CN105430871A - PCB and method for isolating high-noise power supply in PCB - Google Patents
PCB and method for isolating high-noise power supply in PCB Download PDFInfo
- Publication number
- CN105430871A CN105430871A CN201510874818.0A CN201510874818A CN105430871A CN 105430871 A CN105430871 A CN 105430871A CN 201510874818 A CN201510874818 A CN 201510874818A CN 105430871 A CN105430871 A CN 105430871A
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- China
- Prior art keywords
- layer
- pcb
- strong noise
- stratum
- bus plane
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
Abstract
The invention relates to electronic equipment, particularly provides a multi-layer PCB, and aims at solving the problem that the multi-layer PCB in the prior art cannot effectively suppress interference of a high-noise power supply layer to a signal layer. In order to achieve the goal, the multi-layer PCB provided by the invention comprises at least one signal layer, at least one ground layer and at least one high-noise power supply layer, which are stacked together. The PCB is characterized in that two sides of the high-noise power supply layer both are provided with the ground layers. Those skilled in the art easily understand that the high-noise power supply layer in the PCB can be positioned and effectively shielded by the technical scheme provided by the invention, so that the influence on the signal layer is suppressed or thoroughly eliminated and the usability of the PCB is improved.
Description
Technical field
The present invention relates to electronic equipment, the method for the strong noise power supply in a kind of PCB and isolation PCB is specifically provided.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed wiring board, and being called for short printed board, is one of vitals of electronics industry.Almost often kind of electronic equipment, little of electronic watch, calculator, arrive greatly computer, communication electronic device, military issue weapons system, as long as there are the electronic devices and components of integrated circuit, in order to the electric interconnection between them, all will use printed board.In relatively large electronic product research process, the most basic success factor is the design of the printed board of this product, documentation and manufacture.The Design and manufacture quality of printed board directly has influence on quality and the cost of whole product, even causes the success or failure of commercial competition.
Together multi-layer PCB is overlie one another by two-layer or more circuit layer to manufacture, and has pre-set being reliably interconnected between them.Before design multilayer PCB circuit board, designer needs first to determine adopted board structure of circuit according to the requirement of the scale of circuit, the size of circuit board and electromagnetic compatibility (EMC), namely determines employing 4 layers, 6 layers or the circuit board of more multi-layered number.After determining the number of plies, then determine the placement location of internal planes and the different signal that how to distribute on these layers.Stepped construction is the key factor affecting pcb board EMC performance, is also the important means suppressing electromagnetic interference.
The independent process of the multi-layer PCB not to be noted strong noise bus plane-such as 12V high-tension electricity active layer of prior art, have ignored its interference to signals layer.Therefore, this area needs a kind of new technical scheme to solve the interference of strong noise bus plane to other signals, to improve the availability of PCB circuit.
Summary of the invention
In order to solve foregoing problems, being the multi-layer PCB solving prior art and can not effectively having suppressed strong noise bus plane to the problem of the interference of signals layer, having the invention provides a kind of multi-layer PCB.This multi-layer PCB comprises at least one signals layer together of being laminated to each other, at least one stratum and at least one strong noise bus plane, and it is characterized in that, what be arranged on described strong noise bus plane both sides is all stratum.
In the preferred implementation of above-mentioned multi-layer PCB, described multi-layer PCB comprise stack gradually from top to bottom the first signals layer, the first stratum, strong noise bus plane, the second stratum and a secondary signal layer.
In the preferred implementation of above-mentioned multi-layer PCB, described multi-layer PCB comprise stack gradually from top to bottom the first signals layer, the first stratum, not high noisy power layer, secondary signal layer, additional stratum, strong noise bus plane, the second stratum and the 3rd signals layer.
In the preferred implementation of above-mentioned multi-layer PCB, described stratum and/or described strong noise bus plane and/or described not high noisy power layer are copper-clads.
According to another aspect of the present invention, provide a kind of method of isolating strong noise power supply in multi-layer PCB, it is characterized in that comprising the following steps: to analyze the degree that in described multi-layer PCB, each signals layer is interfered; Based on the result location strong noise bus plane of above-mentioned analysis; And the layer of described strong noise bus plane both sides is set to stratum, to cover described strong noise bus plane completely.
In the preferred implementation of said method, the distance that the step of described location strong noise bus plane comprises degree and their the distance certain electric active layer be disturbed based on each signals layer further locates strong noise bus plane.
Those skilled in the art it is easily understood that, owing to have employed said structure or operating procedure, apparatus and method of the present invention can be located strong noise bus plane and effectively be shielded it, thus suppress or thoroughly eliminate it to the impact of signals layer, improve the serviceability of PCB.
Accompanying drawing explanation
Fig. 1 is the structure chart of the multi-layer PCB of prior art;
Fig. 2 is the structure chart according to multi-layer PCB of the present invention;
Fig. 3 is the flow chart according to the method for strong noise power supply in isolation PCB of the present invention.
Embodiment
With reference to the accompanying drawings the preferred embodiment of the present invention is described.One skilled in the art will appreciate that these execution modes only for explaining know-why of the present invention, and not intended to be limits the scope of the invention.Such as, although the application describes in conjunction with seven layers of PCB, this should not be construed as limiting the invention, and technical scheme of the present invention obviously can be applied to has other numbers of plies-such as four layers or six layers of PCB.
First reference Fig. 1, this figure is the structure chart of the multi-layer PCB of prior art.In conjunction with described in the introduction above, the multi-layer PCB (specifically seven layers of PCB) of prior art comprises the first signals layer 1, first stratum 10, first bus plane 100, secondary signal layer 2, second source layer 200, second stratum 20 and the 3rd signals layer 3 from top to bottom successively.As mentioned above, the PCB of prior art only follows the principle of " bus plane and stratum close-coupled ", not to the first bus plane 100 and second source layer 200 differentiated treatment, when in the first bus plane 100 and second source layer 200 is strong noise bus plane, just strong interference can be produced to neighbouring signals layer.Such as, if second source layer 200 is strong noise bus planes, although then itself and the second stratum 20 close-coupled, still strong interference can be produced to secondary signal layer 2.
Consult Fig. 2 below, this figure is the structure chart according to multi-layer PCB of the present invention.In fig. 2, continuing hypothesis second source layer 200 is strong noise bus planes, then it can produce strong interference to neighbouring secondary signal layer 2.As shown in Figure 2, the present invention is after being defined as strong noise bus plane by second source layer 200, the basis on the second stratum 20 below second source layer 200 additionally arranges additional stratum 30, to cover strong noise bus plane completely, thus make it seldom or substantive interference can not be produced to contiguous secondary signal layer 2.
Next consult Fig. 3, this figure is the flow chart according to the method for strong noise power supply in isolation PCB of the present invention.As shown in Figure 3, S1 is started from according to the method for strong noise power supply in isolation PCB of the present invention.In step sl, the signal be interfered is analyzed.Such as, the level that three signals layers are interfered can be detected.Then, in step s 2, strong noise voltage source is located according to testing result.Such as, if detect that secondary signal layer 2 is subject to strong interference, then strong noise voltage source may be the second voltage source 200, also may be the first voltage source 100.Therefore, the interference that following analysis the first signal layer 1 and the 3rd signals layer 3 are subject to, if the interference that the first signal layer 1 is subject to is greater than the interference that the 3rd signals layer 3 is subject to, then can determine that strong noise voltage source is the first voltage source 100.Otherwise, if the interference that the 3rd signal layer 3 is subject to is greater than the interference that the first signals layer 1 is subject to, then can determine that strong noise voltage source is the second voltage source 200.This depends primarily on the close degree of signal specific layer and concrete bus plane.Finally, in step s3, the layer of strong noise power supply both sides is layer by layer set to stratum, covers strong noise bus plane completely, make it can not produce substantial effect to neighbouring signals layer.
One skilled in the art will appreciate that above-mentioned bus plane 100 and 200 and stratum 10,20 and 30 can be copper-clads, also can be the conductor layer of other any appropriate formats.Further, signals layer 1,2 and 3 also can adopt any suitable form comprising tin layers, and these do not depart from protection scope of the present invention.
So far, shown by reference to the accompanying drawings preferred implementation describes technical scheme of the present invention, but those skilled in the art are it is easily understood that protection scope of the present invention is obviously not limited to these embodiments.Under the prerequisite not departing from principle of the present invention, those skilled in the art can make equivalent change or replacement to correlation technique feature, and these changes or the technical scheme after replacing it all will fall within protection scope of the present invention.
Claims (6)
1. a multi-layer PCB, comprises at least one signals layer together of being laminated to each other, at least one stratum and at least one strong noise bus plane,
It is characterized in that, what be arranged on described strong noise bus plane both sides is all stratum.
2. multi-layer PCB according to claim 1, is characterized in that, described multi-layer PCB comprise stack gradually from top to bottom the first signals layer, the first stratum, strong noise bus plane, the second stratum and a secondary signal layer.
3. multi-layer PCB according to claim 1, it is characterized in that, described multi-layer PCB comprise stack gradually from top to bottom the first signals layer, the first stratum, not high noisy power layer, secondary signal layer, additional stratum, strong noise bus plane, the second stratum and the 3rd signals layer.
4. multi-layer PCB according to any one of claim 1 to 3, is characterized in that, described stratum and/or described strong noise bus plane and/or described not high noisy power layer are copper-clads.
5. isolate a method for strong noise power supply in multi-layer PCB, it is characterized in that comprising the following steps:
Analyze the degree that in described multi-layer PCB, each signals layer is interfered;
Based on the result location strong noise bus plane of above-mentioned analysis; And
The layer of described strong noise bus plane both sides is set to stratum, to cover described strong noise bus plane completely.
6. method according to claim 5, is characterized in that, the distance that the step of described location strong noise bus plane comprises degree and their the distance certain electric active layer be disturbed based on each signals layer further locates strong noise bus plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874818.0A CN105430871A (en) | 2015-12-02 | 2015-12-02 | PCB and method for isolating high-noise power supply in PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510874818.0A CN105430871A (en) | 2015-12-02 | 2015-12-02 | PCB and method for isolating high-noise power supply in PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105430871A true CN105430871A (en) | 2016-03-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510874818.0A Pending CN105430871A (en) | 2015-12-02 | 2015-12-02 | PCB and method for isolating high-noise power supply in PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430871A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657962A (en) * | 2016-03-28 | 2016-06-08 | 莆田市涵江区依吨多层电路有限公司 | Multilayer PCB circuit board |
| CN113056090A (en) * | 2021-03-18 | 2021-06-29 | 山东英信计算机技术有限公司 | Multiplexing PCB lamination and server |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2414585Y (en) * | 2000-01-07 | 2001-01-10 | 神达电脑股份有限公司 | Noise silencer for multi-layer printed circuit board |
| US20050225955A1 (en) * | 2004-04-09 | 2005-10-13 | Hewlett-Packard Development Company, L.P. | Multi-layer printed circuit boards |
| US20120242394A1 (en) * | 2009-03-16 | 2012-09-27 | Murata Manufacturing Co., Ltd. | High-frequency switch module |
-
2015
- 2015-12-02 CN CN201510874818.0A patent/CN105430871A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2414585Y (en) * | 2000-01-07 | 2001-01-10 | 神达电脑股份有限公司 | Noise silencer for multi-layer printed circuit board |
| US20050225955A1 (en) * | 2004-04-09 | 2005-10-13 | Hewlett-Packard Development Company, L.P. | Multi-layer printed circuit boards |
| US20120242394A1 (en) * | 2009-03-16 | 2012-09-27 | Murata Manufacturing Co., Ltd. | High-frequency switch module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105657962A (en) * | 2016-03-28 | 2016-06-08 | 莆田市涵江区依吨多层电路有限公司 | Multilayer PCB circuit board |
| CN105657962B (en) * | 2016-03-28 | 2018-05-18 | 莆田市涵江区依吨多层电路有限公司 | A kind of multilayer PCB circuit board |
| CN113056090A (en) * | 2021-03-18 | 2021-06-29 | 山东英信计算机技术有限公司 | Multiplexing PCB lamination and server |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |