CN105426283B

CN105426283B - Electronic product thermal design optimization method

Info

Publication number: CN105426283B
Application number: CN201410479959.8A
Authority: CN
Inventors: 廖友志; 张召辉; 邱信雄
Original assignee: HUANXU ELECTRONICS CO Ltd
Current assignee: HUANXU ELECTRONICS CO Ltd
Priority date: 2014-09-19
Filing date: 2014-09-19
Publication date: 2018-02-02
Anticipated expiration: 2034-09-19
Also published as: CN105426283A

Abstract

A kind of electronic product thermal design optimization method; its step is first to prepare a test environment and set temperature monitor inside it; electronic product to be measured is located in test environment and connects a signal generation device and a computer; electronic product to be measured is in high performance state and cause to rise above its protection temperature; the radiating of electronic product to be measured or the software of energy consumption or hardware are adjusted or changed afterwards, then electronic product to be measured is returned to high performance state again；Thereby, various performance parameters of the electronic product to be measured in radiating management can be tested out, to carry out electronic product thermal design optimization.

Description

Electronic product thermal design optimization method

Technical field

The present invention relates to a kind of test of electronic product radiating characteristic and optimization method, specifically a kind of electronics production The quick test and validation method of the performances of product, temperature and energy consumption, it can directly carry out the optimization of electronic product thermal design.

Background technology

The application chip supplier of embedded system is its kernel software of independent development mostly to make the power supply of chip at present Management, it is each supplier mostly that how chip internal, which dynamically adjusts the core radiating management function such as its performance and operating voltage, Trade secret is without being disclosed.And in the case where stressing compact trend electronic product now, electronic product inside chip. more The distance between be shortened so that heat dissipation problem is more serious, not to mention the power management design of different chip suppliers is each From totally different.Therefore, how to take into account the optimum performance of system electronic product good heat radiating and system entirety is always product development Business is in the target laid siege to.

However, for current different embedded system of all kinds, still lack a complete and systematic survey Examination mode come rapidly test out the performance of electronic product, consumption the parameters such as power and product temperature between pass System, so that product developer when making system combination, is not easy according to its characteristic and carries out accordingly and rapidly assembly layout, soft The efficiency design optimization such as hardware heat radiation protection, cause the spacious day of product whole development time-consuming.

The content of the invention

In view of this, can be fast it is a primary object of the present invention to provide a kind of electronic product thermal design optimization method Speed tests out the performance of electronic product, the consumption parameters such as power and product temperature, and can directly carry out the heat of electronic product Optimization of design.

In order to reach above-mentioned purpose, the invention provides a kind of electronic product thermal design optimization method, its step includes Have：

A) prepare a heat-insulated test environment, at least one temperature monitor is set in test environment, by electronics to be measured Product makes electronic product to be measured connect a signal generation device and a computer in above-mentioned test environment, wherein, meter Calculation machine is that control signal generation device produces processing signal to electronic product to be measured, and captures at least one temperature monitor institute The temperature and the writing speed of electronic product to be measured detected；

B) increase writing speed, electronic product to be measured is in high performance state, when the temperature of the electronic product to be measured is high When a protection temperature, the electronic product to be measured can enter low performance state；

C) adjust or change the radiating of the electronic product to be measured or the software of energy consumption or hardware；

D) judge whether the temperature that at least one temperature monitor is detected is less than protection temperature, if judged result is It is that then increasing writing speed makes electronic product to be measured be in high performance state；

E) step b) to step d) is performed repeatedly, finally terminates to test.

Therefore, the present invention can be adjusted by the software and hardware of the radiating and energy consumption control of electronic product to be measured, survey methodically Try and verify each item datas such as performance and the heat dissipation characteristics of electronic product to be measured, and the thermal design that can carry out electronic product is optimal Change.

Brief description of the drawings

Fig. 1 is graph of a relation of the detecting temperature to the time of present pre-ferred embodiments, and writing speed is to the pass of time System's figure.

Fig. 2 is the method flow diagram of present pre-ferred embodiments.

Embodiment

Where knowing more about the features of the present invention, the invention provides a preferred embodiment and coordinate brief description of the drawings such as Under, refer to Fig. 1 and Fig. 2, in the present embodiment, electronic product be with a chip to be measured as an example, it can also be mobile phone Or the electronic product such as tablet personal computer, the key step of electronic product thermal design optimization method provided by the present invention is said herein It is bright as follows.

Please with reference first to Fig. 2, in step sl, prepare heat-insulated test environment, and the different positions inside test environment One temperature monitor of each setting is put, to detect the temperature of diverse location inside test environment.In the present embodiment, test environment is One room (not shown), the inwall of room is all made of with heat-insulated material, and using reduces between compartment and outside Heat transfer.

Prepare a test platform substrate, make test platform substrate and the computer outside test environment and a news The electrical connection of number generation device.Test platform substrate is used to insert for chip to be measured, and makes chip to be measured and test platform substrate electricity Connection, the components such as an energy supply control module, a memory modules and an input and output module are provided with test platform substrate, For chip to be measured in test test platform substrate can normal operation, because effect and the connected mode of above-mentioned module are not Where the emphasis of this case, not it is described in detail herein.

On the one hand computer is write for controlling above-mentioned signal generation device generation processing signal to send chip to be measured to Enter and do calculation process；On the other hand, computer is also used for data, each temperature of real-time Motion capture chip consumption power to be measured Temperature data that detector is detected and be input to chip to be measured processing signal writing speed, and can be by above-mentioned institute The Data Integration captured is exported into chart, such as Fig. 1.

Fig. 1 and Fig. 2 are refer to, in step s 2, opens test platform substrate, computer, signal generation device and each The power supply of temperature monitor, in a time spacing I, computer control signal generation device produces a processing signal and gives core to be measured Piece processing, and the writing speed of chip to be measured is increased to 330 (MB/s) and maintain this writing speed afterwards, chip to be measured is allowed in height Computing is carried out under performance state.Because now chip to be measured is to make computing in the state of high-performance, its product temperature will be quick Rise, and the consumption power of electronic product can generally also rise, and the temperature of chip to be measured is detected in each temperature monitor Average value close to the default preset temperature of chip to be measured (such as 67 DEG C) when, chip to be measured can reduce writing speed automatically simultaneously One time spacing II is maintained with about 250 (MB/s) speed, but because chip to be measured is still in of a relatively high performance state Under make computing, the mean temperature for the chip to be measured that each temperature monitor is detected still can be slowly risen to close to core to be measured The default protection temperature (such as 73 DEG C) of piece.

Enter step S3 afterwards：When the temperature that each temperature monitor is detected is higher than the protection temperature of chip built-in to be measured When, state of the chip to be measured in overheat, the writing speed of chip to be measured is declined to a great extent and maintain about 15 (MB/s), Now chip to be measured is in low performance state, and computer will also record the protection temperature value of chip to be measured.

Step S4 is then performed, starts to adjust the radiating mode of chip to be measured, such as changes fin or improves fan Rotating speed, chip to be measured is set effectively to be cooled.Now, each temperature monitor still persistently detects the temperature of chip to be measured.

Enter step S5 afterwards, when computer judges that the temperature of chip to be measured is less than protection temperature, then perform step S6, otherwise computer will maintain writing speed and to continue to detect the temperature of chip to be measured.

In step s 6, temperature is protected less than it because chip to be measured has cooled to, can be so as to computerized control Signal generation device and the writing speed of chip to be measured is increased to about 250 (MB/s) and is returned to high performance state, and make Chip to be measured maintains whether to play effect in this high performance state, the regulating measures taken with verification step S4.

Step S7 is performed afterwards.If the radiating after adjustment can not still reach optimum efficiency, treated in high performance state The temperature and consumption power for surveying chip will be gradually increasing again, then step S7 will return to step S3 to continue to test；Otherwise Terminate test.

Because the present embodiment is by taking chip as an example, so just needing to set test platform substrate, if electronic product to be measured The components such as energy supply control module itself are already equipped with, then can directly make electronic product to be measured and computer and signal generation device It is directly connected to.

The computer of the present invention can also directly capture the energy consumption data of electronic product to be measured, and by the step S4 in Fig. 2 The adjustment radiating mode taken is changed to adjust energy consumption control software or hardware, to reduce the energy consumption problem of electronic product to be measured, The optimized purpose of thermal design can equally be reached.

Finally, it is necessary to illustrate again, disclosed constituent components are only for example the present invention in the aforementioned embodiment It is bright, be not used for limiting the scope of this case, every other easily full of beard and structure change, or become with the replacement of other equivalent elements Change, also should be this case claims and covered.

Claims

1. a kind of electronic product thermal design optimization method, it is characterised in that comprise the following steps：

A) prepare a heat-insulated test environment, at least one temperature monitor is set in the test environment, by electronics to be measured Product is located at the test environment and while one signal generation device of connection and a computer；Wherein, the computer control institute State signal generation device generation processing signal and send the electronic product to be measured to, and capture at least one temperature monitor The temperature and the writing speed of the electronic product to be measured detected；

B) increase said write speed, the electronic product to be measured is in high performance state, when the electronic product to be measured When temperature is higher than a protection temperature, the electronic product to be measured can enter low performance state；

C) adjust or change the radiating of the electronic product to be measured or the software or hardware of energy consumption；

D) judge whether the temperature that at least one temperature monitor is detected is less than the protection temperature, if judged result It is yes, then increasing said write speed makes the electronic product to be measured be in the high performance state；And

E) step b) to step d) is performed repeatedly, finally terminates to test.

2. electronic product thermal design optimization method as claimed in claim 1, it is characterised in that

Stop when step b) is also included in the temperature that is detected of at least one temperature monitor close to a preset temperature Increase or start to reduce said write speed, and the electronic product to be measured is maintained at the high performance state.

3. electronic product thermal design optimization method as claimed in claim 1, it is characterised in that

The quantity of at least one temperature monitor is multiple, and uses each temperature detecting in step b) to step d) The average value for the temperature that device is detected.

4. electronic product thermal design optimization method as claimed in claim 1, it is characterised in that

When step d) judged results are no, the electronic product to be measured is set to maintain the low performance state.

5. electronic product thermal design optimization method as claimed in claim 1, it is characterised in that the computer can capture The consumption power of the electronic product to be measured.