CN105460413A - Damp-proof and oxidization resistance packaging device for printed circuit boards (PCBs) - Google Patents
Damp-proof and oxidization resistance packaging device for printed circuit boards (PCBs) Download PDFInfo
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- CN105460413A CN105460413A CN201410463665.6A CN201410463665A CN105460413A CN 105460413 A CN105460413 A CN 105460413A CN 201410463665 A CN201410463665 A CN 201410463665A CN 105460413 A CN105460413 A CN 105460413A
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- pcbs
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- proof
- packing device
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Abstract
The invention discloses a damp-proof and oxidization resistance packaging device for printed circuit boards (PCBs). The device comprises an L-shaped supporting table. A female mold is hinged to the rear side of the supporting table. Sliding grooves are formed in the two sides of a vertical plate of the supporting table. A male mold is movably embedded in the sliding grooves. A reel installation seat is arranged on the other side of the supporting table. Packaging reels are arranged on the upper side and the lower side of the reel installation seat respectively. By means of the damp-proof and oxidization resistance packaging device for the PCBs, the PCBs are prevented from being corroded by air; upper plastic packaging paper and lower plastic packaging paper are pressed by combining the male mold with the female mold; the sealing performance of the device is guaranteed, and sealing of the multiple PCBs can be completed through one-time operation.
Description
Technical field
The present invention relates to a kind of PCB anti-tide-bound oxygen packing device, belong to circuit board operation component technology field.
Background technology
PCB is also known as printed circuit board (PCB) or PC board, be called for short and build and wiring board, take insulcrete as base material, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated through-hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components; After PCB completes printing; Need to carry out process of spraying paint, complete after spraying paint and carry out isolated air-packing, ensure that it is not subject to air corrosion; In prior art, also not good PCB packing device.
Summary of the invention
(1) technical matters that will solve
For solving the problem, the present invention proposes a kind of PCB anti-tide-bound oxygen packing device, being intended to avoid printed circuit board not by air corrosion.
(2) technical scheme
A kind of PCB of the present invention anti-tide-bound oxygen packing device, comprises a platform of L-type; Master tooling is hinged with on rear side of described platform; The riser both sides of described platform are provided with chute; In described chute, activity is embedded with male mould; Described platform opposite side is provided with spool mount pad; Described spool mount pad the upper side and lower side is respectively arranged with packaging spool.
Further, described master tooling offers many translots and pod; Described male mould is provided with the screen coordinated with translot and pod.
Further, on described packaging spool, volume has plastic wrapping paper.
Further, described male mould is also provided with cutting cutter.
(3) beneficial effect
A kind of PCB of the present invention anti-tide-bound oxygen packing device, avoids printed circuit board not by air corrosion; By male mould and master tooling matched moulds, upper plastic wrapping paper and lower plastic wrapping paper are suppressed; Ensure its leak tightness, single job can complete the sealing of polylith pcb board.
Accompanying drawing explanation
Fig. 1 is overall schematic of the present invention.
Detailed description of the invention
A kind of PCB anti-tide-bound oxygen packing device as shown in Figure 1, comprises a platform 1 of L-type; Master tooling 2 is hinged with on rear side of described platform 1; The riser both sides of described platform are provided with chute (not shown); In described chute, activity is embedded with male mould 3; Described platform 1 opposite side is provided with spool mount pad 4; Described spool mount pad 4 the upper side and lower side is respectively arranged with packaging spool 5.
Described master tooling 2 offers many translots 6 and pod 7; Described male mould 3 is provided with the screen 8 coordinated with translot and pod.
On described packaging spool 5, volume has plastic wrapping paper 9.
Described male mould 3 is also provided with cutting cutter 10.
A kind of PCB of the present invention anti-tide-bound oxygen packing device, makes upper plastic wrapping paper and lower plastic wrapping paper suppress by male mould and master tooling matched moulds; Ensure its leak tightness, single job can complete the sealing of polylith pcb board.
Embodiment recited above is only be described the preferred embodiment of the present invention, not limits the spirit and scope of the present invention.Under the prerequisite not departing from design concept of the present invention; the various modification that this area ordinary person makes technical scheme of the present invention and improvement; all should drop into protection scope of the present invention, the technology contents of request protection of the present invention, all records in detail in the claims.
Claims (4)
1. a PCB anti-tide-bound oxygen packing device, is characterized in that: the platform comprising L-type; Master tooling is hinged with on rear side of described platform; The riser both sides of described platform are provided with chute; In described chute, activity is embedded with male mould; Described platform opposite side is provided with spool mount pad; Described spool mount pad the upper side and lower side is respectively arranged with packaging spool.
2. a kind of PCB according to claim 1 anti-tide-bound oxygen packing device, is characterized in that: described master tooling offers many translots and pod; Described male mould is provided with the screen coordinated with translot and pod.
3. a kind of PCB according to claim 1 anti-tide-bound oxygen packing device, is characterized in that: on described packaging spool, volume has plastic wrapping paper.
4. a kind of PCB according to claim 1 anti-tide-bound oxygen packing device, is characterized in that: described male mould is also provided with cutting cutter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410463665.6A CN105460413A (en) | 2014-09-13 | 2014-09-13 | Damp-proof and oxidization resistance packaging device for printed circuit boards (PCBs) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410463665.6A CN105460413A (en) | 2014-09-13 | 2014-09-13 | Damp-proof and oxidization resistance packaging device for printed circuit boards (PCBs) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105460413A true CN105460413A (en) | 2016-04-06 |
Family
ID=55598659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410463665.6A Pending CN105460413A (en) | 2014-09-13 | 2014-09-13 | Damp-proof and oxidization resistance packaging device for printed circuit boards (PCBs) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105460413A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108163257A (en) * | 2017-12-28 | 2018-06-15 | 铜陵安博电路板有限公司 | A kind of anti-tide-bound oxygen packing devices of PCB |
-
2014
- 2014-09-13 CN CN201410463665.6A patent/CN105460413A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108163257A (en) * | 2017-12-28 | 2018-06-15 | 铜陵安博电路板有限公司 | A kind of anti-tide-bound oxygen packing devices of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160406 |