CN105448784A - Silicon chip separating mechanism - Google Patents
Silicon chip separating mechanism Download PDFInfo
- Publication number
- CN105448784A CN105448784A CN201511022075.0A CN201511022075A CN105448784A CN 105448784 A CN105448784 A CN 105448784A CN 201511022075 A CN201511022075 A CN 201511022075A CN 105448784 A CN105448784 A CN 105448784A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- separating mechanism
- chip separating
- conveyer belt
- mechanism body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 73
- 239000010703 silicon Substances 0.000 title claims abstract description 73
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 230000007246 mechanism Effects 0.000 title claims abstract description 51
- 238000007664 blowing Methods 0.000 claims abstract description 38
- 239000011148 porous material Substances 0.000 claims description 27
- 230000000740 bleeding effect Effects 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 3
- 150000003376 silicon Chemical class 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 abstract 3
- 238000005516 engineering process Methods 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000003203 everyday effect Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000003345 natural gas Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Belt Conveyors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electrostatic Separation (AREA)
Abstract
A silicon chip separating mechanism comprises a silicon chip separating mechanism body, wherein two parallel conveying belts are arranged below the silicon chip separating mechanism body at an interval; air extraction holes facing the conveying belts are formed in the silicon chip separating mechanism body, and are communicated with an air extraction device through pipelines; rollers are arranged on the silicon chip separating mechanism body and correspond to the front ends of the conveying directions of the conveying belts; and an air blowing hole facing the conveying belts is formed in the silicon chip separating mechanism body, and is communicated with an air blowing device. According to the invention, the air extraction device, the air blowing device and the conveying belts work together to separate stacked silicon chips, so that the silicon chip separating mechanism is high in chip separating efficiency.
Description
Technical field
The present invention relates to a kind of silicon chip separating mechanism, belong to solar battery sheet and prepare auxiliary device field.
Background technology
Since 21 century, global Energy Consumption sharply rises, and traditional fossil energy is day by day exhausted, and energy problem and environmental problem become two large Important Problems of global concern gradually.Under the pressure of the pressure of sustainable development, solar photovoltaic industry is listed in the emphasis that regenerative resource develops by each major country one after another.Become the second in the world economy along with China, in October, 2013, China's petroleum import in October amount reaches every day 6,300,000 barrels, exceedes the every day 6,240,000 barrels of the U.S., and replacing the U.S. first becomes global maximum net import of oil state.2013, the external dependence degree of CNPC and natural gas reached 58.1% and 31.6% respectively, and China has become global the third-largest natural gas consumption state.Traditional fossil energy is more and more difficult to the thriving demand meeting Chinese national economy.In in the past 20 years, the artificial CO2 emissions in the whole world nearly about 75% derives from combustion of fossil fuel.Therefore, be no matter the energy development angle from low-carbon environment-friendly, still comply with Industry Structure upgrading and transition pressure, China must accelerate development New Energy Industry.
Solar energy belongs to clean reproducible energy.According to " European renewable energy technologies strategic plan " that EU Committee proposes, to the year two thousand twenty, solar energy will account for 15% of European Union's electricity needs.2010, USDOE developed planning, and planned the year two thousand thirty, and solar energy accounts for 10% ~ 15% of total energy consumption figure.Take temperature from worldwide solar energy and the generating of tidal energy aggregate net, China is 3,000,000,000 kilowatt hours, and Germany is 19,000,000,000 dry watt-hours, and Italy is 10,700,000,000 dry watt-hours, and Spain is 9,100,000,000 kilowatt hours, and Japan is 3,800,000,000 kilowatt hours.Following China water power growth space is limited, and nuclear energy exists unsafe factor.Fossil energy will rise by energy-saving and emission-reduction committed cost, the wide market of solar energy power generating.
The processing of monocrystalline silicon piece comprises the first evolution of silicon single crystal rod, then cuts into slices, and the processing of polysilicon chip comprises polycrystal silicon ingot cutting, then cuts into slices, and the processing of quasi-monocrystalline silicon comprises mono-like silicon ingot cutting, then cuts into slices.Generally speaking, section is one of requisite technique in crystal silicon solar cell sheet processing technology.The silicon wafer layer obtained after section stacks, and inserts in silicon wafer bearing box and transport after needing burst, and because silicon chip has thin, crisp, therefore the difficulty of burst, inserted sheet is very large.
Publication number is the application for a patent for invention of CN103681968A, discloses a kind of automatic machine for inserting silicon wafers, and it adopts sucker to capture silicon chip to carry out burst, inserted sheet, and the action capturing silicon chip due to sucker is discontinuous operation, therefore there is the inefficient problem of burst.
Summary of the invention
The object of the invention is to provide a kind of silicon chip separating mechanism.
For achieving the above object, the technical solution used in the present invention is: a kind of silicon chip separating mechanism, comprise silicon chip separating mechanism body, this silicon chip separating mechanism body is to having two parallel and spaced conveyer belts, described silicon chip separating mechanism body is provided with towards described conveyer belt pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; The front end of the throughput direction of the corresponding described conveyer belt of described silicon chip separating mechanism body is provided with roller; Described silicon chip separating mechanism body is provided with the air blowing pore of blowing direction towards described conveyer belt, and this air blowing pore is communicated with blowing device by pipeline.
Preferred technical scheme is: described conveyer belt is Timing Belt.
Preferred technical scheme is: described Timing Belt is set on driving wheel and driven pulley, and described driving wheel and drive unit are in transmission connection.
Preferred technical scheme is: described drive unit is a CD-ROM drive motor, and output shaft and the described driving wheel of this CD-ROM drive motor pass through V belt translation.
Preferred technical scheme is: described silicon chip separating mechanism body is provided with roller fixed head in the front end of the throughput direction of described conveyer belt, and this roller fixed head is towards having pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; Described roller rotational support is on described roller fixed head.
Preferred technical scheme is: described silicon chip separating mechanism body is provided with an air cavity closed, and this air cavity is provided with several pores of bleeding towards described conveyer belt, and described air cavity is fixed with valve, and this valve is communicated with air extractor by pipeline.
Preferred technical scheme is: the rear end of the throughput direction of the corresponding described conveyer belt of described silicon chip separating mechanism body is provided with air blowing air cavity, this air blowing air cavity is provided with the air blowing pore of blowing direction towards described conveyer belt, and described air blowing air cavity is communicated with blowing device by pipeline.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The present invention adopts air extractor, blowning installation and conveyer belt acting in conjunction by the silicon chip of stacking separately, has the advantage that burst efficiency is high.
Accompanying drawing explanation
Accompanying drawing 1 is silicon chip separating mechanism schematic perspective view.
Accompanying drawing 2 is silicon chip separating mechanism elevational schematic view.
Accompanying drawing 3 is silicon chip separating mechanism schematic top plan view.
Accompanying drawing 4 is silicon chip separating mechanism schematic side view.
Accompanying drawing 5 is silicon chip separating mechanism schematic rear view.
In above accompanying drawing: 1, silicon chip separating mechanism body; 2, conveyer belt; 3, to bleed pore; 4, roller; 5, valve; 6, roller fixed head; 7, air blowing pore; 8, air blowing air cavity; 9, pipeline.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Embodiment: silicon chip separating mechanism
Shown in accompanying drawing 1 ~ 5, silicon chip separating mechanism, comprise silicon chip separating mechanism body 1, this silicon chip separating mechanism body 1 is to having two parallel and spaced conveyer belts 2, described silicon chip separating mechanism body 1 is provided with towards described conveyer belt 2 pore 3 of bleeding, this pore 3 of bleeding is communicated with air extractor (not shown) by pipeline, and air extractor can be vacuum suction device.The front end of the throughput direction of the corresponding described conveyer belt 2 of described silicon chip separating mechanism body 1 is provided with roller 4; Described silicon chip separating mechanism body 1 is provided with the air blowing pore 7 of blowing direction towards described conveyer belt 2, and this air blowing pore 7 is communicated with blowing device (not shown) by pipeline 9.Blowing device can be such as air blast.
Be preferred embodiment: described conveyer belt is Timing Belt.
Be preferred embodiment: described Timing Belt is set on driving wheel and driven pulley, and described driving wheel and drive unit are in transmission connection.
Be preferred embodiment: described drive unit is a CD-ROM drive motor that output shaft and the described driving wheel of this CD-ROM drive motor pass through V belt translation.CD-ROM drive motor can be hydraulic motor or motor etc.
Be preferred embodiment: described silicon chip separating mechanism body 1 is provided with roller fixed head 6 in the front end of the throughput direction of described conveyer belt 2 that this roller fixed head 6 is towards having pore 3 of bleeding, and this pore 3 of bleeding is communicated with air extractor by pipeline; Described roller 4 rotational support is on described roller fixed head 6.
Be preferred embodiment: described silicon chip separating mechanism body 1 is provided with an air cavity closed, and this air cavity is provided with several pores 3 of bleeding towards described conveyer belt 2, and described air cavity is fixed with valve 5, and this valve 5 is communicated with air extractor by pipeline.
Be preferred embodiment: the rear end of the throughput direction of the corresponding described conveyer belt 2 of described silicon chip separating mechanism body 1 is provided with air blowing air cavity 8, this air blowing air cavity 8 is provided with the air blowing pore 7 of blowing direction towards described conveyer belt 2, and described air blowing air cavity 8 is communicated with blowing device by pipeline 9.
Method of work: be placed on by the silicon chip of stacking immediately below conveyer belt 2, starts the drive unit that blowing device, air extractor and driving conveyer belt rotate.When first piece of silicon chip at top of the silicon chip being positioned at stacking contacts with conveyer belt, the negative pressure that air extractor produces near pore makes silicon chip relative with conveyer belt fixing, along with the rotation of conveyer belt, silicon chip way roller direction is moved, the first piece of silicon chip being positioned at the top of the silicon chip of stacking is like this separated with the silicon chip of stacking, thus reaches the object of burst.Blowing device is dried to the sidepiece of the silicon chip of stacking, makes the gap between silicon chip become large, silicon chip burst is more prone to.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (7)
1. a silicon chip separating mechanism, it is characterized in that: comprise silicon chip separating mechanism body, this silicon chip separating mechanism body is to having two parallel and spaced conveyer belts, described silicon chip separating mechanism body is provided with towards described conveyer belt pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; The front end of the throughput direction of the corresponding described conveyer belt of described silicon chip separating mechanism body is provided with roller; Described silicon chip separating mechanism body is provided with the air blowing pore of blowing direction towards described conveyer belt, and this air blowing pore is communicated with blowing device by pipeline.
2. silicon chip separating mechanism according to claim 1, is characterized in that: described conveyer belt is Timing Belt.
3. silicon chip separating mechanism according to claim 2, is characterized in that: described Timing Belt is set on driving wheel and driven pulley, and described driving wheel and drive unit are in transmission connection.
4. silicon chip separating mechanism according to claim 3, is characterized in that: described drive unit is a CD-ROM drive motor, and output shaft and the described driving wheel of this CD-ROM drive motor pass through V belt translation.
5. silicon chip separating mechanism according to claim 1, it is characterized in that: described silicon chip separating mechanism body is provided with roller fixed head in the front end of the throughput direction of described conveyer belt, this roller fixed head is towards having pore of bleeding, and this pore of bleeding is communicated with air extractor by pipeline; Described roller rotational support is on described roller fixed head.
6. silicon chip separating mechanism according to claim 1, it is characterized in that: described silicon chip separating mechanism body is provided with an air cavity closed, this air cavity is provided with several pores of bleeding towards described conveyer belt, and described air cavity is fixed with valve, and this valve is communicated with air extractor by pipeline.
7. silicon chip separating mechanism according to claim 1, it is characterized in that: the rear end of the throughput direction of the corresponding described conveyer belt of described silicon chip separating mechanism body is provided with air blowing air cavity, this air blowing air cavity is provided with the air blowing pore of blowing direction towards described conveyer belt, and described air blowing air cavity is communicated with blowing device by pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511022075.0A CN105448784B (en) | 2015-12-31 | 2015-12-31 | Silicon chip separating mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511022075.0A CN105448784B (en) | 2015-12-31 | 2015-12-31 | Silicon chip separating mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105448784A true CN105448784A (en) | 2016-03-30 |
| CN105448784B CN105448784B (en) | 2018-03-13 |
Family
ID=55558829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511022075.0A Active CN105448784B (en) | 2015-12-31 | 2015-12-31 | Silicon chip separating mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105448784B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6135102A (en) * | 1997-05-20 | 2000-10-24 | Tokyo Seimitsu Co., Ltd. | Wafer collecting apparatus |
| WO2003007345A1 (en) * | 2001-07-13 | 2003-01-23 | Tru-Si Technologies, Inc. | Article holders with sensors detecting a type of article held by the holder |
| JP2003037145A (en) * | 2001-07-23 | 2003-02-07 | Nec Kansai Ltd | Wafer carrying apparatus |
| CN204660628U (en) * | 2015-06-04 | 2015-09-23 | 东莞市微格能自动化设备有限公司 | A kind of absorption type load-transfer device |
| CN205303425U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip fragmentation mechanism |
-
2015
- 2015-12-31 CN CN201511022075.0A patent/CN105448784B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6135102A (en) * | 1997-05-20 | 2000-10-24 | Tokyo Seimitsu Co., Ltd. | Wafer collecting apparatus |
| WO2003007345A1 (en) * | 2001-07-13 | 2003-01-23 | Tru-Si Technologies, Inc. | Article holders with sensors detecting a type of article held by the holder |
| JP2003037145A (en) * | 2001-07-23 | 2003-02-07 | Nec Kansai Ltd | Wafer carrying apparatus |
| CN204660628U (en) * | 2015-06-04 | 2015-09-23 | 东莞市微格能自动化设备有限公司 | A kind of absorption type load-transfer device |
| CN205303425U (en) * | 2015-12-31 | 2016-06-08 | 苏州博阳能源设备有限公司 | Silicon chip fragmentation mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105448784B (en) | 2018-03-13 |
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Effective date of registration: 20230327 Address after: 224000 Building 2, No. 10, Liujiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Patentee after: Jiangsu Boyang Intelligent Equipment Co.,Ltd. Address before: 215000 Wang Wu Road, Wuzhong District, Suzhou, Jiangsu 28 Patentee before: SUZHOU BOYANG ENERGY EQUIPMENT CO.,LTD. |
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| TR01 | Transfer of patent right |