CN105436703A - Laser micro-pore drilling device and method applicable to hard-brittle substrate - Google Patents
Laser micro-pore drilling device and method applicable to hard-brittle substrate Download PDFInfo
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- CN105436703A CN105436703A CN201511027035.5A CN201511027035A CN105436703A CN 105436703 A CN105436703 A CN 105436703A CN 201511027035 A CN201511027035 A CN 201511027035A CN 105436703 A CN105436703 A CN 105436703A
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- laser
- wave plate
- hard
- brittle material
- drive unit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
Abstract
The invention discloses a laser micro-pore drilling device applicable to a hard-brittle substrate. The device comprises a laser head, a laser beam transmission device, an 1/4 wave plate, a driving device, an 1/2 wave plate, a first reflector, a two-dimensional galvanometer, a field lens and a stage, wherein the 1/2 wave plate is arranged on the driving device; a laser guide hole is formed in the driving device; the 1/2 wave plate is driven by the driving device to rotate; the laser outgoing surface of the 1/2 wave plate is a vertical surface; after the laser polarization property of a laser beam emitted by the laser beam transmission device is adjusted through the 1/4 wave plate, and the laser polarization direction is adjusted through the driving device and the 1/2 wave plate; the laser beam emitted by the 1/2 wave plate enters the two-dimensional galvanometer through the first reflector, then emitted to a hard-brittle material through the field lens and finally scanned by the two-dimensional galvanometer to form a preset through hole in the hard-brittle substrate. With the adoption of the device, the polarization property of the laser can be changed, and the polarization direction of the laser can be changed in real time, so that the laser intensity distribution can be improved, a conical slot can be formed, and as a result, the drilling quality and drilling rate can be improved.
Description
Technical field
The present invention relates to laser process equipment, particularly relate to a kind of laser drilling micropore Apparatus and method for being applicable to hard crisp substrate.
Background technology
Laser boring reaches practical laser processing technology the earliest, is also one of main application fields of Laser Processing.Along with the modern industry and scientific and technical developing rapidly, use large, that fusing point the is high material of hardness to get more and more, the technical requirement of client to materials processing is also more and more higher, and traditional processing method can not meet some process requirements.Such as, hard brittle material bores the aperture of micron level, the conventional machining process of such processing tasks is difficult to, and sometimes or even impossible, is then not difficult to realize with laser boring.
The general principle of Laser Processing is on hard brittle material to be processed surface Laser Focusing, in conjunction with the Gaussian Profile of laser beam and the mechanism of laser and material effect, the groove formed after making laser and hard brittle material effect presents right circular cone, the right circular cone formed in laser drill has a great impact crudy and process velocity, the formation of Distribution of laser intensity to right circular cone is most important, the polarization state of laser affects Distribution of laser intensity, so the polarization characteristic of laser is the main cause affecting hard brittle material crudy and process velocity simultaneously.
The industrial laser of a lot of companies production at present, output beam is linear polarization, the laser effect Distribution of laser intensity of this characteristic, and the formation of Distribution of laser intensity to right circular cone has a great impact, thus the aperture circularity processed is affected, and working (machining) efficiency also can reduce simultaneously.For addressing this is that, usually adopt laser instrument or the better ultrafast laser of performance of circular polarization characteristics.But this type of laser instrument is on the high side, not only substantially increase the operation cost of equipment, also make the function usability of some manufacturer's laser instruments become single simultaneously, greatly reduce the effective rate of utilization of equipment.
Summary of the invention
The technical problem to be solved in the present invention is, for the deficiencies in the prior art, provide a kind of can change laser polarization characteristic, the polarization direction changing laser in real time, the laser drilling micropore Apparatus and method for being applicable to hard crisp substrate that improves Distribution of laser intensity, positive centrum groove can be formed, drilling quality and bore rate can be improved.
For solving the problems of the technologies described above, the present invention adopts following technical scheme.
A kind of laser drilling micropore equipment being applicable to hard crisp substrate, it includes laser head, Laser Transmission direction along laser head is provided with light beam transfer device successively, quarter wave plate, drive unit, 1/2 wave plate, first speculum, 2-D vibration mirror, field lens and microscope carrier, described microscope carrier is for placing hard brittle material, described laser head is Q-switch molded line polarization laser, described 1/2 wave plate is located on drive unit, described drive unit offers light-conductive hole, and drive 1/2 wave plate to rotate by drive unit, the exiting surface of described 1/2 wave plate is vertical plane, the laser beam of described light beam transfer device outgoing is after quarter wave plate adjustment laser polarization characteristic, via drive unit and 1/2 wave plate adjustment laser polarization direction, the laser beam of described 1/2 wave plate outgoing enters 2-D vibration mirror by the first speculum, again by field lens outgoing to hard brittle material, scanned by 2-D vibration mirror and make hard brittle material form default through hole.
Preferably, also comprise the valve be disposed adjacent with microscope carrier, the outlet of described valve is towards hard brittle material.
Preferably, be provided with the second speculum between described laser head and light beam transfer device, the linearly polarized laser pulse that described laser head sends, after the second speculum reflection, transfers to light beam transfer device.
A kind of laser drilling micropore method being applicable to hard crisp substrate, comprise following process: the Laser Transmission that laser head sends is to light beam transfer device, the laser beam of light beam transfer device outgoing is after quarter wave plate adjustment laser polarization characteristic, via drive unit and 1/2 wave plate adjustment laser polarization direction, the laser beam of described 1/2 wave plate outgoing enters 2-D vibration mirror by the first speculum, again by field lens outgoing to hard brittle material, scanned by 2-D vibration mirror and make hard brittle material form default through hole.
Preferably, the through hole scope that hard brittle material is formed is 20um-150um.
Preferably, bore rate is 15 holes/-50 holes/second second.
Disclosed by the inventionly be applicable in the laser drilling micropore equipment of hard crisp substrate, the laser beam that laser head sends is by light beam transfer device, quarter wave plate, drive unit, 1/2 wave plate, 2-D vibration mirror peace field lens transfers to hard brittle material, laser beam focuses at the upper surface of hard brittle material and starts boring, in laser drilling process, drive unit drives 1/2 wave plate to rotate, effectively change the polarization direction of laser in real time, effectively improve Distribution of laser intensity, the groove formed after making laser and hard brittle material effect presents right circular cone, and then laser beam and material fully act on, capacity usage ratio is high, make institute's holes drilled through round, it is shorter to complete the time that through hole consumes.In addition, rotate by driving 1/2 wave plate with the drive unit of light-conductive hole, make its rotation process more stable, it is more even that 1/2 wave plate rotates, promote the abundant effect of laser beam and material, capacity usage ratio is improved, and then improves laser to the drilling quality of processing hard brittle material and drilling efficiency.Also make the functional diversities of the laser instrument of the type simultaneously, effectively improve the utilization rate of equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation that the present invention is applicable to the laser drilling micropore equipment of hard crisp substrate.
Fig. 2 is that valve is to structural representation during hard brittle material.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in more detail.
The invention discloses a kind of laser drilling micropore equipment being applicable to hard crisp substrate, as shown in Figure 1, it includes laser head 1, Laser Transmission direction along laser head 1 is provided with light beam transfer device 2 successively, quarter wave plate 12, drive unit 3, 1/2 wave plate 4, first speculum 5, 2-D vibration mirror 6, field lens 7 and microscope carrier 9, described microscope carrier 9 is for placing hard brittle material 8, described laser head 1 is Q-switch molded line polarization laser, described 1/2 wave plate 4 is located on drive unit 3, described drive unit 3 offers light-conductive hole, and drive 1/2 wave plate 4 to rotate by drive unit 3, the exiting surface of described 1/2 wave plate 4 is vertical plane, the laser beam of described light beam transfer device 2 outgoing adjusts after laser polarization characteristic through quarter wave plate 12, laser polarization direction is adjusted via drive unit 3 and 1/2 wave plate 4, the laser beam of described 1/2 wave plate 4 outgoing enters 2-D vibration mirror 6 by the first speculum 5, again by field lens 7 outgoing to hard brittle material 8, scanned by 2-D vibration mirror 6 and make hard brittle material 8 form default through hole.
In the course of work, the linearly polarized laser pulse that laser head 1 sends becomes elliptical polarization or circularly polarized laser by quarter wave plate 12,1/2 wave plate 4 is transferred to again by light-conductive hole, the real-time rotation of 1/2 wave plate 4 makes the polarization direction of laser change in real time, effectively improve Distribution of laser intensity, the groove formed after making laser and hard brittle material effect presents right circular cone, and then laser beam and material fully act on, capacity usage ratio is high, improves laser to the quality of processing hard brittle material 8 boring and drilling efficiency.
As a kind of preferred embodiment, shown in composition graphs 1 and Fig. 2, also comprise the valve 10 be disposed adjacent with microscope carrier 9, the outlet of described valve 10 is towards hard brittle material 8.Wherein, laser beam focuses at the upper surface of hard brittle material 8 and starts boring, and valve 10 is blown from side direction to bellmouth simultaneously.Utilize valve 10 powder that bellmouth sputters can be blown away.Meanwhile, different gas types can be selected, such as select oxygen blast gas can accelerate the combustion decomposition of hard brittle material surface residual debris and burr, thus improve the quality of processing hard brittle material through-hole surfaces.
In the present embodiment, be provided with the second speculum 11 between described laser head 1 and light beam transfer device 2, the linearly polarized laser pulse that described laser head 1 sends, after the second speculum 11 reflects, transfers to light beam transfer device 2.By described second speculum 11, effectively shorten the laser drilling micropore equipment length being in the horizontal direction applicable to hard crisp substrate.
Further, laser beam can change the laser of linear polarization into elliptical polarization or circularly polarized laser by quarter wave plate 12.And light beam transfer device 2 has the effect of light beam amplification and beam collimation.
The present invention also discloses a kind of laser drilling micropore method being applicable to hard crisp substrate, it comprises following process: the Laser Transmission that laser head 1 sends is to light beam transfer device 2, the laser beam of light beam transfer device 2 outgoing adjusts after laser polarization characteristic through quarter wave plate 12, laser polarization direction is adjusted via drive unit 3 and 1/2 wave plate 4, the laser beam of described 1/2 wave plate 4 outgoing enters 2-D vibration mirror 6 by the first speculum 5, again by field lens 7 outgoing to hard brittle material 8, scanned by 2-D vibration mirror 6 and make hard brittle material 8 formed preset through hole.
Further, through hole scope hard brittle material 8 formed is 20um-150um.Bore rate is 15 holes/-50 holes/second second.
Disclosed by the inventionly be applicable in the laser drilling micropore equipment of hard crisp substrate, laser head 1 is Q-switch laser instrument, 1/2 wave plate 4 is fixedly connected with drive unit 3, and the exiting surface of 1/2 wave plate 4 is vertical plane, drive unit 3 offers light-conductive hole, and under the drive of drive unit 3, described 1/2 wave plate 4 rotates around the axial line of light-conductive hole, 2-D vibration mirror 6 is entered by the first speculum 5 again from 1/2 wave plate 4 laser beam out, and from field lens 7 outgoing to hard brittle material 8.The linearly polarized laser pulse that this laser head 1 sends becomes elliptical polarization or circularly polarized laser by quarter wave plate 12,1/2 wave plate 4 is transferred to again by light-conductive hole, the real-time rotation of 1/2 wave plate 4 makes the polarization direction of laser change in real time, effectively improve Distribution of laser intensity, the groove formed after making laser and hard brittle material effect presents right circular cone, and then laser beam and material fully act on, and capacity usage ratio is high, make institute's holes drilled through round, it is shorter to complete the time that through hole consumes.In addition, by driving 1/2 wave plate 4 to rotate with the drive unit 3 of light-conductive hole, make its rotation process more stable, it is more even that 1/2 wave plate 4 rotates, promote the abundant effect of laser beam and material, capacity usage ratio is improved, and then improves laser to the quality of processing hard brittle material 8 boring and drilling efficiency.Also make the functional diversities of the laser instrument of the type simultaneously, effectively improve the utilization rate of equipment.
The above is preferred embodiment of the present invention, is not limited to the present invention, all make in technical scope of the present invention amendment, equivalent to replace or improvement etc., all should be included in scope that the present invention protects.
Claims (6)
1. one kind is applicable to the laser drilling micropore equipment of hard crisp substrate, it is characterized in that, include laser head, Laser Transmission direction along laser head is provided with light beam transfer device successively, quarter wave plate, drive unit, 1/2 wave plate, first speculum, 2-D vibration mirror, field lens and microscope carrier, described microscope carrier is for placing hard brittle material, described laser head is Q-switch molded line polarization laser, described 1/2 wave plate is located on drive unit, described drive unit offers light-conductive hole, and drive 1/2 wave plate to rotate by drive unit, the exiting surface of described 1/2 wave plate is vertical plane, the laser beam of described light beam transfer device outgoing is after quarter wave plate adjustment laser polarization characteristic, via drive unit and 1/2 wave plate adjustment laser polarization direction, the laser beam of described 1/2 wave plate outgoing enters 2-D vibration mirror by the first speculum, again by field lens outgoing to hard brittle material, scanned by 2-D vibration mirror and make hard brittle material form default through hole.
2. be applicable to the laser drilling micropore equipment of hard crisp substrate as claimed in claim 1, it is characterized in that, also comprise the valve be disposed adjacent with microscope carrier, the outlet of described valve is towards hard brittle material.
3. be applicable to the laser drilling micropore equipment of hard crisp substrate as claimed in claim 1, it is characterized in that, be provided with the second speculum between described laser head and light beam transfer device, the linearly polarized laser pulse that described laser head sends, after the second speculum reflection, transfers to light beam transfer device.
4. one kind is applicable to the laser drilling micropore method of hard crisp substrate, it is characterized in that, comprise following process: the Laser Transmission that laser head sends is to light beam transfer device, the laser beam of light beam transfer device outgoing is after quarter wave plate adjustment laser polarization characteristic, via drive unit and 1/2 wave plate adjustment laser polarization direction, the laser beam of described 1/2 wave plate outgoing enters 2-D vibration mirror by the first speculum, again by field lens outgoing to hard brittle material, scanned by 2-D vibration mirror and make hard brittle material form default through hole.
5. be applicable to the laser drilling micropore method of hard crisp substrate as claimed in claim 4, it is characterized in that, the through hole scope that hard brittle material is formed is 20um-150um.
6. be applicable to the laser drilling micropore method of hard crisp substrate as claimed in claim 4, it is characterized in that, bore rate is 15 holes/-50 holes/second second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511027035.5A CN105436703A (en) | 2015-12-30 | 2015-12-30 | Laser micro-pore drilling device and method applicable to hard-brittle substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201511027035.5A CN105436703A (en) | 2015-12-30 | 2015-12-30 | Laser micro-pore drilling device and method applicable to hard-brittle substrate |
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| CN105436703A true CN105436703A (en) | 2016-03-30 |
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| CN201511027035.5A Pending CN105436703A (en) | 2015-12-30 | 2015-12-30 | Laser micro-pore drilling device and method applicable to hard-brittle substrate |
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Cited By (5)
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| CN106392342A (en) * | 2016-12-05 | 2017-02-15 | 清华大学 | Laser drilling device and method for gas turbine blade |
| CN110919174A (en) * | 2019-12-20 | 2020-03-27 | 武汉华工激光工程有限责任公司 | Rotary light path light beam device and rotary light path light beam system |
| CN110977205A (en) * | 2019-12-20 | 2020-04-10 | 武汉华工激光工程有限责任公司 | Blind hole machining rotary cutting system and blind hole machining method |
| CN111112859A (en) * | 2019-12-20 | 2020-05-08 | 武汉华工激光工程有限责任公司 | Zero-taper through hole process method for transparent brittle material |
| WO2021152008A1 (en) * | 2020-01-31 | 2021-08-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Assembly for material processing using a laser beam, in particular for laser drilling |
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Address after: Wujin District of Jiangsu city in Changzhou province 213000 Chang Wu Road No. 801 Changzhou Science City building room 1111-1126 South Hui research Applicant after: Inno Machining Co., Ltd. Applicant after: Innovo laser Polytron Technologies Inc Address before: Wujin District of Jiangsu city in Changzhou province 213000 Chang Wu Road No. 801 Changzhou Science City building room 1111-1126 South Hui research Applicant before: Inno Machining Co., Ltd. Applicant before: Shenzhen Inno Laser Technology Co., Ltd. |
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Application publication date: 20160330 |