CN109023258B - Evaporation table - Google Patents
Evaporation table Download PDFInfo
- Publication number
- CN109023258B CN109023258B CN201811102593.7A CN201811102593A CN109023258B CN 109023258 B CN109023258 B CN 109023258B CN 201811102593 A CN201811102593 A CN 201811102593A CN 109023258 B CN109023258 B CN 109023258B
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- Prior art keywords
- groove
- evaporation
- workbench
- hole
- fixed disc
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An evaporation table. Relates to semiconductor processing equipment, in particular to an evaporation table. The evaporating table is simple in structure, convenient to clean and capable of improving machining efficiency. The device comprises a workbench, an evaporation table body, a turntable and a swinging assembly, wherein the evaporation table body is arranged above the workbench, a containing groove is formed in the top surface of the workbench, the containing groove is used for containing the turntable, a first placing groove and a second placing groove are formed in the bottom surface of the workbench, the first placing groove is used for containing a motor, and the second placing groove is used for containing a heater; the swing assembly comprises a hydraulic oil cylinder and a fixed disc, the hydraulic oil cylinder is arranged on the cover plate, a push rod of the hydraulic oil cylinder is connected with the fixed disc, and the fixed disc is positioned in the conical hole and used for being connected with the wafer. The invention is convenient to process and reliable in operation.
Description
Technical Field
The invention relates to semiconductor processing equipment, in particular to an evaporation table.
Background
The evaporation coating is a process of heating a metal having a low melting point so that the metal evaporates and adheres to a wafer to be processed, thereby forming a coating. In the existing coating process, gas-phase metal generated by metal evaporation contacts with the wafer through free movement, so that the gas-phase metal is evaporated to other areas, and waste is caused; simultaneously, evaporate to other regions easily, cause the metal level to be difficult to clear up, the personnel is more laborious when cleaning, and the clearance is not thorough moreover. Usually, a hammer and a straight screwdriver are required to be used for cleaning, and the force is large during knocking, so that metal burrs are easy to occur, the subsequent processing difficulty is increased, and the working efficiency is reduced.
Disclosure of Invention
Aiming at the problems, the invention provides the evaporating table which has the advantages of simple structure, convenient cleaning and improved processing efficiency.
The technical scheme of the invention is as follows: the device comprises a workbench, an evaporation table body, a turntable and a swinging assembly, wherein the evaporation table body is arranged above the workbench, a containing groove is formed in the top surface of the workbench, the containing groove is used for containing the turntable, a first placing groove and a second placing groove are formed in the bottom surface of the workbench, the first placing groove is used for containing a motor, and the second placing groove is used for containing a heater;
a through hole is arranged between the first placement groove and the accommodating groove, a rotating shaft of the motor is positioned in the through hole and used for driving the rotary table to rotate, four heating grooves are uniformly distributed on the circumference of the top surface of the rotary table,
the second placement groove is communicated with the accommodating groove, and the second placement groove is positioned below any heating groove;
the evaporation platform body is provided with a conical hole with a large upper part and a small lower part, the top of the conical hole is provided with a cover plate, and the conical hole is used for being communicated with any heating groove;
the swing assembly comprises a hydraulic oil cylinder and a fixed disc, the hydraulic oil cylinder is arranged on the cover plate, a push rod of the hydraulic oil cylinder is connected with the fixed disc, and the fixed disc is positioned in the conical hole and used for being connected with the wafer.
The rotary table is characterized in that a rotary hole is formed in the center of the bottom surface of the rotary table, and a rotary shaft of the motor extends into the rotary hole.
The wafer is adhesively connected to the fixed disk.
The fixed disk is provided with an air passage, the air passage is connected with a negative pressure fan, the wafer is connected on the fixed disk in an adsorption way,
the caliber of the notch of the heating groove is smaller than the caliber of the lower part of the conical hole.
The protective sleeve is conical, and the protective sleeve is arranged in the conical hole.
And two ends of the protective sleeve are respectively connected with a push rod of the hydraulic oil cylinder through pull ropes.
In operation, the metal is placed in the heating groove of the turntable, different metals can be selected by rotating the motor and are positioned right above the heating groove, and the metal is heated and evaporated by the heater; because the conical hole is communicated with the heating groove, the gas phase metal is evaporated onto the wafer, and the operation is convenient. The wafer is connected to the fixed disk driven by the hydraulic cylinder, and the gas phase metal can be driven to move through lifting movement, so that the speed of evaporating the wafer is improved, and the working efficiency is improved.
The invention is convenient to process and reliable in operation.
Drawings
Figure 1 is a schematic view of the structure of the present invention,
figure 2 is a top view of figure 1,
figure 3 is a schematic view of the structure of the table,
figure 4 is a cross-sectional view of the A-A plane of figure 3,
figure 5 is a schematic view of the structure of the evaporation stage,
figure 6 is a cross-sectional view of B-B of figure 5,
figure 7 is a schematic diagram of the construction of an advantageous embodiment of the invention,
figure 8 is a schematic diagram of a second embodiment of the present invention,
in the figure, 1 is a workbench, 11 is a containing groove, 12 is a first placing groove, 13 is a second placing groove, 14 is a connecting hole,
2 is an evaporation platform body, 20 is a conical hole,
3 is a turntable, 31 is a heating tank, 32 is a rotating hole,
4 is a motor, 5 is a perforation, 6 is a cover plate,
71 is a hydraulic cylinder, 72 is a fixed disk, 73 is a circular disk,
the gas circuit 8, the protective sleeve 9 and the pull rope 10.
Detailed Description
The invention is shown in figures 1-8, and comprises a workbench 1, an evaporation table body 2, a turntable 3 and a swinging component, wherein the evaporation table body is arranged above the workbench, and a connecting hole 14 corresponding to the evaporation table is arranged on the workbench and is connected through a bolt;
the top surface of the workbench is provided with a containing groove 11, the containing groove is used for placing the turntable 3, the bottom surface of the workbench is provided with a first placing groove 12 and a second placing groove 13, the first placing groove 12 is used for placing the motor 4, and the second placing groove is used for placing a heater (which can be an electric heater and is convenient for heating);
a through hole 5 is arranged between the first placement groove and the accommodating groove, a rotating shaft of the motor is positioned in the through hole and used for driving the rotary table to rotate, four heating grooves 31 are uniformly distributed on the circumference of the top surface of the rotary table,
the second placement groove is communicated with the accommodating groove, the second placement groove is positioned below any heating groove, and the turntable is driven to rotate by the motor so as to facilitate the heating action of the second placement groove on the heating groove;
the evaporation platform body 2 is provided with a conical hole 20 with a large upper part and a small lower part, the top of the conical hole is provided with a cover plate 6, and the conical hole is used for being communicated with any heating groove; the rotary table is driven by a motor to rotate, so that the two are communicated;
the swing assembly comprises a hydraulic cylinder 71 and a fixed disc 72, wherein the hydraulic cylinder is arranged on the cover plate, a push rod of the hydraulic cylinder is connected with the fixed disc, and the fixed disc is positioned in the conical hole and used for being connected with a circular disc 73.
In operation, the metal is placed in the heating groove of the turntable, different metals can be selected by rotating the motor and are positioned right above the heating groove, and the metal is heated and evaporated by the heater; because the conical hole is communicated with the heating groove, the gas phase metal is evaporated onto the wafer, and the operation is convenient. The wafer is connected to the fixed disk driven by the hydraulic cylinder, and the gas phase metal can be driven to move through lifting movement, so that the speed of evaporating the wafer is improved, and the working efficiency is improved.
FIG. 1 shows the table separated from the evaporation table body, the two being connected by corresponding connection holes 14; the top view of fig. 2 removes the swing assembly to facilitate viewing of the internal structure.
The center of the bottom surface of the turntable is provided with a rotating hole 32, and the rotating shaft of the motor extends into the rotating hole.
Through setting up the commentaries on classics hole, the pivot of the motor of being convenient for stretches into, and both accessible key connection is convenient for drive.
The wafer is adhesively connected to the fixed disk.
The adhesive connection is directly adopted, so that the operation is convenient.
The fixed disk is provided with an air passage 8, the air passage is connected with a negative pressure fan, the wafer is connected on the fixed disk in an adsorption way,
through setting up negative pressure fan and connecting, the disk of being convenient for adsorbs the connection. The negative pressure fan (not shown in the figure) is arranged outside the evaporation platform body, and the air channel is connected with the negative pressure fan through an air pipe to work.
The caliber of the notch of the heating groove is smaller than the caliber of the lower part of the conical hole.
Therefore, gas phase metal generated by evaporation reliably enters the conical hole, and waste is avoided.
The device also comprises a protective sleeve 9, wherein the protective sleeve is conical, and the protective sleeve is arranged in the conical hole.
The protective sleeve is arranged, so that gas-phase metal generated by evaporation is prevented from accumulating in the conical hole, and subsequent cleaning is facilitated; the protective sleeve can be processed in batches, is convenient to replace and reduces cost.
The two ends of the protective sleeve are respectively connected with a push rod of the hydraulic oil cylinder through a pull rope 10.
The protective sleeve is driven to swing through the pull rope, so that the protective sleeve swings, and meanwhile, the lifting action of the wafer can be matched, the movement speed of gas-phase metal is further improved, and the evaporation efficiency is improved.
Claims (7)
1. The evaporation table is characterized by comprising a workbench, an evaporation table body, a rotary table and a swinging assembly, wherein the evaporation table body is arranged above the workbench, a containing groove is formed in the top surface of the workbench, the containing groove is used for containing the rotary table, a first placing groove and a second placing groove are formed in the bottom surface of the workbench, the first placing groove is used for containing a motor, and the second placing groove is used for containing a heater;
a through hole is arranged between the first placement groove and the accommodating groove, a rotating shaft of the motor is positioned in the through hole and used for driving the rotary table to rotate, four heating grooves are uniformly distributed on the circumference of the top surface of the rotary table,
the second placement groove is communicated with the accommodating groove, and the second placement groove is positioned below any heating groove;
the evaporation platform body is provided with a conical hole with a large upper part and a small lower part, the top of the conical hole is provided with a cover plate, and the conical hole is used for being communicated with any heating groove;
the swing assembly comprises a hydraulic oil cylinder and a fixed disc, the hydraulic oil cylinder is arranged on the cover plate, a push rod of the hydraulic oil cylinder is connected with the fixed disc, and the fixed disc is positioned in the conical hole and used for being connected with the wafer.
2. An evaporation stand according to claim 1, wherein the center of the bottom surface of the turntable is provided with a rotation hole, and the rotation shaft of the motor extends into the rotation hole.
3. An evaporation station according to claim 1, wherein said disc is adhesively attached to the holding pan.
4. An evaporation stand according to claim 1, wherein the fixed disc is provided with an air passage, the air passage is connected with a negative pressure fan, and the wafer is adsorbed and connected to the fixed disc.
5. An evaporation station according to claim 1, wherein the aperture of the slot opening of the heating tank is smaller than the lower aperture of the conical hole.
6. An evaporation station according to claim 1, further comprising a protective sleeve, said protective sleeve being tapered, said protective sleeve being disposed within said tapered bore.
7. The evaporation stand of claim 6, wherein two ends of the protective sleeve are respectively connected with a push rod of the hydraulic cylinder through pull ropes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811102593.7A CN109023258B (en) | 2018-09-20 | 2018-09-20 | Evaporation table |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811102593.7A CN109023258B (en) | 2018-09-20 | 2018-09-20 | Evaporation table |
Publications (2)
Publication Number | Publication Date |
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CN109023258A CN109023258A (en) | 2018-12-18 |
CN109023258B true CN109023258B (en) | 2023-06-30 |
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CN201811102593.7A Active CN109023258B (en) | 2018-09-20 | 2018-09-20 | Evaporation table |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10056686A1 (en) * | 2000-11-15 | 2002-05-29 | Paul Drude Inst Fuer Festkoerp | Vaporizer cell used in a molecular beam epitaxial process comprises a crucible having a heater and an opening, and a covering unit formed by a plate-like screen |
JP2004077237A (en) * | 2002-08-14 | 2004-03-11 | Fuji Photo Film Co Ltd | Manufacturing device for phosphor sheet |
JP2007039767A (en) * | 2005-08-05 | 2007-02-15 | Hitachi Zosen Corp | Evaporation apparatus for vacuum vapor deposition |
EP1806425A1 (en) * | 2006-01-09 | 2007-07-11 | Siemens Aktiengesellschaft | Method and apparatus for coating a substrate |
JP2008121104A (en) * | 2006-10-16 | 2008-05-29 | Able:Kk | Vacuum vapor-deposition apparatus |
CN107958866A (en) * | 2015-11-20 | 2018-04-24 | 苏州赛森电子科技有限公司 | Wafer Fixing Device in Evaporation Coating Process |
CN208791735U (en) * | 2018-09-20 | 2019-04-26 | 扬州扬杰电子科技股份有限公司 | Evaporator |
-
2018
- 2018-09-20 CN CN201811102593.7A patent/CN109023258B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10056686A1 (en) * | 2000-11-15 | 2002-05-29 | Paul Drude Inst Fuer Festkoerp | Vaporizer cell used in a molecular beam epitaxial process comprises a crucible having a heater and an opening, and a covering unit formed by a plate-like screen |
JP2004077237A (en) * | 2002-08-14 | 2004-03-11 | Fuji Photo Film Co Ltd | Manufacturing device for phosphor sheet |
JP2007039767A (en) * | 2005-08-05 | 2007-02-15 | Hitachi Zosen Corp | Evaporation apparatus for vacuum vapor deposition |
EP1806425A1 (en) * | 2006-01-09 | 2007-07-11 | Siemens Aktiengesellschaft | Method and apparatus for coating a substrate |
JP2008121104A (en) * | 2006-10-16 | 2008-05-29 | Able:Kk | Vacuum vapor-deposition apparatus |
CN107958866A (en) * | 2015-11-20 | 2018-04-24 | 苏州赛森电子科技有限公司 | Wafer Fixing Device in Evaporation Coating Process |
CN208791735U (en) * | 2018-09-20 | 2019-04-26 | 扬州扬杰电子科技股份有限公司 | Evaporator |
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CN109023258A (en) | 2018-12-18 |
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