CN105603471A - Surface copper electro-plating solution of titanium-magnesium alloy tablet computer shell - Google Patents
Surface copper electro-plating solution of titanium-magnesium alloy tablet computer shell Download PDFInfo
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- CN105603471A CN105603471A CN201610002198.6A CN201610002198A CN105603471A CN 105603471 A CN105603471 A CN 105603471A CN 201610002198 A CN201610002198 A CN 201610002198A CN 105603471 A CN105603471 A CN 105603471A
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- China
- Prior art keywords
- magnesium alloy
- concentration
- plating solution
- titanium
- titanium magnesium
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
Abstract
The invention discloses a surface copper electro-plating solution of a titanium-magnesium alloy tablet computer shell. Titanium-magnesium alloy is prepared from, by mass, 5%-7% of Al, 3.2%-3.6% of Cu, 0.4%-0.6% of Si, 2%-2.4% of Mo, 0.3%-0.5% of Ni, 0.1%-0.3% of V, 32%-36% of Ti and the balance Mg and unavoidable impurities. The plating solution is prepared from a zinc dipping solution and a copper electro-plating solution; the zinc dipping solution is prepared from ZnSO4.7H2O with the concentration of 32-36 g/L, Na4P2O7.10H2O with the concentration of 160-170 g/L, NaF with the concentration of 10-12 g/L, KF with the concentration of 6-8 g/L, Na2CO3 with the concentration of 8-12 g/L, NiSO4 with the concentration of 2-3 g/L, phosphoric acid with the concentration of 15-18 g/L and the balance water; the copper electro-plating solution is prepared from CuSO4 with the concentration of 40-50 g/L, CuC12 with the concentration of 12-14 g/L, K2CO3 with the concentration of 55-65 g/L, K4P2O7.3H2O with the concentration of 240-260 g/L, C4H4O6KNa.3H2O with the concentration of 44-48 g/L, K2HPO4.3H2O with the concentration of 55-65 g/L, 1-hydroxyethylidene-1,1-diphosphonic acid with the concentration of 100-110 g/L, phytic acid with the concentration of 0.3-0.5 g/L and the balance water.
Description
Technical field
The present invention relates to electroplating technology field, relate in particular to a kind of electroplating surface copper electrolyte of titanium magnesium alloy panel computer housing.
Background technology
The thermal diffusivity of titanium magnesium alloy is not only high than plastics, and is better than magnesium alloy and aluminium alloy, is particularly suitable for making the products such as panel computerThe shell of product.
Titanium magnesium alloy has the function of light durable, damping, shielding, and specific strength is high, be easy to recycling, cheapFeature, can be widely used in the industrial circles such as defence and military, communications and transportation, optical instrument and electronic device.
The subject matter that affects titanium magnesium alloy application is the corrosion resistance problem of titanium magnesium alloy, because the current potential of magnesium is very negative, at certainCorrosion resistance under a little conditions is poor, and its range of application is very limited. In order to make full use of little, the high ratio of titanium magnesium alloy densityThe feature of intensity and specific stiffness, people are on the one hand constantly improving the corrosion resistance of magnesium alloy from the aspect such as alloying, heat treatment,Be exactly on the other hand by process for protecting surface seek to improve magnesium alloy anti-corrosion by way of.
There is much technique on titanium magnesium and Mg alloy surface, to form coat, comprise plating, chemical plating, conversion film, anodeOxidation, organic coating, vapor deposition layer etc. Wherein simple effective method is exactly at titanium magnesium and magnesium by electrochemical method the mostOn alloy substrate, plate the metal or alloy of one deck desired properties, electroplate. The object that titanium magnesium and Mg alloy surface are electroplated has two:The one, protection, the 2nd, attractive in appearance, titanium magnesium and Mg alloy surface have protecting decorative coating. Titanium magnesium after plating and magnesium alloy produceProduct are mainly used on the parts of high-speed moving object and need to carry on the parts of goods and portable product, wherein first-selectedApplication is the industries such as automobile, motorcycle and bicycle, is secondly portable type electronic product, as notebook computer, movementPhone, walkman etc.
The solution titanium magnesium of comparative maturity and Mg alloy surface corrosion-resistanting decoration treatment technology mainly contain two kinds in the world, and first coating is coated withDress, it two is metal platings. The former is the conventional method of current Mg alloy surface processing, but to titanium magnesium alloy surface requirements Gao GuangUnder pool decoration, wear-resisting, heat-resisting condition, use, paint spraying can not meet the demands, and this just need solve with the coat of metal. SoAnd titanium magnesium alloy is extremely unstable in conventional bath solution, titanium magnesium alloy part can not directly enter tank liquor and electroplate. Conventionally needTo carry out pretreatment to titanium magnesium and Mg alloy surface, then can electroplate the object reaching magnesium alloy surface protective decoration by routine.
Titanium magnesium and magnesium alloy plating carry out the standard method that the main U.S. ASTM of employing recommends of pretreated method both at home and abroad at present,Be the zinc method of soaking of Dow company exploitation, its pretreatment has adopted soaks zinc and cyanide copper plating technique. Not only complex process of this technology,And adopt poisonous cyanide. United States Patent (USP) 6068938 has been described pyrophosphate electroplating copper after employing electrogalvanizing and has been replacedCyanide electroplating; Domestic also have the pyrophosphate of employing to replace cyanide technology; Japan Patent 59050194 is described magnesium alloy pre-treatmentAfter, in the time of copper facing, adopt the plating solution that contains silicate. The uniformity of above-mentioned these technique electro-coppering coating, planarization and withThe aspects such as the adhesion of metallic matrix are not very good.
Summary of the invention
The electroplating surface copper electrolyte that the object of the invention is to propose a kind of titanium magnesium alloy panel computer housing, the present invention is first to titaniumThe constituent of magnesium alloy is adjusted, and makes its intensity higher, and stretching and punching performance is good, and it is strong to see through signal of communication ability,Antijamming capability is strong, wear resistance excellence. Simultaneously by the adjustment of copper-plated bath composition, overcome prior artDefect, make the adhesion of coating and matrix better, coating is attractive in appearance, good decorative property.
For reaching this object, the present invention by the following technical solutions:
An electroplating surface copper electrolyte for titanium magnesium alloy panel computer housing, described titanium magnesium alloy is by mass percentage by following componentComposition: Ni, the 0.1-0.3% of Mo, the 0.3-0.5% of Si, the 2-2.4% of the Al of 5-7%, the Cu of 3.2-3.6%, 0.4-0.6%V, the Ti of 32-36%, surplus is Mg and inevitable impurity, described plating solution is by zincate solution and electro-coppering plating solution two partsComposition, described zincate solution consists of: ZnSO4·7H2O32-36g/L，Na4P2O7·10H2O160-170g/L，NaF10-12g/L，KF6-8g/L，Na2CO38-12g/L，NiSO42-3g/L, phosphatase 11 5-18g/L, surplus is water; Described copper-plated plating solution groupBecome: CuSO440-50g/L，CuCl212-14g/L，K2CO355-65g/L，K4P2O7·3H2O240-260g/L，C4H4O6KNa·3H2O44-48g/L，K2HPO4·3H2O55-65g/L, the hydroxy ethylene two sour 100-110g/L that sees, phytic acid0.3-0.5g/L, surplus is water.
Preferably, described dip galvanizing technique is under 75-85 DEG C of condition, and titanium magnesium alloy shell blank is soaked in kirsite immersion liquid10-15min; Electroplating technology is: pH is 8-8.5, and current density is 3-3.5A/dm2, temperature is 35-45 DEG C.
Described zincate solution need be combined use with electro-coppering plating solution.
The present invention has following technique effect:
1) the present invention adjusts the composition of titanium magnesium alloy, on the basis of the basis of traditional titanium magnesium alloy, has addedThe elements such as Mo, Ni, V, performance alloying element interactional advantage, particularly creationary Ni and these two kinds of units of V of having addedElement, forms solid solution and dispersion-strengtherning to titanium magnesium alloy matrix, obtain high strength and high impact toughness titanium magnesium alloy material, makeObtaining punching performance increases substantially.
2) for the adjustment of base material titanium magnesium alloy composition, plating solution composition being improved, is mainly the plating solution composition to soaking zincAdjusts and improve with the plating solution composition of electro-coppering, the coating probability reduction that comes off. Make cladding wearability raising, outer simultaneouslyGo sightseeing bright, adhesion is good, porosity is low. Solution composition is coordinated with the phase-splitting that becomes of magnesium alloy.
3), through adopting hundred lattice cuttves to detect, coating surface flawless, the defect such as peel off. Comment according to GB6461-2002 salt fogSentence standard and test, the resisting salt fog corrosion time that coating of the present invention specifies higher than standard far away, therefore, coating of the present inventionExcellent anti-corrosion performance. Through friction and wear test, the anti-wear performance of coating of the present invention improves more than 40% than existing product,Can meet the needs of panel computer housing.
Detailed description of the invention
Embodiment mono-
An electroplating surface copper electrolyte for titanium magnesium alloy panel computer housing, described titanium magnesium alloy is by mass percentage by following componentComposition: 5% Al, 3.6% Cu, 0.4% Si, 2.4% Mo, 0.3% Ni, 0.3% V, 32% Ti,Surplus is Mg and inevitable impurity, and described plating solution is made up of zincate solution and electro-coppering plating solution two parts, described zincate solution groupBecome: ZnSO4·7H2O32g/L，Na4P2O7·10H2O170g/L，NaF10g/L，KF8g/L，Na2CO38g/L，NiSO43g/L，Phosphatase 11 5g/L, surplus is water; Described copper-plated plating solution consists of: CuSO440g/L，CuCl214g/L，K2CO355g/L，K4P2O7·3H2O260g/L，C4H4O6KNa·3H2O44g/L，K2HPO4·3H2O65g/L, the hydroxy ethylene two sour 100g/L that sees,Phytic acid 0.5g/L, surplus is water.
Embodiment bis-
An electroplating surface copper electrolyte for titanium magnesium alloy panel computer housing, described titanium magnesium alloy is by mass percentage by following componentComposition; 7% Al, 3.2% Cu, 0.6% Si, 2% Mo, 0.5% Ni, 0.1% V, 36% Ti,Surplus is Mg and inevitable impurity, and described plating solution is made up of zincate solution and electro-coppering plating solution two parts, described zincate solution groupBecome: ZnSO4·7H2O36g/L，Na4P2O7·10H2O160g/L，NaF12g/L，KF6g/L，Na2CO312g/L，NiSO42g/L, phosphatase 11 8g/L, surplus is water; Electro-coppering: described copper-plated plating solution consists of: CuSO450g/L，CuCl212g/L，K2CO365g/L，K4P2O7·3H2O240g/L，C4H4O6KNa·3H2O48g/L，K2HPO4·3H2O55g/L, hydroxy ethyleneThe two sour 110g/L that see, phytic acid 0.3g/L, surplus is water.
Embodiment tri-
An electroplating surface copper electrolyte for titanium magnesium alloy panel computer housing, described titanium magnesium alloy is by mass percentage by following componentComposition: 6% Al, 3.4% Cu, 0.5% Si, 2.2% Mo, 0.4% Ni, 0.2% V, 34% Ti,Surplus is Mg and inevitable impurity, and described plating solution is made up of zincate solution and electro-coppering plating solution two parts, described zincate solution groupBecome: ZnSO4·7H2O34g/L，Na4P2O7·10H2O165g/L，NaF11g/L，KF7g/L，Na2CO310g/L，NiSO42.5g/L, phosphatase 11 7.5g/L, surplus is water; Described copper-plated plating solution consists of: CuSO445g/L，CuCl213g/L，K2CO360g/L，K4P2O7·3H2O25Og/L，C4H4O6KNa·3H2O46g/L，K2HPO4·3H2O60g/L, hydroxy ethylene two is seenAcid 105g/L, phytic acid 0.4g/L, surplus is water.
Applicant's statement, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but thisBrightly be not limited to above-mentioned detailed process equipment and process flow process, do not mean that the present invention must rely on above-mentioned detailed process equipmentCould implement with technological process. Person of ordinary skill in the field should understand, any improvement in the present invention, to the present inventionThe selection of the equivalence replacement of the each raw material of product and the interpolation of auxiliary element, concrete mode etc., all drop on protection scope of the present invention andWithin open scope.
Claims (2)
1. an electroplating surface copper electrolyte for titanium magnesium alloy panel computer housing, is characterized in that, described titanium magnesium alloy is by qualityPercentage is made up of following component: Mo, the 0.3-0.5% of Si, the 2-2.4% of the Al of 5-7%, the Cu of 3.2-3.6%, 0.4-0.6%Ni, the V of 0.1-0.3%, the Ti of 32-36%, surplus is Mg and inevitable impurity, described plating solution is by zincate solution and electricityCopper facing plating solution two parts composition, described zincate solution consists of: ZnSO4·7H2O32-36g/L，Na4P2O7·10H2O160-170g/L，NaF10-12g/L，KF6-8g/L，Na2CO38-12g/L，NiSO42-3g/L, phosphatase 11 5-18g/L, surplus is water; InstituteStating copper-plated plating solution consists of: CuSO440-50g/L，CuCl212-14g/l，K2CO355-65g/L，K4P2O7·3H2O240-260g/L，C4H4O6KNa·3H2O44-48g/L，K2HPO4·3H2O55-65g/L, hydroxy ethylene twoThe sour 100-110g/L that sees, phytic acid 0.3-0.5g/L, surplus is water.
2. the electroplating surface copper electrolyte of a kind of titanium magnesium alloy panel computer housing as claimed in claim 2, described zincate solution and electricityCopper facing plating solution need be combined use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610002198.6A CN105603471A (en) | 2016-01-05 | 2016-01-05 | Surface copper electro-plating solution of titanium-magnesium alloy tablet computer shell |
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| CN201610002198.6A CN105603471A (en) | 2016-01-05 | 2016-01-05 | Surface copper electro-plating solution of titanium-magnesium alloy tablet computer shell |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090317556A1 (en) * | 2008-06-19 | 2009-12-24 | Arlington Plating Company | Method of Chrome Plating Magnesium and Magnesium Alloys |
| CN102352459A (en) * | 2011-11-02 | 2012-02-15 | 永鑫精密材料（无锡）有限公司 | Preparation method of magnesium alloy strip for cell phone shell |
| CN102400023A (en) * | 2011-11-14 | 2012-04-04 | 周涛 | Preparation method of magnesium alloy for housing of electric bicycle instrument panel |
| CN103898578A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Plating solution for electrocoppering on surface of magnesium alloy shell |
-
2016
- 2016-01-05 CN CN201610002198.6A patent/CN105603471A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090317556A1 (en) * | 2008-06-19 | 2009-12-24 | Arlington Plating Company | Method of Chrome Plating Magnesium and Magnesium Alloys |
| CN102352459A (en) * | 2011-11-02 | 2012-02-15 | 永鑫精密材料（无锡）有限公司 | Preparation method of magnesium alloy strip for cell phone shell |
| CN102400023A (en) * | 2011-11-14 | 2012-04-04 | 周涛 | Preparation method of magnesium alloy for housing of electric bicycle instrument panel |
| CN103898578A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Plating solution for electrocoppering on surface of magnesium alloy shell |
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Application publication date: 20160525 |