel interleaved parallel boost soft switch circuit, comprising a boost circuit and a soft switch circuit connected with the boost circuit, the soft switch circuit is connected with a drain of a switching tube Sa by a resonant inductance Lr, the first diode D1 The cathode of the second diode D2 is first connected in series with the anode of the second diode D2, and then the anode of the first diode D1 is connected to the series connection point of the resonant inductor Lr and the switch tube Sa, and the cathode of the second diode D2 is connected to the boost circuit The cathode of the main diode D is connected, one end of the resonant capacitor Cr is connected with the anode of the main diode D in the boost circuit, and the other end is connected with the series connection point of the first diode D1 and the second diode D2; In the resonant circuit branch composed of the resonant inductance Lr, the first diode D1 and the second diode D2 in the soft switching circuit, a third diode D3 is connected in series to increase the voltage drop of the branch, Under the same current condition, the voltage drop in the resonant circuit branch is larger than the voltage drop in the main diode D branch connected in parallel with it, so that the current will mainly flow from the main diode D branch in the boost circuit Over, and the current flowing through the resonant circuit branch is relatively reduced.
所述第三二极管D3串接在第二二极管D2之后，即第三二极管D3的阳极与第二二极管D2的阴极相连接，第三二极管D3的阴极与boost电路中的二极管D的阴极相连接。The third diode D3 is connected in series after the second diode D2, that is, the anode of the third diode D3 is connected to the cathode of the second diode D2, and the cathode of the third diode D3 is connected to the boost The cathodes of diode D in the circuit are connected together.
所述第三二极管D3串接在谐振电感Lr的一端或另一端。The third diode D3 is connected in series with one end or the other end of the resonant inductor Lr.
所述第三二极管D3串接在第一二极管D1的一端或另一端。The third diode D3 is connected in series with one end or the other end of the first diode D1.
和现有技术相比较，本发明具备如下优点：Compared with the prior art, the present invention has the following advantages:
本发明在原有软开关+boost电路中增加一个普通二极管，可减小软开关电路流过的电流，进而可以解决在传统的软开关+boost电路中使用sic二极管所带来的软开关电路损耗较大以及谐振电感过热的问题。The present invention adds an ordinary diode to the original soft switch + boost circuit, which can reduce the current flowing through the soft switch circuit, and further solve the problem of the soft switch circuit loss caused by using sic diodes in the traditional soft switch + boost circuit. Large and resonant inductor overheating problems.
附图说明Description of drawings
图1为现有boost软开关电路拓扑结构。Fig. 1 is a topological structure of an existing boost soft switching circuit.
图2为本发明新型交错并联boost软开关电路第一种拓扑结构。Fig. 2 is the first topology structure of the novel interleaved parallel boost soft switching circuit of the present invention.
图3为本发明新型交错并联boost软开关电路第二种拓扑结构。Fig. 3 is the second topology structure of the novel interleaved parallel boost soft switching circuit of the present invention.
图4为本发明新型交错并联boost软开关电路第三种拓扑结构。Fig. 4 is the third topology structure of the novel interleaved parallel boost soft switching circuit of the present invention.
图5为本发明新型交错并联boost软开关电路第四种拓扑结构。Fig. 5 is the fourth topology structure of the novel interleaved parallel boost soft switching circuit of the present invention.
图6为本发明新型交错并联boost软开关电路第五种拓扑结构。Fig. 6 is a fifth topology structure of the novel interleaved parallel boost soft switching circuit of the present invention.
具体实施方式detailed description
下面结合附图和具体实施方式对本发明作进一步详细说明。The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
本发明一种新型交错并联boost软开关电路，包括boost电路以及与boost电路连接的软开关电路，所述软开关电路由一个谐振电感Lr与一开关管Sa的漏极相连接，第一二极管D1的阴极与第二二极管D2的阳极先串联，然后第一二极管D1的阳极与谐振电感Lr与开关管Sa串联连接点相连接，第二二极管D2的阴极与boost电路中的主二极管D的阴极相连接，谐振电容Cr的一端与boost电路中的主二极管D的阳极相连接，另一端与第一二极管D1和第二二极管D2的串联连接点相连接；所述软开关电路中由谐振电感Lr、第一二极管D1和第二二极管D2组成的谐振电路支路中多串联了一个第三二极管D3，增大该支路的压降，使得在相同电流情况下，谐振电路支路中的压降比与之并联连接的主二级管D支路的压降大，这样电流才会主要从boost电路中的主二极管D的支路流过，而流经谐振电路支路的电流相对减小。A novel interleaved parallel boost soft switch circuit of the present invention comprises a boost circuit and a soft switch circuit connected with the boost circuit, the soft switch circuit is connected with a drain of a switching tube Sa by a resonant inductance Lr, the first two The cathode of the tube D1 is first connected in series with the anode of the second diode D2, then the anode of the first diode D1 is connected to the series connection point of the resonant inductor Lr and the switching tube Sa, and the cathode of the second diode D2 is connected to the boost circuit The cathode of the main diode D in the boost circuit is connected, one end of the resonant capacitor Cr is connected to the anode of the main diode D in the boost circuit, and the other end is connected to the series connection point of the first diode D1 and the second diode D2 ; In the resonant circuit branch composed of the resonant inductor Lr, the first diode D1 and the second diode D2 in the soft switching circuit, a third diode D3 is connected in series to increase the voltage of the branch drop, so that under the same current condition, the voltage drop in the branch of the resonant circuit is larger than the voltage drop in the branch of the main diode D connected in parallel with it, so that the current will mainly flow from the branch of the main diode D in the boost circuit The circuit flows, and the current flowing through the branch of the resonant circuit is relatively reduced.
如图2所示，所述第三二极管D3串接在第二二极管D2之后，即第三二极管D3的阳极与第二二极管D2的阴极相连接，第三二极管D3的阴极与boost电路中的主二极管D的阴极相连接。其它的电路连接与现有技术的电路相同。As shown in Figure 2, the third diode D3 is connected in series after the second diode D2, that is, the anode of the third diode D3 is connected with the cathode of the second diode D2, and the third diode D3 The cathode of the tube D3 is connected to the cathode of the main diode D in the boost circuit. Other circuit connections are the same as those of the prior art.
电路工作时，普通二极管开启管压降大约0.7V，sic二极管开启管压降大约1V，在同等电流及温度下管压降大约是普通二极管的1.4倍左右，并且二极管会随着电流增大其管压降会增大，所以为保证在满载工作时软开关二极管仍旧能可靠的截止，需要串联三个软开关二极管以保证其总压降大于主二极管D在满载工作时的压降，这样就能保证软开关二极管在主二极管D导通时基本没有电流流过，这样就可以降低软开关二极管的温升，又降低了流经谐振电感Lr的电流有效值，大幅度降低了谐振电感Lr的温升，解决了软开关电路使用普通二极管时谐振电感温度过高的问题。当然为了解决该问题，软开关电路也可串联更多的二极管，但这样会增加整个电路中开关管的损耗及增加电路成本。When the circuit is working, the voltage drop of the ordinary diode is about 0.7V, and the voltage drop of the sic diode is about 1V. Under the same current and temperature, the voltage drop of the tube is about 1.4 times that of the ordinary diode, and the diode will increase with the current. The voltage drop of the tube will increase, so in order to ensure that the soft-switching diode can still be cut off reliably when working at full load, it is necessary to connect three soft-switching diodes in series to ensure that the total voltage drop is greater than the voltage drop of the main diode D at full load, so that It can ensure that the soft-switching diode basically has no current flowing when the main diode D is turned on, so that the temperature rise of the soft-switching diode can be reduced, and the effective value of the current flowing through the resonant inductance Lr can be reduced, which greatly reduces the value of the resonant inductance Lr. The temperature rise solves the problem that the temperature of the resonant inductor is too high when the soft switching circuit uses a common diode. Of course, in order to solve this problem, more diodes can be connected in series in the soft switching circuit, but this will increase the loss of the switching tube in the entire circuit and increase the circuit cost.
软开关电路中由谐振电感Lr、第一二极管D1和第二二极管D2组成的谐振电路支路中串联二极管主要是为了增大该支路的压降，使得在相同电流情况下，谐振电路中支路的压降比与之并联连接的主二级管D支路的压降大，这样电流才会主要从boost电路中的主二极管D的支路流过，而流经谐振电路支路的电流相对减小，所以该谐振电流中任何地方串联一二极管D3均可达到该目的。In the resonant circuit branch composed of the resonant inductor Lr, the first diode D1 and the second diode D2 in the soft switching circuit, the series diode is mainly to increase the voltage drop of the branch, so that under the same current condition, The voltage drop of the branch in the resonant circuit is larger than the voltage drop of the main diode D branch connected in parallel with it, so that the current mainly flows from the branch of the main diode D in the boost circuit, and flows through the resonant circuit The current of the branch circuit is relatively reduced, so a diode D3 connected in series anywhere in the resonant current can achieve this purpose.
如图3和图4所示，所述第三二极管D3串接在谐振电感Lr的一端或另一端。As shown in FIG. 3 and FIG. 4 , the third diode D3 is connected in series with one end or the other end of the resonant inductor Lr.
如图5和图6所示，所述第三二极管D3串接在第一二极管D1的一端或另一端。As shown in FIG. 5 and FIG. 6, the third diode D3 is connected in series with one end or the other end of the first diode D1.
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| CN102332813A (en) * | 2010-07-13 | 2012-01-25 | 世系动力公司 | Power factor correction efficiency improvement circuit, a converter employing the circuit and a method of manufacturing a converter |
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