CN105445509A - Cantilever-type probe system for parallel testing of multiple radio frequency chips - Google Patents
Cantilever-type probe system for parallel testing of multiple radio frequency chips Download PDFInfo
- Publication number
- CN105445509A CN105445509A CN201510821501.0A CN201510821501A CN105445509A CN 105445509 A CN105445509 A CN 105445509A CN 201510821501 A CN201510821501 A CN 201510821501A CN 105445509 A CN105445509 A CN 105445509A
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- CN
- China
- Prior art keywords
- probe
- radio frequency
- frequency chip
- cantalever type
- dead ring
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07392—Multiple probes manipulating each probe element or tip individually
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
Abstract
The invention provides a cantilever-type probe system for the parallel testing of multiple radio frequency chips, and the system comprises a probe card board and at least two chip detection units. Each chip detection unit detects one radio frequency chip, and each chip detection unit comprises an insulating ring and a probe, wherein the insulating rings are fixed on the probe card board, and the probes are fixed with the insulating rings. One end, far from the tip, of each probe is welded with the probe card board. Shielding layers are disposed among the chip detection units. When the system is used for the paralleling testing of multiple radio frequency chips, the system effectively reduces the radio frequency crosstalk among the radio frequency probes, and can effectively enable the radio frequency crosstalk among the probes to be reduced by 5dB-10dB under the condition that the cost of a probe card is basically not increased.
Description
Technical field
The invention belongs to semiconductor applications, relate to a kind of cantalever type probe system being applied to many radio frequency chip concurrent testings.
Background technology
Along with the development of modern communications technology and the progress of consumer electronics, radio frequency chip widespread use or be integrated in consumer electronics product, wireless device and intelligent control device.The frequency of the radio frequency chip of wafer current level test is more and more higher, and cost is in continuous reduction, the radio frequency chip of 1.5GHz to 12GHz is when wafer-level test, in order to improve testing efficiency and reduce testing cost, need to adopt cantalever type probe system (i.e. cantalever type probe card) to test many radio frequency chips, namely many concurrent testings reduce testing cost further simultaneously.When cantalever type probe is stuck in radio frequency chip many and surveys, although cost is very low, there is radiofrequency signal cross-interference issue, thus can only serial test be carried out.
Prior art is when carrying out many radio frequency chips and surveying, the crosstalk between radiofrequency signal is reduced by the afterbody increase screen layer of the rf probe at cantalever type probe card, specific practice is a radio frequency many and the cantalever type probe card surveyed uses an asphalt mixtures modified by epoxy resin alicyclic ring, all probes of test many radio frequency chips are all placed on same asphalt mixtures modified by epoxy resin alicyclic ring, and increase ground shield to reduce radiofrequency signal crosstalk at each radiofrequency signal probe tails.But because all probes are all placed on same asphalt mixtures modified by epoxy resin alicyclic ring by cantalever type probe card, so screen layer can only be placed at most rf probe and asphalt mixtures modified by epoxy resin alicyclic ring junction, inner and the whole tip portion at asphalt mixtures modified by epoxy resin alicyclic ring, the radiofrequency signal still crosstalk mutually of many radio frequency chips, effectively cannot shield, thus make cantalever type probe card cannot real efficient parallel test.
Summary of the invention
The object of the present invention is to provide a kind of cantalever type probe system being applied to many radio frequency chip concurrent testings.
For solving the problems of the technologies described above, technical scheme provided by the invention is as follows:
The invention provides a kind of cantalever type probe system being applied to many radio frequency chip concurrent testings, comprise probe clamp and at least two chip detection unit, each described chip detection unit inspection radio frequency chip, described chip detection unit comprises dead ring and probe, described dead ring is fixed on described probe clamp, described probe and described dead ring are fixed, and described probe welds with described probe clamp away from one end of needle point, arrange screen layer between described each chip detection unit.
Further, described screen layer is arranged on outside described each chip detection unit, described screen layer one end and described probe clamp are fixed, described probe is all positioned at described screen layer away from one end of needle point and described dead ring, the described screen layer other end is provided with opening, and the tip portion of described probe is through described opening.
Further, described screen layer is grounded metallic shield layer.
Further, described probe clamp comprises the annular distance identical with chip detection element number, described dead ring is fixed on described probe clamp by described annular distance.
Further, fixing glue is utilized to be fixed on described dead ring by described probe.
Further, described probe bending is divided into two parts, is respectively probe tip and probe needle arm.
Further, the bending angle between described probe needle arm and described probe tip is obtuse angle.
Further, the probe needle arm of described probe is fixed on described dead ring by fixing glue.
Further, described dead ring is ceramic ring.
Further, described fixing glue is epoxy resin.
Compared with prior art, advantage of the present invention is:
When radio frequency chip carries out many and surveys, effectively reduce rf probe radio frequency cross talk each other, when probe cost does not increase substantially, can effectively make the radio frequency cross talk between the probe of cantalever type probe system reduce 5dB-10dB.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram being applied to the cantalever type probe system of many radio frequency chip concurrent testings that the embodiment of the present invention provides.
Wherein, 1-probe clamp; 2-chip detection unit; 3-screen layer; 11-annular distance; 21-dead ring; 22-probe; 221-probe tip; 222-probe needle arm.
Embodiment
Below in conjunction with the drawings and specific embodiments, a kind of cantalever type probe system being applied to many radio frequency chip concurrent testings that the present invention proposes is described in further detail.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
As shown in Figure 1, it is a kind of cantalever type probe system being applied to many radio frequency chip concurrent testings provided by the invention, comprise probe clamp 1 and at least two chip detection unit 2, each described chip detection unit 2 detects a radio frequency chip, described chip detection unit comprises dead ring 21 and probe 22, described dead ring 21 is fixed on described probe clamp 1, described probe 22 is fixed with described dead ring 21, described probe 22 welds with described probe clamp 1 away from one end of needle point, arranges screen layer 3 between described each chip detection unit 2.By arranging screen layer 3 outside each chip detection unit 2, make every radio frequency chip when testing, separate between probe 22, the crosstalk of radiofrequency signal between the probe 22 effectively reducing different chip detection unit 2.
Further, described screen layer 3 is arranged on outside described each chip detection unit 2, described screen layer 3 one end and described probe clamp 1 are fixed, described probe 22 is all positioned at described screen layer 3 away from one end of needle point and described dead ring 21, described screen layer 3 other end is provided with opening, and the tip portion of described probe 22 is through described opening.By the setting of screen layer 3, the miscellaneous part of whole chip detection unit 2 except the tip portion of probe 22 is all wrapped in screen layer, the tip portion of probe 22 then needs to carry out radio frequency chip through screen layer 3 and detects, and farthest can reduce the crosstalk of radiofrequency signal between different chip detection unit 2 like this.
Further, described screen layer 3 is grounded metallic shield layer.What it may occur to persons skilled in the art that is that the setting of screen layer 3 is not limited in the grounded metallic shield layer mentioned in the present embodiment, as long as the crosstalk of the radiofrequency signal that can produce between shielded probe.
Further, described probe clamp 1 comprises the annular distance 11 identical with chip detection element number, described dead ring 21 is fixed on described probe clamp 1 by described annular distance 11.
Further, fixing glue is utilized to be fixed on described dead ring 21 by described probe 22.Fixing glue mainly plays bonding effect, is fixed on dead ring 21 by probe 22.
Further, described probe 22 bending is divided into two parts, is respectively probe tip 221 and probe needle arm 222.Certain angle is bent with between the probe needle arm 222 of cantalever type probe system and probe tip 221.
Further, the bending angle between described probe needle arm 222 and described probe tip 221 is obtuse angle.
Further, described probe needle arm 222 is fixed on described dead ring 21 by fixing glue.The probe needle arm 222 of cantalever type probe system is fixed on dead ring 21, and play location and the fixation of probe 22, probe tip 221 then carries out input.
Further, described dead ring 21 is ceramic ring.
Further, described fixing glue is epoxy resin.The surface of epoxy resin to metal and nonmetallic materials has excellent bonding strength, and dielectric properties are good, have stronger advantage as the bonding probe of fixing glue.
Further, the probe 22 of described cantalever type probe system is rf probe.When carrying out the wafer-level test of radio frequency chip, the probe 22 of employing is rf probe.
The present invention starts with from the one-piece construction of cantalever type probe system, multiple asphalt mixtures modified by epoxy resin alicyclic ring is placed by a probe, the probe of every radio frequency chip is positioned over a free ring oxygen tree alicyclic ring and increases screen layer between asphalt mixtures modified by epoxy resin alicyclic ring, this screen layer covers whole asphalt mixtures modified by epoxy resin alicyclic ring and all rf probes, when radio frequency chip carries out many and surveys, all probes of every radio frequency chip and all probes of other radiofrequency signals have carried out ground and have shielded and isolate, the screen layer of cantalever type probe system multiple chips arrives the needle point position of rf probe, effectively reduce rf probe radio frequency cross talk each other.When cost does not increase substantially, the radio frequency cross talk of the rf probe of cantalever type probe system can be effectively made to reduce 5dB-10dB.
Foregoing description is only the description to present pre-ferred embodiments, any restriction not to the scope of the invention, and any change that the those of ordinary skill in field of the present invention does according to above-mentioned disclosure, modification, all belong to the protection domain of claims.
Claims (10)
1. one kind is applied to the cantalever type probe system of many radio frequency chip concurrent testings, it is characterized in that, comprise probe clamp and at least two chip detection unit, each described chip detection unit inspection radio frequency chip, described chip detection unit comprises dead ring and probe, and described dead ring is fixed on described probe clamp, and described probe and described dead ring are fixed, described probe welds with described probe clamp away from one end of needle point, arranges screen layer between described each chip detection unit.
2. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 1, it is characterized in that, described screen layer is arranged on outside described each chip detection unit, described screen layer one end and described probe clamp are fixed, described probe is all positioned at described screen layer away from one end of needle point and described dead ring, the described screen layer other end is provided with opening, and the tip portion of described probe is through described opening.
3. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 1, is characterized in that, described screen layer is grounded metallic shield layer.
4. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 1, it is characterized in that, described probe clamp comprises the annular distance identical with chip detection element number, and described dead ring is fixed on described probe clamp by described annular distance.
5. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 4, is characterized in that, utilizes fixing glue to be fixed on described dead ring by described probe.
6. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 5, is characterized in that, described probe bending is divided into two parts, is respectively probe tip and probe needle arm.
7. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 6, is characterized in that, the bending angle between described probe needle arm and described probe tip is obtuse angle.
8. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 7, is characterized in that, the probe needle arm of described probe is fixed on described dead ring by fixing glue.
9. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 1, is characterized in that, described dead ring is ceramic ring.
10. the cantalever type probe system being applied to many radio frequency chip concurrent testings according to claim 5, is characterized in that, described fixing glue is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510821501.0A CN105445509B (en) | 2015-11-23 | 2015-11-23 | A kind of cantalever type probe system applied to more radio frequency chip concurrent testings |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510821501.0A CN105445509B (en) | 2015-11-23 | 2015-11-23 | A kind of cantalever type probe system applied to more radio frequency chip concurrent testings |
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| CN105445509A true CN105445509A (en) | 2016-03-30 |
| CN105445509B CN105445509B (en) | 2018-12-11 |
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| CN201510821501.0A Active CN105445509B (en) | 2015-11-23 | 2015-11-23 | A kind of cantalever type probe system applied to more radio frequency chip concurrent testings |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872874A (en) * | 2015-12-11 | 2017-06-20 | 华大半导体有限公司 | One kind concentrates CP method of testings for RFID label chip |
| CN107422242A (en) * | 2016-05-23 | 2017-12-01 | 北大方正集团有限公司 | The test device and method of a kind of VDMOS chip |
| CN110086551A (en) * | 2019-05-21 | 2019-08-02 | 上海明矽微电子有限公司 | A kind of test method of RF identification chip |
| CN111163588A (en) * | 2020-01-06 | 2020-05-15 | 苏州浪潮智能科技有限公司 | Method and device for opening electroplating backfill plug hole |
| TWI707145B (en) * | 2019-09-24 | 2020-10-11 | 松翰股份有限公司 | Probe head structure for probe card of image sensing chip |
| CN112881886A (en) * | 2021-01-13 | 2021-06-01 | 上海华岭集成电路技术股份有限公司 | Multi-station probe card and wafer testing method |
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| CN1218285A (en) * | 1997-11-18 | 1999-06-02 | 三星电子株式会社 | Probe card for testing integrated circuit chip |
| CN1916644A (en) * | 2005-08-19 | 2007-02-21 | 旺矽科技股份有限公司 | Cantalever type probe card in high frequency |
| US7521947B2 (en) * | 2006-05-23 | 2009-04-21 | Integrated Technology Corporation | Probe needle protection method for high current probe testing of power devices |
| JP5086783B2 (en) * | 2007-12-05 | 2012-11-28 | 日本電子材料株式会社 | Cantilever probe card |
| CN104237667A (en) * | 2013-06-24 | 2014-12-24 | 旺矽科技股份有限公司 | Detection device |
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2015
- 2015-11-23 CN CN201510821501.0A patent/CN105445509B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1218285A (en) * | 1997-11-18 | 1999-06-02 | 三星电子株式会社 | Probe card for testing integrated circuit chip |
| CN1916644A (en) * | 2005-08-19 | 2007-02-21 | 旺矽科技股份有限公司 | Cantalever type probe card in high frequency |
| US7521947B2 (en) * | 2006-05-23 | 2009-04-21 | Integrated Technology Corporation | Probe needle protection method for high current probe testing of power devices |
| JP5086783B2 (en) * | 2007-12-05 | 2012-11-28 | 日本電子材料株式会社 | Cantilever probe card |
| CN104237667A (en) * | 2013-06-24 | 2014-12-24 | 旺矽科技股份有限公司 | Detection device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872874A (en) * | 2015-12-11 | 2017-06-20 | 华大半导体有限公司 | One kind concentrates CP method of testings for RFID label chip |
| CN107422242A (en) * | 2016-05-23 | 2017-12-01 | 北大方正集团有限公司 | The test device and method of a kind of VDMOS chip |
| CN110086551A (en) * | 2019-05-21 | 2019-08-02 | 上海明矽微电子有限公司 | A kind of test method of RF identification chip |
| TWI707145B (en) * | 2019-09-24 | 2020-10-11 | 松翰股份有限公司 | Probe head structure for probe card of image sensing chip |
| CN111163588A (en) * | 2020-01-06 | 2020-05-15 | 苏州浪潮智能科技有限公司 | Method and device for opening electroplating backfill plug hole |
| CN111163588B (en) * | 2020-01-06 | 2021-07-06 | 苏州浪潮智能科技有限公司 | Method and device for opening electroplating backfill plug hole |
| CN112881886A (en) * | 2021-01-13 | 2021-06-01 | 上海华岭集成电路技术股份有限公司 | Multi-station probe card and wafer testing method |
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| Publication number | Publication date |
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| CN105445509B (en) | 2018-12-11 |
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