CN105426283A

CN105426283A - Thermal design optimization method of electronic product

Info

Publication number: CN105426283A
Application number: CN201410479959.8A
Authority: CN
Inventors: 廖友志; 张召辉; 邱信雄
Original assignee: HUANXU ELECTRONICS CO Ltd
Current assignee: HUANXU ELECTRONICS CO Ltd; Universal Scientific Industrial Co Ltd
Priority date: 2014-09-19
Filing date: 2014-09-19
Publication date: 2016-03-23
Anticipated expiration: 2034-09-19
Also published as: CN105426283B

Abstract

The present invention provides a thermal design optimization method of an electronic product. The method comprises the steps of: first preparing a test environment and setting a temperature detector inside the test environment; disposing a to-be-tested electronic product in the test environment and connecting a signal generating apparatus with a computer; then enabling the to-be-tested electronic product to be in a high-performance state, so that a temperature rise exceeds a protection temperature of the electronic product; adjusting or replacing software or hardware of heat dissipation or energy consumption of the to-be-tested electronic product; and recovering the to-be-tested electronic product to a high-performance state again. Therefore, each performance parameter of the to-be-tested electronic product in heat dissipation management can be tested, so as to thermal design optimization of the electronic product.

Description

Electronic product thermal design optimization method

Technical field

The present invention relates to a kind of test and optimization method of electronic product radiating characteristic, specifically the quick test of a kind of performance of electronic product, temperature and energy consumption and verification method, directly can carry out the optimization of electronic product thermal design.

Background technology

The application chip supplier of current embedded system be mostly its kernel software of independent development to make the power management of chip, how its core such as performance and operating voltage radiating management function of dynamic conditioning is the trade secret of each supplier and is not disclosed chip internal mostly.And under electronic product stresses compact trend more now, the distance between electronic product inside chip is shortened, make heat dissipation problem more serious, the power management design saying nothing of different chip supplier is totally different separately.Therefore, the optimum performance how taking into account system electronic product good heat radiating and entire system is the target that product development business is laying siege to always.

But; for current different embedded system of all kinds; still lack a complete and systematic test mode and test out the parameters relations each other such as the performance of electronic product, consumed power and product temperature rapidly; so that product development business is when doing system combination; not easily according to its characteristic accordingly and carry out the usefulness design optimization such as assembly layout, software and hardware heat radiation protection rapidly, the spacious day of causing Total Product to develop is time-consuming.

Summary of the invention

In view of this, fundamental purpose of the present invention is to provide a kind of electronic product thermal design optimization method, can test out the parameters such as the performance of electronic product, consumed power and product temperature fast, and directly can carry out the thermal design optimization of electronic product.

In order to reach above-mentioned purpose, the invention provides a kind of electronic product thermal design optimization method, its step includes:

A) a heat insulation test environment is prepared, at least one temperature monitor is set in test environment, electronic product to be measured is located in above-mentioned test environment, and make electronic product to be measured connect a signal generation device and a computing machine, wherein, computing machine controls signal generation device to produce process signal to electronic product to be measured, and capture the writing speed of temperature that at least one temperature monitor detects and electronic product to be measured;

B) increase writing speed, make electronic product to be measured be in high performance state, when the temperature of this electronic product to be measured is higher than a protection temperature, this electronic product to be measured can enter low performance state;

C) heat radiation of this electronic product to be measured or the software of energy consumption or hardware is adjusted or changes;

D) judge that whether temperature that this at least one temperature monitor detects is lower than protection temperature, if the determination result is YES, then increases writing speed and makes electronic product to be measured be in high performance state;

E) repeatedly step b is performed) to steps d), finally terminate test.

Therefore, the software and hardware that the present invention can control by the adjustment heat radiation of electronic product to be measured and energy consumption, tests methodically and verifies every data such as the performance of electronic product to be measured and heat dissipation characteristics, and can carry out the thermal design optimization of electronic product.

Accompanying drawing explanation

Fig. 1 be the detecting temperature of present pre-ferred embodiments to the graph of a relation of time, and writing speed is to the graph of a relation of time.

Fig. 2 is the method flow diagram of present pre-ferred embodiments.

Embodiment

In order to feature place of the present invention more can be understood, the invention provides a preferred embodiment and coordinate accompanying drawing to be described as follows, please refer to Fig. 1 and Fig. 2, in the present embodiment, electronic product is with a chip to be measured as an example, it also can be the electronic product such as mobile phone or panel computer, is described as follows in this key step by electronic product thermal design optimization method provided by the present invention.

Please first with reference to figure 2, in step sl, prepare heat insulation test environment, and the diverse location in test environment inside respectively arranges a temperature monitor, to detect the temperature of the inner diverse location of test environment.In the present embodiment, test environment is a room (not shown), and the inwall of room is all make with heat insulation material, uses the heat transfer reduced between compartment and outside.

Prepare a test platform substrate, test platform substrate is electrically connected with the computing machine and a signal generation device being positioned at test environment outside.Test platform substrate is used for inserting for chip to be measured, and chip to be measured is electrically connected with test platform substrate, test platform substrate is provided with the assemblies such as an energy supply control module, a memory modules and a constrained input module, for chip to be measured, when testing, test platform substrate can normal operation, due to the emphasis place that the effect of above-mentioned module and connected mode are not this case, will not describe in detail at this.

Computing machine is used on the one hand to control above-mentioned signal generation device and produces process signal and send chip to be measured to and write and do calculation process; On the other hand, the writing speed of the temperature data that computing machine also detects for the data of real-time Motion capture chip to be measured consumed power, each temperature monitor and the process signal that is input to chip to be measured, and above-mentioned the Data Integration captured can be output into chart, as Fig. 1.

Please refer to Fig. 1 and Fig. 2, in step s 2, open the power supply of test platform substrate, computing machine, signal generation device and each temperature monitor, in a time interval I, computing machine controls signal generation device and produces a process signal to chip process to be measured, and the writing speed of chip to be measured is increased to after 330 (MB/s) maintain this writing speed, allow chip to be measured carry out computing under high performance state.Because now chip to be measured does computing under high performance state, its product temperature will rise fast, and the consumed power of electronic product also can rise usually, each temperature monitor detect the temperature of chip to be measured mean value close to the default preset temperature of chip to be measured (as 67 DEG C) time, chip to be measured can automatically reduce writing speed and maintain a time interval II with the speed of about 250 (MB/s), but because chip to be measured still does computing under relatively high performance state, the medial temperature of the chip to be measured that each temperature monitor detects still can rise to lentamente close to chip to be measured protection temperature (as 73 DEG C) decided at the higher level but not officially announced.

Enter step S3 afterwards: when the protection temperature of the temperature that each temperature monitor is detected higher than chip built-in to be measured; chip to be measured has been in overheated state; the writing speed of chip to be measured is declined to a great extent and maintains about 15 (MB/s); now chip to be measured is in low performance state, and computing machine also will record the protection temperature value of chip to be measured.

Perform step S4 subsequently, start the radiating mode adjusting chip to be measured, such as, change heat radiator or improve rotation speed of the fan, chip to be measured can effectively be lowered the temperature.Now, each temperature monitor still continues the temperature of detecting chip to be measured.

Enter step S5 afterwards, when computing machine judges that the temperature of chip to be measured is lower than protection temperature, then perform step S6, otherwise computing machine will maintain writing speed and continues the temperature of detecting chip to be measured.

In step s 6; because chip to be measured has cooled to lower than its protection temperature; just can make to computerized control signal generation device and make the writing speed of chip to be measured be increased to about 250 (MB/s) and be returned to high performance state; and make chip to be measured maintain this high performance state, to confirm whether the regulating measures that step S4 takes plays effect.

Perform step S7 afterwards.If when the heat radiation after adjustment still cannot reach optimum efficiency, the temperature and the consumed power that are in the chip to be measured of high performance state will rise again gradually, so step S7 will get back to step S3 to continue test; Otherwise just terminate test.

Because the present embodiment is for chip, so just need to arrange test platform substrate, if electronic product to be measured itself is equipped with the assemblies such as energy supply control module, then electronic product to be measured can be directly made directly to be connected with computing machine and signal generation device.

Computing machine of the present invention also directly can capture the energy consumption data of electronic product to be measured, and the adjustment radiating mode taked by the step S4 in Fig. 2 changes adjustment energy consumption control software design or hardware into, to reduce the energy consumption problem of electronic product to be measured, the optimized object of thermal design can be reached equally.

Finally, must again illustrate, the constituent components disclosed by the present invention is in the aforementioned embodiment only and illustrates, not be used for limiting the scope of this case, other easy full of beard every and structure change, or with the alternate variation of other equivalent elements, also should be this case claims and contained.

Claims

1. an electronic product thermal design optimization method, is characterized in that, comprises the following steps:

A) prepare a heat insulation test environment, at least one temperature monitor is set in described test environment, electronic product to be measured be located at described test environment and connect a signal generation device and a computing machine simultaneously; Wherein, described computing machine controls described signal generation device generation process signal and sends described electronic product to be measured to, and the writing speed of the temperature that described in acquisition, at least one temperature monitor detects and described electronic product to be measured;

B) increase said write speed, make described electronic product to be measured be in high performance state, when the temperature of described electronic product to be measured is higher than a protection temperature, described electronic product to be measured can enter low performance state;

C) the described heat radiation of electronic product to be measured or the software of energy consumption or hardware is adjusted or changes;

D) judge that whether temperature that at least one temperature monitor described detects is lower than described protection temperature, if the determination result is YES, then increases said write speed and makes described electronic product to be measured be in described high performance state; And

E) repeatedly step b is performed) to steps d), finally terminate test.

2. electronic product thermal design optimization method as claimed in claim 1, is characterized in that,

In step b) be also included in the temperature that at least one temperature monitor described detects and increase close to stopping during a preset temperature or start to reduce said write speed, and make described electronic product to be measured be maintained at described high performance state.

3. electronic product thermal design optimization method as claimed in claim 1, is characterized in that,

The quantity of at least one temperature monitor described is multiple, and in step b) to steps d) mean value of the temperature that adopts each described temperature monitor to detect.

4. electronic product thermal design optimization method as claimed in claim 1, is characterized in that,

In steps d) judged result is when being no, makes described electronic product to be measured maintain described low performance state.

5. electronic product thermal design optimization method as claimed in claim 1, it is characterized in that, described computing machine can capture the consumed power of described electronic product to be measured.