CN105441897B - Disk fixing device in evaporation coating technique - Google Patents
Disk fixing device in evaporation coating technique Download PDFInfo
- Publication number
- CN105441897B CN105441897B CN201510806316.4A CN201510806316A CN105441897B CN 105441897 B CN105441897 B CN 105441897B CN 201510806316 A CN201510806316 A CN 201510806316A CN 105441897 B CN105441897 B CN 105441897B
- Authority
- CN
- China
- Prior art keywords
- pipeline
- pipe
- fixed station
- work chamber
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses the disk fixing device in a kind of evaporation coating technique, it includes work chamber, and work chamber upper end is provided with fixed station；The axial location of the fixed station is provided with absorption pipeline, it is connected to the vacsorb pump being arranged on outside work chamber；The absorption pipeline includes the first pipeline and second pipe, and the first pipeline is attached with vacsorb pump, and second pipe is attached with fixed station, and second pipe is extended to inside the first pipeline, and the link position of the first pipeline and second pipe is provided with sealing ring；Driven gear is provided with the second pipe, the upper end of work chamber is provided with the driving gear being meshed with driven gear, and driving gear is driven by motor；Using above-mentioned technical proposal, it may be such that disk while its rotation processing is realized, avoids conventional fixed form from damaging its surface.
Description
Technical field
The present invention relates to a kind of semiconductor processing equipment, the disk fixing device in especially a kind of evaporation coating technique.
Background technology
Evaporation coating is to be heated the relatively low metal of fusing point so that evaporation of metal and be attached to disk to be processed it
On to form the technique of plated film.In existing evaporation coating technique, disk is often using mode is gripped, however, due to circle
Piece is chiefly used in semiconductor production, its thinner thickness, disk is easily damaged under prolonged clamp position.
The content of the invention
The technical problem to be solved in the present invention is to provide the disk fixing device in a kind of evaporation coating technique, it can be avoided
Disk is fixed with being damaged in the course of work.
In order to solve the above technical problems, the present invention relates to the disk fixing device in a kind of evaporation coating technique, it includes
There is work chamber, the lower face of work chamber is provided with the mounting table for placing metalliferous material, and mounting table is internally provided with electricity
Heat source, work chamber upper end are provided with the fixed station for fixed wafer, and fixed station is by the electricity that is arranged on outside work chamber
Machine is driven；The axial location of the fixed station is provided with absorption pipeline, its be connected to be arranged on it is true outside work chamber
Empty adsorption pump；The absorption pipeline includes the first pipeline and second pipe, and the first pipeline is attached with vacsorb pump, the
Two pipelines are attached with fixed station, and second pipe is extended to inside the first pipeline, the connection position of the first pipeline and second pipe
Install and be equipped with sealing ring；Driven gear is provided with the second pipe, the upper end of work chamber is provided with and driven tooth
The driving gear being meshed is taken turns, driving gear is driven by motor.
As a modification of the present invention, it is described absorption pipeline in, second pipe in fixed station side end diameter extremely
It is the 1/3 of the diameter of fixed station less.Using above-mentioned design, it can ensure that second pipe produces enough adsorption capacities for disk.
As a modification of the present invention, in the absorption pipeline, end set of the second pipe in fixed station side has
Multiple auxiliary radially extended along fixed station adsorb pipeline, axis Cheng Xuan of multiple auxiliary absorption pipelines on second pipe
Turn symmetrical, each auxiliary absorption pipeline is in contact via the end face of fixed station with disk.Using above-mentioned design, it can pass through
Multiple auxiliary absorption pipelines adsorb each position of disk, so as to avoid disk axle center local pressure excessive and then cause
It is damaged.
Using above-mentioned technical proposal, it can be fixed disk by the suction-operated that vacsorb pump produces, and lead to
Engaging between driving gear and driven gear is crossed, to realize that second pipe connection fixed station is rotated, so that disk exists
While realizing its rotation processing, conventional fixed form is avoided to damage its surface.
Brief description of the drawings
Fig. 1 is schematic diagram of the present invention；
Reference numerals list：
1-work chamber, 2-mounting table, 3-fixed station, 4-motor, 5-absorption pipeline, the 51-the first pipeline, 52-
Second pipe, 53-sealing ring, 6-vacsorb pump, 7-driven gear, 8-driving gear, 9-auxiliary absorption pipeline.
Embodiment
With reference to embodiment, the present invention is furture elucidated, it should be understood that following embodiments are only used for
It is bright the present invention rather than limit the scope of the invention.
Embodiment 1
Disk fixing device in a kind of evaporation coating technique as shown in Figure 1, it includes work chamber 1, working chamber
The lower face of room 1 is provided with the mounting table 2 for placing metalliferous material, and mounting table 2 is internally provided with electric heat source, work chamber 1
Upper end is provided with the fixed station 3 for fixed wafer, and fixed station 3 is driven by being arranged on the motor 4 outside work chamber 1
It is dynamic；The axial location of the fixed station 3 is provided with absorption pipeline 5, it is connected to the vacuum suction being arranged on outside work chamber 1
Pump 6；The absorption pipeline 5 includes the first pipeline 51 and second pipe 52, the first pipeline 51 are connected with vacsorb pump 6
Connect, second pipe 52 is attached with fixed station 3, and second pipe 52 is extended to inside the first pipeline 51, the first pipeline 1 and second
The link position of pipeline 52 is provided with sealing ring 53；Driven gear 7 is provided with the second pipe 52, work chamber 1
Upper end is provided with the driving gear 8 being meshed with driven gear 7, and driving gear 8 is driven by motor 4.
As a modification of the present invention, in the absorption pipeline, second pipe 52 is in the end diameter of 3 side of fixed station
For the 1/3 of the diameter of fixed station 3.Using above-mentioned design, it can ensure that second pipe produces enough adsorption capacities for disk.
Using above-mentioned technical proposal, it can be fixed disk by the suction-operated that vacsorb pump produces, and lead to
Engaging between driving gear and driven gear is crossed, to realize that second pipe connection fixed station is rotated, so that disk exists
While realizing its rotation processing, conventional fixed form is avoided to damage its surface.
Embodiment 2
As a modification of the present invention, in the absorption pipeline 5, second pipe 52 is set in the end of 3 side of fixed station
It is equipped with four auxiliary extended along 3 radial direction of fixed station and adsorbs pipeline 9, multiple auxiliary absorption pipelines 9 is on second pipe 52
Axis into rotational symmetry, each auxiliary absorption pipeline 9 be in contact via the end face of fixed station 3 with disk.Using above-mentioned
Design, it can adsorb pipelines by multiple auxiliary and each position of disk is adsorbed, thus avoid disk axle center local by
Power is excessive and then causes its damage.
The remaining features and advantages of the present embodiment are same as Example 1.
Claims (3)
1. the disk fixing device in a kind of evaporation coating technique, it includes work chamber, and the lower face of work chamber is set
It is useful for placing the mounting table of metalliferous material, mounting table is internally provided with electric heat source, and work chamber upper end is provided with for solid
Determine the fixed station of disk, fixed station is driven by being arranged on the motor outside work chamber；It is characterized in that, the fixed station
Axial location be provided with absorption pipeline, it is connected to the vacsorb pump being arranged on outside work chamber；The absorption pipeline
Include the first pipeline and second pipe, the first pipeline is attached with vacsorb pump, and second pipe is connected with fixed station
Connect, second pipe is extended to inside the first pipeline, and the link position of the first pipeline and second pipe is provided with sealing ring；Described
Driven gear is provided with two pipelines, the upper end of work chamber is provided with the driving gear being meshed with driven gear, main
Moving gear is driven by motor.
2. the disk fixing device in evaporation coating technique described in accordance with the claim 1, it is characterised in that the absorption pipeline
In, end diameter of the second pipe in fixed station side is at least the 1/3 of the diameter of fixed station.
3. the disk fixing device in evaporation coating technique described in accordance with the claim 1, it is characterised in that the absorption pipeline
In, end set of the second pipe in fixed station side has multiple auxiliary radially extended along fixed station to adsorb pipeline, more
A auxiliary absorption pipeline adsorbs pipeline via the end of fixed station on the axis of second pipe into rotational symmetry, each auxiliary
Face is in contact with disk.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510806316.4A CN105441897B (en) | 2015-11-20 | 2015-11-20 | Disk fixing device in evaporation coating technique |
| CN201810004547.7A CN107958866B (en) | 2015-11-20 | 2015-11-20 | Wafer fixing device in evaporation coating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510806316.4A CN105441897B (en) | 2015-11-20 | 2015-11-20 | Disk fixing device in evaporation coating technique |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810004547.7A Division CN107958866B (en) | 2015-11-20 | 2015-11-20 | Wafer fixing device in evaporation coating process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105441897A CN105441897A (en) | 2016-03-30 |
| CN105441897B true CN105441897B (en) | 2018-04-24 |
Family
ID=55552519
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510806316.4A Active CN105441897B (en) | 2015-11-20 | 2015-11-20 | Disk fixing device in evaporation coating technique |
| CN201810004547.7A Active CN107958866B (en) | 2015-11-20 | 2015-11-20 | Wafer fixing device in evaporation coating process |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810004547.7A Active CN107958866B (en) | 2015-11-20 | 2015-11-20 | Wafer fixing device in evaporation coating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN105441897B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023258B (en) * | 2018-09-20 | 2023-06-30 | 扬州扬杰电子科技股份有限公司 | Evaporation table |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1790889A (en) * | 2004-11-30 | 2006-06-21 | 三洋电机株式会社 | Processing method of adsorbate and electrostatic sucking method |
| CN201896027U (en) * | 2010-11-24 | 2011-07-13 | 山东科芯电子有限公司 | Vacuum sucking disc |
| CN104726838A (en) * | 2013-12-20 | 2015-06-24 | 昆山国显光电有限公司 | Supporting device for making flexible display, and making method of flexible display |
| CN205188416U (en) * | 2015-11-20 | 2016-04-27 | 苏州赛森电子科技有限公司 | Disk fixing device among evaporation coating process |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1044379A (en) * | 1974-12-28 | 1978-12-12 | Sony Corporation | Wafer transfer device |
| JPH1088325A (en) * | 1996-09-09 | 1998-04-07 | Nissin Electric Co Ltd | Device for forming thin coating |
| JPH10324966A (en) * | 1997-05-27 | 1998-12-08 | Sony Corp | Vacuum vapor deposition apparatus and vacuum vapor deposition method |
| JP2007242869A (en) * | 2006-03-08 | 2007-09-20 | Tokyo Electron Ltd | Substrate processing system |
| CN102234762B (en) * | 2010-04-23 | 2014-10-15 | 鸿富锦精密工业（深圳）有限公司 | Coating system |
| CN204369974U (en) * | 2014-12-25 | 2015-06-03 | 合肥科晶材料技术有限公司 | Evaporation coating instrument |
-
2015
- 2015-11-20 CN CN201510806316.4A patent/CN105441897B/en active Active
- 2015-11-20 CN CN201810004547.7A patent/CN107958866B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1790889A (en) * | 2004-11-30 | 2006-06-21 | 三洋电机株式会社 | Processing method of adsorbate and electrostatic sucking method |
| CN201896027U (en) * | 2010-11-24 | 2011-07-13 | 山东科芯电子有限公司 | Vacuum sucking disc |
| CN104726838A (en) * | 2013-12-20 | 2015-06-24 | 昆山国显光电有限公司 | Supporting device for making flexible display, and making method of flexible display |
| CN205188416U (en) * | 2015-11-20 | 2016-04-27 | 苏州赛森电子科技有限公司 | Disk fixing device among evaporation coating process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107958866A (en) | 2018-04-24 |
| CN105441897A (en) | 2016-03-30 |
| CN107958866B (en) | 2021-09-14 |
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