CN105463278B - A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper - Google Patents
A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper Download PDFInfo
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- CN105463278B CN105463278B CN201610002196.7A CN201610002196A CN105463278B CN 105463278 B CN105463278 B CN 105463278B CN 201610002196 A CN201610002196 A CN 201610002196A CN 105463278 B CN105463278 B CN 105463278B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/06—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of magnesium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
- C23C28/025—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
The invention discloses a kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper, the titanium magnesium alloy is made up of following component by mass percentage：5 7% Al, 3.2 3.6% Cu, 0.4 0.6% Si, 2 2.4% Mo, 0.3 0.5% Ni, 0.1 0.3% V, 32 36% Ti, surplus are Mg and inevitable impurity, and the preparation method is：(1) preparation of titanium magnesium alloy blank, comprises the following steps：(2) tablet personal computer shell blank is electroplated, is comprised the following steps：(1), clean and activate；(2) kirsite, is soaked：(3), electro-coppering：The copper-plated plating solution, which forms, is：CuSO440 50g/L, CuCl212 14g/L, K2CO355 65g/L, K4P2O7·3H2O 240 260g/L, C4H4O6KNa·3H2O 44 48g/L, K2HPO4·3H2The 65g/L of O 55, hydroxy ethylene two are seen 100 110g/L of acid, and the 0.5g/L of phytic acid 0.3, surplus is water；Electroplating technology is：PH is 8 8.5, and current density is 3 3.5A/dm2, temperature is 35 45 DEG C.
Description
Technical field
The present invention relates to electroplating technology, more particularly to a kind of titanium magnesium alloy tablet personal computer housing of electroplating surface copper
Preparation method.
Background technology
The thermal diffusivity of titanium magnesium alloy is not only higher than plastics, and is better than magnesium alloy and aluminium alloy, is particularly suitable for making flat board electricity
The shell of the products such as brain.
Titanium magnesium alloy has light durable, damping, the function of shielding, and specific strength is high, is easily recycled, is cheap
The characteristics of, the industrial circles such as defence and military, communications and transportation, optical instrument and electronic device can be widely used in.
The subject matter for influenceing titanium magnesium alloy application is the anti-corrosion sex chromosome mosaicism of titanium magnesium alloy, because the current potential of magnesium is very negative,
Corrosion resistance under certain conditions is poor, and its application is very limited.In order to make full use of titanium magnesium alloy density small, high
On the one hand the characteristics of specific strength and specific stiffness, people improve the anti-corrosion of magnesium alloy constantly from alloying, heat treatment etc.
Property, on the other hand be exactly by process for protecting surface seek raising magnesium alloy it is anti-corrosion by way of.
There are many techniques to form coat, including plating, chemical plating, conversion film, sun on titanium magnesium and Mg alloy surface
Pole oxidation, organic coating, vapor deposition layer etc..Wherein the most simple effective method be exactly by electrochemical method in titanium magnesium and
The metal or alloy of performance needed for one layer is plated on magnesium alloy substrate, that is, is electroplated.Titanium magnesium and the purpose of Mg alloy surface plating have two
It is individual：First, protection, second, attractive in appearance, i.e., titanium magnesium and Mg alloy surface have protecting decorative coating.Titanium magnesium and magnesium after plating close
Golden product is mainly used on the parts of high-speed moving object and needs to carry on product and the parts of portable product, wherein first
The application field of choosing is the industries such as automobile, motorcycle and bicycle, next to that portable type electronic product, such as notebook computer, is moved
Mobile phone, walkman etc..
The solution titanium magnesium of comparative maturity and Mg alloy surface corrosion-resistanting decoration treatment technology mainly have two kinds in the world, one is
Paint spraying, the second is metal plating.The former is the conventional method of current Mg alloy surface processing, but will to titanium magnesium alloy surface
Ask and used under high glaze decoration, wear-resisting, heat conditions, then paint spraying can not then meet to require, this just needs to use the coat of metal
To solve.But titanium magnesium alloy is extremely unstable in the bath solution of routine, titanium magnesium alloy part cannot directly enter tank liquor progress
Plating.It is generally necessary to be pre-processed to titanium magnesium and Mg alloy surface, conventional plating is then can use, reaches and Mg alloy surface is prevented
Protect the purpose of decoration.
The standard that the method that titanium magnesium and magnesium alloy plating are pre-processed at present is mainly recommended using U.S. ASTM both at home and abroad
Method, it is the leaching zinc method of Dow companies exploitation, it, which is pre-processed, employs leaching zinc and cyanide copper plating technique.The technology not only technique
Complexity, and employ poisonous cyanide.United States Patent (USP) 6068938 describe using pyrophosphate electroplating copper after electrogalvanizing come
Instead of cyanide electroplating；The country also has replaces cyanide technology using pyrophosphate；Before Japan Patent 59050194 describes magnesium alloy
After processing, in copper facing using the plating solution containing silicate.The uniformity of above-mentioned these techniques plating copper coating, planarization and
It is not very good with the adhesion of metallic matrix etc..
The content of the invention
, should it is an object of the invention to a kind of preparation method for the titanium magnesium alloy tablet personal computer housing for proposing electroplating surface copper
Method is adjusted to the constituent of titanium magnesium alloy first, makes its intensity higher, and stretching and punching performance is good, and through logical
Letter signal capabilities are strong, strong antijamming capability, and wear resistance is excellent.Simultaneously by pair and copper-plated bath composition tune
It is whole, the defects of overcoming prior art so that the adhesion of coating and matrix is more preferable, and coating is attractive in appearance, good decorative property.
To use following technical scheme up to this purpose, the present invention：
A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper, the titanium magnesium alloy press quality percentage
Than being made up of following component：5-7% Al, 3.2-3.6% Cu, 0.4-0.6% Si, 2-2.4% Mo, 0.3-0.5%
Ni, 0.1-0.3% V, 32-36% Ti, surplus is Mg and inevitable impurity, and the preparation method is：
(1) preparation of titanium magnesium alloy blank, comprises the following steps：
(1), stocked up by said ratio using simple metal or the intermediate alloy of each alloying element and magnesium, and be smelted into titanium
Magnesium alloy ingot；
(2), annealing, timeliness and subzero treatment, ingot casting is inserted in resistance furnace, is heated to 840-860 DEG C, insulation 4-6 is small
Shi Jinhang makes annealing treatment, and then stove is as cold as room temperature；Ingot casting after annealing is inserted in aging furnace, is heated to 350-370 DEG C, when
After effect processing 4-6 hours, slow cooling to room temperature；Ingot casting after Ageing Treatment is inserted into deep cooling box and carries out subzero treatment, deep cooling temperature
Spend for -140~-160 DEG C, subzero treatment soaking time is 40-60min, and insulation recovers to room temperature after terminating；
(3), by step (2) processing after titanium magnesium alloy ingot casting be placed in heat-treatment furnace, be heated to 500 DEG C~
520 DEG C and it is incubated 6-8 hours；
(4) split rolling method, is carried out using hot-rolling mill, the temperature control in the operation of rolling obtains hot rolling at 480 DEG C~500 DEG C
Band；
(5), the titanium magnesium alloy section bar by hot-rolled band using rolled by cold rolling machine into 0.8 ± 0.02mm；Between cold rolling pass
Intermediate annealing is carried out, annealing temperature is 390 DEG C~410 DEG C, and soaking time is 2~3 hours；
(6), according to the shape of tablet personal computer housing, the section bar that above-mentioned (5) step obtains is struck out into tablet personal computer housing
Blank；
(2) tablet personal computer shell blank is electroplated, is comprised the following steps：
(1), clean and activate；The blank that above-mentioned (6) step obtains is cleaned and activation process；
(2) kirsite, is soaked：Zincate solution forms：ZnSO4·7H2O 32-36g/L, Na4P2O7·10H2O 160-170g/
L, NaF 10-12g/L, KF 6-8g/L, Na2CO38-12g/L, NiSO42-3g/L, phosphatase 11 5-18g/L, surplus are water；
Under the conditions of 75-85 DEG C, titanium magnesium alloy shell blank is soaked into 10-15min in kirsite immersion liquid；
(3), electro-coppering：The copper-plated plating solution, which forms, is：CuSO440-50g/L, CuCl212-14g/L, K2CO3
55-65g/L, K4P2O7·3H2O 240-260g/L, C4H4O6KNa·3H2O 44-48g/L, K2HPO4·3H2O 55-65g/L,
Hydroxy ethylene two is seen sour 100-110g/L, and phytic acid 0.3-0.5g/L, surplus is water；Electroplating technology is：PH is 8-8.5, electric current
Density is 3-3.5A/dm2, temperature is 35-45 DEG C.
The present invention has the following technical effect that：
1) present invention is adjusted to the composition of titanium magnesium alloy, is added on the basis of the basis of traditional titanium magnesium alloy
Entered the elements such as Mo, Ni, V, played the advantage of alloying element interaction, it is particularly creative add Ni and V both
Elements, solid solution and dispersion-strengtherning are formed to titanium magnesium alloy matrix, obtain high intensity and the titanium magnesium alloy material of high impact toughness,
So that punching performance increases substantially.
2) adjustment of base material titanium magnesium alloy composition is directed to, plating solution composition is improved, mainly the plating solution to soaking zinc
Composition and electro-coppering plating solution composition adjust and has been improved, coating come off probability reduce.Simultaneously cladding wearability is carried
Height, shiny appearance, adhesion are good, porosity is low.So that solution composition and magnesium alloy are coordinated into split-phase.
3) through being detected using cross-cut tester, coating surface flawless, the defects of peeling off.According to GB6461-2002 salt fogs
Judgment criteria is tested, and coating of the invention is significantly larger than the resisting salt fog corrosion time as defined in standard, therefore, plating of the invention
The excellent anti-corrosion performance of layer.Rubbed wear testing, the anti-wear performance of coating of the invention than existing product improve 40% with
On, the needs of tablet personal computer housing can be met.
Embodiment
Embodiment one
A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper, the titanium magnesium alloy press quality percentage
Than being made up of following component：5% Al, 3.6% Cu, 0.4% Si, 2.4% Mo, 0.3% Ni, 0.3% V,
32% Ti, surplus are Mg and inevitable impurity, and the preparation method is：
(1) preparation of titanium magnesium alloy blank, comprises the following steps：
(1), stocked up by said ratio using simple metal or the intermediate alloy of each alloying element and magnesium, and be smelted into titanium
Magnesium alloy ingot；
(2), annealing, timeliness and subzero treatment, ingot casting is inserted in resistance furnace, is heated to 840-860 DEG C, insulation 4-6 is small
Shi Jinhang makes annealing treatment, and then stove is as cold as room temperature；Ingot casting after annealing is inserted in aging furnace, is heated to 350-370 DEG C, when
After effect processing 4-6 hours, slow cooling to room temperature；Ingot casting after Ageing Treatment is inserted into deep cooling box and carries out subzero treatment, deep cooling temperature
Spend for -140~-160 DEG C, subzero treatment soaking time is 40-60min, and insulation recovers to room temperature after terminating；
(3), by step (2) processing after titanium magnesium alloy ingot casting be placed in heat-treatment furnace, be heated to 500 DEG C~
520 DEG C and it is incubated 6-8 hours；
(4) split rolling method, is carried out using hot-rolling mill, the temperature control in the operation of rolling obtains hot rolling at 480 DEG C~500 DEG C
Band；
(5), the titanium magnesium alloy section bar by hot-rolled band using rolled by cold rolling machine into 0.8 ± 0.02mm；Between cold rolling pass
Intermediate annealing is carried out, annealing temperature is 390 DEG C~410 DEG C, and soaking time is 2~3 hours；
(6), according to the shape of tablet personal computer housing, the section bar that above-mentioned (5) step obtains is struck out into tablet personal computer housing
Blank；
(2) tablet personal computer shell blank is electroplated, is comprised the following steps：
(1), clean and activate；The blank that above-mentioned (6) step obtains is cleaned and activation process；
(2) kirsite, is soaked：Zincate solution forms：ZnSO4·7H2O 32g/L, Na4P2O7·10H2O 170g/L, NaF
10g/L, KF 8g/L, Na2CO38g/L, NiSO43g/L, phosphatase 11 5g/L, surplus are water；Under the conditions of 75-85 DEG C, by titanium magnesium
Alloy shell blank soaks 10-15min in kirsite immersion liquid；
(3), electro-coppering：The copper-plated plating solution, which forms, is：CuSO440g/L, CuCl214g/L, K2CO355g/L,
K4P2O7·3H2O 260g/L, C4H4O6KNa·3H2O 44g/L, K2HPO4·3H2O 65g/L, hydroxy ethylene two are seen acid
100g/L, phytic acid 0.5g/L, surplus are water；Electroplating technology is：PH is 8-8.5, current density 3-3.5A/dm2, temperature is
35-45℃。
Embodiment two
A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper, the titanium magnesium alloy press quality percentage
Than being made up of following component：7% Al, 3.2% Cu, 0.6% Si, 2% Mo, 0.5% Ni, 0.1% V, 36%
Ti, surplus is Mg and inevitable impurity, and the preparation method is：
(1) preparation of titanium magnesium alloy blank, comprises the following steps：
(1), stocked up by said ratio using simple metal or the intermediate alloy of each alloying element and magnesium, and be smelted into titanium
Magnesium alloy ingot；
(2), annealing, timeliness and subzero treatment, ingot casting is inserted in resistance furnace, is heated to 840-860 DEG C, insulation 4-6 is small
Shi Jinhang makes annealing treatment, and then stove is as cold as room temperature；Ingot casting after annealing is inserted in aging furnace, is heated to 350-370 DEG C, when
After effect processing 4-6 hours, slow cooling to room temperature；Ingot casting after Ageing Treatment is inserted into deep cooling box and carries out subzero treatment, deep cooling temperature
Spend for -140~-160 DEG C, subzero treatment soaking time is 40-60min, and insulation recovers to room temperature after terminating；
(3), by step (2) processing after titanium magnesium alloy ingot casting be placed in heat-treatment furnace, be heated to 500 DEG C~
520 DEG C and it is incubated 6-8 hours；
(4) split rolling method, is carried out using hot-rolling mill, the temperature control in the operation of rolling obtains hot rolling at 480 DEG C~500 DEG C
Band；
(5), the titanium magnesium alloy section bar by hot-rolled band using rolled by cold rolling machine into 0.8 ± 0.02mm；Between cold rolling pass
Intermediate annealing is carried out, annealing temperature is 390 DEG C~410 DEG C, and soaking time is 2~3 hours；
(6), according to the shape of tablet personal computer housing, the section bar that above-mentioned (5) step obtains is struck out into tablet personal computer housing
Blank；
(2) tablet personal computer shell blank is electroplated, is comprised the following steps：
(1), clean and activate；The blank that above-mentioned (6) step obtains is cleaned and activation process；
(2) kirsite, is soaked：Zincate solution forms：ZnSO4·7H2O 36g/L, Na4P2O7·10H2O 160g/L, NaF
12g/L, KF 6g/L, Na2CO312g/L, NiSO42g/L, phosphatase 11 8g/L, surplus are water；Under the conditions of 75-85 DEG C, by titanium
Magnesium alloy shell blank soaks 10-15min in kirsite immersion liquid；
(3), electro-coppering：The copper-plated plating solution, which forms, is：CuSO450g/L, CuCl212g/L, K2CO365g/L,
K4P2O7·3H2O 240g/L, C4H4O6KNa·3H2O 48g/L, K2HPO4·3H2O 55g/L, hydroxy ethylene two are seen acid
110g/L, phytic acid 0.3g/L, surplus are water；Electroplating technology is：PH is 8-8.5, current density 3-3.5A/dm2, temperature is
35-45℃。
Embodiment three
A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper, the titanium magnesium alloy press quality percentage
Than being made up of following component：6% Al, 3.4% Cu, 0.5% Si, 2.2% Mo, 0.4% Ni, 0.2% V,
34% Ti, surplus are Mg and inevitable impurity, and the preparation method is：
(1) preparation of titanium magnesium alloy blank, comprises the following steps：
(1), stocked up by said ratio using simple metal or the intermediate alloy of each alloying element and magnesium, and be smelted into titanium
Magnesium alloy ingot；
(2), annealing, timeliness and subzero treatment, ingot casting is inserted in resistance furnace, is heated to 840-860 DEG C, insulation 4-6 is small
Shi Jinhang makes annealing treatment, and then stove is as cold as room temperature；Ingot casting after annealing is inserted in aging furnace, is heated to 350-370 DEG C, when
After effect processing 4-6 hours, slow cooling to room temperature；Ingot casting after Ageing Treatment is inserted into deep cooling box and carries out subzero treatment, deep cooling temperature
Spend for -140~-160 DEG C, subzero treatment soaking time is 40-60min, and insulation recovers to room temperature after terminating；
(3), by step (2) processing after titanium magnesium alloy ingot casting be placed in heat-treatment furnace, be heated to 500 DEG C~
520 DEG C and it is incubated 6-8 hours；
(4) split rolling method, is carried out using hot-rolling mill, the temperature control in the operation of rolling obtains hot rolling at 480 DEG C~500 DEG C
Band；
(5), the titanium magnesium alloy section bar by hot-rolled band using rolled by cold rolling machine into 0.8 ± 0.02mm；Between cold rolling pass
Intermediate annealing is carried out, annealing temperature is 390 DEG C~410 DEG C, and soaking time is 2~3 hours；
(6), according to the shape of tablet personal computer housing, the section bar that above-mentioned (5) step obtains is struck out into tablet personal computer housing
Blank；
(2) tablet personal computer shell blank is electroplated, is comprised the following steps：
(1), clean and activate；The blank that above-mentioned (6) step obtains is cleaned and activation process；
(2) kirsite, is soaked：Zincate solution forms：ZnSO4·7H2O 34g/L, Na4P2O7·10H2O 165g/L, NaF
11g/L, KF 7g/L, Na2CO310g/L, NiSO42.5g/L, phosphatase 11 7.5g/L, surplus are water；Under the conditions of 75-85 DEG C,
Titanium magnesium alloy shell blank is soaked into 10-15min in kirsite immersion liquid；
(3), electro-coppering：The copper-plated plating solution, which forms, is：CuSO445g/L, CuCl213g/L, K2CO360g/L,
K4P2O7·3H2O 250g/L, C4H4O6KNa·3H2O 46g/L, K2HPO4·3H2O 60g/L, hydroxy ethylene two are seen acid
105g/L, phytic acid 0.4g/L, surplus are water；Electroplating technology is：PH is 8-8.5, current density 3-3.5A/dm2, temperature is
35-45℃。
Applicant states that the present invention illustrates the detailed process equipment of the present invention and technological process by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, that is, it is above-mentioned detailed not mean that the present invention has to rely on
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
The addition of equivalence replacement and auxiliary element to each raw material of product of the present invention, selection of concrete mode etc., all fall within the present invention's
Within the scope of protection domain and disclosure.
Claims (1)
- A kind of 1. preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper, it is characterised in that the titanium magnesium alloy It is made up of by mass percentage following component：6% Al, 3.4% Cu, 0.5% Si, 2.2% Mo, 0.4% Ni, 0.2% V, 34% Ti, surplus are Mg and inevitable impurity, and the preparation method is：(1) preparation of titanium magnesium alloy blank, comprises the following steps：(1), stocked up by said ratio using simple metal or the intermediate alloy of each alloying element and magnesium, and be smelted into the conjunction of titanium magnesium Golden ingot casting；(2), annealing, timeliness and subzero treatment, ingot casting is inserted in resistance furnace, is heated to 840-860 DEG C, insulation 4-6 hours enter Row annealing, then stove is as cold as room temperature；Ingot casting after annealing is inserted in aging furnace, is heated to 350-370 DEG C, at timeliness After managing 4-6 hours, slow cooling to room temperature；By the ingot casting after Ageing Treatment insert deep cooling box carry out subzero treatment, cryogenic temperature for- 140~-160 DEG C, subzero treatment soaking time is 40-60min, and insulation recovers to room temperature after terminating；(3), the titanium magnesium alloy ingot casting after step (2) processing is placed in heat-treatment furnace, is heated to 500 DEG C~520 DEG C And it is incubated 6-8 hours；(4) split rolling method, is carried out using hot-rolling mill, the temperature control in the operation of rolling obtains hot-rolled band at 480 DEG C~500 DEG C；(5), the titanium magnesium alloy section bar by hot-rolled band using rolled by cold rolling machine into 0.8 ± 0.02mm；Carried out between cold rolling pass Intermediate annealing, annealing temperature are 390 DEG C~410 DEG C, and soaking time is 2~3 hours；(6), according to the shape of tablet personal computer housing, the section bar that above-mentioned (5) step obtains is struck out into tablet personal computer shell blank；(2) tablet personal computer shell blank is electroplated, is comprised the following steps：(1), clean and activate；The blank that above-mentioned (6) step obtains is cleaned and activation process；(2) kirsite, is soaked：Zincate solution forms：ZnSO4·7H2O 34g/L, Na4P2O7·10H2O 165g/L, NaF 11g/ L, KF 7g/L, Na2CO310g/L, NiSO42.5g/L, phosphatase 11 7.5g/L, surplus are water；Under the conditions of 75-85 DEG C, by titanium magnesium Alloy shell blank soaks 10-15min in kirsite immersion liquid；(3), electro-coppering：The copper-plated plating solution, which forms, is：CuSO445g/L, CuCl213g/L, K2CO360g/L, K4P2O7· 3H2O 250g/L, C4H4O6KNa·3H2O 46g/L, K2HPO4·3H2O 60g/L, hydroxy ethylene diphosphonic acid 105g/L, phytic acid 0.4g/L, surplus are water；Electroplating technology is：PH is 8-8.5, current density 3-3.5A/dm2, temperature is 35-45 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610002196.7A CN105463278B (en) | 2016-01-05 | 2016-01-05 | A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610002196.7A CN105463278B (en) | 2016-01-05 | 2016-01-05 | A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper |
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| Publication Number | Publication Date |
|---|---|
| CN105463278A CN105463278A (en) | 2016-04-06 |
| CN105463278B true CN105463278B (en) | 2018-01-09 |
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| CN201610002196.7A Expired - Fee Related CN105463278B (en) | 2016-01-05 | 2016-01-05 | A kind of preparation method of the titanium magnesium alloy tablet personal computer housing of electroplating surface copper |
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| CN113235027B (en) * | 2021-05-21 | 2021-12-10 | 重庆理工大学 | Deformed magnesium alloy plate with good matching of strength and plasticity and preparation method thereof |
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| CN102352459A (en) * | 2011-11-02 | 2012-02-15 | 永鑫精密材料（无锡）有限公司 | Preparation method of magnesium alloy strip for cell phone shell |
| CN103898572A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Process for plating copper on surface of magnesium alloy shell |
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